Jon Peddie Research reports the growth of the global PC-based Graphics Processor Units (GPU) market reached 123 million units in Q2'21 and PC CPU shipments increased by 42% year-over-year. Overall, the installed base of GPUs will grow at a compound annual growth rate of 3.5% during 2020-2025 to reach a total of 3,318 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC will grow to reach a level of 25%.

AMD's overall market share percentage from last quarter decreased by -0.2%, Intel's market share increased 0.1%, and Nvidia's market share increased 0.06%, as indicated in the following chart. Overall GPU unit shipments increased by 3.4% from last quarter, AMD shipments increased 2.3%, Intel's shipments rose 3.6%, and Nvidia's shipments increased 3.8%.

Intel's upcoming Alder Lake processor family is set to bring a mixture of big and little cores, combined into one package designed for the hybrid way of computing. Alongside the CPU cores, Intel is also etching integrated graphics into the Alder Lake silicon. However, according to Komachi (@KOMACHI_ENSAKA), there will be Alder Lake SKUs that don't feature a working integrated GPU. Just like we witnessed Intel produce "F" models for its past few generations of Core processors, we could see a re-appearance of the F SKUs with Alder Lake as well. In the leaked listing, Komachi notes the appearance of Intel Core i5-12600KF, Core i7-12700KF, and Core i9-12900KF.

All of the listed models are overclockable SKUs, just with their integrated graphics disabled. Just like the previous generation, Intel decided to introduce this SKU, giving customers a few benefits with the non-functional iGPU. As there is no GPU to produce heat, overclocking efforts could be much better on the "F" SKUs. In addition to that, these SKUs could be a bit cheaper compared to the regular models, saving the buyers some spare cash if they are going to purchase a 3rd party dedicated GPU anyway.

We recently saw the Intel Core i7-12700 appear on Geekbench 5 where it traded blows with the AMD Ryzen 7 5800X, we have now discovered the flagship Core i9-12900K also making an appearance. The benchmarked Intel Core i9-12900K features a hybrid design with 8 high-performance cores, 8 high-efficiency cores, and 24 threads running at a base clock of 3.2 GHz. The test was performed on a Windows 11 Pro machine allowing for full use of the Intel Thread Director technology paired with 32 GB of DDR5 memory. The processor achieved a single-core score of 1834/1893 in the two tests which gives it the highest score on the official Benchmarks coming in 12% faster than the Ryzen 9 5950X. The processor also achieved an impressive multi-core score of 17299/17370 which places it 3% above the Ryzen 9 5950X and 57% above the previous generation flagship 8-core i9-11900K. These leaked benchmarks highlight the impressive potential of Intel's upcoming 12th Generation Core series which is expected to launch in November.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, confirms compatibility with the upcoming Intel 12th Gen Alder Lake CPU and announces the availability of LGA 1700 mounting kits for its current and future multi-socket desktop CPU coolers.

ENERMAX's LGA 1700 mounting kits will offer full compatibility with the new LGA 1700 socket for its CPU cooler lineups. In addition to LGA 1700, the coolers will continue to include mounting hardware for the previous generation Intel platform (LGA 2066, LGA 2011, LGA 1156, LGA 1155, LGA 1151, LGA 1150, LGA 1200) as well as AMD (AM4/AM3+/AM3/AM2+/AM2/FM2+/FM2/FM).

NAND Flash suppliers' Clients in the data center segment were gradually stepping up enterprise SSD procurement after finishing inventory adjustments, according to TrendForce's latest investigations. Moreover, the adoption rate of 4/8 TB products in the enterprise SSD market increased substantially on account of the releases and adoption of the new server processor platforms from Intel and AMD. Although the recent wave of COVID-19 outbreaks that struck Southeast Asia weakened smartphone sales in 2Q21, the quarterly total NAND Flash bit shipments rose by nearly 9% QoQ, as PC OEMs still had plenty of component orders in 2Q21 due to the fairly robust notebook demand during the period. On the other hand, the shortage of controller ICs became more severe during the period, and the winter storm that battered Texas this February affected the operation of Samsung's foundry fab Line S2 in Austin. As demand for NAND Flash products rose, the overall ASP also rose by nearly 7% QoQ, and the quarterly total NAND Flash revenue rose by 10.8% QoQ to US$16.4 billion in 2Q21.

CPU-Z, the software of choice for monitoring the CPU and its attributes, has yesterday been updated to version 1.97, which brings much-needed and interesting features. For starters, the new version adds support to detect Intel Core i9-12900K, Core i7-12700K, and Core i5-12600K "Alder Lake" CPUs and the Intel Z6xx chipset platform. Those specific SKUs are the top of the line in their respective categories, and it is only logical that support for the new generation starts there.

Next up, the software now supports detection of the latest DDR5 DRAM technology, which can now also be detected along with the new XMP 3.0 profile format. Last but not least, the software is adding detection for AMD's Radeon RX 6600 XT GPU as well.

To download the latest update, head over to our downloads section. If you wanna get pinged automagically when a new version is released, select the yellow "Get Notified" button on that same page.

Intel Vice President and General Manager of Client Graphics Products and Solutions Roger Chandler has recently announced that the companies upcoming Arc gaming graphics cards will include overclocking support at launch through the official driver UI. This offering may resemble that of AMD's with their Radeon Software that offers various overclocking tools including clock speeds, power settings, and fan curves. Intel has also been working on various other driver improvements in the lead-up to release including enhancing shader compiling and improving throughput. The post also confirmed the implementation of complete DirectX 12 Ultimate compliance which will enable variable-rate shading tier 2 and mesh shading. Intel is expected to release the first Arc gaming graphics cards for desktops and notebooks in Q1 2022.

IntelWe're even integrating overclocking controls into the driver UI to give enthusiasts the tools they need to push the hardware to the limit.

The Intel Core i9-12900K has made another appearance this time on the PugetBenchmark website paired with an ASUS ROG Strix Z690-E Gaming WiFi motherboard. The Core i9-12900K is the flagship processor in Intel's upcoming 12th Generation Core Series featuring a hybrid core design with 8 high-performance cores, 8 high-efficiency cores, and 24 threads. The processor was paired with 64 GB of DDR5 4800 MHz memory and an RTX 3090 where it scored similarly to the Core i9-11900K in the GPU-focused Adobe After Effects test. While this test has limited use in determining the processor's performance it may signify the start of more leaks to come. The score pages have now been removed from the PugetBench site however they can still be accessed from the Internet Archive. The Intel Core i9-12900K along with the entire 12th Generation Core Series is now expected to launch in November with DDR5 and PCIe 5.0 support on the new LGA1700 socket and Z690 chipset.

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

AMD might fall behind Intel on PCI-Express Gen 5 support, say sources familiar with the recent GIGABYTE ransomware attack and ensuing leak of confidential documents. If you recall, AMD had extensively marketed the fact that it was first-to-market with PCI-Express Gen 4, over a year ahead of Intel's "Rocket Lake" processor. The platform block-diagram for Socket AM5 states that the AM5 SoC puts out a total of 28 PCI-Express Gen 4 lanes. 16 of these are allocated toward PCI-Express discrete graphics, 4 toward a CPU-attached M.2 NVMe slot, another 4 lanes toward a discrete USB4 controller, and the remaining 4 lanes as chipset-bus.

Socket AM5 SoCs appear to have an additional 4 lanes to spare than the outgoing "Matisse" and "Vermeer" SoCs, which on higher-end platforms are used up by the USB4 controller, but can be left unused for the purpose, and instead wired to an additional M.2 NVMe slot on lower-end motherboards. Thankfully, memory is one area where AMD will maintain parity with Intel, as Socket AM5 is being designed for dual-channel DDR5. The other SoC-integrated I/O, as well as I/O from the chipset, appear to be identical to "Vermeer," with minor exceptions such as support for 20 Gbps USB 3.2x2. The Socket has preparation for display I/O for APUs from the generation. Intel's upcoming "Alder Lake-S" processor implements PCI-Express Gen 5, but only for the 16-lane PEG port. The CPU-attached NVMe slot, as well as downstream PCIe connectivity, are limited to PCIe Gen 4.

Server and workstation users will soon be able to mount all Eisblock XPX Pro models and the Eisbaer Pro AIO on the LGA 4189 socket. The corresponding bracket will soon be available as an option. Owners of an XPX Pro cooler or the Eisbaer PRO AIO can contact Alphacool with their invoice to receive a free bracket: info@alphacool.com

All Eisblock XPX coolers and Eisbaer AIOs are already compatible with Intel Socket LGA 1700. If you own an Alphacool Eisblock XPX cooler and looking to upgrade to the new Intel Socket 1700, you don't have to worry about additional mounts. All Eisblock XPX coolers are already compatible with the new socket LGA 1700 with the included mounting material. A corresponding new manual for all coolers of the Alphacool Eisblock XPX series will be available online when the socket is released. All Eisbaer CPU AIO water coolers are also compatible with Socket 1700 with the enclosed mounting kit.

Intel's upcoming Xeon "Sapphire Rapids" processor features a memory interface topology that closely resembles that of first-generation AMD EPYC "Rome," thanks to the multi-chip module design of the processor. Back in 2017, Intel's competing "Skylake-SP" Xeon processors were based on monolithic dies. Despite being spread across multiple memory controller tiles, the 6-channel DDR4 memory interface was depicted by Intel as an advantage over EPYC "Rome." AMD's first "Zen" based enterprise processor was a multi-chip module of four 14 nm, 8-core "Zeppelin" dies, each with a 2-channel DDR4 memory interface that added up to the processor's 8-channel I/O. Much like "Sapphire Rapids," a CPU core from any of the four dies had access to memory and I/O controlled by any other die, as the four were networked over the Infinity Fabric interconnect in a configuration that essentially resembled "4P on a stick."

With "Sapphire Rapids," Intel is taking a largely similar approach—it has four compute tiles (dies) instead of a monolithic die, which Intel says helps with scalability in both directions; and each of the four compute tiles has a 2-channel DDR5 or 1024-bit HBM memory interface, which add up to the processor's 8-channel DDR5 total I/O. Intel says that CPU cores from each tile has equal access to memory, last-level cache, and I/O controlled by another die. Inter-tile communication is handled by EMIB physical media (55 micron bump-pitch wiring). UPI 2.0 makes up the inter-socket interconnect. Each of the four compute tiles has 24 UPI 2.0 links that operate at 16 GT/s. Intel didn't detail how memory is presented to the operating system, or the NUMA hierarchy, however much of Intel's engineering effort appears to be focused on making this disjointed memory I/O work as if "Sapphire Rapids" were a monolithic die. The company claims "consistent low-latency, high cross-sectional bandwidth across the SoC."

It's happening, Intel is taking a very pointy stab at the AAA gaming graphics market, taking the fight to NVIDIA GeForce and AMD Radeon. The Arc "Alchemist" discrete GPU implements the Xe HPG (high performance gaming) graphics architecture, and offers full DirectX 12 Ultimate compatibility. It also offers contemporary features gamers want, such as XeSS, an AI-supersampling feature rivaling DLSS and FSR. There's a lot more to the Xe HPG architecture than being a simple a scale-up from the Xe LP-based iGPUs found in today's "Tiger Lake" processors.

Just like Compute Units on AMD GPUs, and Streaming Multiprocessors on NVIDIA, Intel designed a scalable hierarchical compute hardware structure for Xe HPG. It begins with the Xe-core, an indivisible compute building block that contains 16 each of 256-bit vector engines and 1024-bit matrix engines. combined with basic load/store hardware and an L1 cache. The vector unit here is interchangeable with the execution unit, and the Xe-core contains 16 of these. The Render Slice is a collective of four Xe-cores, four Raytracing Units; and other common fixed-function hardware that include the geometry pipeline, rasterization pipeline, samplers, and pixel-backends. The Raytracing Units contain fixed-function hardware for bounding-box intersection, ray traversal, and triangle intersection.

When early benchmarks of the Core i9-12900K "Alder Lake-S" processor showing performance comparable to AMD's top 16-core Ryzen 9 5950X surfaced, we knew something was up. 8 Intel P-cores and 8 E-cores, are able to match 16 "Zen 3" cores that are all performance cores. Apparently Intel is able to turn its P-core deficit around by taking a wacky approach. First, the 8 "Golden Cove" P-cores themselves offer significantly higher IPC than "Zen 3." Second, the 8 "Gracemont" E-cores aren't as "slow" as conventional wisdom would suggest.

Intel in its Architecture Day presentation put out some astounding numbers that help support how 8 big + 8 little cores are able to perform in the league of 16 AMD big cores. Apparently, on "Alder Lake-S," the 8 "Gracemont" E-cores enjoy a lavish power budget, and are able to strike an incredible performance/Watt sweet-spot. Intel claims that the "Gracemont" E-core offers 40% higher performance at ISO power than a "Skylake" core (Intel's workhorse P-core for desktops until as recently as 2020); which means it consumes 40% less power at comparable performance.

Intel will beat AMD to next-generation I/O, with its 12th Generation Core "Alder Lake-S" desktop processors. The company confirmed that the processor will debut both DDR5 memory and PCI-Express Gen 5.0, which double data-rates over current-gen DDR4 and PCI-Express Gen 4, respectively. "Alder Lake-S" features a dual-channel DDR5 memory interface, with data-rates specced to DDR5-4800 MHz, more with overclocking, reaching enthusiast-grade memory attaining speeds in excess of DDR5-7200. Besides speed, DDR5 is expected to herald a doubling in density, with 16 GB single-rank modules becoming a common density-class, 32 GB single-rank being possible in premium modules; and 64 GB dual-rank modules being possible soon. Leading memory manufacturers have started announcing their first DDR5 products in preparation of "Alder Lake-S" launch in Q4-2021.

The memory controller is now able to dynamically adjust memory frequency and voltage, depending on current workload, power budget and other inputs—a first for the PC! This could even mean automatic "Turbo" overclocking for memory. Intel also mentioned "Enhanced Overclocking Support" but didn't go into further detail what that entails. While DDR5 is definitely the cool new kid on the block, Intel's Alder Lake memory controller keeps support for DDR4, and LPDDR4, while adding LPDDR5-5200 support (important for mobile devices). Just to clarify, there won't be one die support DDR5, and another for DDR4, no, all dies will have support for all four of these memory standards. How that will work out for motherboard designs is unknown at this point.

In its 2021 Architecture Day presentation, Intel revealed that its first performance gaming GPU, the Arc "Alchemist," is built on the TSMC N6 silicon fabrication node (6 nm). A more advanced node than the N7 (7 nm) used by AMD for its current RDNA2 GPUs, TSMC N6 leverages EUV (extreme ultraviolet) lithography, and offers 18% higher transistor density, besides power improvements. "With N6, TSMC provides an optimal balance of performance, density, and power-efficiency that are ideal for modern GPUs," said Dr Kevin Zhang, SVP of Business Development at TSMC.

With working prototypes of "Alchemist" already internally circulating as the "DG2," Intel has beaten AMD to 6 nm. Team Red is reportedly planning optical-shrinks of its RDNA2-based "Navi 22" and "Navi 23" chips to TSMC N6, and assigning them mid-range SKUs in the Radeon RX 7000 series. The company will build two higher-segment RDNA3 GPUs on the more advanced TSMC N5 (5 nm) process, which will release in 2022, and power successors to the RX 6700 series and RX 6800/6900 series.

Intel in its Architecture Day presentation Thread Director, a hardware component present on the "Alder Lake" silicon, which makes the Hybrid architecture of the processor work flawlessly. "Alder Lake-S" is the first desktop processor with two kinds of x86 CPU cores—the larger Performance P-cores, and the smaller Efficient E-cores, which work in a setup not unlike big.LITTLE by Arm.

The x86-based "Alder Lake" processor has a much more complex ISA, and the E-cores don't have all of the instruction sets or hardware capabilities that the P-cores do. The two cores operate at very different performance/Watt bands, and are optimized for vastly different workloads. At the same time, sending a workload to the wrong kind of core could not only impact performance, but also crash, due to an ISA mismatch. Intel realized that it will take a lot more than mere OS-level awareness to solve the problem, and so innovated the Thread Director.

Intel plans to go full tilt with gaming graphics, with its newly announced Arc line of graphics processors designed for high-performance gaming. The top Arc "Alchemist" part meets all requirements for DirectX 12 Ultimate logo, including real-time raytracing. The company, during the technology's reveal, earlier this week, also said that it's working on an AI-accelerated supersampling technology. The company is calling it XeSS (Xe SuperSampling). It likely went with Xe in the name, as it possibly plans to extend the technology to even its Xe LP-based iGPUs and the entry-level Iris Xe MAX discrete GPU.

Intel claims that XeSS cuts down 4K frame render-times by half. By all accounts, 1440p appears to be the target use case of the top Arc "Alchemist" SKU. XeSS would make 4K possible (i.e., display resolution set at 4K, rendering at a lower resolution, with AI-accelerated supersampling restoring detail). The company revealed that XeSS will use a neural network-based temporal upscaling technology that incorporates motion vectors. In the rendering pipeline, XeSS sits before most post-processing stages, similar to AMD FSR.

While AMD's FSR technology is purely shader based, the Intel algorithm can either use XMX hardware units (new in Intel Xe HPG), or DP4a instructions (available on nearly all modern AMD and NVIDIA GPUs). XMX stands for Xe Matrix Extensions and is basically Intel's version of NVIDIA's Tensor Cores, to speed up matrix math, which is used in many AI-related tasks. The Intel XeSS SDK will be available this month, in open source, using XMX hardware, the DP4a version will be available "later this year".

Intel's 13th Gen Core "Raptor Lake-S" desktop processor could come with core counts as high as 24, overtaking AMD's number for mainstream desktops, for the first time since 2017. There is, however, a big catch, The 24-core chip could comprise of 8 "big" P-cores, and 16 "little" E-cores, according to a report by AdoredTV. The silicon features 8 "Raptor Cove" P-cores, which succeed "Golden Cove," introducing IPC and instruction-set improvements; while the type of low-power E-cores remains to be determined. AdoredTV predicts that the Core i9 brand extension could max out the silicon with 8+16 cores, while lower Core i7 SKUs could be 8+8 cores, and Core i5 6+8 cores. The TDP of Unlocked K SKUs could be rated at 125 W, and the other "locked" ones at 65 W.

Intel today announced AWS customers can access the latest 3rd Gen Intel Xeon Scalable processors via the new Amazon Elastic Compute Cloud (Amazon EC2) M6i instances. Optimized for high-performance, general-purpose compute, the latest Intel-powered Amazon EC2 instances provide customers increased flexibility and more choices when running their Intel-powered infrastructure within the AWS cloud. Today's news is a further continuation of Intel and AWS' close collaboration, giving customers scalable compute instances in the cloud for almost 15 years.

"Our latest 3rd Gen Intel Xeon Scalable processors are our highest performance data center CPU and provide AWS customers an excellent platform to run their most critical business applications. We look forward to continuing our long-term collaboration with AWS to deploy industry-leading technologies within AWS' cloud infrastructure." -Sandra Rivera, Intel executive vice president and general manager, Datacenter and AI Group.

Intel has recently released a promotional video teasing the dual-fan cooler design of their upcoming Arc gaming graphics card with 1000 drones. The company used 1000 drones fitted with lighting to create various shapes including a dual-fan desktop graphics card which has a strong resemblance to the previously leaked design for a DG2-512EU engineering sample. The two images also both include 9 blades on the fans giving further authority to the previous rumor. The first Intel Arc "Alchemist" products will begin shipping in Q1 2022 with the flagship desktop graphics card rumored to feature 512 Execution Units paired with 16 GB GDDR6 memory targeting RTX 3070 Ti performance. Intel is also preparing a NVIDIA DLSS/AMD FidelityFX Super Resolution competitor codenamed XeSS and will include hardware-accelerated raytracing support with the Arc lineup.

Intel today surprised us with the reveal of its new high-performance gaming graphics brand, Intel Arc. Competing with the AMD Radeon and NVIDIA GeForce brands, Arc enables Intel to take a stab at the gaming graphics market that's been a duopoly for the past 2 decades; and the company doesn't intend to only make low-cost e-sports chips. As if a statement of intent, the company revealed the codenamed of the first three generations of Arc: "Battlemage," "Celestial," and "Druid."

Of these "Battlemage" is likely the fancy new codename for the Xe HPG graphics architecture, which has been implemented in a working prototype referred to as the DG2, and which Intel is now referring to as "Alchemist." Intel revealed that "Battlemage" is being designed to meet DirectX 12 Ultimate requirements, which means it will support hardware-accelerated real-time raytracing; mesh shaders, sampler feedback, and variable-rate shading. Intel also announced that the chips will feature an AI-accelerated supersampling feature. This will rival NVIDIA DLSS and AMD FSR. Intel announced that the first consumer products based on the "Alchemist" silicon will release in the first quarter of 2022, the company will put out more specifics throughout 2021, in the run-up to this launch.

The upcoming 12th Generation hybrid Intel Core i9-12900K has recently made an appearance in the BaseMark database. The i9-12900K is a rumored 16 core, 24 thread processor with a combination of 8 high-performance and 8 high-efficiency cores. The BaseMark entry reports the processor as featuring only 12 cores which may be an error with the software not recognizing the hybrid processor or simply derived by halving the 24 threads. The chip was running at 3.2 GHz on an unknown Z690 motherboard from Acer codenamed Z69H6-AM with the latest Windows 11 22000.132 beta build. The processor was paired with an RTX 3080 and 16 GB ram achieving a score of 17,744 inline with other results with the RTX 3080. The 12th Generation Intel Core series is expected to launch in October with qualification samples already ready for board partners and OEMs.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, launches the U12 rackmount enterprise cloud storage server equipped with a powerful quad-core Intel Xeon processor.TheTerraMaster U12 is a 12-bay networked storage server with high scalability. The U12 is designed to meet the requirements of enterprise virtualizations, data-intensive applications, and service continuity.

The new TerraMaster U12 Series rackmount storage server is the ideal solution for business cloud storage servers, providing high-speed data storage for multiple sharing users. The latest TerraMaster U12 rackmount server features an upgraded processor, up to a quad-core Intel Xeon, and 8 GB of DDR4 memory that's upgradeable to 64 GB maximum. The rackmount server also comes with two PCIe X16 Gen3 slots offering upgrade options such as 10 GbE NIC cards and RAID cards. Also, users can configure and upgrade the CPU and memory to enhance performance as required.