Elitegroup Computer Systems (ECS), the global leading motherboard, Mini-PCs, Notebooks, mobile device and smart city solutions provider, is proud to present the high performance, power efficient and multi-tasking mini PC - LIVA Z3 & Z3E. They build in powerful and multi-functional Intel Jasper Lake Pentium & Celeron processors with up to 16 GB DDR4 dual-channel memory technology, and is expandable through the M.2 socket to meet various needs. LIVA Z3 & Z3E also equip with the latest 802.11ax technology to effortlessly support your wireless connection. They support dual-screen output via HDMI 2.0 and mini DisplayPort both up to 4K high-quality resolution. It is not only suitable for commercial office, remote office, online learning and home entertainment, but also an alternative option for smart digital signage, smart education and self-service kiosk and so forth to broaden your business!

The LIVA Z3 & Z3E feature Intel Pentium & Celeron processors, up to 35% higher processing power than the previous generation. They adopt eMMC 5.1 128 GB as the storage capacity and DDR4 dual-channel 16 GB memory, which accelerate system performance and improve response speed as well. Furthermore, the M.2 PCIE 2280 interface for SSD and 2.5" SATA interface for HDD/ SSD assist users to easily tackle the daily tasks by experiencing a compact PC.

Based on the Intel 600-series chipset leak earlier today, it was easy to conclude that all 600-series motherboards would be getting PCIe 5.0 support, but alas, that is not the case. We've already seen some rock bottom Z690 without PCIe 5.0 and thanks to Videocardz we now know that Gigabyte's B660 Gaming X DDR4 will also lack PCIe 5.0 support.

How do we know this board doesn't support PCIe 5.0? First of all, the x16 slot closest to the CPU uses one of Gigabyte's older reinforced PCIe 4.0 slots, whereas all of its Z690 boards with PCIe 5.0 support uses a new, white type of slot. These slots use a visually different kind of reinforcement as well, even if it's only marginally different. However, Gigabyte doesn't appear to be silk screening PCIe 5.0 on supported boards and it's possible that they're using a different slot vendor for the B660 boards.

Unlike Intel and Qualcomm, Samsung seems to be far more pessimistic about the current chip supply issues, as the company isn't expecting the chip shortage to be resolved next year. Admittedly this information comes via a meeting of its mobile divisions top brass, but considering that the mobile division is using a significant amount of various chips for its products, it would seem that the information is reliable.

The two biggest shortages for Samsung's mobile division will continue to be application processors (also known as SoCs) and radio frequency (RF) components. Considering that these are key components of any modern smartphone, it's not hard to see why Samsung would be concerned. What we don't know is how much of an advantage Samsung's various business units have when they work with Samsung's foundries and we might have reached a point where the highest bidder wins the allocation.

Intel is preparing to significantly expand its 12th Gen Core "Alder Lake" desktop processor series next January, alongside more motherboard chipset choices for the client-desktop segment. These include the H670, the B660, and the H610. The H670 offers most of the I/O features of the top Z690 chipset, but you lose out on CPU overclocking. The B660 is the mid-tier option, and while you still get a formidable I/O feature-set, the chipset bus is narrower. The H610 is the entry-level chipset with very basic I/O, and no CPU-attached NVMe slots. The interesting thing is that all these chipsets support PCI-Express 5.0 x16 (PEG) from the CPU, but leave it to the motherboard vendors whether they want to implement it. There do exist Z690 motherboard that lack Gen 5 PEG (and only feature Gen 4).

The chipset-attached downstream PCIe also varies greatly across the lineup. The top Z690 part puts out 12 Gen 4 lanes besides 16 Gen 3 lanes; while the H670 puts out 12 each of Gen 4 and Gen 3. The B660 puts out 6 Gen 4 lanes and 8 Gen 3 lanes. The H610 completely lacks downstream Gen 4, and only puts out 8 Gen 3 lanes. The H670 and B660 put out up to two 20 Gbps USB 3.2 Gen 2x2 ports; while the H610 lacks 20 Gbps ports. All chipset models put out at least two 10 Gbps Gen 2x1 ports; and at least four 5 Gbps Gen 1x1 ports. An interesting aspect of the lineup is that Intel is allowing memory overclocking across H670 and B660 chipsets, provided the CPU supports it.

With the full support of Intel's board of directors, Intel today announced its intention to take Mobileye public in the United States in mid-2022 via an initial public offering (IPO) of newly issued Mobileye stock. The move will unlock the value of Mobileye for Intel shareholders by creating a separate publicly traded company and will build on Mobileye's successful track record and serve its expanded market.

Intel will remain the majority owner of Mobileye, and the two companies will continue as strategic partners, collaborating on projects as they pursue the growth of computing in the automotive sector. The share of semiconductors is expected to be 20% of a premium vehicle's total bill-of-materials (BOM) by 20301. The Mobileye executive team will remain, with Prof. Amnon Shashua continuing as the company's CEO. Recently acquired Moovit as well as Intel teams working on lidar and radar development and other Mobileye projects will be aligned as part of Mobileye.

January 4, 2022 could be a date of major product announcements by both AMD and Intel as part of their International CES 2022 plans. Both companies will host virtual press-meets on that day, and are expected to unveil several product lines. AMD could shed more like on its Ryzen "Vermeer-S" Socket AM4 desktop processors, possible updates to its Ryzen 5000 mobile product stack; as well as put out some juicy nuggets of info on its future "Zen 4" processors; while Intel will significantly expand its 12th Gen Core "Alder Lake" family across both its desktop and mobile segments, along with more info on its Arc "Alchemist" gaming GPU. The AMD event is slated for 8 AM Pacific, while the Intel one goes up two hours later, at 10 AM Pacific. We will be live-blogging both.

Intel is reportedly in talks with TSMC to secure foundry allocation to meet its product roadmap execution. The company is sending an executive delegation to meet with TSMC later this month, to secure foundry capacity for the N3 (3 nm) silicon fabrication node, and ensure that Intel's allocation isn't affected by other customers such as Apple. As part of its IDM 2.0 strategy, Intel has decided to build its products essentially as multi-chip modules with each block of IP built on a silicon fabrication node most optimal to it, so the company maximizes cutting-edge foundry nodes only on the technology that benefits from it the most. N3 will play a vital role with logic/compute tiles in products bound for 2023, as N3 hits critical volume in the first half of the year.

In related news, Intel CEO Pat Gelsinger speaking at the Fortune Brainstorm Tech conference, stressed on the importance for American chip designers to seek out semiconductor manufacturing in America, and cautioned against investing in Taiwan (without naming TSMC). This comes in the wake of geopolitical uncertainty in the region. In response to this statement issued to DigiTimes, TSMC CEO Mark Liu downplayed the matter, and said that Gelsinger's statement wasn't worth responding to, and that he doesn't slander industry colleagues. TSMC and Samsung have each announced multi-billion Dollar foundry investments in the US, in attempts to make the global semiconductor supply chains resilient to any security situation that may emerge in East Asia.

According to a new research report from the analyst firm Jon Peddie Research, unit shipments of add-in boards increased in Q3'21 from last year. AMD saw a one-percent increase in market share while Nvidia remained the dominant market share leader with 78.2%. Year over year, total AIB shipments increased by 25.7% this quarter compared to last year at 12.7 million units, and up quarter-to-quarter from 11.47 million units in Q2'21.

Add-in boards (AIBs) use discrete GPUs (dGPU) with dedicated memory. Desktop PCs, workstations, servers, rendering and mining farms, and scientific instruments use AIBs. Consumers and enterprises buy AIBs from resellers or OEMs. They can be part of a new system or installed as an upgrade to an existing system. Systems with AIBs represent the higher end of the graphics industry. Entry-level systems use integrated GPUs (iGPU) in CPUs that share slower system memory.

The National Renewable Energy Laboratory (NREL) has selected Hewlett Packard Enterprise (HPE) to build its third-generation, high performance computing (HPC) system, called Kestrel. Named for a falcon with keen eyesight and intelligence, Kestrel's moniker is apropos for its mission—to rapidly advance the U.S. Department of Energy's (DOE's) energy research and development (R&D) efforts to deliver transformative energy solutions to the entire United States.

Installation of the new system will begin in the fall of 2022 in NREL's Energy Systems Integration Facility (ESIF) data center. Kestrel will complement the laboratory's current supercomputer, Eagle, during the transition. When completed—in early 2023—Kestrel will accelerate energy efficiency and renewable energy research at a pace and scale more than five times greater than Eagle, with approximately 44 petaflops of computing power.

Since Intel CEO Pat Gelsinger joined the company earlier this year, the messaging language from Intel has changed radically, as it has become a no-nonsense message of Intel going back to its roots as a leading foundry and a leading chip maker. However, Gelsinger might've overstepped a little bit as of lately, as during a conference in California, he went on record saying that Intel deserves special treatment by the US government, in favor of some of its competitors.

At the same time, it's not hard to see why Intel thinks the US government should favor it and other US companies like Micron and Texas Instruments, over Samsung and TSMC. However, Intel's selling argument here is that investing in non-US companies means that the R&D money and IP ends up abroad, which isn't entirely true when it comes to foundries. Gelsinger also complained about the fact that Samsung and TSMC was getting large government subsidies in their home countries and claimed that because of those subsidies, Intel was competing with Korea and Taiwan, rather than with Samsung and TSMC.

Intel's next entry-level processor for the Socket LGA1700 platform is the Core i3-12100. Carved out of the "Alder Lake-S" H0 silicon, this processor features 4 "Golden Cove" performance cores with HyperThreading enabling 8 logical processors, and no E-cores. The processor ticks at 3.30 GHz, with 4.30 GHz Turbo Boost 2.0 frequency. Each of the four cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The i3-12100 gets a Gen12 Xe LP-based iGPU, while a variant of the processor, the i3-12100F, lacks integrated graphics. Intel is rating the processor base power value at 60 W, with 77 W maximum turbo power.

XFastest scored an i3-12100 engineering sample, and wasted no time in comparing it with the Ryzen 3 3300X. The i3-12100 was tested on an ASRock Z690 Steel Legend motherboard that has DDR4 memory slots. 16 GB of dual-channel DDR4-3600 memory and RTX 3060 Ti were used on both the Intel and AMD test-beds. A Ryzen 3 3100 was also used on the AMD side. Right off the bat, we see the i3-12100 take a significant lead over the AMD chips at PCMark, posting a roughly 15% performance lead. Cinebench R23 is another test where the little "Alder Lake" scores big, posting a roughly 26% performance lead in the multi-threaded test, and 27% in the single-threaded test. This is mainly because the 3300X is based on "Zen 2" while the i3-12100 uses the cutting-edge "Golden Cove" cores. AMD hasn't bothered with "Zen 3" based Ryzen 3 desktop processors in the retail market.

MinisForum, a small mini PC manufacturer, is famous for its Ryzen series mini PC. Earlier this month they released information about their upcoming Ryzen 5000X series mini PC which will comes with a dedicated graphics card. It is still not sure when they will launch this Ryzen mini PC. But we can expect that there is Intel chip mini PC coming soon from them.

The previous Intel chip mini PC from MinisForum was TL50, which is equipped with Intel core i5-1135G7 processor and was launched in May. The new model, called TH50, is going to be more powerful which will come with Intel Core i5-11320H Processor. It is 4-core/8-thread. Base clock can vary from 2.5 to 3.2 GHz based on the TDP setting and can be boosted up to 4.5 GHz (while i5-1135G7 can run from 0.9/2.4 GHz to 4.2 GHz).

Here are some of the first pictures of the 12th Gen Intel Core "Alder Lake" desktop processor models that are expected to join the lineup in January 2022. Intel debuted the series with unlocked "K" and "KF" SKUs, with "locked" SKUs saved for next year. Pictured here are the Core i9-12900, the Core i5-12600, the i5-12500, and the i5-12400. The S-SPEC codes for these processors are SRL4E, SRL4F, SRL4G, and SRL4P, respectively. Our older article details their possible specifications. The lineup isn't limited to these models. Others include the Core i7-12700, and the "F" variants of many of these SKUs, which lack integrated graphics, allowing those with discrete graphics cards to save a little.

Besides these processors, Intel is expected to expand its motherboard chipset options. Currently, Z690 is the only chipset option for the LGA1700 socket. Upcoming chipset models are likely to include the H670, W680, B660, and perhaps even the H610. Intel could use platform I/O for segmentation of these chipsets, besides lack of CPU overclocking support. A big change with the 12th Gen desktop processor lineup concerns Core i5. While the i5-12600K and i5-12600KF feature 6 P-cores and 4 E-cores, the other Core i5 SKUs, including the i5-12600, lack E-cores. The source installed these processors to confirm that the i5-12600 is indeed based on the "H0" silicon and lacks E-cores.

Today, MSI announced the latest lineup of gaming desktops equipped with Intel 12th Gen Alder Lake processor. Based on a new hybrid architecture, the 12th generation Intel Core processor combines a mix of Performance cores (P-cores) and Efficiency cores (E-cores) to maximize performance, increases multi-thread performance by up to 55%, the gaming performance has more than 13% increase compared to the previous generation.

The full lineup of K Series gaming desktops adopted DDR5 memory with read speed up to 60% higher than the previous generation equipped with DDR4. Support for PCIe 5 which is primed to provide speedy and improved transmission. Additionally, MSI has also upgraded MSI Center and MSI App Player. The new MSI Center helps to control and customize your system. With innovation in MSI App Player, it is easier to play mobile games on the PC. The lineup also features 2.5G Ethernet LAN and Wi-Fi 6E to offer faster data transfer speeds. MSI launched 3 models of gamer-oriented desktops, including Aegis Series, Trident Series and Codex X5 series to cater towards all types of gamers.

The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce's latest investigations. More specifically, NAND Flash suppliers' hyperscaler and enterprise clients kept up their procurement activities that began in 2Q21 in order to deploy products based on new processor platforms. Major smartphone brands, on the other hand, likewise expanded their NAND Flash procurement activities during the quarter as they prepared to release their new flagship models. As such, clients in both server and smartphone industries made significant contributions to the revenue growth of the NAND Flash industry for 3Q21. At the same time, however, suppliers also warned that orders from PC OEMs began showing signs of decline. On the whole, the industry's quarterly total NAND Flash bit shipment increased by nearly 11% QoQ for 3Q21, and the overall NAND Flash ASP rose by nearly 4% QoQ for the same quarter. Thanks to rising prices and expanding shipments, the quarterly total NAND Flash revenue increased by 15% QoQ to a new record high of US$18.8 billion in 3Q21.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today released the new NVR network surveillance server - QVP-41B - that integrates a Power-over-Ethernet (PoE) switch with sixteen 30-watt Gigabit PoE ports, two RJ45/SFP combo ports, and two 2.5GbE host management ports, supporting all kinds of PoE devices and creating an intelligent surveillance infrastructure. Powered by an Intel Celeron J4125 quad-core processor, the QVP-41B comes with four 3.5-inch SATA drive bays, providing great storage potential and high-speed networking to meet the requirements of monitoring small/medium-sized environments.

"With built-in 140 W PoE and supporting up to 24 cameras, the QVP-41B provides complete network surveillance server capabilities. Surveillance feeds can also be simultaneously recorded and monitored using QNAP's QVR Smart Client application." said Alan Kuo, adding "recorded footage can be intelligently analyzed by using QVR Smart Search, and for large-scale deployments (such as retail) all QVR Pro servers including the QVP-41B can be centrally managed through QNAP's QVR Center."

Jon Peddie Research reports the growth of the global PC-based Graphics Processor Units (GPU) market reached 101 million units in Q3'21 and PC CPUs shipments increased by 9% year over year. Overall, GPUs will have a compound annual growth rate of -1.1% during 2020-2025 and reach an installed base of 3,249 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC will grow to reach a level of 31%.

AMD's overall market share percentage from last quarter increased 1.4%, Intel's market share decreased by -6.2%, and Nvidia's market share increased 4.86%, as indicated in the following chart.

According to some testing performed by the team behind RPCS3, a free and open-source emulation software for Sony's PlayStation 3, Intel's Alder Lake processors are enjoying a hefty performance boost when E-Cores is disabled. First of all, the Alder Lake processors feature a hybrid configuration with high-performance P-cores and low-power E-cores. The P-cores are based on Golden Cove architecture and can execute AVX-512 instructions with ease. However, the AVX-512 boost is only applicable when E-cores are disabled as software looks at the whole package. Officially, Alder Lake processors don't support AVX-512, as the processor's little E-cores cannot execute AVX-512 instruction.

Thanks to the team behind the RPCS3 emulator, we have some information and tests that suggest that turning E-cores off gives a performance boost to the emulation speed and game FPS. With E-Cores disabled, and only P-cores left, the processor can execute AVX-512 and gets a higher ring ratio. This means that latency in the ring bus is presumably lower. The team benchmarked Intel Core i9-12900K, and Core i9-11900K processors clocked at 5.2 GHz for tests. The Alder Lake chip had disabled E-cores. In God of War: Ascension, the Rocket Lake processor produced 68 FPS, while Alder Lake produced 78 FPS, representing around 15% improvement.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

With Intel's Alder Lake processors released, the company introduced a rather interesting concept of mixing high-performance and high-efficiency cores into one design. This hybrid approach combines performance P-cores based on Golden Cove architecture with high-efficiency E-cores based on Gracemont design. While Intel dedicated a lot of effort to optimizing software for Alder Lake, there are sometimes issues that persist when playing older games. At the heart of ADL processors, a thread scheduler decides which task is running on P or E-cores and ensures the best core gets selected for the job.

However, many users know that E-cores can be recognized as another system by DRM software and cause troubles on the latest 12th Generation machines. GIGABYTE has designed a software tool for its Z690 motherboards to fix this issue, which allows on-demand enablement of E-cores. Users can easily "park" or "unpark" E-cores and enable some older game titles to run efficiently with the help of P-cores. This DRM Fix Tool is a lightweight utility that unfortunately runs exclusively on GIGABYTE motherboards. It is less than a megabyte in size and requires no particular installation. However, it is an excellent addition to GIGABYTE's customers, and all that it needs is the latest BIOS update to run. Here you can download the tool, and below, you can see the list of the latest BIOS versions of GIGABYTE Z690 motherboards that support this tool.

Intel has dominated the client Wi-Fi + Bluetooth network adapter market in the PC space for some time now, particularly with WiFi 6 and WiFi 6E interfaces integrated with motherboards. Even on the AMD platform, motherboard vendors have extensively packaged not just Intel-branded WiFi + Bluetooth modules, but also their wired LAN controllers. In the commercial desktop and commercial notebook markets, Intel leverages this position to push its vPro management suite, with Intel WLAN controllers featuring vPro support. This is something felt lacking in the rival AMD PRO ecosystem, and something the company is looking to change with its collaboration with MediaTek.

AMD RZ660 will be the first controller based on this partnership. Based on the MediaTek Filogic 330P chipset, the controller combines WiFi 6E (6 GHz), with the latest generation Bluetooth (at least Bluetooth 5.2). Driver software and support for this solution will be handled by AMD, as would distribution. MediaTek stated that the first notebooks and desktop PCs (includes DIY motherboards) featuring the AMD RZ660 will debut in 2022. The AMD-supplied driver software would also enable the company to create special "PRO" variants of the RZ660 to bundle with its Ryzen PRO SoCs for the commercial PC and workstation markets. There doesn't appear to be any such collaboration with wired Ethernet, as there is an even competition between Intel and Realtek over the 2.5 GbE PHY market, with both companies offering gaming-specific variants—Intel Killer and Realtek DragonLAN.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).

According to an industry report by IC Insights, AMD will see a yearly growth rate of no less than 65 percent this year, compared to 2020, whereas Intel is expected to have a slightly negative growth rate of one percent. The report includes the top 25 semiconductor sales leaders, ranked by growth rate, although it should be pointed out that some of them are foundries and not just semiconductor companies.

AMD is closely followed by MediaTek, which is expected to reach a 60 percent growth rate this year, followed by Nvidia at 54 percent and Qualcomm and 51 percent growth. The only surprise in the top five is PRC based SMIC, which saw a 39 percent growth this year, despite, or maybe because of the US sanctions against various Chinese IC makers.

Qualcomm has been in the game of creating SoCs for the PC market with the company's Snapdragon lineup. These processors mainly were beefed-up versions of their mobile designs and were based on the Arm instruction set architecture (ISA). Microsoft has backed this effort by creation Windows-on-Arm (WoA) project that enables the Windows OS to operate on Arm processors. However, up until now, Qualcomm's designs were not very powerful as they represented a relatively moderate approach to the problem and almost made no sense of purchase compared to the standard laptops equipped with x86 processors from AMD and Intel. This is about to change.

According to the news from Investor Day yesterday, Qualcomm is preparing high-performance Arm SoCs for the PC market. The company has recently acquired Nuvia Inc., a startup focused on creating novel IPs based on Arm ISA. And this is what Qualcomm will use in building its next-generation PC processors. As the company plans, in August of 2022, it should start sampling OEM partners with these new chips, and we will be seeing them in consumers' hands in early 2023. If everything goes as planned, this should represent direct competition to AMD, Intel, and now Apple in the high-end SoC market. After PCs, the company plans to tackle datacenter, mobile, and automotive market.