Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce's latest investigations. Global sales of large-sized TVs were brisk thanks to major sporting events such as the Tokyo Olympics and UEFA Euro 2020. Likewise, the proliferation of WFH and distance learning applications propelled the demand for IT products, while the automotive semiconductor and data center markets also showed upward trajectories. Taking into account the above factors, OSAT companies raised their quotes in response, resulting in a 26.4% YoY increase in the top 10 OSAT companies' revenue to US$7.88 billion for 2Q21.

TrendForce indicates that, in light of the ongoing global chip shortage and the growing production capacities of foundries/IDMs in the upstream semiconductor supply chain, OSAT companies gradually increased their CAPEX and expanded their fabs and equipment in order to meet the persistently growing client demand. However, the OSAT industry still faces an uncertain future in 2H21 due to the Delta variant's global surge and the health crisis taking place in Southeast Asia, home to a significant number of OSAT facilities.

Intel have recently launched five NUC X15 Laptop Kits featuring Tiger Lake processors and NVIDIA RTX 30 Series graphics. The Intel NUC laptops are sold direct to system integrators without memory or storage and are not available for direct consumer purchase so availability and pricing are unknown. Intel has two processor options available with the Core i5-11400H and i7-11800H paired with an RTX 3060 or RTX 3070 graphics card. The three display options all feature narrow bezel IPS panels and are available in 144 Hz FHD, 240 Hz FHD, and 165 Hz QHD configurations. The laptops all feature mechanical keyboards with RGB lighting, WiFi 6, Thunderbolt 4, PCIe Gen 4 storage, 2.5 Gigabit Ethernet, HDMI 2.1, Windows Hello, and a 94 Wh battery.

The Gigabyte Z690 AORUS MASTER and Gigabyte Z690 AORUS ELITE AX motherboards have recently been listed for sale at an Australian retailer. The LGA1700 motherboards will support Intel's upcoming Alder Lake 12th Generation Core series processors which are expected to launch in November. The motherboards were listed for 768.90 AUD and 438.90 AUD which equates to 572 USD and 327 USD respectively. These prices are approximately 10% more than their equivalent Z590 versions which should provide a good indication of general pricing for all upcoming Z690 motherboards.

The listings state that the Gigabyte Z690 AORUS MASTER will feature DDR4 memory compatibility which may be a mistake as manufacturers have announced that some high-end boards will be offered with DDR5 support. The motherboards will likely be some of the first consumer boards to support PCIe 5.0 which will enable faster storage with supported drives. These motherboards should be available to purchase in the coming months when Intel officially launches their 12th Gen Core series processors and Z690 chipset.

According to a new research report from the analyst firm Jon Peddie Research, unit shipments of add-in boards increased in Q2'21 from last year, while Nvidia increased market share to 80% from last quarter a 0.3% increase as well as 2% year-over-year.. Over $11.8 billion AIBs shipped in the quarter—an increase of 179% year-over-year.

Add-in boards (AIBs) use discrete GPUs (dGPU) with dedicated memory. Desktop PCs, workstations, servers, rendering and mining farms, and scientific instruments use AIBs. Consumers and enterprises buy AIBs from resellers or OEMs. They can be part of a new system or installed as an upgrade to an existing system. Systems with AIBs represent the higher end of the graphics industry. Entry-level systems use integrated GPUs (iGPU) in CPUs that share slower system memory.

The top Intel 12th Gen Core "Alder Lake-S" 8+8 (P+E) cores processor will cost 741€ including taxes, according to a leaked document revealing retail channel prices of various upcoming 12th Gen Core desktop processors. It also speaks of the i9-12900KF, the "almost-flagship" part that comes with a disabled iGPU, going for up to 708€ (incl taxes).

The Core i7-12700K, the 8+4 (P+E) cores part that lacks Thermal Velocity Boost, will go for up to 524€ (incl taxes). Its "KF" twin will be about 20€ cheaper. The mid-tier Core i5-12600K processor (6 P-cores and 4 E-cores), is going for up to 365€. Not long ago, this was the roughly the price of Intel's top mainstream-desktop processors (such as the i7-7700K). The iGPU-devoid i5-12600KF will go for 333€. Intel is expected to debut its 12th Gen Core desktop processors and compatible Socket LGA1700 motherboards in Q4-2021, along the sidelines of the Windows 11 launch. The first wave of processors are expected to only be unlocked K or KF parts, with locked ones only arriving in early Q1-2022.

[Editor's note: We have published the review of HYTE Revolt 3 Case here.]

HYTE, the new PC components and lifestyle brand of iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today released its premier product, the Revolt 3 Mini-ITX PC case. Previously announced during CES 2021 as the Revolt 3 MK3, the Revolt 3 was designed with careful consideration for DIY PC enthusiasts, gamers, and creators alike.

"iBUYPOWER is excited to introduce its new sub-brand, HYTE, to our community with its very first product, the Revolt 3" said Darren Su, Executive Vice President of iBUYPOWER. "With over 20 years of experience as a systems integrator we felt like we had a unique perspective to bring to the table when developing PC Components. We approached the Revolt 3 with the goal of designing a case with the freedom and flexibility that would allow the use of a wide range of components without imposing performance restrictions based on the size of the case."

ID-COOLING today announced SE-226-XT ARGB and SE-226-XT BLACK CPU air coolers. Both coolers include the same black heatsink with 6 heatpipes and copper base. 120 mm ARGB fan and Black fan are used on ARGB / BLACK version respectively. SE-226-XT Series is designed to cool those processors with a TDP up to 250 W. Both models are built with a solid heatsink which is specially design with 100% RAM compatibility. Black coating is applied for a stealthy looking.

For SE-226-XT ARGB, the included 120x120x25mm fan is built with 2Ball bearing and has 8pcs rubber dampeners on all corners of both sides, running at 800 to 2000rpm with PWM support while pushing 56.6CFM air at maximum speed, noise level measured 16.2 to 31.5dB (A). For SE-226-XT BLACK, the included standard 120x120x25mm fan has 8pcs rubber dampeners on all corners of both sides, running at 700 to 1800rpm with PWM support while pushing 76.16CFM air at maximum speed, noise level measured 15.2 to 35.2dB (A).

The lineup of 600-Series motherboards planned by ASRock and NZXT for the upcoming 12th Generation Intel Core Series of processors has recently been published by VideoCardz. While NZXT has only two high-end Z590 motherboards listed with them being the N5-Z69XT, and the N7-Z69XT, ASRock has 36 listed across all the Z690, H670, B660, and H610 chipsets. The Z690 chipset will serve as the flagship platform for high-performance and overclocking while the H670 and B660 will take the mid-range and the H610 for entry-level boards. The list does not contain any Taichi, Aqua, or OC Formula series boards from ASRock as those may not be ready for day-one release or are still under active development.

ASRock will offer several of their motherboards in two variants with one offering integrated WiFi 6E networking, they also have an ITX option for each chipset. Intel is expected to announce their 12th Generation Core Series processors and Z690 chipset in late 2021 with the remaining chipsets to be announced at CES 2022. The entire list of motherboards from the two companies can be found below.

ASUS has begun rolling out BIOS updates that add motherboard support for Windows 11 even for processor families that Microsoft said would be left out of their latest Windows OS. Ever since the introduction of Windows 11, the message around specific hardware requirements has been difficult to pinpoint, as the company struggles to send a clear message on exactly which users should be looking to update their hardware - and which should not. ASUS' new BIOS updates will certainly add to the stirring pot, as they are being touted to enable Windows 11 support for Intel CPU families that Microsoft doesn't officially (yet) support for the OS release: Skylake (6th Gen) and Kaby Lake (7th Gen). According to Microsoft, only 8th Gen (Coffee Lake) and later Intel CPUs are supported by Windows 11.

The new BIOS updates typically activate TPM on the users' machine, should it be off at the BIOS level. ASUS has already released beta BIOS versions that introduce support for Windows 11 on Z270, H270 and B250 motherboards, and launched a hub page with compatibility status for a number of its motherboard releases. According to the company in the respective motherboard support pages, "The following motherboards are compatible with Windows 11 under current testing. The upgrability [sic] is subject to the support from operation system or 3rd party drivers availability." Which of course means that even if ASUS has gotten preview versions of Windows 11 to run on systems with this hardware, there's no way to know if the final, retail Windows 11 version will actually offer support for these CPUs. Of course, driver compatibility is also in question, since nothing guarantees Windows 11 to competently manage your hardware on the basis of Windows 10-bound driver packages.

Jon Peddie Research reports the growth of the global PC-based Graphics Processor Units (GPU) market reached 123 million units in Q2'21 and PC CPU shipments increased by 42% year-over-year. Overall, the installed base of GPUs will grow at a compound annual growth rate of 3.5% during 2020-2025 to reach a total of 3,318 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC will grow to reach a level of 25%.

AMD's overall market share percentage from last quarter decreased by -0.2%, Intel's market share increased 0.1%, and Nvidia's market share increased 0.06%, as indicated in the following chart. Overall GPU unit shipments increased by 3.4% from last quarter, AMD shipments increased 2.3%, Intel's shipments rose 3.6%, and Nvidia's shipments increased 3.8%.

Intel's upcoming Alder Lake processor family is set to bring a mixture of big and little cores, combined into one package designed for the hybrid way of computing. Alongside the CPU cores, Intel is also etching integrated graphics into the Alder Lake silicon. However, according to Komachi (@KOMACHI_ENSAKA), there will be Alder Lake SKUs that don't feature a working integrated GPU. Just like we witnessed Intel produce "F" models for its past few generations of Core processors, we could see a re-appearance of the F SKUs with Alder Lake as well. In the leaked listing, Komachi notes the appearance of Intel Core i5-12600KF, Core i7-12700KF, and Core i9-12900KF.

All of the listed models are overclockable SKUs, just with their integrated graphics disabled. Just like the previous generation, Intel decided to introduce this SKU, giving customers a few benefits with the non-functional iGPU. As there is no GPU to produce heat, overclocking efforts could be much better on the "F" SKUs. In addition to that, these SKUs could be a bit cheaper compared to the regular models, saving the buyers some spare cash if they are going to purchase a 3rd party dedicated GPU anyway.

We recently saw the Intel Core i7-12700 appear on Geekbench 5 where it traded blows with the AMD Ryzen 7 5800X, we have now discovered the flagship Core i9-12900K also making an appearance. The benchmarked Intel Core i9-12900K features a hybrid design with 8 high-performance cores, 8 high-efficiency cores, and 24 threads running at a base clock of 3.2 GHz. The test was performed on a Windows 11 Pro machine allowing for full use of the Intel Thread Director technology paired with 32 GB of DDR5 memory. The processor achieved a single-core score of 1834/1893 in the two tests which gives it the highest score on the official Benchmarks coming in 12% faster than the Ryzen 9 5950X. The processor also achieved an impressive multi-core score of 17299/17370 which places it 3% above the Ryzen 9 5950X and 57% above the previous generation flagship 8-core i9-11900K. These leaked benchmarks highlight the impressive potential of Intel's upcoming 12th Generation Core series which is expected to launch in November.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, confirms compatibility with the upcoming Intel 12th Gen Alder Lake CPU and announces the availability of LGA 1700 mounting kits for its current and future multi-socket desktop CPU coolers.

ENERMAX's LGA 1700 mounting kits will offer full compatibility with the new LGA 1700 socket for its CPU cooler lineups. In addition to LGA 1700, the coolers will continue to include mounting hardware for the previous generation Intel platform (LGA 2066, LGA 2011, LGA 1156, LGA 1155, LGA 1151, LGA 1150, LGA 1200) as well as AMD (AM4/AM3+/AM3/AM2+/AM2/FM2+/FM2/FM).

NAND Flash suppliers' Clients in the data center segment were gradually stepping up enterprise SSD procurement after finishing inventory adjustments, according to TrendForce's latest investigations. Moreover, the adoption rate of 4/8 TB products in the enterprise SSD market increased substantially on account of the releases and adoption of the new server processor platforms from Intel and AMD. Although the recent wave of COVID-19 outbreaks that struck Southeast Asia weakened smartphone sales in 2Q21, the quarterly total NAND Flash bit shipments rose by nearly 9% QoQ, as PC OEMs still had plenty of component orders in 2Q21 due to the fairly robust notebook demand during the period. On the other hand, the shortage of controller ICs became more severe during the period, and the winter storm that battered Texas this February affected the operation of Samsung's foundry fab Line S2 in Austin. As demand for NAND Flash products rose, the overall ASP also rose by nearly 7% QoQ, and the quarterly total NAND Flash revenue rose by 10.8% QoQ to US$16.4 billion in 2Q21.

CPU-Z, the software of choice for monitoring the CPU and its attributes, has yesterday been updated to version 1.97, which brings much-needed and interesting features. For starters, the new version adds support to detect Intel Core i9-12900K, Core i7-12700K, and Core i5-12600K "Alder Lake" CPUs and the Intel Z6xx chipset platform. Those specific SKUs are the top of the line in their respective categories, and it is only logical that support for the new generation starts there.

Next up, the software now supports detection of the latest DDR5 DRAM technology, which can now also be detected along with the new XMP 3.0 profile format. Last but not least, the software is adding detection for AMD's Radeon RX 6600 XT GPU as well.

To download the latest update, head over to our downloads section. If you wanna get pinged automagically when a new version is released, select the yellow "Get Notified" button on that same page.

Intel Vice President and General Manager of Client Graphics Products and Solutions Roger Chandler has recently announced that the companies upcoming Arc gaming graphics cards will include overclocking support at launch through the official driver UI. This offering may resemble that of AMD's with their Radeon Software that offers various overclocking tools including clock speeds, power settings, and fan curves. Intel has also been working on various other driver improvements in the lead-up to release including enhancing shader compiling and improving throughput. The post also confirmed the implementation of complete DirectX 12 Ultimate compliance which will enable variable-rate shading tier 2 and mesh shading. Intel is expected to release the first Arc gaming graphics cards for desktops and notebooks in Q1 2022.

IntelWe're even integrating overclocking controls into the driver UI to give enthusiasts the tools they need to push the hardware to the limit.

The Intel Core i9-12900K has made another appearance this time on the PugetBenchmark website paired with an ASUS ROG Strix Z690-E Gaming WiFi motherboard. The Core i9-12900K is the flagship processor in Intel's upcoming 12th Generation Core Series featuring a hybrid core design with 8 high-performance cores, 8 high-efficiency cores, and 24 threads. The processor was paired with 64 GB of DDR5 4800 MHz memory and an RTX 3090 where it scored similarly to the Core i9-11900K in the GPU-focused Adobe After Effects test. While this test has limited use in determining the processor's performance it may signify the start of more leaks to come. The score pages have now been removed from the PugetBench site however they can still be accessed from the Internet Archive. The Intel Core i9-12900K along with the entire 12th Generation Core Series is now expected to launch in November with DDR5 and PCIe 5.0 support on the new LGA1700 socket and Z690 chipset.

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

AMD might fall behind Intel on PCI-Express Gen 5 support, say sources familiar with the recent GIGABYTE ransomware attack and ensuing leak of confidential documents. If you recall, AMD had extensively marketed the fact that it was first-to-market with PCI-Express Gen 4, over a year ahead of Intel's "Rocket Lake" processor. The platform block-diagram for Socket AM5 states that the AM5 SoC puts out a total of 28 PCI-Express Gen 4 lanes. 16 of these are allocated toward PCI-Express discrete graphics, 4 toward a CPU-attached M.2 NVMe slot, another 4 lanes toward a discrete USB4 controller, and the remaining 4 lanes as chipset-bus.

Socket AM5 SoCs appear to have an additional 4 lanes to spare than the outgoing "Matisse" and "Vermeer" SoCs, which on higher-end platforms are used up by the USB4 controller, but can be left unused for the purpose, and instead wired to an additional M.2 NVMe slot on lower-end motherboards. Thankfully, memory is one area where AMD will maintain parity with Intel, as Socket AM5 is being designed for dual-channel DDR5. The other SoC-integrated I/O, as well as I/O from the chipset, appear to be identical to "Vermeer," with minor exceptions such as support for 20 Gbps USB 3.2x2. The Socket has preparation for display I/O for APUs from the generation. Intel's upcoming "Alder Lake-S" processor implements PCI-Express Gen 5, but only for the 16-lane PEG port. The CPU-attached NVMe slot, as well as downstream PCIe connectivity, are limited to PCIe Gen 4.

Server and workstation users will soon be able to mount all Eisblock XPX Pro models and the Eisbaer Pro AIO on the LGA 4189 socket. The corresponding bracket will soon be available as an option. Owners of an XPX Pro cooler or the Eisbaer PRO AIO can contact Alphacool with their invoice to receive a free bracket: info@alphacool.com

All Eisblock XPX coolers and Eisbaer AIOs are already compatible with Intel Socket LGA 1700. If you own an Alphacool Eisblock XPX cooler and looking to upgrade to the new Intel Socket 1700, you don't have to worry about additional mounts. All Eisblock XPX coolers are already compatible with the new socket LGA 1700 with the included mounting material. A corresponding new manual for all coolers of the Alphacool Eisblock XPX series will be available online when the socket is released. All Eisbaer CPU AIO water coolers are also compatible with Socket 1700 with the enclosed mounting kit.

Intel's upcoming Xeon "Sapphire Rapids" processor features a memory interface topology that closely resembles that of first-generation AMD EPYC "Rome," thanks to the multi-chip module design of the processor. Back in 2017, Intel's competing "Skylake-SP" Xeon processors were based on monolithic dies. Despite being spread across multiple memory controller tiles, the 6-channel DDR4 memory interface was depicted by Intel as an advantage over EPYC "Rome." AMD's first "Zen" based enterprise processor was a multi-chip module of four 14 nm, 8-core "Zeppelin" dies, each with a 2-channel DDR4 memory interface that added up to the processor's 8-channel I/O. Much like "Sapphire Rapids," a CPU core from any of the four dies had access to memory and I/O controlled by any other die, as the four were networked over the Infinity Fabric interconnect in a configuration that essentially resembled "4P on a stick."

With "Sapphire Rapids," Intel is taking a largely similar approach—it has four compute tiles (dies) instead of a monolithic die, which Intel says helps with scalability in both directions; and each of the four compute tiles has a 2-channel DDR5 or 1024-bit HBM memory interface, which add up to the processor's 8-channel DDR5 total I/O. Intel says that CPU cores from each tile has equal access to memory, last-level cache, and I/O controlled by another die. Inter-tile communication is handled by EMIB physical media (55 micron bump-pitch wiring). UPI 2.0 makes up the inter-socket interconnect. Each of the four compute tiles has 24 UPI 2.0 links that operate at 16 GT/s. Intel didn't detail how memory is presented to the operating system, or the NUMA hierarchy, however much of Intel's engineering effort appears to be focused on making this disjointed memory I/O work as if "Sapphire Rapids" were a monolithic die. The company claims "consistent low-latency, high cross-sectional bandwidth across the SoC."

It's happening, Intel is taking a very pointy stab at the AAA gaming graphics market, taking the fight to NVIDIA GeForce and AMD Radeon. The Arc "Alchemist" discrete GPU implements the Xe HPG (high performance gaming) graphics architecture, and offers full DirectX 12 Ultimate compatibility. It also offers contemporary features gamers want, such as XeSS, an AI-supersampling feature rivaling DLSS and FSR. There's a lot more to the Xe HPG architecture than being a simple a scale-up from the Xe LP-based iGPUs found in today's "Tiger Lake" processors.

Just like Compute Units on AMD GPUs, and Streaming Multiprocessors on NVIDIA, Intel designed a scalable hierarchical compute hardware structure for Xe HPG. It begins with the Xe-core, an indivisible compute building block that contains 16 each of 256-bit vector engines and 1024-bit matrix engines. combined with basic load/store hardware and an L1 cache. The vector unit here is interchangeable with the execution unit, and the Xe-core contains 16 of these. The Render Slice is a collective of four Xe-cores, four Raytracing Units; and other common fixed-function hardware that include the geometry pipeline, rasterization pipeline, samplers, and pixel-backends. The Raytracing Units contain fixed-function hardware for bounding-box intersection, ray traversal, and triangle intersection.

When early benchmarks of the Core i9-12900K "Alder Lake-S" processor showing performance comparable to AMD's top 16-core Ryzen 9 5950X surfaced, we knew something was up. 8 Intel P-cores and 8 E-cores, are able to match 16 "Zen 3" cores that are all performance cores. Apparently Intel is able to turn its P-core deficit around by taking a wacky approach. First, the 8 "Golden Cove" P-cores themselves offer significantly higher IPC than "Zen 3." Second, the 8 "Gracemont" E-cores aren't as "slow" as conventional wisdom would suggest.

Intel in its Architecture Day presentation put out some astounding numbers that help support how 8 big + 8 little cores are able to perform in the league of 16 AMD big cores. Apparently, on "Alder Lake-S," the 8 "Gracemont" E-cores enjoy a lavish power budget, and are able to strike an incredible performance/Watt sweet-spot. Intel claims that the "Gracemont" E-core offers 40% higher performance at ISO power than a "Skylake" core (Intel's workhorse P-core for desktops until as recently as 2020); which means it consumes 40% less power at comparable performance.

Intel will beat AMD to next-generation I/O, with its 12th Generation Core "Alder Lake-S" desktop processors. The company confirmed that the processor will debut both DDR5 memory and PCI-Express Gen 5.0, which double data-rates over current-gen DDR4 and PCI-Express Gen 4, respectively. "Alder Lake-S" features a dual-channel DDR5 memory interface, with data-rates specced to DDR5-4800 MHz, more with overclocking, reaching enthusiast-grade memory attaining speeds in excess of DDR5-7200. Besides speed, DDR5 is expected to herald a doubling in density, with 16 GB single-rank modules becoming a common density-class, 32 GB single-rank being possible in premium modules; and 64 GB dual-rank modules being possible soon. Leading memory manufacturers have started announcing their first DDR5 products in preparation of "Alder Lake-S" launch in Q4-2021.

The memory controller is now able to dynamically adjust memory frequency and voltage, depending on current workload, power budget and other inputs—a first for the PC! This could even mean automatic "Turbo" overclocking for memory. Intel also mentioned "Enhanced Overclocking Support" but didn't go into further detail what that entails. While DDR5 is definitely the cool new kid on the block, Intel's Alder Lake memory controller keeps support for DDR4, and LPDDR4, while adding LPDDR5-5200 support (important for mobile devices). Just to clarify, there won't be one die support DDR5, and another for DDR4, no, all dies will have support for all four of these memory standards. How that will work out for motherboard designs is unknown at this point.

In its 2021 Architecture Day presentation, Intel revealed that its first performance gaming GPU, the Arc "Alchemist," is built on the TSMC N6 silicon fabrication node (6 nm). A more advanced node than the N7 (7 nm) used by AMD for its current RDNA2 GPUs, TSMC N6 leverages EUV (extreme ultraviolet) lithography, and offers 18% higher transistor density, besides power improvements. "With N6, TSMC provides an optimal balance of performance, density, and power-efficiency that are ideal for modern GPUs," said Dr Kevin Zhang, SVP of Business Development at TSMC.

With working prototypes of "Alchemist" already internally circulating as the "DG2," Intel has beaten AMD to 6 nm. Team Red is reportedly planning optical-shrinks of its RDNA2-based "Navi 22" and "Navi 23" chips to TSMC N6, and assigning them mid-range SKUs in the Radeon RX 7000 series. The company will build two higher-segment RDNA3 GPUs on the more advanced TSMC N5 (5 nm) process, which will release in 2022, and power successors to the RX 6700 series and RX 6800/6900 series.