Prices of retail 11th Gen Intel Core "Rocket Lake" desktop processors are beginning to settle down close to the "1,000-unit tray" prices on Amazon (US). The 1K-unit tray prices have traditionally served as a de facto baseline for retail prices, and as of today (April 16), we see several SKUs popular with gamers and PC enthusiasts approach levels close to the baseline. This wouldn't strictly be a price-cut, since they are still higher than the baseline, but would be a trimming of the retailer mark-ups traditionally attached to new processor launches.

As of this writing, the retail Core i7-11700K is listed on Amazon (US) for USD $404, practically identical to the $399 1K-unit tray price. The i7-11700 (non-K) can be had for $339.99, very close to the $323.99 tray price. The Core i5-11600K is going for $264.99, which is almost identical to the $262 tray price. Lesser "locked" SKUs such as the i5-11500 are within $10-15 of their tray pricing. It's only the top-dog Core i9-11900K and i9-11900KF that remain heavily marked up by sellers on Amazon. At these prices, the 11th Gen Core processors are expected to apply pressure on sellers of AMD Ryzen 5000 series processors to review the prices of SKUs such as the Ryzen 7 5800X and Ryzen 5 5600X; and on AMD to release cheaper Ryzen 5000 series SKUs in the retail channel.

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.Download CPU-Z Version 1.96 Here.

NVIDIA has recently announced the company's first standalone Grace CPU that will come out as a product in 2023. NVIDIA has designed Grace on Arm ISA, likely ARM v9, to represent a new way that data centers are built and deliver a whole new level of HPC and AI performance. However, the CPU competition in a data center space is considered one of the hardest markets to enter. Usually, the market is a duopoly between Intel and AMD, which supply x86 processors to server vendors. In the past few years, there have been few Arm CPUs that managed to enter the data canter space, however, NVIDIA is aiming to deliver much more performance and grab a bigger piece of the market.

As a self-proclaimed leader in AI, Intel is facing hard competition from NVIDIA in the coming years. In an interview with Fortune, Intel's new CEO Pat Gelsinger has talked about NVIDIA and how the company sees the competition between the two. Mr. Gelsinger is claiming that Intel is a leader in CPUs that feature AI acceleration built in the chip and that they are not playing defense, but rather offense against NVIDIA. You can check out the whole quote from the interview below.

Microsoft's hardware legacy stretches back more than four decades to the early days of personal computing. As Windows built and inspired new computing experiences, new Microsoft hardware accessories helped people interact with them. At this intersection of hardware and software, magical experiences are possible. This core belief is at the heart of every product we build at Microsoft, and it's especially true of our Surface products. For almost a decade, Surface has pioneered breakthrough experiences that immerse people in their creative flow, eliminating friction that often exists between people and technology.

Surface allows people to adapt to new ways of working and creating through innovative and versatile devices that offer premium design and performance, quality typing and trackpads, exceptional cameras and mics, and immersive touchscreen display technologies. From the student learning on their Surface Go or Surface Laptop Go, to the knowledge worker on their Surface Pro 7+, to the creative professional working on a Surface Book 3, these products now serve as a lifeline to connections, content and work. It's inspiring to consider all that can be achieved on a Surface.

ASUS today announced ASUS Chrome Enterprise devices, an exciting offering that combines the benefits of top-notch ASUS hardware with the business capabilities of Chrome OS. ASUS Chrome Enterprise devices are specifically built for business—enabled with Chrome Enterprise and housed in versatile, lightweight and robust ASUS Chrome devices to provide professionals with the tools they need to be effective and productive.

The lineup of ASUS Chrome Enterprise devices spans Chromebooks with clamshell and convertible designs and various form factors, as well as Chromebox models tailored to different business needs. With this offering, businesses can enjoy features such as zero-touch enrollment and Parallels Desktop for Chrome OS to optimize workflows for cloud-first devices.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

Dell's gaming subsidiary, Alienware, has launched a product designed to reintroduce products of a company that was abandoned in the laptop sector a long time ago. Alienware's last AMD-based gaming laptop made an appearance in 2007, and for 14 years there wasn't an Alienware laptop with an AMD processor inside it. For all those years, the heart of Alienware laptops was promised to Intel, however, that is no longer the case. Today, Alienware has introduced a Ryzen edition of the m15 R5 gaming laptop, powered by... you guessed it, AMD Ryzen 5000 series of mobile processors.

The new Alienware m15 R5 Ryzen Edition laptop is set to bring the balance to the force. Featuring AMD's flagship Ryzen 9 5900HX overclockable processor, the CPU is paired with NVIDIA's GeForce RTX 3070 graphics card. All of that is crammed inside a 15-inch body that offers QHD 240Hz or FHD 360Hz panels for the best possible gaming experience. For the cherry on top, the laptop offers Cherry MX keyboard switches with per-key RGB lighting. The new Ryzen edition Alienware laptop will be available for purchase in the U.S. with select configurations on April 20 starting at $1793.98. You can check out some pictures of the laptop below.More pictures follow.

In the course of our Core i5-11400F "Rocket Lake" processor review, we discovered that the Gear 2 memory mode has the potential to offer higher performance than Gear 1. The Gear 1 mode runs the memory frequency and memory controller frequency in 1:1 sync, while the Gear 2 mode runs them at 1:2, meaning that the memory controllers run at half the memory frequency, allowing you additional memory overclocking headroom. At lower, more stable, memory frequencies, it should be logical to use Gear 1. Our testing springs some surprising results.

Overall, a stock Core i5-11400F paired with DDR4-3733 MHz memory, was found to be 1.5% faster with Gear 2, when averaged across all our CPU tests, compared to Gear 1 at the same 3733 MHz frequency. Gear 2 was 3.42% faster in Cinebench R23 multi-threaded, and a staggering 6% in MySQL. Across rendering and media workloads that scale across all cores, we find Gear 2 faster by 1-3%. It's only with less parallelized workloads such as gaming, where we see Gear 2 lag behind Gear 1, though not by much. In our i5-11400F review, we show that by running your processor in Gear 2, you're making your memory controllers pull less power, freeing up power budget for the CPU cores, translating into the nT performance gains we see here. We discovered that the uncore can pull anywhere between 5 to 10 W more power in Gear 1 mode. This is valuable power eating into the already constrained power-budget of this 65 W TDP chip.

Read the Intel Core i5-11400F TechPowerUp Review

Intel today is launching its 3rd Generation Xeon Scalable processor bringing its first major IPC uplift to the enterprise space in five years. The Xeon Scalable processors are built on the 10 nm SuperFin process, and the "Ice Lake-SP" microarchitecture that bring new "Sunny Cove" CPU cores to the server space, including support for PCI-Express 4.0 I/O capabilities, a wider memory interface, and a more feature-rich AVX-512 instruction-set, along with DLBoost for HPC. join us for its launch live-blog.14:59 UTC: CEO Pat Gelsinger and Data Platforms group head Navin Shenoy are expected to take centerstage. Xeon and memory group head Lisa Spelman could announce relevant platform products. This is Gelsinger's first major launch since taking office.

15:01 UTC: What will you solve for?

Tianshu Zhixin, a Chinese startup company dedicated to designing advanced processors for accelerating various kinds of tasks, has officially entered the production of its latest GPGPU design. Called "Big Island" GPU, it is the company's entry into the GPU market, currently dominated by AMD, NVIDIA, and soon Intel. So what is so special about Tianshu Zhixin's Big Island GPU, making it so important? Firstly, it represents China's attempt of independence from the outside processor suppliers, ensuring maximum security at all times. Secondly, it is an interesting feat to enter a market that is controlled by big players and attempt to grab a piece of that cake. To be successful, the GPU needs to represent a great design.

And great it is, at least on paper. The specifications list that Big Island is currently being manufactured on TSMC's 7 nm node using CoWoS packaging technology, enabling the die to feature over 24 billion transistors. When it comes to performance, the company claims that the GPU is capable of crunching 37 TeraFLOPs of single-precision FP32 data. At FP16/BF16 half-precision, the chip is capable of outputting 147 TeraFLOPs. When it comes to integer performance, it can achieve 317, 147, and 295 TOPS in INT32, INT16, and IN8 respectively. There is no data on double-precision floating-point numbers, so the chip is optimized for single-precision workloads. There is also 32 GB of HBM2 memory present, and it has 1.2 TB of bandwidth. If we compare the chip to the competing offers like NVIDIA A100 or AMD MI100, the new Big Island GPU outperforms both at single-precision FP32 compute tasks, for which it is designed.Pictures of possible solutions follow.

Razer, the maker of various gaming peripherals and gaming PCs/Laptops, has been a long-time user of Intel CPUs in their laptops devices. However, that might be changing just about now. According to some findings by @_rogame, there was a 3D Mark benchmark run that featured AMD Ryzen 5000 series "Cezanne" mobile processors. What is more interesting is the system it was running in. Called Razer PI411, this system is officially Razer's first AMD-powered laptop. While we don't have many details about it, we have some basic system configuration details. For starters, the laptop carries AMD's top-tier Ryzen 9 5900HX overclockable mobile processor. Carrying a configured TDP of 45 Watts (the maximum is 54 W), the system is likely not equipped with sufficient cooling for overclocking.

When it comes to the rest of the laptop, it features NVIDIA's GeForce RTX 3060 GPU, 16 GB of RAM, and 512 GB of storage. Being that this laptop was codenamed PI411, it could indicate a 14-inch model. However, we still don't know if it is ever going to hit consumer shelves. Being that Razer never carried an AMD CPU option, this could just be an engineering sample that the company was experimenting with, so we have to wait to find out more.

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

Rapid evolution in AI technology is infusing IoT devices with new capabilities, leading to the new trend of AIoT. Simply speaking, IoT devices acquire data then transmit that data through the network to an integrated backend system. Typical applications include automation, remote control, and connection with other IoT devices. AIoT brings the power of AI to these IoT devices, so that machine equipment and factories can play a more active role in the process and learn intelligently. Accumulation of data, continuous learning, and data analysis can achieve failure prevention or autonomous operation to implement a fully-fledged "smart factory." The GP-3000 is Cincoze's highly-acclaimed flagship model for AI and machine vision applications, combining high-end computing performance, rich high-speed I/O, and harsh environment resilience to enable edge computing in the AIoT framework. It is the first choice for effectively implementing multiple applications on the field side, such as smart manufacturing and transportation.

The key to rapid smart manufacturing upgrades is introducing high-efficiency GPU computers as the on-site data processing center. To that end, the GP-3000 supports an Intel Xeon /Core (Coffee Lake-R & Coffee Lake) processor and sports the Intel C246 chipset, with up to two sets of DDR4-2666 ECC/non-ECC SO-DIMMs for a maximum of 64 GB of total memory. This setup provides the coveted combination of efficient processing and parallel processing. The GPU Expansion Box (GEB) supports up to two 250 W high-end full-length (≤328 mm) GPU cards to further enhance its processing capabilities. The high-speed I/O ports, with the simple addition of a camera, become the machine equipment's eyes, allowing for the quick and accurate inspection and categorization of high-definition image inputs.

XPG, a fast growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts,is pleased to announce a new Intel collaboration for a 15.6"performance EVO certified ultrabook with thin and light form factor, the XPG XENIA Xe.

With a sleek and modem design, XPG XENIA Xe is built with a premium CNC anodized aluminium chassis with an overall thickness of only 14.9 mm (0.58 in) and weight of 1.65 kg (3.6 lbs). The ultrabook sports an Intel 11th Gen Core i5-1135G7 or i7-1165G7 processor, Intel Iris Xe graphics, a low power, high brightness 1080P Full HD IPS 15.6" display with capacitive touch, as well as XPG's very own PCIe Gen 4 high speed M.2 solid state drive (SSD).

In the past few years, Intel has struggled a lot with its semiconductor manufacturing. Starting from the 10 nm fiasco, the company delayed the new node for years and years, making it seem like it is never going to get delivered. The node was believed to be so advanced that it was unexpectedly hard to manufacture, giving the company more problems. Low yields have been present for a long time, and it is only recently that Intel has started shipping its 10 nm products. However, its competitor, TSMC, has been pumping out nodes at an amazing rate. At the time of writing, the Taiwanese giant is producing the 5 nm node, with a 4 nm node on the way.

So to remain competitive, Intel would need to apply a new tactic. The company has a 7 nm node in the works for 2023 when TSMC will switch to the 3 nm+ nodes. That represents a marketing problem, where the node naming convention is making Intel inferior to its competitors. To fix that, the company will likely start node renaming and give its nodes new names, that are corresponding to the industry naming conventions. We still have no information how will the new names look like, or if Intel will do it in the first place, so take this with a grain of salt.

G.SKILL is excited to announce a series of high speed DDR4 kits for the new Intel Z590 platform. , including DDR4-5333 CL22 16 GB (8GBx2), DDR4-4800 CL17 16 GB (8GBx2), DDR4-4800 CL20 32 GB (16GBx2), and DDR4-4600 CL20 64 GB (32GBx2) under the Trident Z Royal, Trident Z RGB, and Ripjaws V series. These new DDR4 memory specifications offer a perfect choice for those pursuing extreme memory overclocking performance, building a powerful workstation, or for the ultimate gaming experience.

Ultimate Performance DDR4-5333 on the Intel Z590 Platform
Dedicated to developing ever-faster extreme overclocking memory, G.SKILL is pushing the 16 GB (8GBx2) kit capacity to a blistering speed of DDR4-5333. This demonstrates the remarkable memory overclocking support on the latest Intel Z590 platform, which has been validated on the ASUS ROG STRIX Z590-E GAMING WIFI, ASUS ROG MAXIMUS XIII APEX, and MSI MEG Z590I UNIFY motherboards with the latest Intel Core i9-11900K processor, as shown in the screenshots below:

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.3 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency. Designed to Game: With its new 11th Gen desktop processors, Intel continues to push desktop gaming performance to the limits and deliver the most amazing immersive experiences for players everywhere.Read the TechPowerUp Reviews of the Core i9-11900K and Core i5-11600K.

Intel Core i9-11900K processor, the flagship model from the 11th generation "Rocket Lake" CPU lineup, has been overclocked to more than 7 GHz by the "Rog-Fisher". Thanks to the report coming from VideoCardz, we have information that the top-end Rocket Lake processor is possibly a very good overclocker. Running at 7048 MHz, the CPU managed to achieve that frequency using "only" 1.873 V. There is no doubt that the system was being cooled by LN2, as such overclocks need it to remain stable, however, we don't have any data on that. The CPU was paired with the ASUS ROG Maximus XIII Apex motherboard, designed for extreme overclocking purposes.

It is important to note that the CPU didn't run any benchmarks, as it was just validated at that frequency by Valid x86. The sample was likely supplied by Intel, so it could be a cherry-picked model. For the official benchmark results of Rocket Lake processors, we have to wait until tomorrow (March 30th), when NDA lifts.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is proud to introduce its extremely compact fanless embedded system, the eBOX560-52R-FL. This palm-sized embedded system is powered by the onboard Intel Core i5-8365UE or Intel Celeron 4305UE processors (codename: Whisky Lake-U). It provides high-performance, power-efficient, and abundant I/O interfaces in a compact device. The eBOX560-52R-FL is highly suitable for space-constrained applications with strict performance requirements such as industrial equipment computers, in-cabinet equipment integration, collaborative robots, and more.

"Axiomtek's eBOX560-52R-FL is designed to provide customers with flexible, convenient, and simplified solutions for industrial and embedded applications. The fanless yet low-power embedded system can operate under wide temperatures ranging from -10°C to 50°C with 0.7 m/s airflows and endure up to 50G shock and 3Grms vibration. Moreover, it features two independent 4K Ultra HD displays through its DisplayPort++ and HDMI for multi-display applications," said Janney Lee, a product manager of Product PM Division at Axiomtek. "Its compact size, excellent computing power, and ability to function in harsh environments making it ideal for diverse industrial applications such as factory, machine, and logistics automation, station gate controls, and ticket vending machines."

The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components. Fabless IC design companies that supply such components therefore benefitted greatly from manufacturers' procurement demand, and the IC design industry underwent tremendous growth in 2020. In particular, the top three IC design companies (Qualcomm, Broadcom, and Nvidia) all posted YoY increases in their revenues, with Nvidia registering the most impressive growth, at a staggering 52.2% increase YoY, the highest among the top 10 companies.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has expanded its DDR5 DRAM memory portfolio with the industry's first 512 GB DDR5 module based on High-K Metal Gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200 megabits per second (Mbps), the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications.

"Samsung is the only semiconductor company with logic and memory capabilities and the expertise to incorporate HKMG cutting-edge logic technology into memory product development," said Young-Soo Sohn, Vice President of the DRAM Memory Planning/Enabling Group at Samsung Electronics. "By bringing this type of process innovation to DRAM manufacturing, we are able to offer our customers high-performance, yet energy-efficient memory solutions to power the computers needed for medical research, financial markets, autonomous driving, smart cities and beyond."

Raja Koduri of Intel has today posted an interesting video on his Twitter account. Showing one of the greatest engineering marvels Intel has ever created, Mr. Koduri has teased what is to come when the company launches the Xe-HPC Ponte Vecchio graphics card designed for high-performance computing workloads. Showcased today was the "petaflops in your palm" chip, designed to run AI workloads with a petaflop of computing power. Having over 100 billion transistors, the chip uses as much as 47 tiles combined in the most advanced packaging technology ever created by Intel. They call them "magical tiles", and they bring logic, memory, and I/O controllers, all built using different semiconductor nodes.

Mr. Koduri also pointed out that the chip was born after only two years after the concept, which is an awesome achievement, given that the research of the new silicon takes years. The chip will be the heart of many systems that require massive computational power, especially the ones like AI. Claiming to have the capability to perform quadrillion floating-point operations per second (one petaflop), the chip will be a true monster. So far we don't know other details like the floating-point precision it runs at with one petaflop or the total power consumption of those 47 tiles, so we have to wait for more details.More pictures follow.

Intel's problems with processor production, especially with newer nodes like 10 nm and 7 nm, have been widely known. The company has not been able to deliver the latest semiconductor process on time and has thus delayed many product launches. However, things are looking to take a complete U-turn and the hell will freeze. During the "Intel Unleashed: Engineering the Future" webcast event that happened yesterday, the company made several announcements regarding the 7 nm process and its viability. We have already reported that the company is working on the new Meteor Lake processor lineup for 2023, supposed to be manufactured on the fixed 7 nm node.

However, it seems like Intel will have to tap external capacities to manufacture a part of its processor production. The company has confirmed that it will use an unknown TSMC process to manufacture a part of the 2023 processor lineup. That means that Intel and TSMC have already established the needed capacity and that TSMC has already booked wafer capacity for Intel. This has never happened before, as Intel always kept its processor production under the company roof. However, given that there is a huge demand for new semiconductor processes, Intel has to look at external manufacturing options to keep up with the demand.

Intel will formally enter the third-party semiconductor foundry business under the Intel Foundry Services (IFS) brand, announced CEO Pat Gelsinger, on Tuesday. This entity would operate under a business model not unlike that of TSMC, with its latest foundry technologies available to third-party customers, besides Intel. The company hopes to become a major foundry service provider to U.S. and E.U. customers, particularly enterprise and government contractors that need secure semiconductor manufacturing on U.S. soil.

To this effect, Gelsinger announced that the company will invest $20 billion in the state of Arizona, to set up two semiconductor foundries. Intel could have an edge over other foundry companies as its foundry service portfolio includes Intel technologies as IP blocks. IFS will be led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Pat Gelsinger. The $20 billion investment in Arizona, according to Intel, will generate over 3,000 high-skilled jobs, over 3,000 construction jobs, and approximately 15,000 local long-term jobs.