Intel will debut its 500-series desktop motherboard chipset series with its 11th Gen Core "Rocket Lake-S" desktop processors. A leaked alleged roadmap slide possibly from a presentation targeting an Intel ecosystem partner, reveals that the 500-series chipset will debut no sooner than March 2021, which could also mean "Rocket Lake-S" chips themselves could launch around that time, since Intel tends to launch new processor generations alongside new chipsets that are compatible out of the box. Even the 9th Generation "Coffee Lake Refresh" was accompanied by new Z390 and B365 chipsets. That said, Socket LGA1200 motherboards based on the existing 400-series chipset are expected to be compatible with "Rocket Lake-S," with BIOS updates. 500-series chipset motherboards might also support older 10th Gen Core "Comet Lake-S" processors.

The roadmap slide reveals that "Rocket Lake-S" could debut with strictly client-segment chipsets, such as the Z590 targeting overclockers, H570 targeting premium desktops, B560 targeting mid-range desktops, and H510 for entry-level desktops. Later in April, Intel could debut the Q570 chipset for commercial desktops, and W580 for workstations. What sets the 500-series chipset apart from the 400-series, appears to be a standardization of PCI-Express Gen 4, at least for the main PEG slot. Certain premium 400-series chipset motherboards already come with preparation for PCIe Gen 4 PEG. The "Rocket Lake-S" processor sees the first IPC increase by Intel on the desktop platform in five years, as the 14 nm chips are expected to feature new "Cypress Cove" CPU cores, which are a back-port of "Willow Cove" for the older 14 nm process. The chips could also feature a Gen12 Xe iGPU.

Intel 10 nm products have seen massive delays over the years, and Intel has built many IPs on the new node, however, not many of them have seen the light of the day due to problems the company has experienced with the manufacturing of the new node. That has caused delays in product shipments in the past, meaning that the time for 10 nm is just ahead. According to the latest DigiTimes Taiwan report, we have information that Intel is going to delay its Ice Lake-SP server processors manufactured on a 10 nm node. And it is going to be a whole quarter late according to the report. Instead of launching in Q4 this year, we can expect to see new processors in Q1 of 2021. It is yet unknown whatever the launch will happen at the beginning of Q1 or its end, however, we will report on it as we hear more information.

Update: DigiTimes has also released another report regarding server shipments. It is reported that server vendors are decelerating the shipments as they are making fewer orders in Q4 to wait for the new Intel CPUs. Judging by this move, the demand for these new processors is going to be rather high and the supply chain is preparing slowly for it.

Intel's upcoming Core "Alder Lake-S" desktop processor, which is shaping up to be the first Hybrid desktop processor, surfaced on the SiSoft SANDRA benchmark database, as dug up by TUM_APISAK. The chip is reported by SANDRA to be 16-core/32-thread, although this is expected to be a combination of eight "big" high-performance cores, and eight "small" high-efficiency cores, in a multi-core topology similar to Arm big.LITTLE. Other specs read by SANDRA include clock speeds around "1.40 GHz," ten 1.25 MB L2 caches (possibly 8x 1.25 MB for the big "Golden Cove" cores, 2x 1.25 MB for the two groups of small "Gracemont" cores), and 30 MB of L3 cache. The Hybrid processor architecture is expected to introduce several platform-level innovations to the modern desktop, taking advantage of the extremely low power draw of the "Gracemont" cores when the machine isn't grinding serious workloads.

In a report by Phoronix, we have the latest information about Intel's efforts to prepare the next generation of hardware for launch sometime in the future. In the latest Linux kernel patches prepared to go mainline soon, Intel has been adding support for its "Meteor Lake" processor architecture manufactured on Intel's most advanced 7 nm node. While there are no official patches in the mainline kernel yet, the first signs of Meteor Lake are expected to show up in the version 5.10, where we will be seeing the mentions of it. This way Intel is ensuring that the Meteor Lake platform will see the best software support, even though it is a few years away from the launch.

Meteor Lake is expected to debut in late 2022 or 2023, which will replace the Alder Lake platform coming soon. In a similar way to Alder Lake, Meteor Lake will use a hybrid core technology where it will combine small and big cores. The Meteor Lake platform will use the new big "Ocean Cove" design paired with small "Gracemont" cores that will be powering the CPU. This processor is going to be manufactured on Intel's 7 nm node that will be the first 7 nm design from Intel. With all the delays to the node, we are in for an interesting period to see how the company copes with it and how the design IPs turn out.

Today, Intel Federal LLC announced a three-year agreement with Sandia National Laboratories (Sandia) to explore the value of neuromorphic computing for scaled-up computational problems. Sandia will kick off its research using a 50-million neuron Loihi-based system that was delivered to its facility in Albuquerque, New Mexico. This work with Loihi will lay the foundation for the later phase of the collaboration, which is expected to include continued large-scale neuromorphic research on Intel's upcoming next-generation neuromorphic architecture and the delivery of Intel's largest neuromorphic research system to date, which could exceed more than 1 billion neurons in computational capacity.

"By applying the high-speed, high-efficiency and adaptive capabilities of neuromorphic computing architecture, Sandia National Labs will explore the acceleration of high-demand and frequently evolving workloads that are increasingly important for our national security. We look forward to a productive collaboration leading to the next generation of neuromorphic tools, algorithms, and systems that can scale to the billion neuron level and beyond," said Mike Davies, director of Intel's Neuromorphic Computing Lab.

The idea of working and learning from home, which at one point felt temporary, has for many of us started to feel more permanent. Even as some people in cities around the world return to work and schools in person, many others have found themselves reorganizing homes to create makeshift offices and classrooms. Whether your commute is across the house or across town, the PC continues to play an integral role in keeping all of us connected to our work, school, and lives - and each person in the household needs one.

As we continue to expand our Surface family of devices with the new Surface Laptop Go and updates to Surface Pro X, our goal is to design a Surface for every person, work style and location. To give every person in your household or organization a laptop that's not just something you need to use, but something you want to use. A virtual office you want to be in, a virtual classroom that engages you to learn, a place you can play your favorite game or watch a movie - with a bright vibrant screen, a fluid and comfortable keyboard, high quality cameras and mics, and the versatility of touch screens.

The Alliance for Computing at Extreme Scale (ACES), a partnership between Los Alamos National Laboratory and Sandia National Laboratories, announced the details of a $105 million contract awarded to Hewlett Packard Enterprise (HPE) to deliver Crossroads, a next-generation supercomputer to be sited at Los Alamos.

"This machine will advance our ability to study the most complex physical systems for science and national security. We look forward to its arrival and deployment," said Jason Pruet, Los Alamos' Program Director for the Advanced Simulating and Computing (ASC) Program.

In big corporate mergers and acquisitions involving multi-national corporations, money is the easy part, with the hard part being competition regulators of major markets giving their assent. The NVIDIA-Arm deal could get entangled in the US-China tech trade-war, with Beijing likely to use its approval of the deal as a bargaining chip against the US. Former Lenovo chief engineer Ni Guangnan predicts that the Chinese government's position would be to try and fight the deal on anti-trust grounds, as it could create a monopoly of chip-design tools. China's main concern, however, would be Arm IP falling into the hands of a US corporation, the California-based NVIDIA, which would put the IP under US export-control regulations.

Both Arm and NVIDIA announced an agreement for the latter to acquire Arm from SoftBank in a deal valued at USD $40 billion. NVIDIA CEO has been quoted as calling it the "deal of the century," as it would put NVIDIA in control of the biggest CPU machine architecture standard after Intel's x86, letting it scale the IP from low-power edge SoCs, to large data-center processors. Chinese regulators could cite recent examples of US export controls harming the Chinese tech industry, such as technology bans over Huawei and SMIC, in its action against the NVIDIA-Arm deal. Arm's 200-odd Chinese licensees have shipped over 19 billion chips based on the architecture as of mid-September 2020.

Intel and Heidelberg University Computing Center (URZ) today announced that they have established oneAPI Academic Center of Excellence (CoE) at UZR. The newly established CoE has a goal to further develop Intel's oneAPI standard and enable it to work on AMD GPUs. This information is a bit shocking, however, Intel believes that the technology should work on a wide range of processors, no matter the vendor. The heterogeneous hardware programming is the main goal here. In a Twitter thread, an Intel employee specifies that Intel has also been working with Arm and NVIDIA to bring Data-Parallel C++ (DPC++), a core of oneAPI, to those vendors as well. That should bring this universal programming model to every device and adapt to every platform, which is a goal of heterogeneous programming - whatever you need to program a CPU, GPU, or some other ASIC, it is covered by a single API, specifically oneAPI.

UZRURZ's work as a oneAPI CoE will add advanced DPC++ capabilities into hipSYCL, which supports systems based on AMD GPUs, NVIDIA GPUs, and CPUs. New DPC++ extensions are part of the SYCL 2020 provisional specification that brings features such as unified shared memory to hipSYCL and the platforms it supports - furthering the promise of oneAPI application support across system architectures and vendors.

Intel Corp. and Lightbits Labs today announced an agreement to propel development of disaggregated storage solutions to solve the challenges of today's data center operators who are craving improved total-cost-of-ownership (TCO) due to stranded disk capacity and performance. This strategic partnership includes technical co-engineering, go-to-market collaboration and an Intel Capital investment in Lightbits Labs. Lightbits' LightOS product delivers high-performance shared storage across servers while providing high availability and read-and-write management designed to maximize the value of flash-based storage. LightOS, while being fully optimized for Intel hardware, provides customers with vastly improved storage efficiency and reduces underutilization while maintaining compatibility with existing infrastructure without compromising performance and simplicity.

Lightbits Labs will enhance its composable disaggregated software-defined storage solution, LightOS, for Intel technologies, creating an optimized software and hardware solution. The system will utilize Intel Optane persistent memory and Intel 3D NAND SSDs based on Intel QLC Technology, Intel Xeon Scalable processors with unique built-in artificial intelligence (AI) acceleration capabilities and Intel Ethernet 800 Series Network Adapters with Application Device Queues (ADQ) technology. Intel's leadership FPGAs for next-generation performance, flexibility and programmability will complement the solution.

Lenovo is very excited to unveil the latest addition to our premium X1 portfolio, ThinkPad X1 Nano. The lightest ThinkPad ever at just 1.99 pounds (907 g) breaks new ground for performance and functionality in an incredibly featherweight package. Lenovo's first ThinkPad based on Intel Evo platform and powered by 11th Gen Intel Core processors, the X1 Nano delivers supreme speed and intelligence while maintaining outstanding battery life. Stunning visuals are delivered through a narrow bezel 13-inch 2K display with a 16:10 aspect ratio, and four speakers and four 360-degree microphones enhance the audio-visual capabilities. For a truly immersive user experience, the X1 Nano supports Dolby Vision and Dolby Atmos. State of the art connectivity is provided by WiFi 65 and optional 5G will deliver higher bandwidth capability and drive new levels of always on always connected efficiency and collaboration in a new hybrid working world.

Lenovo today is also delighted to announce that the world's first foldable PC, ThinkPad X1 Fold, is available to order and will ship in a few weeks. A pinnacle of engineering innovation, the X1 Fold offers a revolutionary mix of portability and versatility that defines a new computing category enabled by Intel Core processors with Intel Hybrid Technology and made possible by Intel's Project Athena innovation program. Blending familiar functionality that we all know from smartphones, tablets and laptops into a single foldable PC device that will forever reshape the way you work, play, create and connect. With optional 5G, you can trust that your connection speed is more secure and optimized where available and that you are better protected with ThinkShield security features. Find out more how ThinkPad X1 Fold is pioneering a new category: A Game Changing Category

AMD is preparing to launch the new iteration of desktop CPUs based on the latest Zen 3 core, codenamed Vermeer. On October 8th, AMD will hold the presentation and again deliver the latest technological advancements to its desktop platform. The latest generation of CPUs will be branded as a part of 5000 series, bypassing the 4000 series naming scheme which should follow, given that the prior generation was labeled as 3000 series of processors. Nonetheless, AMD is going to bring a new Zen 3 core with its processors, which should bring modest IPC gains. It will be manufactured on TSMC's 7 nm+ manufacturing node, which offers a further improvement to power efficiency and transistor density.

Today, we have gotten the first benchmark of AMD's upcoming Ryzen 7 5800X CPU. Thanks to the popular hardware leaker, TUP APISAK, we have the first benchmark of the new Vermeer processor, compared to Intel's latest and greatest - Core i9-10900K. The AMD processor is an eight-core, sixteen threaded model compared to the 10C/20T Intel processor. While we do not know the final clocks of the AMD CPU, we could assume that the engineering sample was used and we could see an even higher performance. Below you can see the performance of the CPU and how it compares to Intel. By the numbers shown, we can expect AMD to possibly be a new gaming king, as the numbers are very close to Intel. The average batch result for the Ryzen 7 5800X was 59.3 FPS and when it comes to CPU frames it managed to score 133.6 FPS. Intel's best managed to average 60.3 FPS and 114.8 FPS from the CPU framerates. Both systems were tested with NVIDIA's GeForce RTX 2080 GPUs.

TechN unveils the most powerful CPU water coolers for three platforms at once. AMD's AM4 sockets and the Intel sockets LGA 1200 and 2066 will each receive their own high-end water block with the most advanced cooling technology and sophisticated manufacturing - Made in Germany.

Superior performance and build quality
A compact, reduced design language, the high-quality material mix and hidden mounting elements form the puristic character of the high-performance cooling blocks. Both the mirror-polished acrylic and matte anodized surfaces demonstrate the highest level of care. The perfection in manufacturing achieves a flush composition for a modern industrial look, which incorporates the extensive technological innovations of the TechN CPU water coolers.

AAEON, a leader in embedded solutions, announces up-coming products featuring the 11th Generation Intel Core processors (formerly Tiger Lake) and Intel Atom x6000E series processors, Intel Pentium and Celeron N and J series processors (formerly Elkhart Lake). These next generation solutions provide greater performance, flexibility and a host of Intel technologies to power computing at the edge.

The 11th Generation Intel Core processors, now the third generation of Intel's 10 nm microarchitecture, provide performance above the current industry standard 8th and 9th Generation processors. These processors also open up access to cutting edge technologies, featuring the Intel Iris Xe graphics (Gen 12), PCIe 4.0, Thunderbolt 4, USB4, DDR4 and LPDDR4x memory, and Deep Learning Boost on select SKUs.

Today at the Intel Industrial Summit 2020, Intel announced new enhanced internet of things (IoT) capabilities. The 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series bring new artificial intelligence (AI), security, functional safety and real-time capabilities to edge customers. With a robust hardware and software portfolio, an unparalleled ecosystem and 15,000 customer deployments globally, Intel is providing robust solutions for the $65 billion edge silicon market opportunity by 2024.

"By 2023, up to 70% of all enterprises will process data at the edge. 11th Gen Intel Core processors, Intel Atom x6000E series, and Intel Pentium and Celeron N and J series processors represent our most significant step forward yet in enhancements for IoT, bringing features that address our customers' current needs, while setting the foundation for capabilities with advancements in AI and 5G," said John Healy, Intel vice president of the Internet of Things Group and general manager of Platform Management and Customer Engineering.

Currently, Intel's best silicon manufacturing process available to desktop users is their 14 nm node, specifically the 14 nm+++ variant, which features several enhancements so it can achieve a higher frequencies and allow for faster gate switching. Compare that to AMD's best, a Ryzen 3000 series processor based on Zen 2 architecture, which is built on TSMC's 7 nm node, and you would think AMD is in clear advantage there. Well, it only sort of is. German hardware overclocker and hacker, der8auer, has decided to see how one production level silicon compares to another, and he put it to the test. He decided to use Intel's Core i9-10900K processor and compare it to AMD's Ryzen 9 3950X under a scanning electron microscope (SEM).

First, der8auer took both chips and detached them from their packages; then he proceeded to grind them as much as possible so SEM could do its job of imaging the chips sans the substrate and protective barrier. This was followed by securing the chips to a sample holder using an electrically conductive adhesive to improve penetration of the high energy electrons from the SEM electron gun. To get as fair a comparison as possible, he used the L2 cache component of both processors as they are usually the best representatives of a node. This happens because the logic portion of the chip differs according to architecture; hence, level two cache is used to get a fair comparison - it's design is much more standardized.

Have you ever felt the need that your motherboard needs more ports? Different peripherals can occupy quite a lot of USB ports and almost fill up all of them quickly. That is where the Portwell PEB-9783G2AR motherboard comes into play. Being built on Intel's latest W480E/Q470E chipset designed to accommodate any 10th generation 10 core CPU with a TDP of up to 80 W, the board can run either a Xeon W CPU or regular Comet Lake-S Core CPU. However, what makes this board unique is not its chipset or anything, it is the number of USB ports present.

Portwell has put an astonishing 20 (you read that right) USB 3.1 Gen1 ports on the board, which you can run at a full 5 Gbit/s data signaling rate at the same time. The board doesn't use any splitting technology so you are getting the full bandwidth. To get that many ports to run at full capacity, Portwell has presumably re-routed chipset lanes for SATA 3 connectors and used them for USB ports, leaving only two SATA 3 ports. The board is built for the FlexATX form factor and features a sideways PCIe 3.0 port. Being built for Xeon, the board also features support for ECC memory and up to 128 GB of it. While the pricing is not yet available, you can get a quote on Portwell's website.

CORSAIR announces more new products each year than most companies, and this often means that marketing resources get devoted to the high-ticket items more often than not. Their custom watercooling line, the Hydro X Series, is not always one of them and so we end up seeing quiet updates without a press release or even a direct note from their representatives to the media. With the new NVIDIA GeForce RTX 3000-series cards coming in three different categories as far as custom watercooling goes (reference, Founders Edition, AIC-variants), we took the weekend to briefly check what the usual custom watercooling suspects were up to. A page on the CORSAIR website confirms, among other things, that Hydro X GPU blocks are on the way for at least the reference PCB, if not more.

More interestingly, we noted that the Hydro XC7 and XC9 CPU blocks had been updated in more ways than one. We have detailed reviews of both (XC7, XC9) for those who want to see, and our review of the iCUE Nexus also showed a rebranding in the making for the company. The updated CPU blocks carry the new wordmark design for the logo on all 5 SKUs and, more importantly, change the mounting mechanism to allow for a captive system with new thumb screws that should make installation even easier on all Intel and AMD CPU sockets. This should bring with it increased compatibility with crowded m-ITX motherboards as well, and we see it reflected in the additional 719 motherboards in the compatibility list relative to before. Finally, a motherboard ARGB LED adapter is now included in the packaging, so you can use the integrated lighting with motherboard LED headers and control software, should you not want to pony extra for CORSAIR's ecosystem. Pricing for the Hydro XC7 is now $5 higher and the same as the XC9, which is confusing given it uses fewer fins on the cold plate and, the launch versions at least, employed a plastic trim compared to the metal on the XC9. We have contacted the company for clarification on this, and will update the post as we receive more information.

[Update, September 16: CORSAIR has a new photo for their example GPU block that looks suspiciously like it is meant for the FE RTX 3000-series cards. Note also the revised I/O port terminal which should help address some concerns people had about the previous design.]

New details have leaked on Intel's upcoming DG2 graphics accelerator, which could help shed some light on what exactly can be expected from Intel's foray into the discrete graphics department. For one, a product listing shows an Intel DG2 graphic accelerator being paired with 8 GB of GDDR6 memory and a Tiger Lake-H CPU (45 W version with 8 cores, which should carry only 32 EUs in integrated graphics hardware). This 8 GB of GDDR6 detail is interesting, as it points towards a 256-bit memory bus - one that is expected to be paired with the 512 EU version of Intel's DG2 (remember that a 384 EU version is also expected, but that one carries only 6 GB of GDDR6, which most likely means a 192-bit bus.

Videocardz says they have received an image for the block diagram on Intel's DG2, pointing towards a 189 mm² die area for the 384 EU version. Looking at component density, it seems that this particular diagram may refer to an MXM design, commonly employed as a discrete notebook solution. 6 total GDDR6 chips are seen in the diagram, thus pointing towards a memory density of 6 GB and the aforementioned 192-bit bus. Other specs that have turned up in the meantime point towards a USB-C interface being available for the DG2, which could either point towards a Thunderbolt 4-supporting design, or something like Virtual Link.

Intel's Corporate Vice President of Client Computing Group Boyd Phelps posted an article on medium where he confirms development of 8-core Tiger Lake-based CPU solutions, to be released during the year 2021. This was confirmed by Boyd saying that 8-core Tiger Lake CPUs would have access to 24 MB of LLC cache (adequately doubling the 12 MB available for 4-core Tiger Lake-U parts that we already know about); Boyd then simply added in parentheticals "more detail on 8-core products at a later date".

The 8-core processors will be part of the Tiger Lake-H product stack, which, according to a leaker on PTT Shopping, would scale between the 35 W-45 W TDPs with various core and GPU Execution Unit counts. The 45 W high-performance parts can feature between 4, 6, and 8-cores - but additional space taken up by the CPU cores is thus unavailable for GPU resources, which top out at 32 Intel Xe EUs (and will make use of a BGA1787 socket). The 35 W variants, on the other hand, will be installed in the same socket as Tiger Lake-U - BGA 1449 - and reportedly only offer a 4-core design with 96 EUs.

Patriot Memory today unveiled new high-frequency variants of its Viper 4 Blackout memory modules which debuted in May 2020. At the time, the Viper 4 Blackout series came in frequency based variants of up to DDR4-3600. Today, Patriot is introducing new DDR4-4133, DDR4-4266, and DDR4-4400 variants, all of which are in 16 GB (2x 8 GB) dual-channel kits. These modules use binned memory chips, and a 10-layer PCB for better signalling. Patriot has tested the hits to offer their advertised frequencies on both Intel Core and 3rd Gen AMD Ryzen platforms.

The DDR4-4133 variant (PVB416G413C8K) achieves its advertised speeds at 18-22-22-42 timings, and 1.4 V. The DDR4-4266 variant (PVB416G426C8K) ticks at 18-26-26-46 timings, and 1.45 V. The top-spec DDR4-4400 variant (PVB416G440C8K) was tested with the same 18-26-26-46 timings as the DDR4-4266 variant, but with 1.5 V module voltage. All three variants are backed by limited lifetime warranty. The company didn't reveal pricing.

Crucial, Micron's global consumer brand of computer memory and storage, today announced its limited edition Crucial Ballistix MAX 5100 gaming DRAM. Expanding on the award-winning legacy of the Crucial Ballistix product portfolio, this latest offering provides consumers with an optimal gaming memory option, boasting the highest speeds available to date for purchase.

Crucial Ballistix is the only brand of gaming DRAM that incorporates custom tuning at the die level, resulting in world record-setting performance. In fact, these same gaming DRAM modules were recently used by a competitive overclocker to hit a blistering 6,666MT/s, the fastest ever for DDR4 modules. The record-breaking frequency and valid CPU-Z screenshot are posted on HWBOT. Like Micron's leading products and solutions for enterprise and personal computing, Crucial gaming memory is purpose-built, making it the only gaming memory that's vertically integrated - designed, engineered and manufactured from start to finish in-house. This unique approach is unmatched by competitors, allowing the new 5100MT/s modules to deliver blazing fast speeds to hardcore gamers and maximized results to overclocking enthusiasts.

Intel is giving finishing touches to six new Pentium Silver and Celeron "Jasper Lake" entry-level processors. Built on the 10 nm silicon fabrication process, these processors leverage the "Tremont" CPU cores, or the "small" x86-64 cores Intel is deploying on its "Lakefield" Core Hybrid processors. The chips also feature a low-power trim of the company's Gen11 iGPU (same graphics architecture found in "Ice Lake-U" and "Lakefield" processors). The desktop SKUs consist of three parts with TDP rated at 10 W, while the three other mobile SKUs offer 6 W TDP.

The desktop lineup is led by the Pentium Silver J6005, a 4-core/4-thread part with 2.00 GHz clock speeds, up to 3.00 GHz "maximum quad-core burst speed," and 4 MB L2 cache. The Celeron J5105 is next in line, with 2.00 GHz clocks, 2.80 GHz burst speeds, a slightly slower iGPU, and 4 MB L2 cache. At the bottom end of the desktop lineup is the Celeron J4505, a 2-core/2-thread part clocked at 2.00 GHz with 2.90 GHz burst, and 4 MB L2 cache. The mobile lineup is led by the Pentium Silver N6000, a 4-core/4-thread part with 1.10 GHz clocks, 3.10 GHz burst speeds, and 4 MB L2 cache. The Celeron N5100 is right behind, clocked at 1.10 GHz and 2.80 GHz clocks. At the bottom of the stack is the Celeron N4500, a 2-core/2-thread part with 1.10 GHz base and 2.80 GHz burst.An Intel video presentation on the "Tremont" CPU core architecture follows.

Stepping into the Wi-Fi 6 era, QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today released the QXP-W6-AX200 dual band Wi-Fi 6 PCIe network card for NAS and PC. The QXP-W6-AX200 supports the IEEE 802.11ax standard (backward compatible with 802.11a/b/g/n/ac), MIMO 2Tx2R, MU-MIMO TX/RX, and can be installed in a QNAP NAS, or Windows /Linux PC to provide fast Wi-Fi 6 connectivity. When installed in a Windows PC, the QXP-W6-AX200 also provides Bluetooth 5.0 connectivity.

The QXP-W6-AX200 is a PCIe Gen 2x1 Wi-Fi 6 adapter with an Intel Wi-Fi 6 AX200 module, providing speeds of up to 2400 Mbps - significantly faster than Wi-Fi 5. The new antenna design supports dual band 802.11ax 2.4 GHz and 5 GHz, and the multiple angle tilt and magnetic base provides the best signal strength direction and location.

Every year, Lenovo rolls out a Yoga PC holiday lineup that shows consumers just how premium our laptop experience can be by providing the latest in smarter technology, bold innovation, and refined craftsmanship. Today, Lenovo reveals the thin and light Yoga laptops that will offer up to the new 11th Gen Intel Core mobile processors with Intel Iris Xe graphics from consumer PCs recently launched, the 14-inch Yoga 9i, and also the 14-inch Yoga Slim 9i, the 14-inch Yoga Slim 7i Pro, the 13-inch Yoga Slim 7i, and the 14-inch and 15-inch Yoga 7i.

As an extension of the Project Athena innovation program, Lenovo and Intel continue to collaborate on the new Intel Evo platform, and together, are targeting verification of our new laptop designs to utilize the Intel Evo platform badge. Yoga is at the forefront of combining style, substance, and portability for the most discerning of consumers, and this smarter combination of laptop design, mobile processors, graphics, and artificial intelligence is optimized to work together in harmony.