Since lobbying is both legal and regulated in the US (an attempt to bring attempts of influencing political power by corporations under legal boundaries, as opposed to being done in the dark), it feels like it was only a matter of time before big tech attempted to join under one banner. As such, the Semiconductors in America Coalition (SIAC) has now been put together, and boasts of 64 members including Microsoft, Apple, TSMC, Intel, AMD, NVIDIA, Arm, and Samsung. It seems that all of these companies - which are often at odds with one another when it comes to competing for consumers' choice and money - have found enough similarities to get organized in an attempt to nudge political power in their favor.

SIAC said in a press release that its mission is to "advance federal policies that promote semiconductor manufacturing and research in the U.S. to strengthen America's economy, national security, and critical infrastructure." The first announcement from the SIAC following its foundation was its intention to support the CHIPS for America Act. The Act (supported by The Semiconductor Industry Association (SIA) and President Joe Biden) has already been approved by the House and the Senate as part of the National Defense Authorization Act for 2021 but has not yet been funded. It seems that SIAC's first mission is to get the government to open up its $50 billion-deep pockets.

Intel's upcoming Alder Lake-S processors are going to be the company's first attempt at delivering heterogeneous core solutions, combining low-power and high-performance IPs in a single chip. Another important milestone that these processors will reach is DDR5 memory adoption, the first of its kind on consumer platforms. Today, thanks to CapFrameX, a monitoring tool that also hosts a database of benchmark runs, we have a piece of recorded information coming from a test system equipped with an Intel Alder Lake-S processor. The tested system spotted an engineering sample of the Alder Lake-S lineup, clocked at just 2.2 GHz. The core count and core configuration remained unknown.

Alongside the upcoming CPU, the system is composed of NVIDIA's GeForce RTX 3080 GPU and DDR5 memory running at 4800 MHz. There were four sticks present, each having 8 GB capacity. The leaked system was running the DOTA 2 game at an average of 119.98 FPS, which doesn't mean much, given that we don't know which settings were applied and what was the resolution. There is a chart showing the gaming frame rate and frame time, which could be interesting to look at. However, the only new information we have come to know is that the Alder Lake-S is already capable of playing games and the ecosystem support should be very good at launch.

The new Razer Blade 15 Advanced Model lineup continues to present the best gaming laptops on the market. Armed with the new 11th Gen Intel Core H-Series Processor up to an Intel Core i9, NVIDIA GeForce RTX 30-Series Laptop GPU, and the fastest available displays with up to 360Hz, the new Razer Blade 15 Advanced Model delivers ultimate power in a premium compact form factor. The RTX 3060 version stands at an impressive height of only 15.8 mm, making it the thinnest gaming laptop in the world with a GeForce RTX 3060 Laptop GPU.

To ensure a smooth experience, the new Razer Blade 15 Advanced Model utilizes the latest PCIe Gen 4 configuration and is powered by DDR4 3200 MHz memory. The innovative M.2 design returns, with dual slots available on RTX 3070 versions and above, allowing users to easily expand the SSD according to their storage needs. Be it hardcore gaming or content creation, the Razer Blade 15 Advanced Model laptops are built to handle intensive usage and multitasking.

Intel's 11th Gen Core "Rocket Lake-S" could have a brief stint as the tip of Intel's desktop spear. Wccftech reports that its successor, the 12th Gen Core "Alder Lake-S," could launch by November 2021. The processor debuts on the new LGA1700 socket, and will introduce many firsts to the platform. The biggest change will be the heterogenous CPU core architecture. The top-spec "Alder Lake-S" is believed to be a 16-core/24-thread processor. From these, 8 will be larger high-performance cores, featuring HyperThreading, while the other 8 will be smaller high-efficiency cores. The chip is expected to be built on the 10 nm SuperFin process, and hence Intel is expected to significantly lower power draw of desktops when the machine is idling or handling lighter desktop loads.

Besides the major update to the CPU cores, "Alder Lake-S" is expected to continue featuring a Xe LP based integrated graphics solution. Significant changes with the I/O are expected, including DDR5 memory support with backwards compatibility for DDR4, and PCI-Express Gen 5.0. The LGA1700 socket is significantly different from the various LGA115x/LGA1200 sockets Intel has been pulling for its mainstream desktop platforms since 2009. It could trigger the need for new CPU coolers that support the socket.

In collaboration with Newzoo, Intel today released a report titled "Diversity and Inclusion in Gaming." This research identifies industry gaps and key insights in an effort to help make gaming more accessible and inclusive. "To strengthen diversity and inclusion across the gaming space, the industry needs to listen and act on the needs of its diverse gaming audience, as well as make hardware and software more affordable and accessible. As part of Intel's desire to better understand its global customer base, Intel is taking key learnings from this report and shaping current internal and external programs to better serve gamers from all backgrounds and walks of life," said Marcus Kennedy, general manager of Intel's Gaming and Esports Segment.

Newzoo, a leading provider of games and esports analytics, independently conducted a survey of 1,824 individuals in the United States between the ages of 10 and 65 who self-identified as gamers. The survey reveals that the gaming market lags behind in diverse representation, both in the player base and in the games themselves. Women, people of color, the LGBTQIA+ community and those with disabilities are often overlooked.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is pleased to announce a new series of coolers—TOUGHLIQUID 240/280/360 ARGB Sync All-In-One Liquid Coolers are now available for purchase.

This series of all-in-one liquid coolers are equipped with TOUGHFAN fans, a superior fan with speeds of up to 2000RPM and only 22.3 dBA and 33.2 dBA for TOUGHFAN 12 and TOUGHFAN 14 respectively; there are different sizes of fans corresponding to the different dimensions of radiators, users can choose from 240 mm, 280 mm, and 360 mm to achieve the finest cooling results in a quiet way. Besides that, there is a high-performance waterblock featuring a copper base plate, which expedites heat effectively. Plus, a high quality pump distributes a steady flow of water, keeping the copper plate continuously cool. With the low evaporation tube, the loss of coolant can be minimized; hence no refill is needed. Additionally, an exclusive built-in controller is settled on the side of the waterblock, which saves space by integrating with the waterblock and, at the same time, eliminates the cumbersomeness of routing cables.

Ahead of its launch later this month, notebook OEMs are beginning to tease their upcoming gaming notebooks powered by 11th Gen Core "Tiger Lake-H" mobile processors that come in core counts of up to 8. ASUS will be hosting a media event tomorrow (May 11) launching its first "Tiger Lake-H" notebooks, which probably follows Intel's own public unveiling of the new processors. The teaser video to the ASUS event reveals at least two notebooks under the company's ROG Zephyrus brand, the Zephyrus S17, and the Zephyrus M16.

The M16 looks to be the more compact of the two, with styling characteristic of past generations of ROG Zephyrus notebooks. The lid-mounted LEDs now come in color. while the S17 is a whole different beast. The teasers reveal an elevated keyboard+touchscreen on the lower half of the clamshell. The gap between this elevation and the base probably opens up additional vents to cool the processor and GPU underneath. This could be the notebook from ASUS's lineup that uses the 65-Watt Core i9-11980HK, the 8-core/16-thread beast that can tick at speeds of 5.00 GHz.

Intel has quietly let out details of its latest-generation Xeon W series workstation processors based on the 14 nm "Rocket Lake" silicon. These chips are built in the same Socket LGA1200 package as the 11th Gen Core desktop processors, but compatible with the W580 chipset. The lineup includes two 6-core/12-thread; and five 8-core/16-thread parts. Leading the pack is the Xeon W-1390P, with clock speeds of up to 5.30 GHz, followed by the W-1390, at 5.20 GHz. These two SKUs feature Thermal Velocity Boost, and are analogous with the 11th Gen Core i9 series.

Next up, are the Xeon W-1370P and W-1370, clocked at speeds of up to 5.20 GHz, and 5.10 GHz respectively, These parts lack Thermal Velocity Boost, and are comparable in many ways to the 11th Gen Core i7 SKUs. The slowest of these 8-core parts is the energy-efficient W-1390T, ticking at nominal clocks of just 1.50 GHz, with 4.90 GHz maximum boost, but a TDP of just 35 W. Among the other SKUs, the "P" SKUs have rated TDP of 125 W, while the non-P ones have 80 W. The 6-core/12-thread SKUs include the W-1350P and W-1350, clocked up to 5.10 GHz and 5.00 GHz, respectively. All Xeon W processors support up to 128 GB of dual-channel DDR4-3200 memory with ECC support.

Yesterday, we got information that Intel's upcoming DG2 discrete graphics card is "right around the corner". That means that we are inching closer to the launch of Intel's discrete GPU offerings, and we are going to get another major player in the current GPU market duopoly. Today, however, we are in luck because Igor from Igor's LAB has managed to get ahold of the specifications of Intel's Xe-HPG DG2 graphics card. For starters, it is important to note that DG2 GPU will first come to laptops later this year. More precisely, laptops powered by Alder Lake-P processors will get paired with DG2 discrete GPU in the second half of 2021. The CPU and GPU will connect using the PCIe 4.0 x12 link as shown in the diagram below, where the GPU is paired with the Tiger Lake-H processor. The GPU has its subsystem that handles the IO as well.

As AI technology becomes ubiquitous, the impact of unusual weather also gains more attention. The most impressive case was the sudden weather change in Denver, the US, last September that the temperature dropped from 37°C to minus overnight. Faced with such fluctuation, the devices which maintained the daily life of the city in order, like the facilities for traffic flow analysis, surveillance, and AI visual analytics, could no longer operate normally, or even damaged, due to the lack of endurance to the extreme weathers.

Inspired by the situation, DFI brought an innovative design into the newly-released CS551, the "World's First 3.5" desktop SBC with auto heat-up". This breakthrough gives devices high performance with smaller footprint for image analysis or heavy workloads, no matter at subzero temperatures or under heat waves.

A senior game developer relations engineer at Intel, Pete Brubaker, Tweeted late Wednesday that the company's DG2 discrete graphics card is "right around the corner," and that "it's about to get exciting." Brubaker's Tweet comes as the company is looking to recruit more engineers to work with its developer relations, the team that interfaces with game devs to optimize their engines and games for Intel's graphics architectures.

While the DG1, which was productized as the Iris Xe MAX graphics card, was essentially an iGPU-on-a-stick, the DG2 should spark a lot more interest. Based on a third-party foundry process, the DG2 is the first client graphics product based on the Xe HPG (high performance gaming) graphics architecture, and allegedly crams up to 512 execution units or 4,096 unified shaders—a 4.3x gain over the Iris Xe MAX. It's also rumored to ship with up to 16 GB of GDDR6 memory across a 256-bit wide memory bus. Whether it features DirectX 12 Ultimate features or not, remains to be seen, but it's becoming clear that Intel wants a crack at the high-volume e-sports market, with a product that's fast enough for competitive e-sports gaming, and capable of AAA.

Today, Lenovo in partnership with Intel has announced that Leibniz Supercomputing Centre (LRZ) is building a supercomputer powered by Intel's next-generation technologies. Specifically, the supercomputer will use Intel's Sapphire Rapids CPUs in combination with the highly-teased Ponte Vecchio GPUs to power the applications running at Leibniz Supercomputing Centre. Along with the various processors, the LRZ will also deploy Intel Optane persistent memory to process the huge amount of data the LRZ has and is producing. The integration of HPC and AI processing will be enabled by the expansion of LRZ's current supercomputer called SuperMUG-NG, which will receive an upgrade in 2022, which will feature both Sapphire Rapids and Ponte Vecchio.

Mr. Raja Koduri, Intel graphics guru, has on Twitter teased that this supercomputer installment will represent a combination of Sapphire Rapids, Ponte Vecchio, Optane, and One API all in one machine. The system will use over one petabyte of Distributed Asynchronous Object Storage (DAOS) based on the Optane technologies. Then, Mr. Koduri has teased some Ponte Vecchio eye candy, which is a GIF of tiles combining to form a GPU, which you can check out here. You can also see some pictures of Ponte Vecchio below.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel's fabled 8-core "Tiger Lake-H" silicon built on the 10 nm SuperFin process, is close to reality. The company's upcoming 11th Gen Core "Tiger Lake-H" processors for performance- and gaming notebooks, leverages this die. An HD Tecnologia report leaks alleged company slides from Intel that detail the processor line up and feature-set. To begin with, the 11th Gen Core-H series processors come in core-counts ranging from 4-core/8-thread, to 6-core/12-thread, and 8-core/16-thread. Look at the embargo date on the leaked slides, one could expect a formal launch as close as May 11, 2021.

The 10 nm SuperFin "Tiger Lake-H" silicon features 8 "Willow Cove" CPU cores, and an updated iGPU based on the company's latest Gen12 Xe LP graphics architecture. Each of the eight CPU cores has 1.25 MB of L2 cache, and they share a massive 24 MB of L3 cache. The Gen12 Xe LP iGPU only has 32 execution units (EUs), according to the slides, 1/3rd those of the 96 EUs on the "Tiger Lake-U." The uncore component is also updated, now featuring dual-channel DDR4-3200 native support, and a 28-lane PCI-Express 4.0 root-complex. 16 of these lanes are wired out as PEG (PCI-Express Graphics), four as a CPU-attached NVMe slot, and eight toward the 8-lane DMI 3.0 chipset bus.

Intel's upcoming Alder Lake generation of processors is going to be the first iteration of heterogeneous x86 architecture. That means that Intel will for the first time combine smaller, low-power cores, with some big high-performance cores to provide the boost to all the workloads. If a task doesn't need much power, as some background task, for example, the smaller cores are used. And if you need to render something or you want to fire up a game, big cores are used to provide the power needed for the tasks. Intel has decided to provide such an architecture on the advanced 10 nm SuperFin, which represents a major upgrade over the existing 14 nm process.

Today, we got some information from Igor's Lab, showing the leaked specification of the Intel Core-1800 processor engineering sample. While this may not represent the final name, we see that the leaked information shows that the processor is B0 stepping. That means that the CPU will see more changes when the final sample arrives. The CPU has 16 cores with 24 threads. Eight of those cores are big ones with hyperthreading, while the remaining 8 are smaller Atom cores. They are running at the base clock of 1800 MHz, while the boost speeds are 4.6 GHz with two cores, 4.4 GHz with four cores, and 4.2 GHz with 6 cores. When all cores are used, the boost speed is locked at 4.0 GHz. The CPU has a PL1 TDP of 125 Watts, while the PL2 configuration boosts the TDP to 228 Watts. The CPU was reportedly running at 1.3147 Volts during the test. You can check out the complete datasheet below.

Intel is giving finishing touches to the NUC 11 Essential, its next-generation entry-level NUC desktops powered by Pentium Silver and Celeron SoCs based on the 10 nm "Jasper Lake" silicon. Among the SoC options are the Pentium Silver J6005, packing a 4-core/4-thread CPU based on the "Tremont" microarchitecture, a Gen11 iGPU with 32 execution units, and a dual-channel DDR4 memory interface. The Celeron J5105 is the next best option, with slightly lower clock speeds, and the Celeron J4505, a 2-core/2-thread part.

The NUC 11 Essential comes with two DDR4 SO-DIMM slots supporting up to 16 GB of dual-channel DDR4-2933 memory. The Gen11 iGPU is leveraged to put out an HDMI 2.0b port, and a DisplayPort 1.4, both of which support 4K displays up to 60 Hz. Connectivity includes 802.11ax + Bluetooth 4.2 with audio offload; 1 GbE wired LAN, four 5 Gbps USB 3.1 type-A ports, and two USB 2.0 ports.A 65-Watt power brick is included. It measures 135 mm x 115 mm x 36 mm.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of Intel Z590 platform with AORUS MODEL X and mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of premium performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the overclocking, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers reassuring and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a standard to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with optimized compatibility, Expandability, and three-year warranty of whole system.

Intel over the weekend announced that it will make new investments into its Rio Rancho manufacturing facility in the U.S. state of New Mexico. The company will hold a media event later today, describing the nature of the investment. Keyvan Esfarjani its VP and GM for manufacturing and operations will be joined by New Mexico Governor Michelle Lujan Grisham, along with a few Members of Congress from the state, in this event. Given the substantial participation of elected representatives, this is likely to be an expansion to the facility. Intel describes the Rio Rancho facility as focusing on mass production of the company's 3D XPoint memory, NAND flash, and silicon photonics products.

Update 16:13 UTC: Intel outlined its expansion plans with Rio Rancho, with a $3.5 billion investment, which could create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state.The press release follows.

Researches from the University of Virginia and University of California San Diego have published their latest case study. The two universities have worked hard to discover a new Spectre vulnerability variant that can pass all of the existing Spectre mitigations and exploit all of the existing processors coming from Intel and AMD. The vulnerability exploits all of the existing x86 processors, and as it is new, there are not implementations of hardware mitigation. The whitepaper called "I see dead μops" takes the implementation of exploiting micro-op caches that could lead to a potential data leak in the processor, which is leading to a Spectre-type exploit.

Modern x86 processors break down complex instructions into smaller RISC-like units called micro-ops, in the frontend, where it makes the design of the backend part much simpler. The micro-ops are stored in the micro-ops cache. The paper is describing micro-op cache-based timing channel exploits in three primary settings: "a) across code regions within the same thread, but operating at different privilege levels, (b) across different co-located threads running simultaneously on different SMT contexts (logical cores) within the same physical core, and (c) two transient execution attack variants that leverage the micro-op cache to leak transiently accessed secrets, bypassing several existing hardware and software-based mitigations, including Intel's recommended LFENCE."

MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

Intel's upcoming Xeon "Sapphire Rapids" enterprise processor come come with CPU core-counts as high as 80, according to the latest round of photo-leaks. An earlier article predicted the chip cram up to 56 cores alongside on-package HBM. The processor reportedly features up to 80 cores, spread across four 20-core chiplets. Unlike on the latest AMD EPYC processor, there doesn't appear to be a centralized I/O controller die. This particular processor is based in the LGA4189 package, which features additional pins compared to the LGA4577-X socket from the 56-core leak. The newer socket has additional pins that enable next-gen I/O, which include PCI-Express Gen 5.0, and CXL 1.1 interface.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

Linksys, a global leader in home and business Wi-Fi solutions, today announces the availability of the market's first Wi-Fi 6E certified systems, the Linksys Hydra Pro 6E and award-winning Linksys Atlas Max 6E. Built with Velop Intelligent Mesh and utilizing the newly opened 6GHz band, the Linksys Hydra Pro and Linksys Atlas Max expand the user's network for the fastest speeds possible to every corner of the home. Wi-Fi 6E offers the 6GHz band connection that is needed for device-heavy homes and ensures optimal performance for video conferencing, working and learning from home, as well as the latest AR and VR devices.

"Wi-Fi 6E is driving a surge in technology innovation and we're proud to deliver next-level solutions that harness 6E speeds and efficiency, coupled with built-in Velop Intelligent Mesh," says Harry Dewhirst, vice president of business development, Linksys. "As the market's first Wi-Fi 6E system certified by the Wi-Fi Alliance we remain steadfast in our commitment to provide our customers reliable, innovative and secure Wi-Fi solutions."

AAEON, an industry leader of AI and IOT solutions, is excited to celebrate the launch of Intel's latest scalable platform, the 3rd Generation Intel Xeon Scalable Processors (formerly Ice Lake-SP). As an associate member of the Intel IoT Solutions Alliance, AAEON is excited to bring this new technology to market with the ARES-WHI0 industrial ATX server board and other future products.

The 3rd Generation Intel Xeon Scalable Processors deliver the next generation of high-end computing performance and support for vital data integrity and security technologies. This new generation of Xeon SP brings higher processing speeds and Intel's Deep Learning Boost technology, allowing for greater acceleration and more efficient processing for AI server applications.

Starting today, Microsoft Defender for Endpoint expands its use of Intel Threat Detection Technology (Intel TDT) beyond accelerated memory scanning capabilities to activate central processing unit (CPU) based cryptomining machine learning (ML) detection. This move further accelerates endpoint detection and response for millions of customers without compromising experience.

"This is a true inflection point for the security industry as well as our SMB, mid-market and enterprise customers that have rapidly adopted Windows 10 with built-in endpoint protections. Customers who choose Intel vPro with the exclusive Intel Hardware Shield now gain full-stack visibility to detect threats out of the box with no need for IT configuration. The scale of this CPU-based threat detection rollout across customer systems is unmatched and helps close gaps in corporate defenses," said Michael Nordquist, senior director of Strategic Planning and Architecture in the Business Client Group at Intel.