QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the QXG-2G1T-I225 PCIe network card. Providing single-port 2.5GBASE-T connectivity that supports 2.5G, 1G, 100 Mbps and 10 Mbps network speeds, the QXG-2G1T-I225 is a PCIe 2.0 x1 card that can be installed in a QNAP NAS or a Windows /Linux PC. Existing CAT 5e cables can be used with the QXG-2G1T-I225 to provide an immediate upgrade to 2.5 GbE networking. The QXG-2G1T-I225 also supports Windows Server 2019 and provides efficient server management with support for Intel Teaming (Link aggregation), PXE, Intel AMT, Wake on LAN, and VLAN.

"The QXG-2G1T-I225 represents QNAP's commitment to providing affordable 2.5 GbE solutions. By using existing CAT 5e cables, users can immediately benefit from 2.5 GbE by pairing their QXG-2G1T-I225 with a 2.5 GbE switch and NAS." said Stanley Huang, Product Manager of QNAP, adding "2.5 GbE provides immediate benefits to both home and business users across a wide range of applications - including gaming, multimedia, virtualization, backup, and general everyday usage. QNAP's 2.5 GbE solutions represent the easiest and most wallet-friendly way to adopt high-speed networking."

Intel appears to have every intention of addressing the performance gaming segment with its Xe graphics architecture. According to information leaked to the web by VideoCardz, Xe-HPG (high performance gaming?) represents a product vertical dedicated to the gaming segment. Among the other verticals are Xe-HPC (high performance compute). The Xe-HPG graphics architecture is being developed for a 2021 market launch. It will feature all the client-segment staples, including a conventional PCI-Express interface, and GDDR6 memory instead of HBM. Intel may also eye DirectX 12 Ultimate logo compliance. Intel's Xe discrete GPU and scalar processor development is already de-coupled with Intel's foundry business development, and so the company could contract external foundries to manufacture these chips.

As for specs, it is learned that each Xe-HP "tile" (a silicon die sub-unit that adds up in MCMs for higher tiers of Xe scalar processors), features 512 execution units (EUs). Compare this to the Xe-LP iGPU solution found in the upcoming "Tiger Lake" processor, which has 96. Intel has been able to design scalar processors with up to four tiles, adding up to 2,048 EUs. It remains to be seen if each tile on the scalar processors also include the raster hardware needed for the silicon to function as a GPU. The number of tiles on Xe-HPG are not known, but it reportedly features GDDR6 memory, and so the tile could be a variation of the Xe-HP. Intel SVP and technology head Raja Koduri is expected to detail the near-future of Intel architectures at a virtual event later today, and Xe-HPG is expected to come up.

Intel's upcoming 11th Generation Core "Tiger Lake" processors introduce the company's first major refinement of its 10 nanometer silicon fabrication node, dubbed 10 nm+. The node introduces two key features that work to improve the power characteristics of the silicon, allowing Intel to yield more performance without raising power/thermals over the previous generation. VideoCardz scored a major scoop on 10 nm+, including the introduction of the new SuperFin transistor, and SuperMIM capacitor.

SuperFin is a redesigned FinFET, a nanoscale transistor, which offers increased gate pitch, yielding higher drive current, improved channel mobility, and an improved source/drain, yielding in lower resistance. The other key component of 10 nm+ is SuperMIM, delivering a 5 times increase in metal-insulator-metal capacitance. Intel is yet to put out energy efficiency gain numbers for the process, but promises a "dramatic increase in frequency" over the previous generation, which lines up with leaks of the Core i7-1185G7 shipping with significantly higher clock speeds.

Intel Optane persistent memory (PMem), in combination with Intel's open-source distributed asynchronous object storage (DAOS) solution, sets a new world record, soaring to the top of the Virtual Institute for I/O IO-500 list. With just 30 servers of Intel Optane PMem, Intel's DAOS solution defeated today's best supercomputers and now ranks No. 1 for file system performance worldwide. These results validate the solution's delivery as having the most performance of any distributed storage today. They also demonstrate how Intel is truly changing the storage paradigm by providing customers the persistence of disk storage with the fine-grained and low-latency data access of memory in its Intel Optane PMem product.

"The recent IO-500 results for DAOS demonstrate the continuing maturity of the software's functionality enabled by a well-managed code development and testing process. The collaborative development program will continue to deliver additional capabilities for DAOS in support of Argonne's upcoming exascale system, Aurora," said Gordon McPheeters, HPC systems administration specialist at the Argonne Leadership Computing Facility.

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

"Global demand for storage and memory in the data center is increasing as AI-powered business intelligence and data processing growth continues", said Youjong Kang, VP of Growth Strategy, SK hynix. "SiFive is well-positioned to grow with opportunities created from data center, enterprise, storage and networking requirements for workload-focused processor IP."

Database spelunker TUM_APISAK has brought to the surface another revealing entry regarding Intel's upcoming Tiger Lake CPUs. Discovered in SiSoftware's database entries, the Intel Core i3-1115G4 has reared its head sporting a mightily impressive base core clock set at 3.0 GHz. Compare this to the Ice Lake-based Core i3-1005G1, which while making use of the 10 nm process itself, only managed to run on a 1.2 GHz base clock. This increase speaks to Intel's refinement of the 10 nm manufacturing process (even sporting its well-known woes) and the usage of the new Willow Cove architecture core that will power the i3-1115G4.

Whilst still being a 2-core, 4-thread processor (ehrm), the new i3-1115G4 based on Tiger Lake sports a number of improvements on both its CPU and GPU core design. The new architectural improvements baked into Willow Cove are aided by an L3 cache boost from 4 MB to 6 MB, and its GPU is expected to make use of Intel's Xe graphics, featuring 96 EUs (compared to the 64 EUs in Ice Lake's 12th Gen graphics). It remains to be seen exactly how competitive Tiger Lake will be compared to AMD's current (and future) Ryzen offerings, but these are some encouraging leaks.

Device IDs of Intel's upcoming line of standalone USB 4.0 host controllers leaked to the web, courtesy Hardware Leaks (@_rogame). The controller possibly comes in three variants, bearing device IDs 0x9A1B, 0x9A1D, and 0x9A13. The alleged Intel confidential document screengrab speaks of USB 4.0 and USB 3.2 support (no mention of USB 2.0/1.1), and USB Power Delivery 3.0.

With USB 4.0, the USB-IF (USB Implementers Forum, or the special interest group behind USB), appears to want to standardize the USB type-C connector, eventually phasing out the type-A connector. To that effect, the document leaves out mention of USB 2.0/1.1 backwards compatibility. USB 4.0 debuts with an interface bandwidth of 40 Gbps, or 8 times that of USB 3.0, or over 80 times that of USB 2.0.

Intel designed an Apple-exclusive Core i9-10910 10-core processor for its new-generation iMac, with an interesting set of specs. The chip has a base frequency of 3.60 GHz - much higher than the 2.90 GHz of the i9-10900 - but a lower max boost frequency of 5.00 GHz (against 5.20 GHz TVB max of the i9-10900). The TDP of the new chip is rumored to be higher, at 95 W, giving its boosting algorithm more breathing room. Leakbench, a twitter handle that tracks interesting submissions to the Geekbench online database, fished out one of the first Geekbench 5 submissions of the i9-10910.

The i9-10910 serves up 6.9% higher single-threaded performance than the i9-10900. It however, falls behind the i9-10900 in multi-threaded performance by 9.6%. These results as surprising. Normally, we'd expect the i9-10910 to have a lower single-threaded performance and higher multi-threaded performance. As its max boost frequency is lower, and the i9-10900 is able to run single-threaded workloads on its favored cores at frequencies of up to 5.20 GHz (as opposed to 5.00 GHz on the i9-10910). On the other hand, with a higher TDP (higher PL1), the i9-10910 has more power budget for its cores to sustain higher boost states, which should give it a slight edge over the i9-10900 in multi-threaded performance. The raison d'être of the i9-10910 appears to be in giving Apple a variation of the 10-core "Comet Lake" die that macOS can make the most of, as it probably lacks optimization for Turbo Boost Max 3.0 and Thermal Velocity Boost.

The US is one of the leading countries when it comes to chip design technologies and know-how; however, when it comes to actual manufacturing those designs, it's fallen from grace in recent years. Once the leader in both design and manufacturing, nowadays the US can only claim some 12% of the world's semiconductor production. The rest of it is mainly produced in Asia, where TSMC stands as the industry juggernaut, with other companies stretching across Taiwan, Japan, and most recently (and surging) China - the country has more than doubled its 300 mm manufacturing sites since 2017. This places some strain on the US' dependence from foreign shipments; and the country is looking to bridge that gap in its perceived national interests by investing heavily in silicon manufacturing to be brought back to the country. Recent slippages from Intel when it comes to keeping its manufacturing lead have apparently also instilled preoccupation amongst US policy makers.

MediaTek and Intel have reached a milestone in the development and certification of 5G T700 modem solutions for next-generation PC experiences. As announced by MediaTek today, the project is on schedule and the team has conducted 5G calls with the chipset. Intel is also well under way developing platform optimizations for best-in-class 5G PC user experiences that include validation and system integration, and readying co-engineering support for further enablement of its OEM partners.

"A successful partnership is measured by execution, and we're excited to see the rapid progress we are making with MediaTek on our 5G modem solution with customer sampling starting later this quarter. Building on Intel's 4G/LTE leadership in PCs, 5G is poised to further transform the way we connect, compute and communicate. Intel is committed to enhancing those capabilities on the world's best PCs," said Chris Walker, corporate vice president and general manager of Mobile Client Platforms at Intel.

Intel became the official PC hardware partner for the PC version of Marvel's Avengers last year and it seems like Intel is looking to take advantage of that with new limited edition "KA" Avengers series processors. Trusted leaked @momomo_us recently discovered listings for several of these Intel "KA" series processors on a Vietnamese retailer. It appears Intel is preparing to release 4 processors across their i5, i7, and i9 lineups these being the i5-10600KA, i7-10700KA, i9-10850KA and i9-10900KA. These processors should be identical to their K series counterparts apart from the commemorative packaging and the possible inclusion of Marvel's Avengers game codes. These processors will likely see a global release in the coming weeks/months in preparation for the launch of Marvel's Avengers on September 4th.

Intel will launch its 11th Generation Core "Tiger Lake" mobile processors on September 2. The company sent out invites to a "virtual event" to be held on that date, which will be webcast to the public. On that day, several major notebook manufacturers are expected to unveil their next-generation devices based on the new processors. "Tiger Lake" is an important product launch for Intel as it marks the commercial debut of its ambitious Xe graphics architecture as the chip's Gen12 integrated graphics solution. In related news, Intel's chief architect for Xe, Raja Koduri, is expected to lead a webcast on August 13, where he will provide an update on his team's work.

The processors also debut the "Willow Cove" CPU cores that offer increased IPC over current "Sunny Cove" and "Skylake" cores, which will play a big role in closing the performance gap against the 8-core "Zen 2" processors by AMD based on the "Renoir" silicon. "Tiger Lake" is also expected to be one of the final front-line mobile processors by Intel to feature only one kind of CPU cores, as the company is expected to go big on Hybrid core technology with its future microarchitectures.

Mercury Research, one of the electronics industry's premier analyst firms, has revealed its market analysis results - and as you no doubt expected, these paint AMD in a very positive light. According to the company, AMD has reached market share levels it didn't hold since 2013 - a marked improvement over its continuingly dwindling presence in both enterprise's and consumer's minds following some debatable management decisions and technology pursuits.

AMD's Desktop x86 unit share rose to 19.2% in 2Q20, a 0.6% gain over the previous quarter and a very significant 2.1% year-over-year (YoY) increase - a significant achievement following 10 straight quarters of growing market share for the company. However, AMD's mobile chip share paints a much more impressive story, where the company managed to achieve a historic 19.9% of the market - a segment where AMD has long struggled historically, where it embattled a deeply entrenched Intel (and still is battling both Intel and OEM's perceptions and Intel-geared product development and manufacturing workflow). AMD's 2Q18 share in the mobile market was a mere 8.8% - AMD more than doubled its share in just two years, and increased its share by 2.9% over the prior quarter and a 5.8% gain YoY. And that number can only go up, following the extremely warm reception of the company's latest Ryzen 4000 mobile processors, which have already scored 50 design wins with some 30 more designs to be released before year's end.

Apple today announced a major update to its 27-inch iMac. By far the most powerful and capable iMac ever, it features faster Intel processors up to 10 cores, double the memory capacity, next-generation AMD graphics, superfast SSDs across the line with four times the storage capacity, a new nano-texture glass option for an even more stunning Retina 5K display, a 1080p FaceTime HD camera, higher fidelity speakers, and studio-quality mics. For the consumer using their iMac all day, every day, to the aspiring creative looking for inspiration, to the serious pro pushing the limits of their creativity, the new 27-inch iMac delivers the ultimate desktop experience that is now better in every way.

"Now more than ever, our customers are relying on the Mac. And many of them need the most powerful and capable iMac we've ever made," said Tom Boger, Apple's senior director of Mac and iPad Product Marketing. "With blazing performance, double the memory, SSDs across the line with quadruple the storage, an even more stunning Retina 5K display, a better camera, higher fidelity speakers, and studio-quality mics, the 27-inch iMac is loaded with new features at the same price. It's the ultimate desktop, to work, create, and communicate."

In data centers of hyperscalers like Amazon, Google, Facebook, and ones alike, there is a massive need for more computing power. Being that data centers are space-limited facilities, it is beneficial if there is a system that can pack as much computing power as possible, in a smaller form factor. Penguin Computing has thought exactly about this problem and has decided to launch a TundraAP platform, designed specifically as a high-density CPU system. Using an Intel Xeon Platinum 9200 processor, the company utilizes Intel's processor with the highest core count - 56 cores spread on two dies, brought together by a single BGA package.

The Penguin Computing TundraAP system relies on Intel's S9200WK server system. In a 1U server, Penguin Computing puts two of those in one system, with a twist. The company implements a power disaggregation system, which is designed to handle and remove the heat coming from those 400 W TPD monster processors. This means that the PSU is moved from the server itself and moved on a special rack, so the heat from the CPUs wouldn't affect PSUs. The company uses Open Compute Project standards and says it improves efficiency by 15%. To cool those chips, Penguin Computing uses a direct-to-chip liquid cooling system. And if you are wondering how much cores the company can fit in a rack, look no further as it is possible to have as much as 7616 Xeon Platinum cores in just one rack. This is a huge achievement as the density is quite big. The custom cooling and power delivery system that the company built enabled this, by only allowing compute elements to be present in the system.

Intel is preparing to launch an 8-core mobile processor based on its 10 nm "Tiger Lake" microarchitecture, according to a corporate memo by leading notebook OEM Compal, which serves major notebook brands such as Acer. The memo was drafted in May, but unearthed by momomo_us. Compal expects Intel to launch the 8-core "Tiger Lake-H" processor in Q1 2021. This is big, as it would be the first large 10 nm client-segment silicon that goes beyond 4 cores. The company's first 10 nm client silicon, "Ice Lake," as well as the "Tiger Lake-U" silicon that's right around the corner, feature up to 4 cores. As an H-segment part, the new 8-core processor could target TDPs in the range of 35-45 W, and notebooks in the "conventional thickness" form-factor, as well as premium gaming notebooks and mobile workstations.

The 8-core "Tiger Lake-H" silicon is the first real sign of Intel's 10 nm yields improving. Up until now, Intel confined 10 nm to the U- and Y-segments (15 W and below), addressing only ultra-portable form-factors. Even here, Intel launched U-segment 14 nm "Comet Lake" parts at competitive prices, to take the market demand off "Ice Lake-U." The H-segment has been exclusively held by "Comet Lake-H." Intel is planning to launch "Ice Lake-SP" Xeon processors later this year, but like all server parts, these are high-margin + low-volume parts. Compal says Intel will refresh the H-segment with a newer 8-core "Comet Lake-H" part in the second half of 2020, possibly to bolster the high-end against the likes of AMD's Ryzen 9 4900H. Later in 2021, Intel is expected to introduce its 10 nm "Alder Lake" processor, including a mobile variant. These processors will feature Hybrid technology, combining "Golden Cove" big CPU cores with "Gracemont" small ones.

Analog Devices, Inc. (ADI) today announced its collaboration with Intel Corporation to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically. The new radio platform combines the advanced technology of ADI's radio frequency (RF) transceivers with the high performance and low power of Intel Arria 10 Field Programmable Gate Arrays (FPGAs) giving developers a new set of design tools for more easily creating optimized 5G solutions.

The communications market is moving at a rapid pace to keep up with the strains put on bandwidth and latency as more people transact business digitally and consume and transmit data from everywhere. A significant increase in traffic over existing wireless networks is occurring in both private networks and public spaces. As a result, wireless operators are looking to shorten development times and cost-effectively implement new solutions that increase the capacity, performance and reliability of 5G networks. Through a mix of open standards and existing communication links, mobile network operators are developing a broader set of specifications and supporting a growing span of use cases.

Today we are finding out that Intel has allegedly infringed FinFET patents of Microelectronics Institute of the Chinese Academy of Sciences. On July 28th, the patent review committee has heard an application that accuses Intel of violating a patent 201110240931.5 commonly referred to as FinFET patent. The patent dates back to 2011, and it comes from the Chinese Academy of Sciences, mainly Microelectronics Institute. The Chinese patent holders are asking for as much as 200 million yuan, which roughly translates to 28,664,380 US dollars. Given that this patent infringement is a major one for Intel, it is sure that a company will be pursued extensively in court. All of the Intel's semiconductors use FinFET technology, and if this is true, the violation is rather big. For more in detail reading, please refer to the source which goes through the history of Intel and Microelectronics Institute patent violation filing.

It was reported last week that NVIDIA is "interested" in acquiring UK chip-design firm Arm from Japan's SoftBank that holds a treasure chest of tech IP. Now Bloomberg reports that things are getting serious between NVIDIA and SoftBank, with the two reportedly engaged in "advanced talks" over the possible acquisition of Arm by NVIDIA. The graphics and scalar compute giant recently surpassed Intel in market capitalization.

With a few quick moves, NVIDIA stands a real chance of displacing Intel as makers of the world's most popular CPU machine architecture, driven mainly by smartphones, tablets, networking infrastructure, wearables, and IoT devices. The Arm architecture is also taking strides into the server space, and Apple recently decided to dump Intel x86 in favor of Arm-powered homebrew SoCs. Arm could cost NVIDIA an arm and a leg. New Street Research LLP estimated Arm's valuation at USD $44 billion if its IPO took off in 2021, and as much as $68 billion by 2025.

EVO is likely to become a prominent client-segment processor brand by Intel as it wades into the post-Core product generation. Intel just registered a large tranche of trademarks and logos with the USPTO. It begins with a re-design of Intel's corporate identity from the ground-up, including the company's main logo. A clean new typeface replaces the one Intel has been using since the original Core i7 from a decade ago. The brands are placed with simple geometric backgrounds with fewer color gradients. The brand extension (i3/i5/i7/i9) is located at the bottom-right corner.

The distinction between two logos, "EVO Powered by Core" and just Core i3, caught our eye. We speculate that EVO could refer to a new category of Hybrid processors (chips with more than one kind of CPU core), and could debut with "Alder Lake." The non-EVO chips could have only one kind of CPU core, and given the timing of this trademark application (July 2020), we expect it to debut only with the processor that succeeds "Tiger Lake," as notebooks based on the new chips may already be under mass-production. In any case, it's only a matter of the notebook ODM (eg: Quanta, Compal, Foxconn, etc.,) placing a sticker on the product or its packaging. It's also interesting to note the "powered by Core" subtext in the EVO branding. Intel could be using this to transition between the two brands.Update 20:02 UTC: Added registration data from US Patent Office:

Screenshots of a SiSoft SANDRA database submission of an alleged Intel 11th Gen Core "Rocket Lake-S" desktop processor machine confirms that the processor introduces PCI-Express gen 4.0 support to Intel's mainstream desktop platform. PCIe gen 4.0 has been rather limited in Intel's product stack, with only 10th Gen Core "Ice Lake-U" and "Ice Lake-Y" mobile processors supporting it so far. The upcoming 11th Gen "Tiger Lake" mobile processors will support it, too. Intel's HEDT product line, currently led by "Cascade Lake-X," as well as the server side of things, let by "Cooper Lake," are limited to PCIe gen 3.0. The SANDRA screenshot shows the "Rocket Lake-S" powered machine running a PCI-Express 4.0 NVMe SSD.

According to alleged "Rocket Lake-S" + Intel 500-series chipset platform maps leaked to the web by VideoCardz, "Rocket Lake-S" will finally take forward strides in the area of I/O. The CPU socket puts out not just its usual PEG slot (16 lanes meant for PCI-Express graphics cards), but also a CPU-attached M.2 NVMe slot with 4 PCI-Express gen 4.0 lanes, much like Socket AM4 motherboards based on AMD X570 or B550 chipsets. What's more, Intel fattened the chipset bus with 8 lanes. While the bus is still DMI 3.0 (with PCI-Express gen 3.0 physical layer), 8 lanes mean a doubling in bandwidth compared to Intel 400-series chipsets (or older). The 500-series PCH itself will still be PCI-Express gen 3.0 based, putting out only gen 3.0 downstream PCIe lanes, unlike the AMD X570, which puts out gen 4.0 downstream general purpose lanes, and uses a PCI-Express 4.0 x4 pipe to the CPU. Quite a few Intel 400-series chipset motherboards have preparation for PCIe gen 4.0 PEG slot when paired with a "Rocket Lake-S" processor.

ASUS today launched ZenBook 13 (UX325) and ZenBook 14 (UX425), which are thinner and lighter than the previous generation that offers power on the go with versatile connectivity. The compact four-sided NanoEdge display offers a 90% screen-to-body ratio for immersive visuals, with the option of an ultra-low power 1-watt display that maximizes battery life. The user experience is also fully updated, featuring ASUS NumberPad 2.0, up to 22 hours battery life, a new edge-to-edge keyboard design, ErgoLift hinge mechanisms, and IR cameras for fast face-recognition. It's also equipped with the latest 10th Generation Intel Core processor and up to 8 GB RAM, up to 512 GB PCIe 3.0 x4 SSDs, and the latest WiFi 6 (802.11ax) for a faster and smoother performance.

The latest ZenBook Classic series offers two screen sizes. There's the ultralight ZenBook 13 for the ultimate travelers and the Zenbook 14 for those who prefer a larger screen. Both models are designed for effortless portability and a compact and elegant all-metal chassis that's a mere 13.9 mm thin. ZenBook 13 and 14 are also power efficient and a perfect match for today's on-the-go lifestyle.

Intel is preparing to launch its next-generation for server processors and the next in line is the Ice Lake-SP 10 nm CPU. Featuring a Golden Cove CPU and up to 28 cores, the CPU is set to bring big improvements over the past generation of server products called Cascade Lake. Today, thanks to the sharp eye of TUM_APISAK, we have a new benchmark of the Ice Lake-SP platform, which is compared to AMD's EPYC Rome offerings. In the latest GeekBench 4 score, appeared an engineering sample of unknown Ice Lake-SP model with 28 cores, 56 threads, a base frequency of 1.5 GHz, and a boost of 3.19 GHz.

This model was put in a dual-socket configuration that ends up at a total of 56 core and 112 threads, against a single 64 core AMD EPYC 7442 Rome CPU. The dual-socket Intel configuration scored 3424 points in the single-threaded test, where AMD configuration scored notably higher 4398 points. The lower score on Intel's part is possibly due to lower clocks, which should improve in the final product, as this is only an engineering sample. When it comes to the multi-threaded test, Intel configuration scored 38079 points, where the AMD EPYC system did worse and scored 35492 points. The reason for this higher result is unknown, however, it shows that Ice Lake-SP has some potential.

AMD late Tuesday released its Q2-2020 financial results, which saw the company rake in revenue of $1.93 billion for the quarter, and clock a 26 percent YoY revenue growth. In both its corporate presentation targeted at the financial analysts, and its post-results conference call, AMD revealed a handful interesting bits looking into the near future. Much of the focus of AMD's presentation was in reassuring investors that [unlike Intel] it is promising a stable and predictable roadmap, that nothing has changed on its roadmap, and that it intends to execute everything on time. "Over the past couple of quarters what we've seen is that they see our performance/capability. You can count on us for a consistent roadmap. Milan point important for us, will ensure it ships later this year. Already started engaging people on Zen4/5nm. We feel customers are very open. We feel well positioned," said president and CEO Dr Lisa Su.

For starters, there was yet another confirmation from the CEO that the company will launch the "Zen 3" CPU microarchitecture across both the consumer and data-center segments before year-end, which means both Ryzen and EPYC "Milan" products based on "Zen 3." Also confirmed was the introduction of the RDNA2 graphics architecture across consumer graphics segments, and the debut of the CDNA scalar compute architecture. The company started shipping semi-custom SoCs to both Microsoft and Sony, so they could manufacture their next-generation Xbox Series X and PlayStation 5 game consoles in volumes for the Holiday shopping season. Semi-custom shipments could contribute big to the company's Q3-2020 earnings. CDNA won't play a big role in 2020 for AMD, but there will be more opportunities for the datacenter GPU lineup in 2021, according to the company. CDNA2 debuts next year.

TSMC has been the backbone of silicon designers for a long time. Whenever you question where you can use the latest technology and get some good supply capacity, TSMC got everyone covered. That case seems to be similar to Intel and its struggles. When Intel announced that its 7 nm semiconductor node is going to be delayed a full year, the company's customers and contractors surely became worried about the future releases of products and their delivery, like the case is with Aurora exascale supercomputer made for Argonne National Laboratory, which relies on Intel's 7 nm Ponte Vecchio graphics cards for most of the computation power.

To manage to deliver this, Intel is reportedly in talks with TSMC to prepare capacity for the GPUs and deliver them on time. However, according to industry sources of DigiTimes, TSMC is unlikely to build additional capacity for Intel, besides what it can deliver now. According to those sources, TSMC does not see Intel as a long-term customer and it is unknown what treatment will Intel get from TSMC. Surely, Intel will be able to make a deal with TSMC and secure enough of the present capacity for delivering next-generation processors.