Odd Tech Reviews published a performance review of an Intel Core i7-11700 (non-K) "employee beta sample." This review comes on the heels of a Lab501.ro review of an unlocked i7-11700K engineering sample; and yet springs a different set of results in relation to the AMD Ryzen 7 5800X. The i7-11700 is shown having a slight edge over the 5800X in both the single- and multi-threaded tests of the CPU-Z Bench, where it's shown posting a 3.59% higher single-threaded score.

The Ryzen 7 5800X retakes the lead over the Core i7-11700 sample in Cinebench R15 and R20, posting higher scores in both the single- and multi-threaded tests. The 5800X also maintains lead with 7-Zip. Blender sees the i7-11700 once again run past the 5800X, but the AMD chip claws back with V-Ray and Handbrake video-encoding tests. There's a pitched battle between the 5800X and the i7-11700 with gaming, with each chip having an upper hand over the other, depending on the test. Find all these results and more in the Odd Tech Reviews presentation.

Intel's upcoming flagship desktop processor, the Core i9-11900K, is expected to feature a fancy retail package, much like the original Core i9-9900K. VideoCardz just tweeted a teaser shot of what looks like an acrylic retail package of the chip, with its prominent i9 branding, in Intel's favorite shade of blue. Unlike the i9-10900K, which has a mostly paperboard box with a large acrylic window, the i9-11900K package appears to be entirely made of hard plastic, and an unknown geometric shape. We'll know a lot more as we creep toward the mid-March launch of these chips.

Update 10:18 UTC: Here it is, the i9-11900K retail package in all its glory. It's mostly a cuboid, but with numerous trapezoid shapes. The i9-11900KF, however, gets a basic paperboard box sans cooler, while the "locked" i9-11900 has a slightly larger paperboard box that has a boxed cooler.

In the latest round of rumors, we have today received some really interesting news regarding Intel's upcoming lineup of desktop processors. Thanks to HKEPC media, we have information about the launch date of Intel's Rocket Lake-S processor lineup and Alder Lake-S details. Starting with Rocket Lake, Intel did not unveil the exact availability date on these processors. However, thanks to HKEPC, we have information that Rocket Lake is landing in our hands on March 15th. With 500 series chipsets already launched, consumers are now waiting for the processors to arrive as well, so they can pair their new PCIe 4.0 NVMe SSDs with the latest processor generation.

When it comes to the next generation Alder Lake-S design, Intel is reported to use its enhanced 10 nm SuperFin process for the manufacturing of these processors. This would mean that the node is more efficient than the regular 10 nm SuperFin present on Tiger Lake processors, and some improvements like better frequencies are expected. Alder Lake is expected to make use of big.LITTLE core configuration, with small cores being Gracemont designs, and the big cores being Golden Cove designs. The magic of Golden Cove is expected to result in 20% IPC improvement over Willow Cove, which exists today in Tiger Lake designs. Paired with PCIe 5.0 and DDR5 technology, Alder Lake is looking like a compelling upgrade that is arriving in December of this year. Pictured below is the LGA1700 engineering sample of Alder Lake-S processor.

When AMD announced its Ryzen 5000 series of processors based on the new Zen 3 architecture, the performance of these processors was the best on the market. Even in our own testing, we have found that AMD's Zen 3 core is the highest performing core on the market, even beating Intel's latest and greatest, the 10th generation of Core processors. However, Intel has been doing some silent work and the company has developed a new core to be used in the 11th generation "Rocket Lake" platform. Codenamed Cypress Cove, the design is representing a backport of the 10 nm Sunny Cove design, supposed to bring around 19% IPC improvement across the board.

If you were wondering if that was enough to catch up with AMD's Zen 3 IPC performance, look no further because we have Geekbench 5 performance results of Intel's 35 Watt Core i9-11900T processor. Having a base frequency of only 1.51 GHz, the CPU is capable of boosting one or two cores to the very high speed of 4.9 GHz, giving us a good example of the single-threaded performance we can expect from this CPU. In GB5 tests, the Core i9-11900T has managed to score 1717 points in the single-threaded test and 8349 points in multi-threaded results. Comparing that to something like AMD Ryzen 5800X, which scores 1674 points in single-threaded results, Rocket Lake's Cypress Cove core has managed to be 2.5% faster than Zen 3. However, in multi-threaded results, the AMD chip is unmatched as the low TDP of the Intel processor is stopping it from reaching full performance.

Today marks Intel's official CEO transition as Pat Gelsinger becomes the company's eighth chief executive officer in its history. Gelsinger is an accomplished CEO and industry veteran with more than four decades of technology and leadership experience - including 30 years at Intel, where he began his career.

Gelsinger shared his thoughts on returning to lead the company, saying:
"As the incoming CEO, I am just really thrilled that we have the opportunity to take this great icon of a company, this company that has been crucial to every aspect of technology, and have it be that leader again into the future. Because I believe that Intel has a treasure trove of technologists, of technology, and ultimately its core DNA is being that technology leader for the future. I'm just thrilled as a technologist, as a geek at heart, to be able to be in that leadership role to help bring the passions, the history, the opportunity of this great company forward as never before. Our best days are in front of us."

Intel is reportedly giving finishing touches to the Core i9-10900KS Special Edition desktop processor. The SKU was leaked to the web in an "eligible products list" as part of a "Crysis Remastered" game bundle campaign. This would be the third in a string of special edition processor models from Intel, after the Core i7-8086K, and the Core i9-9900KS. The i9-10900KS could be a 10-core/20-thread processor based on the "Comet Lake-S" silicon, but with higher clock-speeds than the i9-10900K, possibly even a high all-core boost frequency. The timing of this launch is curious, as we're just 6-7 weeks from market availability of the 11th Gen Core "Rocket Lake-S" launch.

In related news, Intel is refreshing the bottom end of its 10th Gen Core "Comet Lake" lineup with the company's latest corporate identity and packaging. This is probably being done to cater to entry-level 400-series chipsets such as the H410 and B460, which will not support "Rocket Lake" processors. A Malaysian tech publication posted a picture of a refreshed Core i3-10105F 4-core/8-thread processor retail package. In all likelihood, the refreshed 10th Gen chips are speed-bumps.

Intel announced their 11th Generation Tiger Lake-H processors for high-end gaming laptops at CES 2021. The three models announced are now shipping in slim gaming machines and target the AMD Ryzen 5000H series processors. The Intel models compete favorably in single-core performance but only feature four cores and eight threads while the Ryzen 5000H series processors include up to 8 cores and 16 threads giving them the clear advantage in multi-core performance.

Intel is planning to close this performance gap with the launch of three new 45 W 8 core 11th Generation H-series processors in Q2 2021 with a possible announcement at Computex. The three models include the unlocked Core i9-11980HK, Core i9-11900H, and the Core i7-11800H along with the Core i5-11400H with six cores. These new processors will compete directly with the Ryzen 9 5980HX, Ryzen 9 5900H, and Ryzen 7 5800H with the Core i9-11980HK likely to feature a boost clock of 5 GHz on multiple cores.

LG Electronics USA announced pricing and availability of the full line of 2021 LG gram laptops at LG-authorized dealers nationwide. Led by the CES 2021 Innovation Award-winning 17-inch LG gram 17, the 2021 line features stylish new designs and productivity-boosting 16:10 aspect ratio screens ideal for both productivity and entertainment.

The diverse lineup includes five exciting new models: LG gram 17 (model 17Z90P), LG gram 16 (model 16Z90P), LG gram 14 (model 14Z90P), LG gram 2-in-1 16 (model 16T90P) and LG gram 2-in-1 14 (model 14T90P) all with 16:10 aspect ratio screens designed around maximizing work efficiency. Offering more screen real estate than the 16:9 displays found on most laptops, the latest LG grams are able to show more information at any one time. The keyboard and touchpad have also been enlarged for extended comfort and efficiency without compromising the portability of these compact devices. The 2021 LG gram lineup also features an expanded range of color options including white, black, silver and green outer shells.

Intel has apparently begun discounting its desktop CPUs, perhaps in a bid to try and maintain market share earning momentum the company garnered in the last few months. As AMD struggles to keep up with consumer demand for its latest Ryzen 5000 series, Intel looks to be capitalizing on its vertical integration (as well as the fact that Intel owns its own fabs and fabricates in a more than mature 14 nm process). A interesting move by the blue giant, who has generally opted out of a price reduction strategy - a move that might make Intel look on the back foot, and as an alternative budget brand, to the incommensurately smaller AMD.

Various retailers have been carrying Intel inventory with much reduced prices over their official MSRP. Amazon, for example, is offering the Intel Core i7-10700K for $344, down from its average pricing of $383. In the same retailer, the iGPU-less i7-10700F processor is down from $315 one month ago to just $229. Odds are that this is an Intel decision because if one considers the amount of demand on PC products and components due to COVID-19, it's very likely that consumers who can't get an AMD 5000-series CPU will still choose to purchase hardware - even if it has to be from Intel. So retailers eschewing part of their profits at a time like this seems slightly off-character.

Lab501 posted the first comprehensive review of an Intel Core i7-11700K "Rocket Lake-S" engineering sample. The ES has clock speeds matching the rumored clock speeds of the retail version, and should give you a fair idea of how the finished product should perform. The i7-11700K, which is an 8-core/16-thread chip, was tested to be being consistently behind the AMD Ryzen 7 5800X in synthetics such as WPrime, rendering tests such as Blender, video-encoding tests such as Handbrake, and was negligibly trading blows with the 5800X at gaming ±1%. The chip does post leads over the previous-gen i7-10700K in all these areas, though.

Performance aside, the Core i7-11700K is shown to have significantly higher power draw, with the whole-system power draw being 27% higher than a 5800X-based whole-system, when measured using Prime95 (which only adds a CPU load). In a real-world scenario such as gaming, where GPU power draw is added, this whole-system power draw percentage difference should come down. Interestingly, the i7-11700K isn't a "hot" processor, running up to 18°C cooler than a 5800X under Prime95 load. Check out this, and other invaluable early insights into "Rocket Lake" by hitting the source link below.

Intel's head for architecture, software, and graphics divisions, Raja Koduri, on Wednesday (10/02) teased a Xe HPG discrete GPU prototype running the upcoming 3DMark DirectX 12 Mesh Shaders feature test. Mesh Shaders are one of the four key features for graphics solutions to achieve the DirectX 12 Ultimate logo readiness, the other three being Real-time raytracing, Variable Rate Shading, and Sampler Feedback. Intel has already been supporting VRS tier-1 since Gen11, and the new Gen12 Xe LP carries forward VRS support.

The Xe HPG architecture is being pushed by Intel as the company's first high-performance gaming discrete graphics architecture. The company earlier released entry-level dGPUs based on the same Xe LP architecture as the Gen12 iGPU found in its "Tiger Lake" processors. The presence of VRS and Mesh Shader support, along with foundational work Intel has done in the area of real-time raytracing, hints at the likelihood of Intel gunning for DirectX 12 Ultimate readiness for the Xe HPG.

Earlier this week, Intel shook the DIY PC market, particularly the vast mainstream segment, by revealing that its mid-tier B460 and entry-level H410 desktop motherboard chipsets will not be compatible with 11th Gen Core "Rocket Lake-S" processors, and that only its top-tier Z490 and H470, will. We have an explanation into what's going on, after consulting with people in the know, thanks to our friends at Hardware Zone Israel, who spoke with sources within Intel. It turns out, that some batches of B460 and H410 PCH dies are re-badged from older generations of PCH, and built on the 22 nm silicon fabrication process; whereas the Z490 and H470 are based on a newer generation that's built on 14 nm. This is similar to Intel's move to carve out the B365 chipset from the older H170.

In addition to being limited to an older version of Intel ME (Management Engine), the H460 and H410 PCH lack the ability to communicate with "Rocket Lake-S" processors over side-band, using PMSYNC/PMDN signals, a design change Intel introduced with the "Tiger Lake" and "Rocket Lake" microarchitectures. The chipsets faced no such limitation with "Comet Lake-S." Intel's decision to re-badge older 22 nm-class PCH silicon as B460 and H410 may have been dictated by the company's 14 nm node volume constraints. HotHardware reports that some motherboard vendors, such as GIGABYTE, found a clever (albeit expensive) way around this limitation, by creating "V2" revisions of their existing B460 and H410 motherboards, which actually use the 14 nm H470 chipset.

Intel has reportedly caught an ex-employee stealing confidential company files for the Xeon processor lineup. Dr. Varun Gupta, who left Intel last year to join Microsoft as Principal for Strategic Planning in Cloud and AI, has reportedly walked away with over 3900 files of confidential information. The stolen files, contain information about Intel's Xeon processors, pricing data, corporate strategies, and Intel's manufacturing capabilities of the chips. Dr. Gupta is being sued by Intel for 75,000 USD and liability to not use confidential Intel information again. The security forensics team at Intel has discovered that Dr. Gupta downloaded almost 4000 files on multiple USB drives, however, Dr. Gupta is denying these claims. We are waiting to hear more information about the situation as it evolves.

In a controversial move that baffles our technical understanding of how processor+chipset (platforms) work, Intel has decided to restrict the mid-tier B460 and entry-level H410 desktop motherboard chipsets from supporting 11th Gen Core "Rocket Lake-S" processors. A BIOS Updates Support page for Intel 400-series chipsets on the company website mentions "Motherboards based on Intel B460 or H410 chipsets are not compatible with upcoming 11th Gen Intel Core processors."

The company states that only the top Intel Z490 and next-best H470 chipsets support "Rocket Lake-S" from the 400-series, and such motherboards require a BIOS update from the motherboard manufacturer or pre-built OEM. We're having a hard time figuring out why the B460 or H410 have been excluded. With the H410, an argument can be made on insufficient CPU VRM capabilities of most motherboards; but the same can't be made for the B460, with several motherboard manufacturers having developed premium DIY motherboards with capable VRM solutions (eg: the ROG B460-F Gaming, or B460 AORUS Elite). Those looking to save some dough on mid-tier motherboards to use with "Rocket Lake" should now wait for Intel to launch the B560 chipset.

With the debut of PCIe 4.0 standard, SSD manufacturers have started launching a new generation of storage devices, with unseen speeds before. Today's PCIe 4.0 SSDs can reach up to 8.0 GB/s reads and writes, all thanks to the bandwidth-heavy PCIe protocol. However, enterprise workloads are always requiring more and more bandwidth to satisfy their needs. Data is being moved in immense quantities and faster hardware is always welcome. The previous PCIe 4.0 standard is about to kneel to its successor - PCIe 5.0 protocol. Having double the amount of bandwidth, the new standard is set to bring unseen speeds.

The PCIe 5.0 protocol offers 32 GT/s per lane, making up to 64 GB/s in the full x16 implementation. However, when it comes to SSDs, as they use x4 lanes, it will increase the maximum speed to 16 GB/s, doubling the previous bandwidth. Silicon Motion, the maker of NAND flash controllers, has announced that the company is going to debut a PCIe 5.0 controller next year. "We are excited about enterprise-grade PCIe Gen5 controller, which we will have taped out early next year and sample in the second half of 2022", said Wallace Kuo, chief executive of Silicon Motion, during a conference call. Launching just in time to pair with Intel's Sapphire Rapids Xeon processors that support the PCIe 5.0 protocol, Silicon Motion is probably expecting to grab its market share there.

Applications such as data analytics, autonomous-driving and medical diagnostics are driving extraordinary demands for machine learning and hyperscale compute infrastructure. To meet these demands, Microchip Technology Inc. today announced the world's first PCI Express (PCIe) 5.0 switch solutions—the Switchtec PFX PCIe 5.0 family—doubling the interconnect performance for dense compute, high speed networking and NVM Express (NVMe ) storage. Together with the XpressConnect retimers, Microchip is the industry's only supplier of both PCIe Gen 5 switches and PCIe Gen 5 retimer products, delivering a complete portfolio of PCIe Gen 5 infrastructure solutions with proven interoperability.

"Accelerators, graphic processing units (GPUs), central processing units (CPUs) and high-speed network adapters continue to drive the need for higher performance PCIe infrastructure. Microchip's introduction of the world's first PCIe 5.0 switch doubles the PCIe Gen 4 interconnect link rates to 32 GT/s to support the most demanding next-generation machine learning platforms," said Andrew Dieckmann, associate vice president of marketing and applications engineering for Microchip's data center solutions business unit. "Coupled with our XpressConnect family of PCIe 5.0 and Compute Express Link (CXL ) 1.1/2.0 retimers, Microchip offers the industry's broadest portfolio of PCIe Gen 5 infrastructure solutions with the lowest latency and end-to-end interoperability."

The 11th Gen Intel Core H35 processors, the newest of Intel's H-series processors, are designed for ultraportable gaming on laptops. Packed with incredible gaming performance in an ultraportable form factor, the processors balance mobility and enthusiast-level gaming. The 11th Gen Intel Core i7-11375H Special Edition headlines the new H35 processors, and utilizes Intel Turbo Boost Max 3.0 to deliver up to 5.00 GHz Turbo frequencies.

The 11th Gen Intel Core i7-11375H Special Edition delivers the fastest single-threaded performance of any laptop processor and is matched only by the 10th Gen Intel Core i9-10980HK. 11th Gen Intel Core H35 processors enable enthusiast level gaming on the go. Users can play a majority of popular e-sports and AAA games in full high definition at high settings with the 11th Gen Intel Core i7-11375H Special Edition processor.

Here are some of the first pictures of the humongous Intel Xeon "Sapphire Rapids-SP" processor, in the flesh. Pictured by YuuKi-AnS on Chinese micro-blogging site bilibili, the engineering sample looks visibly larger than an AMD EPYC. Bound for 2021, this processor will leverage the latest generation of Intel's 10 nm Enhanced SuperFin silicon fabrication node, the latest I/O that include 8-channel DDR5 memory, a large number of PCI-Express gen 5.0 lanes, and ComputeXpress Link (CXL) interconnect. Perhaps the most interesting bit of information from the YuuKi-AnS has to be the mention of an on-package high-bandwidth memory solution. The processors will introduce an IPC uplift over "Ice Lake-SP" processors, as they use the newer "Willow Cove" CPU cores.

AMD's CPU offerings are generally considered to best Intel's competition, especially since the company's Zen 3, Ryzen-5000 series of CPUs launched to great critical and customer acclaim. However, silicon performance can only get you so far - one other issue impacting market penetration is availability of said processors. As AMD fights for constrained wafer supply from TSMC - in no small part due to their focusing of their entire portfolio on the company's highly-sought 7 nm process - users worldwide are generally seeing insufficient stocks of AMD silicon to satisfy their needs. And as such, it seems that at least some users are going with Intel solutions, due to their higher availability in the market.

According to a report from Mercury Research, AMD's constrained chip supply has led the company to a market share loss QoQ. AMD's desktop penetration fell from 20.1% to 19.3% in a single quarter, and its mobile market share saw a similar decrease, going from a 20.1% share down to 19.1%. Of course, not only from market share and shipments are a company's financials made of; AMD ushered in higher ASP (Average Selling Price) for its products, leading the company to a 50% increase in YoY revenue. This doesn't mean AMD is selling less CPUs, however; the x86 CPU market grew a massive 20.1% YoY, so AMD is actually shipping more product than in previous years - it just couldn't account for the entirety of that x86 market increase. Overall, and considering AMD's desktop, mobile, and server markets, the company's x86 market share decreased by 0.7% in Q4 2020 to 21.7% - still a very significant increase, YoY, from its previous 15.5% of the market pie.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the launch of their new H510 series motherboards designed to run the latest Intel 11th gen Rocket Lake-S processors. Introduced to the market in two Micro-ATX models, the H510MH/E 2.0 and the H510MX/E 2.0 motherboards are designed to be the best choice for business and casual use. Based on Intel's H510 single chip architecture, these motherboards are ready to unleash the true potential of the latest Intel 11th gen processors.

Equipped with all the essential features, the new H510 series comes from an immensely popular lineage of motherboards from BIOSTAR used all over the world in many offices that combine cutting edge technology with proven durability for smart business solutions. Designed to optimize any professional workflow, the H510 series motherboards bring the latest technology for users like PCIe 4.0 and WiFi 6 optimized to perfection with the protection and stability of BIOSTAR's proprietary Super Hyper PWM technology. Both motherboards support dual-channel DDR4 memory, optimized to run up to 64 GB and a maximum clock speed 2933 MHz.

An Intel 12th Gen Core "Alder Lake-P" sample surfaced on the Geekbench online results database. The "Alder Lake" microarchitecture introduces heterogenous multi-core to the desktop platform, following its long march from Arm big.LITTLE in 2013, through to laptops with Intel's "Lakefield" in 2019. Intel will build both desktop- and mobile processors using the microarchitecture. The concept is unchanged from big.LITTLE. A processor has two kinds of cores—performance and low-power. Under lower processing loads, the low-power cores are engaged, and the performance cores are only woken up as needed. In theory, this brings about tremendous energy-efficiency gains, as the low-power cores operate within a much higher performance/Watt band than the high-performance cores.

The "Alder Lake" silicon features two kinds of cores—eight "Golden Cove" performance cores, and eight "Gracemont" low-power cores. The "Golden Cove" cores can be configured with HyperThreading (2 logical processors per core). Intel's product managers can create multiple combinations of performance and low-power cores, to achieve total core counts of up to 16, and logical processor counts of up to 24. This also warrants close attention to the composition of the core types, beyond an abstract core-count. A 14-core processor with 6 performance- and 8 low-power cores will perform vastly different from a 14-core processor with 8 performance- and 6 low-power cores. One way to derive core counts is by paying attention to the logical processor (thread) counts, as only the performance "Golden Cove" cores support HTT.

Here are some of the first pictures of the Intel Xe DG1 SDV, taken apart to reveal its rather desolate PCB. The Xe DG1 SDV isn't commercially available, but rather distributed by Intel to ISVs, so they can begin optimizing or developing for the Gen12 Xe graphics architecture. The board features a GPU ASIC that's nearly identical to the Iris Xe MAX mobile discrete GPUs, and four LPDDR4 memory chips making up 8 GB of video memory.

The Xe DG1 GPU is based on the Xe LP graphics architecture, and the silicon is built on the 10 nm SuperFin silicon fabrication node. The chip features 96 execution units (768 unified shaders); and apparently makes do with the 75 W power supplied by the PCI-Express slot. A frugal 2-phase VRM powers the GPU. The GPU uses conventional 4-pin PWM to control the fan, which ventilates a simple aluminium mono-block heatsink. Three DisplayPorts and one HDMI 2.1 make up the output configuration. While you won't be able to buy a Xe DG1 SDV in the market (unless an ISV decides to break their NDA and put one up on eBay), Intel has allowed a small number of board partners to develop custom-design cards. ASUS is ready with one. Igor's Lab has more pictures, a list of benchmark fails, and other interesting commentary in the source link below.

We recently reported on Intel's goal to launch their 7 nm node in 2023 which would put them on track to directly compete with TSMC's 3 nm node. It would seem like Intel has partially accepted defeat according to a recent DigiTimes report which alleges that Intel has signed a deal with TSMC to mass-produce 3 nm processors starting H2 2022. The report goes on to detail an arrangement where TSMC manufacturers the bulk of Intel processors with in-house production expected to continue albeit at lower quantities. This arrangement would also see Intel and TSMC cooperate on 2 nm products. If this deal turns out to be real Intel would become TSMC's second-largest customer after Apple.

Today, Elon Musk, the founder of Tesla, Inc., has announced an update to the Tesla Model S automobile. The new car has seen a design revision for the first time since 2012, and it looks like something straight from the future. The interior has seen a complete revamp, and now it looks very futuristic and minimalistic. The specs of the car are also impressive. It can accelerate from 0-60 mph in just under two seconds. The starting price of the car is 80K USD, and it will be available in March. However, the speed and the price is not the main character found inside the car.

Tesla has announced that the updated Model S design has a new infotainment system that has a Tesla Arcade gaming platform with 10 TeraFLOPs of power. According to Mr. Musk, you will be able to play Witcher 3 and Cyberpunk on the Tesla Arcade, a new gaming platform for Tesla vehicles. Right now, it is undefined what is the exact configuration inside the new Tesla Model S car. However, it is speculated that AMD Radeon Navi 23 GPU is powering the platform. When it comes to the CPU choice, speculations are pointing out that Tesla is most likely using an Intel Atom chip paired with the aforementioned AMD Radeon GPU. All we know is that the GPU is clocked at 2.44 GHz, and possibly has 32 CUs. To play Cyberpunk and Witcher 3, you are would need to own one of these new Model S autos and the whole software stack is running locally. We are expecting to hear more about the final specifications once the car arrives in March.

Intel's 11th Gen Core "Rocket Lake-S" processor is shaping up to be one hot chip. Enthusiasts on Chinese tech forum ChipHell with access to a Core i9-11900KF sample report, that when stressed at [apparently] stock settings, in which the processor hits its all-core boost frequency of 4.80 GHz, even a 360 mm all-in-one liquid CPU cooler struggles to keep the chip from hitting 100 °C, with core temperatures reaching 98 °C. The i9-11900KF comes with a disabled iGPU, which means all of its heat is generated by the core and uncore components of the GPU. AIDA64 was used, to apply multi-threaded stress on the processor (the burn-in test), while CPU-Z reports a core voltage of 1.401 V, it's not known whether this is a manual setting, the chip's VID, or whether the motherboard is trying to stabilize the 4.80 GHz clocks.