The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.3 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency. Designed to Game: With its new 11th Gen desktop processors, Intel continues to push desktop gaming performance to the limits and deliver the most amazing immersive experiences for players everywhere.Read the TechPowerUp Reviews of the Core i9-11900K and Core i5-11600K.

Intel Core i9-11900K processor, the flagship model from the 11th generation "Rocket Lake" CPU lineup, has been overclocked to more than 7 GHz by the "Rog-Fisher". Thanks to the report coming from VideoCardz, we have information that the top-end Rocket Lake processor is possibly a very good overclocker. Running at 7048 MHz, the CPU managed to achieve that frequency using "only" 1.873 V. There is no doubt that the system was being cooled by LN2, as such overclocks need it to remain stable, however, we don't have any data on that. The CPU was paired with the ASUS ROG Maximus XIII Apex motherboard, designed for extreme overclocking purposes.

It is important to note that the CPU didn't run any benchmarks, as it was just validated at that frequency by Valid x86. The sample was likely supplied by Intel, so it could be a cherry-picked model. For the official benchmark results of Rocket Lake processors, we have to wait until tomorrow (March 30th), when NDA lifts.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is proud to introduce its extremely compact fanless embedded system, the eBOX560-52R-FL. This palm-sized embedded system is powered by the onboard Intel Core i5-8365UE or Intel Celeron 4305UE processors (codename: Whisky Lake-U). It provides high-performance, power-efficient, and abundant I/O interfaces in a compact device. The eBOX560-52R-FL is highly suitable for space-constrained applications with strict performance requirements such as industrial equipment computers, in-cabinet equipment integration, collaborative robots, and more.

"Axiomtek's eBOX560-52R-FL is designed to provide customers with flexible, convenient, and simplified solutions for industrial and embedded applications. The fanless yet low-power embedded system can operate under wide temperatures ranging from -10°C to 50°C with 0.7 m/s airflows and endure up to 50G shock and 3Grms vibration. Moreover, it features two independent 4K Ultra HD displays through its DisplayPort++ and HDMI for multi-display applications," said Janney Lee, a product manager of Product PM Division at Axiomtek. "Its compact size, excellent computing power, and ability to function in harsh environments making it ideal for diverse industrial applications such as factory, machine, and logistics automation, station gate controls, and ticket vending machines."

The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components. Fabless IC design companies that supply such components therefore benefitted greatly from manufacturers' procurement demand, and the IC design industry underwent tremendous growth in 2020. In particular, the top three IC design companies (Qualcomm, Broadcom, and Nvidia) all posted YoY increases in their revenues, with Nvidia registering the most impressive growth, at a staggering 52.2% increase YoY, the highest among the top 10 companies.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has expanded its DDR5 DRAM memory portfolio with the industry's first 512 GB DDR5 module based on High-K Metal Gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200 megabits per second (Mbps), the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications.

"Samsung is the only semiconductor company with logic and memory capabilities and the expertise to incorporate HKMG cutting-edge logic technology into memory product development," said Young-Soo Sohn, Vice President of the DRAM Memory Planning/Enabling Group at Samsung Electronics. "By bringing this type of process innovation to DRAM manufacturing, we are able to offer our customers high-performance, yet energy-efficient memory solutions to power the computers needed for medical research, financial markets, autonomous driving, smart cities and beyond."

Raja Koduri of Intel has today posted an interesting video on his Twitter account. Showing one of the greatest engineering marvels Intel has ever created, Mr. Koduri has teased what is to come when the company launches the Xe-HPC Ponte Vecchio graphics card designed for high-performance computing workloads. Showcased today was the "petaflops in your palm" chip, designed to run AI workloads with a petaflop of computing power. Having over 100 billion transistors, the chip uses as much as 47 tiles combined in the most advanced packaging technology ever created by Intel. They call them "magical tiles", and they bring logic, memory, and I/O controllers, all built using different semiconductor nodes.

Mr. Koduri also pointed out that the chip was born after only two years after the concept, which is an awesome achievement, given that the research of the new silicon takes years. The chip will be the heart of many systems that require massive computational power, especially the ones like AI. Claiming to have the capability to perform quadrillion floating-point operations per second (one petaflop), the chip will be a true monster. So far we don't know other details like the floating-point precision it runs at with one petaflop or the total power consumption of those 47 tiles, so we have to wait for more details.More pictures follow.

Intel's problems with processor production, especially with newer nodes like 10 nm and 7 nm, have been widely known. The company has not been able to deliver the latest semiconductor process on time and has thus delayed many product launches. However, things are looking to take a complete U-turn and the hell will freeze. During the "Intel Unleashed: Engineering the Future" webcast event that happened yesterday, the company made several announcements regarding the 7 nm process and its viability. We have already reported that the company is working on the new Meteor Lake processor lineup for 2023, supposed to be manufactured on the fixed 7 nm node.

However, it seems like Intel will have to tap external capacities to manufacture a part of its processor production. The company has confirmed that it will use an unknown TSMC process to manufacture a part of the 2023 processor lineup. That means that Intel and TSMC have already established the needed capacity and that TSMC has already booked wafer capacity for Intel. This has never happened before, as Intel always kept its processor production under the company roof. However, given that there is a huge demand for new semiconductor processes, Intel has to look at external manufacturing options to keep up with the demand.

Intel will formally enter the third-party semiconductor foundry business under the Intel Foundry Services (IFS) brand, announced CEO Pat Gelsinger, on Tuesday. This entity would operate under a business model not unlike that of TSMC, with its latest foundry technologies available to third-party customers, besides Intel. The company hopes to become a major foundry service provider to U.S. and E.U. customers, particularly enterprise and government contractors that need secure semiconductor manufacturing on U.S. soil.

To this effect, Gelsinger announced that the company will invest $20 billion in the state of Arizona, to set up two semiconductor foundries. Intel could have an edge over other foundry companies as its foundry service portfolio includes Intel technologies as IP blocks. IFS will be led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Pat Gelsinger. The $20 billion investment in Arizona, according to Intel, will generate over 3,000 high-skilled jobs, over 3,000 construction jobs, and approximately 15,000 local long-term jobs.

Intel today revealed that it will launch its 3rd Generation Xeon Scalable processor series at an online event titled "How Wonderful Gets Done 2021," on April 6, 2021. This will be one of the first major media events headed by Intel's new CEO, Pat Gelsinger. Besides the processor launch, Intel is expected to detail many of its advances in the enterprise space, particularly in the areas of 5G infrastructure rollout, edge computing, and AI/HPC. The 3rd Gen Xeon Scalable processors are based on the new 10 nm "Ice Lake-SP" silicon, heralding the company's first CPU core IPC gain in the server space since 2015. The processors also introduce new I/O capabilities, such as PCI-Express 4.0.

Intel only just announced their 11th generation Rocket Lake-S desktop processors last week but we are already receiving information about the next generation Alder Lake-S platform which will finally make the jump to 10 nm. Intel slides for the upcoming family of processors have been leaked and they reveal some interesting information including a claimed 20% single-threaded performance increases from the new Golden Cove core design and 10 nm SuperFin node. The processors will feature Intel Hybrid Technology with a mix of small low-performance cores and large high-performance cores with a maximum of eight each for sixteen total cores. The processors will also include the latest connectivity with both PCIe 4.0 and PCIe 5.0 support along with DDR4 and DDR5 4800 MHz compatibility.

Intel will also be launching a new socket type called LGA1700 with a new package size which will render existing cooling solutions for LGA115X and LGA1200 sockets incompatible. The processors will also come with the launch of a new 600 Series chipset with PCIe 3.0 and PCIe 4.0 support along with the usual complement of USB, SATA, and networking. The entry-level 600-series motherboards will only support DDR4 memory at up to 3200 MHz while high-end Z690 motherboards will include DDR5 support. Intel has confirmed that they intend to launch Alder Lake later this year but it is yet to be known if they are referring to the desktop or mobile series.

Intel Graphics tweeted a marketing splash screen of its upcoming Xe HPG gaming discrete graphics architecture. There's not much to the video, except announcing the Xe HPG logo. It starts off with a depiction of the Xe LP architecture, on which the company's Gen12 iGPUs and Iris Xe MAX entry-level discrete GPUs are based; and swells into a larger silicon that grows in all directions. The animation could be a hint that Xe HPG chips will be an order of magnitude faster than the Iris Xe MAX, target serious gaming, and take the fight to both NVIDIA and AMD.

Intel is designing the Xe HPG graphics architecture for third-party silicon fabrication nodes, such as TSMC and Samsung, and could leverage a sub-10 nm node to significantly scale up from the Xe LP. A recent report pointed to the likelihood of 512 execution units on a certain Xe HPG variant (4,096 unified shaders) and contemporary GDDR6 memory, while Intel has the necessary IP to pull off DirectX 12 Ultimate logo readiness, including raytracing. Intel is likely eyeing a slice of the e-sports hardware segment, although a high-end GPU cannot be completely ruled out. Watch the video from the source link below.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

Intel and the U.S. Defense Advanced Research Projects Agency (DARPA) today announced a three-year partnership to advance the development of domestically manufactured structured Application Specific Integrated Circuit (ASIC) platforms. The Structured Array Hardware for Automatically Realized Applications (SAHARA) partnership enables the design of custom chips that include state-of-the-art security countermeasure technologies. A reliable, secure, domestic source of leading-edge semiconductors remains critical to the U.S.

"We are combining our most advanced Intel eASIC structured ASIC technology with state-of-the-art data interface chiplets and enhanced security protection, and it's all being made within the U.S. from beginning to end. This will enable defense and commercial electronics systems developers to rapidly develop and deploy custom chips based on Intel's advanced 10 nm semiconductor process," said José Roberto Alvarez, senior director, CTO Office, Intel Programmable Solutions Group.

Recently appointed Intel CEO Pat Gelsinger has announced via Twitter that the company will be holding a webcast on March 23rd - likely in the toes of Rocket Lake's actual release, which is expected towards the end of the month. The webcast, titled "Intel Unleashed", seems to serve as the premier event with Pat Gelsinger firmly entrenched on Intel's reins, and should be a tour de force for Intel's strengths, planned execution on product development and release, and growth opportunities - and, if we're being honest, a frontal recognizance of Intel's current weaknesses. for now, the only information Pat Gelsinger put forwards is that this is a business update, and that "exciting things" are coming in 2021.

With Samsung, YMTC, SK Hynix, and Intel leading the charge, NAND Flash suppliers will maintain an aggressive effort to expand their production capacities throughout 2Q21, during which NAND Flash bit output will likely increase by nearly 10% QoQ, according to TrendForce's latest investigations. On the other hand, orders from PC OEMs and Chinese smartphone brands since 1Q21, as well as recovering procurement activities from clients in the data center segment during 2Q21, will generate upward momentum propelling NAND Flash bit demand. Furthermore, buyers are actively stocking up on finished products, such as SSDs and eMMC, due to persistently limited NAND Flash controller supply. TrendForce therefore expects NAND Flash contract prices to increase by an average of 3-8% QoQ in 2Q21 after experiencing a 5-10% decline QoQ in 1Q21. In particular, as Samsung's Line S2 fab in Austin has yet to resume full operation after the Texas winter storm, the supply of NAND Flash controllers going forward may be at risk, and Samsung's ability to manufacture client SSDs will be further constrained as a result. In light of these factors, TrendForce is not ruling out the possibility that NAND Flash contract prices may increase by even more than current forecasts.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

CORSAIR, a world leader in high-performance gear for gamers, creators, and PC builders, today announced a new series of models in the acclaimed CORSAIR VENGEANCE i7200 Series of fully-built gaming PCs. Now equipped with a cutting-edge 11th Gen Intel Core CPU, these powerful systems feature the raw speed and raytracing power of NVIDIA GeForce RTX 3000-Series GPUs. VENGEANCE i7200 systems are completed with a full array of award-winning CORSAIR components in an airflow-optimized CORSAIR 4000D AIRFLOW mid-tower case, to help you step up your game, whatever you do.

The 11th generation of Intel Core processors is here, delivering blazing-fast frequencies and the processing power to push the limits of your gaming, streaming, and more. Available in configurations with up to an Intel Core i9 11900K CPU, the new CORSAIR VENGEANCE i7200 Series can power through complex content creation, extreme gaming, and demanding applications with ease. Fantastic 3D rendering and content creation performance is driven by the incredible power of NVIDIA GeForce RTX 3000-Series graphics, up to a GeForce RTX 3090, for amazingly lifelike visuals. NVIDIA DLSS 2.0 AI technology boosts frame rates, producing silky-smooth image quality even when playing at maximum detail at 4K settings.

Micron and Intel started development on 3D XPoint memory technology back in 2012 and by 2015 Intel had announced their Optane branded lineup of storage products featuring the new memory. Micron estimated that the chips would be sold for half the price of DRAM but five times the cost of flash memory and started limited manufacturing at a jointly owned factory in Lehi, Utah. The new technology was proposed as the future of memory but with Intel being the only major manufacturer of products that dream has not been realized. While the Intel Optane lineup of products has been generally well-received the high-cost and limited use cases have limited its adoption.

Micron has been dissolving its partnership with Intel over the years with their joint 3D XPoint development program ending in 2019 and Micron exercising their right to acquire Intel's share of the factory. This left Intel in the position of purchasing 3D XPoint wafers from Micron for use in their Optane products however this wasn't enough to fully utilize the facilities production and as such Micron has consistently been losing money on the factory. Micron has decided to sell the factory and is now in discussions with potential buyers the most likely being Intel to take over the facility. Intel has announced that their strategy for Optane products will remain the same and that supply will continue.

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.30 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance​. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency.

Intel started shipping their first Xe DG1 graphics card to OEMs earlier this year which features 4 GB of LPDDR4X and 80 execution units. While these initial cards aren't high performance and only compete with entry-level products like the NVIDIA MX350 they demonstrated Intel's ability to produce a discrete GPU. We have recently received some more potential performance information about Intel's next card the DG2 from chief GPU architect, Raja Koduri. Koduri posted an image of him with the team at Intel's Folsom lab working on the Intel Iris Pro 5200 iGPU back in 2012 and noted that now 9 years later their new GPU is over 20 times faster. The Intel Iris Pro 5200 scores 1015 on Videocard Benchmarks and ~1,400 points on 3DMark Fire Strike, if we assume these scores will be 20x more we get values of ~20,300 in Videocard Benchmarks and 28,000 points in Fire Strike. While these values don't extrapolate perfectly they provide a good indication of potential performance placing the GPU in the same realm of the NVIDIA RTX 3070 and AMD RX 6800.

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, announced today that it is taking rugged computing performance to new heights with its all-new S14I 14-inch semi-rugged laptop. The S14I laptop pushes the boundaries of semi-rugged design and innovation to deliver ultimate mobile computing experiences. The new generation S14I will be available in April and includes the following upgrades: the new Intel Tiger Lake 11th generation processors, the latest NVMe PCIe SSD solution and the Intel Iris Xe MAX graphics or the option of NVIDIA GeForce GTX 1050 discrete graphics.

"Our refreshed S14I laptop takes semi-rugged devices to a whole new level," stated Tom Wang, Durabook Americas president. "This advanced version further enhances the unit's perfect combination of military-grade durability, certified with IP53 and 4-foot drop, field-worker functionality, computer performance, and long battery life of 12 hours. It is the perfect mobile device for today's demanding and diverse working environments with its DynaVue sunlight-readable technology. There is no wonder why the Durabook S14I is the most rugged laptop in its class."

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces that their Z490 series motherboards are ready to support the latest Intel 11th gen Rocket Lake processors.

In anticipation of the imminent launch of Intel's 11th gen processors, BIOSTAR has wasted no time in preparing their products to support the new chips. The Z490 series motherboards, which consists of 5 models (RACING Z490GTA EVO, RACING Z490GTA, RACING Z490GTN, Z490A-SILVER and Z490T-SILVER) have received optimized BIOS updates (ME 14.1) to support the 11th gen Intel processors and can be easily updated just by downloading and installing the new BIOS patch from the official product page.

Historically, system builders have been very good indicators of the market situation and demand for the latest processors available. Today, we have the report coming from Puget Systems, a system builder making PCs and laptops for any task needed. Having been present in the PC building business for 21 years, the company was able to notice some trends and look at the market like no one else could, simply by analyzing its orders. Today, we have the report that showcases just how much the CPU market has fluctuated and how dominant forces have shifted. The two main players, AMD and Intel, have been present for lots of years and we now get to see the latest trends in the consumer marketplace.

Back in 2015, Puget Systems quietly dropped AMD processors from their offerings, amid the very low demand the company saw for them. The sales of AMD processors accounted for a single-digit percentage of all of the total sales, and no one was interested in such systems. With the introduction of the Ryzen generation, Puget Systems re-introduced AMD processors back in their offerings. As the company analyzes its processor sales, it has concluded that, currently, AMD processors account for over 50% of the total CPU sales. That is quite a comeback for AMD, as the latest generation Ryzen 5000 series processors have taken the performance crown, and consumer demand is showing the need for new high-performance processors. You can take a look at the graph representing processor sales in the last five years below.

Google and the broader Chrome ecosystem continue to deliver innovative, cloud-first PC experiences with Chromebooks powered by Intel—from use in classrooms to go-anywhere connectivity for work and gaming.

"This past year has reminded us that the PC is an integral part of our lives," said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms. "Intel and Google share a vision for delivering the computing experiences that matter most to people. Together, we have enabled the incredible growth and evolution of the Chrome ecosystem over the last decade to reach amazing levels of capability and performance. We're excited to build on this collaboration as we continue to drive innovation forward." Since the first device was introduced in 2011, an entire ecosystem has evolved and more than 100 million Chromebooks have made their way into the world for students and educators, general consumers and businesses. Over those 10 years, Intel has worked closely with Google and original equipment manufacturers (OEM) to enable more than 100 Intel-based Chromebook designs and drive new areas of innovation.