G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the availability of the latest Trident Z Royal Elite memory series, along with the introduction of new high-speed, low-latency performance memory specifications at DDR4-4000 CL14-15-15-35 and DDR4-3600 CL14-14-14-34. Built with Samsung 8 Gb B-die ICs to achieve these incredibly low latency timings, these new DDR4 memory specifications are the ideal choice for building a powerful workstation or the ultimate gaming system.

G.SKILL is dedicated to developing high-speed, low-latency memory kits for high performance PC systems, and achieving an extremely low CL14 latency on high-speed dual-ranked memory modules is no easy feat. Created with Samsung B-die ICs, G.SKILL is launching the incredible DDR4-4000 CL14-15-15-35 memory specification with 16 GB modules for a 32 GB (16 GB x2) kit capacity. Below is a screenshot showing the memory kit on the ASUS ROG STRIX Z590-E GAMING WIFI motherboard with the Intel Core i7-11700KF processor.

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

Enterprise SSD procurement has been rising on the back of growing server shipments since 2Q21, according to TrendForce's latest investigations. In particular, the share of 8 TB products in shipments of SSDs to data centers has shown the most noticeable growth, which is expected to persist through 3Q21. However, certain SSD components and parts may be in shortage due to insufficient foundry capacity. TrendForce is therefore revising the QoQ hikes in contract prices of enterprise SSDs for 3Q21 to 10-15% from the previous projection of 5-10%.

TrendForce further indicates that the high demand for enterprise SSDs in 3Q21 is attributed to several factors. First, North American cloud service providers (hyperscalers) have pretty much completed their inventory adjustments and now continue to expand their storage capacity. Second, the flow of incoming orders to traditional server brands is getting stronger over the quarters as government agencies and SMBs increase their budgets for IT infrastructure. Third, Intel and AMD are ramping up production for server CPUs based on their respective new processor platforms. Following the adoption of new CPUs, the overall demand for enterprise SSDs has also shifted to higher-density products because clients want to upgrade their computing power and storage capacity. Specifically, demand is mainly trending toward 4/8 TB SSDs since raising NAND Flash density can lower the cost of SSD deployment.

Intel is likely targeting a Halloween (October 2021) launch for its 12th Generation Core "Alder Lake-S" desktop processors, along the sidelines of the next-generation Windows PC operating system, which is being referred to in the press as "Windows 11," according to "Moore's Law is Dead," a reliable source of tech leaks. This launch timing is key, as the next-gen operating system is said to feature significant changes to its scheduler, to make the most of hybrid processors (processors with two kinds of CPU cores).

The two CPU core types on "Alder Lake-S," the performance "Golden Cove," and the low-power "Gracemont" ones, operate in two entirely different performance/Watt bands, and come with different ISA feature-sets. The OS needs to be aware of these, so it knows exactly when to wake up performance cores, or what kind of processing traffic to send to which kind of core. Microsoft is expected to unveil this new-gen Windows OS on June 24, with RTX (retail) availability expected in Q4-2021.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to announce the launch of new capacities for TOUGHRAM XG RGB DDR4 Memory Kits, aiming to meet the toughest needs of creators while producing video, animation or exporting large files.

The memory kits are forged with frequencies up to 3600 and 4000 MHz and capacities up to 32 GB (16 GB x2) and 64 GB (32 GB x2). The TOUGHRAM XG RGB series inherits the same craftsmanship and quality expected from the TOUGHRAM name; they are compatible with the latest AMD and Intel motherboards and they have been through rigorous tests to select tightly-screened ICs, designed with a with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. Designed with 2 different colors of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB is ambitioned at providing an exclusive style for users standing out from the normal.

Today, Mr. Raja Koduri, senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel, has teased Intel's upcoming Xe-HPG (DG2) gaming GPU on Twitter. Sharing a die shot of Intel's Xe-HPG design with 512 Execution Units (EUs), Mr. Koduri has highlighted the progress that the company is currently going through. The Xe-HPG will represent the company's efforts of going into a very competitive discrete GPU market, dominated by a duopoly of AMD and NVIDIA. The Xe-HPG design pictured below is representative of a maxed-out SKU with 512 EUs, translating into 4096 shading units. This model is expected to be paired with 16 GB of GDDR6 memory.

"From jittery journeys to buttery smooth" - it is quoted in a Tweet of Mr. Koduri. This doubles down on the efforts Intel is putting into creating a GPU and the difficulties that the company is facing. It is also noted that there remains a lot of work in form of driver coding and a lot of game optimizations, which are very important for the new GPU. You can check out the complete Tweet below.

Raja KoduriXe-HPG (DG2) real candy - very productive time at the Folsom lab couple of weeks ago. "From jittery journeys to buttery smooth" said @rogerdchandler - lots of game and driver optimization work ahead for @gfxlisa's software team. They are all very excited..and a little scared:)

The Beast Canyon NUC 11 Extreme is an upcoming small form factor PC from Intel featuring their latest Tiger Lake-H processors. The processors will be installed on new compute units with options for various Tiger Lake-H SKUs including Core i5, i7, and i9 models. The compute element will also include support for dual-channel DDR4 3200 MHz memory and three M.2 devices. The 8L NUC 11 Extreme enclosure will also feature support for full-length discrete GPUs. The connectivity options for the upcoming NUC include WiFi 6E, Bluetooth 5.2, 2.5/10 GbE, dual Thunderbolt 4 ports, and triple HDMI 2.0b connectors. Intel is expected to provide a "sneak peek" of the NUC 11 Extreme during COMPUTEX 2021.

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

Marvell today announced its new Bravera SC5 controller family, bringing unprecedented performance, best-in-class efficiency, and leading security features to address ever-expanding workloads in the cloud. The massive amount of data to be processed in cloud data centers is driving demand for faster and higher bandwidth storage in these environments. Marvell's Bravera SC5 SSD controllers address the critical requirements for scalable, containerized cloud storage infrastructure. By enabling the highest performing flash storage solutions, Marvell's controllers are poised to be the foundation for data centers that offer ultra-low latency, real-time applications while also providing cost-optimized, cloud-scale capacity.

As the industry's first SSD controllers to support PCIe 5.0 and NVMe 1.4b, Marvell's Bravera SC5 doubles the performance compared to PCIe 4.0 SSDs. This contributes to accelerated workloads and reduced latency, dramatically improving the user experience. In order to meet cloud service providers' stringent security requirements to ensure users' data is safe and protected, the controllers offer FIPS-compliant root of trust (RoT), AES 256-bit encryption and multi-key revocation. The new controllers are the first with a hardware-based Elastic SLA Enforcer to assure quality of service (QoS) and provide metering capabilities per customer to increase overall storage efficiency and utilization while lowering total cost of ownership (TCO).

Intel is preparing its 12th Gen Core "Alder Lake" processors to target not just desktop, but also notebook. The "Alder Lake-P" mobile processor will be Intel's second to implement a hybrid CPU core design (after "Lakefield"). Coelacanth Dream revealed the power level (PL) values of the three key variants of the "Alder Lake-P" silicon. Intel will create broadly three categories of mobile chips targeting specific notebook form-factors—15 W, 28 W, and 45 W. The "Alder Lake-U" 15 W chips are expected to have a PL1 value (interchangeable with the TDP marked on the tin), of 15 W, but its PL2 value, which enables the highest Turbo frequency, can be as high as 55 W.

The next category, the "Alder Lake-U" 28 W chips, have a PL2 value of 64 W. Lastly, the "Alder Lake-H" 45 W chip, which will go into notebooks of conventional thickness, is expected to have a PL2 value of a scorching 115 W. Unless we're mistaken, "Alder Lake-P" is a hybrid processor with up to 6 "Golden Cove" performance CPU cores, and up to 8 "Gracemont" low-power cores. The performance cores feature HyperThreading, and are AVX-512 capable. Unlike the desktop "Alder Lake-S," Intel is investing in a larger iGPU. Based on the Gen12 Xe LP graphics architecture, the iGPU of the "Alder Lake-P" could feature 96 execution units, compared to just 48 on the "Alder Lake-S."

MAINGEAR—an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations—today launched the MAINGEAR ELEMENT Lite, a 15" ultra-premium notebook designed in collaboration with Intel. Featuring Intel Iris Xe Graphics and up to an 11th Gen Intel Core i7 processor, the MAINGEAR ELEMENT Lite pairs next-generation hardware with a sleek and minimal machined aluminium alloy chassis for maximum power, speed, and portability. The new MAINGEAR ELEMENT Lite is the perfect Windows laptop for work and play on the go.

Custom designed and engineered in collaboration with Intel, this uncompromising notebook PC comes equipped with up to an Intel Core i7-1165G7 Processor running at 2.8 GHz with a Max Turbo Frequency of 4.7 GHz on 4 cores / 8 threads. Integrated Intel Iris Xe Graphics make multimedia viewing, content creation, and even light gaming a breeze. ELEMENT Lite systems can be equipped with 16 GB of DDR4 memory and up to 2 TB of user-replaceable PCI-E Gen4 M.2 NVMe SSD storage. MAINGEAR optimized the ELEMENT Lite to pack exceptional performance and cooling into its frame without sacrificing on battery life or upgradeability. It weighs in at just 3.64 lbs (1.65 kg) and is 14.9 mm thin—making it the thinnest notebook that MAINGEAR has ever offered.

Total NAND Flash revenue for 1Q21 increased by 5.1% QoQ to US$14.82 billion, according to TrendForce's latest investigations. In particular, bit shipments rose by 11% QoQ, while the overall ASP dropped by 5% QoQ; hence, bit shipment growth offset the decline in the overall ASP. Although NAND Flash demand from notebook computer and smartphone manufacturers remained high, clients from the data center segment exhibited relatively weak demand, since this segment had yet to leave the state of NAND Flash oversupply. Contract prices for this quarter therefore still mostly showed a considerable QoQ drop. On the other hand, OEMs/ODMs of end products began to increase procurement of NAND Flash products from the second half of January onward because they noticed that the shortage of NAND Flash controller ICs was affecting the production of medium- and low-density storage products. Besides avoiding a possible supply crunch in the future, OEMs/ODMs were placing additional orders because they were preparing for a push to expand market share. On account of these developments, the overall NAND Flash demand surpassed expectations in 1Q21.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

Intel has today confirmed that they have taped in their upcoming 7 nm Meteor Lake compute tile meaning the design is now ready and Intel can proceed to tape out the whole chip. Intel Meteor Lake is rumored to power the 14th Gen Core series of processors which will launch in 2023 and will feature a 7 nm Enhanced SuperFin node. The Meteor Lake series of processors will be Intel's fourth product series to feature a hybrid core design and will support 600 series chipsets expected to launch later this year for 12th generation Alder Lake processors.

Gregory M. BryantGreat way to start the week! We are taping in our 7 nm Meteor Lake compute tile right now.

A well-deserved celebration by the team on this milestone.

SK Hynix is now a step closer to fulfilling its acquisition plans of Intel's NAND and SSD Business. The deal, for $9 billion, has now been cleared by the European Comission. This is in addition to previous approvals garnered from the U.S. Federal Trade Commission last year, and approval from the Committee on Foreign Investment in the United States (CFIUS) this March. Intel and SK Hynix expect all the further required approvals to be obtained throughout 2021.

Per the agreement terms, SK hynix will acquire from Intel the remaining assets, including IP related to the manufacture and design of NAND flash wafers, R&D employees, and the Dalian fab workforce, upon a final closing. SK hynix expects that the transaction would enable SK hynix to grow the memory ecosystem to the benefit of customers, partners, employees and shareholders. Access to Intel's IP and already specialized workforce and plant on memory manufacturing is sure to enable these goals.

A few details have been let out on Intel's next socket, LGA 1700, which will be the one to accept next-gen Alder Lake CPUs. Apparently, Intel's LGA 1700 - which replaces the current LGA 1200 socket) will feature a lower height (by a full [1] millimeter, helping to further reduce socket load) as well as new mounting holes positions for cooling solutions. This would effectively render existing cooling solutions incompatible with Intel's next-gen CPUs - it will be up to your cooling solution provider to offer a new cooler bracket that's compatible with the new LGA 1700 socket. If the manufacturer doesn't, it's likely you'll have to get a newer cooling solution that actually ships with the required adapter.

It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced immediate availability of Cadence IP supporting the PCI Express (PCIe ) 5.0 specification on TSMC N5 process technology. The next follow-on version on TSMC N3 process technology is expected to be taped out in early 2022. Collaboration with major customers is ongoing for N5 SoC designs targeting hyperscale computing and networking applications. The Cadence IP for PCIe 5.0 technology consists of a PHY, companion controller and Verification IP (VIP) targeted at SoC designs for very high-bandwidth hyperscale computing, networking and storage applications. With Cadence's PHY and Controller Subsystem for PCIe 5.0 architecture, customers can design extremely power-efficient SoCs with accelerated time to market.

The Cadence IP for PCIe 5.0 architecture offers a highly power-efficient implementation of the standard, with several evaluations from leading customers indicating it provides industry best-in-class power at the maximum data transfer rate of 32GT/s and worst-case insertion loss. Leveraging Cadence's existing N7/N6 silicon validated offering, the N5 design provides a full 512GT/s (gigatransfers per second) power-optimized solution across the full range of operating conditions with a single clock lane.

Famous chip photographer Fritzchens Fritz has always surprised us with some awesome die shots of the latest processors. Today, he has prepared another interesting surprise for all technology enthusiasts. Mr. Fritz has managed to run Intel's Core i5-11400 "Rocket Lake" processor without any type of colling solution, and use a thermal camera to capture what is happening inside the silicon. As the Rocket Lake design is impossible to run at any low-power setting, the author has made some changes to get a sustained run from the CPU. For starters, he set the operating clock speed to the constant 800 MHz, with iGPU, AVX, and HyperThreading disabled. The VCCSA was offset by -0.200 mV and the memory speed was lowered to DDR4-1333 speed.

The results? Well, the CPU has managed to run some tests without a cooler, and the thermal camera shows us just how the CPU works. As a CPU core gets in use, a thermal camera picks it up and we can see a core sort of spiking. Its temperature increases and it becomes distinctive from the rest of the die. After some time, the CPU became unusable, which is to be expected given that Rocket Lake's power-hungry design managed to survive quite a long time without any sufficient cooling.You can check out the YouTube video below and see the magic happen.

HP introduced its latest gaming hardware and software designed for today's gamers with the powerful OMEN 16 and OMEN 17, bright and customizable OMEN 25i Gaming Monitor, and community gaming with OMEN OASIS Beta feature in OMEN Gaming Hub. The company also debuted Victus by HP, its next-generation mainstream-level gaming PC portfolio, with a 16-inch laptop.

Gaming continues to be an outlet for entertainment and connecting with friends. Two out of three people are spending more time watching videos and gaming than they did prior to the pandemic, with one in four gaming three to four hours more and almost one in five gaming six to ten hours more a week6. HP's next-generation gaming portfolio is designed for both veteran gamers and enthusiast explorers to be entertained, connected, and empowered to progress in their favorite games.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

Intel will detail its 12th Gen Core "Alder Lake" client and "Sapphire Rapids" server CPU microarchitectures at the Hot Chips 33 conclave, this August. In fact, Intel's presentation leads the CPU sessions on the opening day of August 23. "Alder Lake" will be the session opener, followed by AMD's presentation of the already-launched "Zen 3," and IBM's 5 GHz Z processor powering its next-gen mainframes. A talk on Xeon "Sapphire Rapids" follows this. Hot Chips is predominantly an engineering conclave, where highly technical sessions are presented by engineers from major semiconductor firms; and so the sessions on "Alder Lake" and "Sapphire Rapids" are expected to be very juicy.

"Alder Lake" is Intel's attempt at changing the PC ecosystem by introducing hybrid CPU cores, a concept introduced to the x86 machine architecture with "Lakefield." The processor will also support next-generation I/O, such as DDR5 memory. The "Sapphire Rapids" server CPU microarchitecture will see an increase in CPU core counts, next-gen I/O such as PCI-Express 5.0, CXL 1.1, DDR5 memory, and more.

Intel announced its new memory and storage product for client, Intel Optane memory H20 with solid state storage. Delivering innovation in storage through 11th Gen Intel Core processor-based platforms, Intel Optane memory H20 offers a personalized computing experience with a new level of performance and large storage capacity options for gamers, media and content creators, everyday users and professionals.

By combining the best attributes of Intel Optane technology and Intel QLC 3D NAND technology, Intel Optane memory H20 brings together two revolutionary memory and storage technologies on a single M.2 2280 form factor device. The versatile M.2 form factor works in everything from Intel Evo laptops to traditional desktops, as well as all-in-ones and mini-PCs. Providing improved performance and responsiveness with lower power consumption compared with the prior-generation product, Intel Optane memory H20 accelerates what you use most, from everyday tasks to managing large media and gaming files and applications.

XMG introduces an additional configuration variant to the high-end NEO range of gaming laptops with Intel's new Tiger Lake H45 processors. The eight-core CPUs from the 11th Core generation not only offer higher performance compared to their predecessors, but also boast the advantages of a completely updated platform. These includes support for PCI Express 4.0 and Thunderbolt 4 - features that the AMD version of the XMG NEO cannot offer. In addition, the models utilising the new Intel processor also benefit from a slight performance increase on the graphics card side. The GPU in the XMG NEO 15 and NEO 17 (M21) now operates with a TGP of up to 165 instead of 150 watts.

The discrete GPU market has been a duopoly for quite some time, and when Intel announced that the company is rebooting plans for its discrete GPU lineup, another player was about to break that duopoly. Today, that has been changed forever and Intel has officially become the third manufacturer of discrete GPUs, as we can see on the online listing. On BestBuy, CyberPowerPC has listed "Gamer Xtreme Gaming Desktop" powered exclusively by Intel components. When it comes to the CPU choice, Intel's 6C/12T Core i5-11400F CPU model is present without iGPU. Now comes the interesting part. The GPU powering the system is Intel Iris Xe discrete graphics card, which is a DG1 GPU based on Xe-LP SKU.

This model features 80 EUs, resulting in 640 shading units. While this is not any gaming beast, casual 1080p gaming should be just fine on this configuration. The system is listed for 750 US Dollars, and it is sold out, as of the time of writing this. While the performance of this configuration may not be something monumental, it is an important step towards Intel's inclusion in the discrete GPU market. By using OEMs, the GPU will reach a very large market without any major problems. We are waiting to see the first reviews of the system, which will surely take a good look at the card and examine its performance.

Join Intel Executive Vice President Michelle Johnston Holthaus for Intel's first virtual COMPUTEX keynote and a firsthand look at how the strategies of new CEO Pat Gelsinger, along with the forces of a rapidly accelerating digital transformation, are unleashing a new era of innovation at Intel — right when the world needs it most.

Johnston Holthaus will welcome Intel's Steve Long, corporate vice president of Client Computing Group Sales, and Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group, to outline how Intel innovations help expand human potential by expanding technology's potential. This includes collaborating with partners to drive innovation across the technology ecosystem — from the data center and cloud to connectivity, artificial intelligence, and the intelligent edge.