Intel's 11th generation Core "Rocket Lake-S" desktop processors could feature similar Power Level values to their 10th Gen counterparts, according to a recent Core i9-11900 engineering sample benchmark leak posted to Chinese social media platform Bilibili. The i9-11900 (non-K) is a locked SKU that succeeds the i9-10900, and has a rated TDP of 65 W (which is also its PL1), but the PL2 value is reportedly 224 W, identical to that of the i9-10900. A recent report also predicted that individual 11th Gen SKUs have the same TDP (PL1) ratings as their 10th Gen counterparts, with locked SKUs rated at 65 W, and unlocked "K" and "KF" SKUs featuring 125 W.

The "QV1J" engineering sample for the i9-11900, which has been doing rounds with most leaks, has a nominal clock speed of just 1.80 GHz, an all-core Turbo Boost frequency of 3.80 GHz, and maximum (single-core) boost frequency of 4.40 GHz. The 8-core/16-thread processor ends up performing slightly better than the i9-9900K at Cinebench R15 and Cinebench R20, although not nearly enough to qualify as a generational performance uplift. The i9-11900 ES was tested on a motherboard based on the next-gen mid-range Intel B560 chipset.

The dankest of memes has come out of the digital underworld to spread fear through all chickens out there in the world. KFC has announced the KFConsole, a development made in partnership with Intel, ASUS, Cooler Master, and Seagate, do deliver a console that "runs better than any other console" - which means bugs relating to chicken movement have been ironed out before release. The chassis is a KFC chicken bucket-shaped one, and is based on Intel's NUC 9 Extreme compute element paired with an unspecified ASUS graphics card - that supports ray tracing.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the XPG SPECTRIX S20G PCIe Gen3x4 M.2 2280 solid state drive (SSD). The SPECTRIX S20G is an SSD built with form and performance in mind with its distinct x-shaped RBG lighting and excellent read/write speeds.

The XPG SPECTRIX S20G is a gaming SSD through and through and its styling reflects this. It sports a distinctive and prominent x-shaped RGB design that outshines the competition. The RGB light effects can be customized via software. What's more, a hairline-brushed finish gives the SSD a formidable yet elegant look that will intimidate and impress.

Intel's 11th Generation Core "Rocket Lake-S" desktop processor family could be formally unveiled in just a few weeks from now, with HotHardware reporting a 2021 International CES unveiling (virtual event), for both the processors and their companion Intel 500-series chipset motherboards. This would put the unveiling around mid-January for the virtual launch event.

Availability is a different story, with the report predicting that while the Intel 500-series chipset motherboards will be available from mid-January, the processors won't arrive until March. Older reports predicted a market availability of these processors to almost miss Q1, and spill over into Q2 (April-June). Since "Rocket Lake-S" is based on the current LGA1200 package, the Intel 500-series chipset motherboards are expected to support existing 10th Gen Core "Comet Lake-S" processors, along with out-of-the-box support for the 11th Gen.

Designing a custom processor can be a rewarding thing. You can control your ecosystem surrounding it and get massive rewards in terms of application-specific performance uplift, or lower total cost of ownership. It seems like cloud providers have figured out that at their scale, designing a custom processor can get all of the above with the right amount of effort put into it. If you remember, in 2018, Amazon has announced its Graviton processor based on Arm instruction set architecture. Today, the company has almost 10% of its AWS instances based on the Graviton 1 or 2 processors, which is a massive win for a custom design.

Following Amazon's example, the next company to join the custom server processor race is going to be Microsoft. The Redmond based giant is looking to build a custom lineup of processors that are meant to satisfy Microsoft's most demanding sector - server space. The company's Azure arm is an important part where it has big and increasing revenue. By building a custom processor, it could satisfy the market needs better while delivering higher value. The sources of Bloomberg say that Microsoft is planning to use Arm ISA, and start building independence from the x86 vendors like Intel and AMD. Just like we saw with AWS, the industry cloud giants are starting to get silicon-independent and with their scale, they can drive the ecosystem surrounding the new processors forward rapidly. The sources are also speculating that the company is building custom processors for Surface PCs, and with Windows-on-Arm (WoA) project, Microsoft has laid the groundwork in that field as well.

Benchmark numbers of an upcoming Intel Core i9-11900 (non-K) and i9-11900K processor engineering samples allegedly obtained on CPU-Z Bench reveal that the chip will deliver on the company's "double-digit IPC gain" promise for the "Rocket Lake" microarchitecture. The i9-11900 (non-K) sample posted a single-threaded performance score of 582 points, while the i9-11900K ES posted 597 points, which are roughly 12% higher than typical CPU-Z Bench single-thread numbers for the current-gen i9-10900 (non-K) and i9-10900K "Comet Lake-S" processors. The multi-threaded score of the i9-11900 (non-K) ES, at 5262 points, ends up just around 5-10% lower than that of the i9-10900, despite a deficit of two cores. Intel's 11th Gen Core "Rocket Lake-S" story is hence shaping up to be that of increased gaming performance from the IPC gain, while roughly the same multi-threaded performance as the 10th Gen "Comet Lake-S."

Intel's 11th Gen Core "Rocket Lake-S" desktop processors could feature similar TDP values to their 10th Gen "Comet Lake-S" predecessors, according to Momomo_us. Intel is preparing to give the Unlocked "K" and "KF" SKUs a TDP rating of 125 W, while the locked non-K models feature 65 W rating. The lineup is led by the 8-core/16-thread Core i9-11900K, followed by the locked i9-11900 and iGPU-devoid i9-11900F; the slightly slower 8-core/16-thread Core i7-11700K, followed by the i7-11700KF, i7-11700, and i7-11700F; and the 6-core/12-thread i5-10600K and its derivatives.

The 11th Gen Core desktop processor series arrives in Q1 2021, and is based on the 14 nm "Rocket Lake-S" silicon, and built into the Socket LGA1200 package, with backwards compatibility with Intel's 400-series chipset motherboards, and native support for the Intel 500-series. The "Rocket Lake-S" die is rumored to feature up to 8 "Cypress Cove" CPU cores, a dual-channel DDR4 memory controller, a 24-lane PCI-Express 4.0 root complex, and an updated Gen12 iGPU based on the Xe LP graphics architecture. The "Cypress Cove" CPU cores are reportedly 14 nm back-ports of the "Willow Cove" cores, and feature a double-digit percent IPC increase over the "Skylake" cores.

Intel today commenced the process of discontinuation of the "Avengers Edition" SKUs of its 10th Generation Core "Comet Lake-S" desktop processors, through a product change notification (PCN). The said PCN #117894-00 mentions December 16, 2020 as a common date for all four key discontinuation milestones in the product's lifecycle, namely Product Discontinuation Support commencement, Last Product Discontinuance Order (the last opportunity for distributors to place orders from Intel for), the date for these orders to become non-cancelable and non-returnable; and the date for the last order to ship. Normally, the latter two milestones are spaced 6 months and 12 months apart from the date of the product discontinuation PCN. To put this in simpler terms—and unless the PCN doesn't have a typo with its dates—Intel is expeditiously discontinuing its 10th Gen Core "Comet Lake-S" desktop processors, marking them EOL (end of life).

Intel is preparing to update the PC platform (unclear if mobile or desktop although likely mobile); with the ability for a PC to adapt to its surroundings. This would mean adjusting the brightness on-the-fly based on ambient light (a feature that's existed on mobile phones for 20 years now); but also to detect the presence of a user in its vicinity. The company didn't detail how it goes about this, but technologies already exist to combine visual input from the PC's cameras; radio from the PC's antennas, audio from its mic array; to form a picture of its surroundings.

Intel's next-gen PC platforms could introduce hardware called the Visual Sensing Controller (codenamed "Clover Falls,") a device that serves as a "companion module" to the processor, giving it additional AI capabilities. The chip will serve a dual purpose as a security module, using visual inputs to detect user-presence. This possibly builds on Windows Hello, but now has certain additional capabilities (you probably won't need to sit still and put on your poker face).

Intel is still in the work of testing and certification for their more complex graphics products based on their Xe microarchitectures, and that means that some tests are being done in well-known benchmarking platforms. Case in point, an Intel Xe GPU with a reported 128 EUs (1024 shading units), 3 GB of memory, and a clockspeed of 1.4 GHz ran through Geekbench, where it scored an... interesting 9,311 points in the OpenCL test.

This is more likely than not an engineering sample, considering that Intel's Iris Xe MAX wrapped in its Tiger Lake package can score up to 23,000 points. It is currently unclear if this particular Xe manifestation is running on Intel's Xe-LP or Xe-HPG architecture. This might be Intel's DG-2 product, which offers higher performance than their DG-1 discrete graphics card that is only available for system integrators.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today announced the desktop smart edge PoE Switch - QGD-3014-16PT. With sixteen 30-watt Gigabit PoE ports, two 2.5GbE host management ports, Intel Celeron J4125 quad-core 2.0 GHz processor, and four 3.5-inch SATA drive bays, the QGD-3014-16PT supports QVR Pro, HBS 3 and QuWAN SD-WAN to integrate surveillance deployment, video storage computing, and multi-site remote management to offer SMBs innovative intelligent IP surveillance infrastructure and remote backup solutions.
"Expanding multi-site surveillance networks can be costly and involve large amounts of equipment with low transmission efficiency between multiple remote devices - not to mention the complexities involved in deployment and management. " said Daniel Hsieh, QNAP Product Manager, adding, "the QGD-3014-16PT desktop Smart Edge PoE Switch integrates PoE, surveillance capabilities, and data backup management to simplify these requirements and increase the transmission and backup efficiency of surveillance videos."

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

Susquehanna is a global trading firm which has various interests in silicon manufacturing - and part of that interest is naturally materialized in Intel. In a recent group call from the firm, some details on Intel's manufacturing and product design woes came to light, which point towards even more execution slips than we've already seen. During the call, a number of points were broached, including dismal yields for Intel's 10 nm manufacturing process as of its introduction in late 2018 (which is why it never saw mainstream adoption from the company). News that Intel is looking for a new CEO also don't instill confidence on current CEO Bob Swan's capacity to steer the Intel behemoth.

Improved yields on 10 nm are being reported due to deployment of Intel's SuperFin technology, which improved yields to upwards of 50%, but still keeps them under the ones achieved in Intel's 14 nm process; an eye-opening tidbit in that Cannon Lake on 10 nm originally saw yields of only 25% usable chips per wafer; and that backporting Rocket Lake meant Intel had to deal with unfathomably large chips and high power consumption characteristics. And to add insult to injury, there is still not a definite timetable for 7 nm deployment, with delays being expected to be worse than the previously reported 6-12 months. This all paints a somewhat grim picture for Intel's capacity to compete with TSMC-powered AMD in many of its most important markets; the blue giant won't topple, of course, but it's expected that five years from now, we'll be looking at a very different outlook in the market between AMD and Intel. You can check the talked-about points in the call via the transcript after the break. You should still take the transcript with a grain of salt.

Intel needs a platform refresh to battle the competition, mainly speaking to battle AMD and its Ryzen 5000 series processors. That is why the company is developing 500 series of chipsets covering the low-end (H510), mid-range (B560), and high-end markets (Z590) that pair with the upcoming Rocket Lake-S processor generation. Dubbed 11th generation of Core processors, the 11th generation of Intel Core CPUs are going to be built on Intel's refined 14 nm process. The CPUs are supposed to feature a Cypress Cove core, which is a backport of Golden Cove found in Ice Lake. The 500 series motherboards are the last in the DDR4 generation, launching in the timeframe when DDR5 is supposed to take over in the coming years.

Today, thanks to Weixin, a Chinese media outlet that posted a short story on the WeChat platform, we have information about the launch date of these new chipsets. According to the source, we are allegedly going to see these new chipsets on January 11th, the day that Intel CES 2021 event is supposed to happen. The platform will include a range of motherboards from Intel's partners and is supposed to bring support for the much-needed PCIe 4.0 protocol. The launch date should be taken with a grain of salt, of course, before taking it as a fact.

Today, at Intel's Memory and Storage 2020 event, the company highlighted six new memory and storage products to help customers meet the challenges of digital transformation. Key to advancing innovation across memory and storage, Intel announced two new additions to its Intel Optane Solid State Drive (SSD) Series: the Intel Optane SSD P5800X, the world's fastest data center SSD, and the Intel Optane Memory H20 for client, which features performance and mainstream productivity for gaming and content creation. Optane helps meet the needs of modern computing by bringing the memory closer to the CPU. The company also revealed its intent to deliver its 3rd generation of Intel Optane persistent memory (code-named "Crow Pass") for cloud and enterprise customers.

"Today is a key moment for our memory and storage journey. With the release of these new Optane products, we continue our innovation, strengthen our memory and storage portfolio, and enable our customers to better navigate the complexity of digital transformation. Optane products and technologies are becoming a mainstream element of business compute. And as a part of Intel, these leadership products are advancing our long-term growth priorities, including AI, 5G networking and the intelligent, autonomous edge." -Alper Ilkbahar, Intel vice president in the Data Platforms Group and general manager of the Intel Optane Group.

AMD is preparing to launch its next-generation of EPYC processors codenamed Millan. Being based on the company's latest Zen 3 cores, the new EPYC generation is going to deliver a massive IPC boost, spread across many cores. Models are supposed to range anywhere from 16 to 64 cores, to satisfy all of the demanding server workloads. Today, thanks to the leak from ExecutableFix on Twitter, we have the first benchmark of a system containing two of the 64 core, 128 thread Zen 3 based EPYC Milan processors. Running in the 2P configuration the processors achieved a maximum boost clock of 3.7 GHz, which is very high for a server CPU with that many cores.

The system was able to produce a Cinebench R23 score of insane 87878 points. With that many cores, it is no wonder how it is done, however, we need to look at how does it fare against the competition. For comparison, the Intel Xeon Platinum 8280L processor with its 28 cores and 56 threads that boost to 4.0 GHz can score up to 49,876 points. Of course, the scaling to that many cores may not work very well in this example application, so we have to wait and see how it performs in other workloads before jumping to any conclusions. The launch date is unknown for these processors, so we have to wait and report as more information appears.

According to the International Data Corporation (IDC) Worldwide Quarterly Server Tracker, vendor revenue in the worldwide server market grew 2.2% year over year to $22.6 billion during the third quarter of 2020 (3Q20). Worldwide server shipments declined 0.2% year over year to nearly 3.1 million units in 3Q20. Volume server revenue was up 5.8% to $19.0 billion, while midrange server revenue declined 13.9% to $2.6 billion, and high-end servers declined by 12.6% to $937 million.

"Global demand for enterprise servers was a bit muted during the third quarter of 2020 although we did see areas of strong demand," said Paul Maguranis, senior research analyst, Infrastructure Platforms and Technologies at IDC. "From a regional perspective, server revenue within China grew 14.2% year over year. And worldwide revenues for servers running AMD CPUs were up 112.4% year over year while ARM-based servers grew revenues 430.5% year over year, albeit on a very small base of revenue."

Amazon Web Services (AWS), the world's largest cloud services provider, has launched its Graviton series of custom processors some time ago. With Graviton, AWS had a plan to bring down the costs of offering some cloud services both for the customer and for the company. By doing that, the company planned to attract new customers offering greater value, and that plan seems to be working out well. When AWS launched its first-generation Graviton processor, the company took everyone by surprise and showed that it is capable of designing and operating its custom processors. The Graviton series of processors is based on the Arm Instruction Set Architecture (ISA) and the latest Graviton 2 series uses Arm Neoverse N1 cores as the base.

Today, thanks to the data from Liftr Insights, we get to see just how many total AWS instances are Graviton based. The data is showing some rather impressive numbers for the period from June 2019, to August 2020. In that timeframe, Intel with its Xeon offerings has seen its presence decrease from 88% to 70%, while AMD has grown from 11% to 20% presence. And perhaps the greatest silent winner here is the Graviton processor, which had massive growth. In the same period, AWS increased Graviton instance number from making up only 1% of all instances, to make up 10% of all instances available. This is a 10-fold increase which is not a small feat, given that data center providers are very difficult when it comes to changing platforms.

Today, thanks to the ServeTheHome forum member "111alan", we have the first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what appears to be a dual-die design similar to Cascade Lake-SP design with 56 cores and 112 threads that uses two dies. The Sapphire Rapids is a 10 nm SuperFin design that allegedly comes even in the dual-die configuration. To host this processor, the motherboard needs an LGA4677 socket with 4677 pins present. The new LGA socket, along with the new 10 nm Sapphire Rapids Xeon processors are set for delivery in 2021 when Intel is expected to launch its new processors and their respective platforms.

The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.

Raja Koduri senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel Corporation has recently teased Intel's upcoming Xe-HP accelerator alongside its in production HC3 XG310 server card. The HC3 solution was Intel's first Xe-based product utilizing the Xe-LP architecture. The Intel Xe-LP products are Intel's lowest power efficiency optimized Xe processors while the Xe-HP products should offer improved performance and scaling. The upcoming Xe-HP accelerator appears to be a single-slot passively card with a single 8-pin power connector. Raja Koduri expects developers will begin receiving Xe-HP, Xe-HPG, and Xe-HPC products in 2021. He also declared that we are in the GPU golden age with new launches from NVIDIA, AMD, Intel, and Apple.

ID Cooling has announced their latest Mega Coolers, a new moniker and lineup that announces the coolers' compatibility with the latest, greatest, highest performance, and most power-hungry CPUs. The coolers are designed to accompany CPUs with TDPs up to 280 W. ID Cooling said these new mega coolers in the SE-207-series, which are basically tower coolers in design, will be hitting market just in time to address AMD's new-generation enthusiast grade Ryzen 5000-series 'Vermeer' and Intel's upcoming 11th Generation Core 'Rocket Lake' processors.

There are two separate coolers in the family; the SE-207-XT Black is aimed at AMD's Ryzen processors as well as Intel CPUs in LGA1200/115x/20xx form-factors; if you need some more cooling oomph, however, the SE-207-TRX Black is aimed at AMD's Ryzen Threadripper processor in TR4 packaging. Both coolers offer the same 280 W TDP dissipation capabilities, and are built in a twin-tower design with twin fans (700 RPM ~ 1800 RPM, up to 76.16 CFM air pressure, up to 35.2 dBA). In the case of the Threadripper-loving SE-207-TRX, a copper baseplate with direct-touch heatpipe technology removes heat from your CPU and passes it through the large, black, dual fin-stack arrays which are then cooled by two 120 mm fans. The E-207-XT Black, on the other hand, makes do with a solid copper baseplate absent of that same direct touch technology.

Apple's M1 SoC is possibly the year's biggest semiconductor success story, as the chip has helped Apple begin its transition away from Intel's x86 machine architecture, and create its own silicon that's optimized for its software and devices; much like its A-series SoCs powering iOS devices. The company now plans to scale up this silicon with a new 32-core version designed for high-performance Mac devices, such as the fastest MacBook Pro models; and possibly even iMac Pros and Mac Pros. The new silicon could debut in a new-generation Mac Pro in 2022. Bloomberg reports that the new silicon will allow this workstation to be half the size of the current-gen Mac Pro workstation in form, while letting Apple keep its generational performance growth trajectory.

In addition, Apple is reportedly developing a 16-core "big" + 4 "small" core version of the M1, which could power more middle-of-the-market Macs, such as the iMac desktop, and the bulk of the MacBook Pro lineup. The 16B+4s core chip could debut as early as Spring 2021. Elsewhere, the company is reportedly stepping up efforts to develop its own high-end professional-visualization GPU that it can use in its iMac Pro and Mac Pro workstations, replacing the AMD Radeon Pro solutions found in the current generation. This graphics architecture will be built from the ground-up for the Metal 3D graphics API, as well as a parallel compute accelerator. Perhaps the 2022 debut of the Arm-powered Mac Pro could feature this GPU.

Today, in the latest GeekBench 5 submission by ASUS, we have discovered something rather interesting. Intel's Ice Lake-SP processors were rumored to arrive with up to 28 cores and 56 threads at maximum, on a single chip. That was due to the 10 nm process used to make these chips, with suspicions that the yield of the node was not good enough to make any higher core count parts. Thanks to the GB5 listing, discovered by Leakbench on Twitter, the Intel Ice Lake-SP CPU engineering sample appeared with an amazing 36 cores with 72 threads. This is supposedly Intel's efforts to try and match the 64 cores and 128 threads of AMD's EPYC "Rome" CPUs, which are winning many server applications due to their performance.

The 36C/72T chip was paired with another similar chip in a 2P dual-socket configuration, which made the total core count rise to 72 cores and 144 threads, running inside of Asustek's Y4R-A1-ASUS-G1 server. The system was reporting a clock frequency of 3.6 GHz base speed, which means that the possible boost clocks could be higher. The CPU features a 1.25 MB level two (L2) cache per core (45 MB in total) and 54 MB of unified level three (L3) cache. That makes this CPU core quite an improvement over the past Cooper Lake generation. We are waiting for more information about these CPUs, and we are going to report on it in the coming time.

In a bid to maximize utilization of its own semiconductor foundry for manufacturing larger, more profitable processors, Intel could be look at contracting TSMC to manufacture certain processors based on its low-power CPU microarchitectures, according to a new Intel job posting discovered by Komachi Ensaka. The job description for a position in Intel's Bengaluru facility, speaks of a "QAT Design Integration Engineer" who would play a role in the "development and integration of CPM into Atom and Xeon-based SoC on Intel and TSMC process."

QAT is a hardware feature that accelerates cryptography and data-compression workloads. Since the Xeon part in this sentence is referenced next to SoC, Intel could be referring to Xeon processors based on low-power cores, such as "Snow Ridge," which uses "Tremont" CPU cores. The decision to go with TSMC could also be driven by the 5G infrastructure hardware gold rush awaiting the likes of Intel across dozens of new markets, particularly those averse to buying hardware from Huawei.

During CES 2020, way back in January of this year, Razer had shown off a quite interesting concept. Called a modular gaming desktop, the concept has a goal to allow users to just swap-out parts on the fly and have no trouble doing so. Today, the company has officially decided to launch the Tomahawk gaming desktop. Designed for small-form-factor computing, the case of the Tomahawk PC is coming in at just 10L volume, with measurements of 210 mm x 365 mm x 150 mm. The case is an all-black aluminium silhouette with the signature Razer logo and Chroma lighting around the base. That gives it a simple look that can blend in with any environment.

When it comes to the insides, the PC features a power supply of 750 Watts that powers one of Intel's NUC Element boards that is a house for a 45 W Core i9-9980HK Coffee Lake processor with eight cores and 16 threads. When it comes to memory, it has 16 GB of RAM and 512 GB of PCIe M.2 NVMe SSD storage, paired with a 2 TB hard drive. Razer offers users to upgrade memory and storage, while the CPU is soldered to the board. You can pre-order the Razer Tomahawk PC at a price starting at $2,399.99, while if you want to equip it with something like NVIDIA GeForce RTX 3080 GPU, you will be paying $3,199.99. If you already have a GPU to install, then you should just order the base.