A leaked marketing slide from MSI Japan confirmed specifications of three 11th Gen Core "Rocket Lake-S" desktop processors that gamers and enthusiasts have their eyes on—the flagship Core i9-11900K, the next-best Core i7-11700K, and the performance-segment Core i5-11600K. The slides confirm that both the i9-11900K and i7-11700K are 8-core/16-thread parts, while the i5-11600K is 6-core/12-thread. With the "Rocket Lake-S" die capping out at 8 cores, Intel's product managers have lesser wiggle room to segment the Core i7 part from the Core i9 flagship.

The i9-11900K comes with a base frequency of 3.50 GHz, Turbo Boost 2.0 frequency of 5.10 GHz, Turbo Boost Max 3.0 frequency of 5.20 GHz, and Thermal Velocity Boost frequency of 5.30 GHz. Its all-core boost frequency is 4.80 GHz. The i7-11700K, on the other hand, lacks TVB. It ticks at 3.60 GHz base, 4.90 GHz Turbo Boost 2.0, and 5.00 GHz Turbo Boost Max 3.0. The i5-11600K lacks Turbo Boost Max 3.0 and TVB, it does 3.90 GHz base, with 4.90 GHz Turbo Boost 2.0. The Core i9 and Core i7 parts are joined at the hip with not just identical core counts, but also the same amount of L3 cache, at 16 MB. The i5 comes with 12 MB. All three Unlocked "K" SKUs come with native support for DDR4-3200 memory frequency, and their TDP is rated at 125 W. Intel is expected to launch these processors by late-March, 2021.

Intel Corporation today announced the appointment of Sunil Shenoy as senior vice president and general manager of the Design Engineering Group, effective Feb. 1. Shenoy, a 33-year Intel veteran who departed in 2014, returns to the company to lead the critical work of design, development, validation and manufacturing of intellectual properties and system-on-chips (SOC) for client and data center applications. Shenoy will report to current CEO Bob Swan until Feb. 15, after which he will report to incoming CEO Pat Gelsinger.

"Sunil is a proven engineering leader who has deep experience in microprocessor and SoC design and R&D," said Swan. "His experience inside and outside of Intel will enable him to combine the best of Intel culture with an entrepreneurial spirit and fresh perspective as we work to strengthen the company's technical leadership team and to coach and develop a new generation of technical talent."

Intel has partnered with ASUS and Colorful to design and launch Intel Iris Xe discrete desktop graphics cards. The two new DG1 boards are targeted towards mainstream users and small to medium-size businesses. The cards will only be available to system integrators who will offer Iris Xe discrete graphics as part of pre-built systems.

These new desktop cards follow the launch of Intel Iris Xe MAX for notebooks, including many of the same features and specifications. The cards feature 80 execution units and 4 GB of LPDDR4X video memory which is 16 execution units less than the notebook version however we are unsure of what clock speed they will be running at. The desktop cards also feature the same three display outputs, hardware video decode and encode acceleration, including AV1 decode support, VESA Adaptive Sync, and Display HDR support along with artificial intelligence capabilities.

Update Jan 28th: Colorful has recently published an official statement clarifying that they will not be releasing an Intel Iris Xe Desktop Graphics Card, this means that Intel's other launch partner is currently unknown.

Intel has apparently begun shipment of its discrete Iris Xe LP-based DG1 graphics card to OEMs and system integrators, which means we will soon see these graphics cards hitting the market - in a manner of speaking. The quantities aren't yet known, but considering Intel's intentions of only shipping it to OEMs, volume shouldn't be quite significant. It remains to be seen whether DG1-toting systems will even be available to the general public, or if these will be sold primarily to business customers. However, considering that the discrete DG1 only offers entry-level performance due to its 80 EUs (less than even the 96 available through integrated graphics on Intel Tiger Lake CPUs), hopes placed on this particular graphics card as somewhat remedying the current industry ailment of undersupply won't materialize.

One interesting tidbit, however, is that system integrators will have to use specific hardware on the systems they build that carry Intel's DG1, as the blue giant has specified that these graphics cards will only work pending specific firmware updates that enable them to function on certain chipset and processor products. Namely, and according to Intel speaking to Legit Reviews, "The Iris Xe discrete add-in card will be paired with 9th gen (Coffee Lake-S) and 10th gen (Comet Lake-S) Intel Core desktop processors and Intel B460, H410, B365, and H310C chipset-based motherboards and sold as part of pre-built systems. These motherboards require a special BIOS that supports Intel Iris Xe, so the cards won't be compatible with other systems."

At the beginning of 2021, MSI, a would-leading motherboards brand, had announed the latest Intel 500 series platforms will launch soon. Through few weeks of waiting, on January 27th, MSI Intel 500 series motherboards are officially launched.

As MSI official announcement mentioned, all of MSI 500 series motherboards with 11th Gen Intel Core processors support PCIe 4.0, and all of Z590 Wi-Fi motherboards have at least one 2.5G LAN and the latest Wi-Fi 6E solution which extends to 6 GHz spectrum providing remarkble user experience when streaming, gaming and even working from home.

Intel Corporation today announced it has invested a further US $475 million in Intel Products Vietnam (IPV). This new investment is in addition to Intel's US$1 billion investment to build a state-of-the-art chip assembly and test manufacturing facility in Saigon Hi-Tech Park (SHTP), first announced in 2006. This takes Intel's total investment in its Vietnam facility to US $1.5 billion.

"As of the end of 2020, Intel Products Vietnam has shipped more than 2 billion units to customers worldwide. We're very proud of this milestone, which shows both how important IPV is to helping Intel meet the needs of its customers all around the world, and why we continue to invest in our facilities and team here in Vietnam," said Kim Huat Ooi, vice president of Manufacturing and Operations and general manager of Intel Products Vietnam Co. Ltd.

Intel SVP for architecture, graphics, and software, Raja Koduri, tweeted the first picture of the Xe HPC scalar compute processor multi-chip module, with its large IHS off. It reveals two large main logic dies built on the 7 nm silicon fabrication process from a third-party foundry. The Xe HPC processor will be targeted at supercomputing and AI-ML applications, so the main logic dies are expected to be large arrays of execution units, spread across what appear to be eight clusters, surrounded by ancillary components such as memory controllers and interconnect PHYs.

There appear to be two kinds of on-package memory on the Xe HPC. The first kind is HBM stacks (from either the HBM2E or HBM3 generation), serving as the main high-speed memory; while the other is a mystery for now. This could either be another class of DRAM, serving a serial processing component on the main logic die; or a non-volatile memory, such as 3D XPoint or NAND flash (likely the former), providing fast persistent storage close to the main logic dies. There appear to be four HBM-class stacks per logic die (so 4096-bit per die and 8192-bit per package), and one die of this secondary memory per logic die.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today announces the launch of their new RACING series Z590GTA and B560GTQ motherboards designed to run the latest Intel 11th gen Rocket Lake-S processors.

Approved by many users as one of the best motherboard brands in the market, BIOSTAR's RACING series motherboards have always been the top choices for gamers and content creators for their style and durability. BIOSTAR carries their RACING series legacy with the all-new RACING Z590GTA and the new RACING B560GTQ motherboards. Both motherboards are engineered with new design elements updated to be great at thermal dissipation that improves the system's overall performance and lifetime substantially.

2021 is shaping up to be a big year for Intel in the DIY desktop space, with the company preparing to launch not one, but two generations of desktop processors. Having announced them in January, the 11th Gen Core "Rocket Lake-S" desktop processors in the LGA1200 package, will release to market in March, with the company claiming a restoration in gaming performance leadership away from AMD's Ryzen 5000 series. Sources tell Uniko's Hardware that the company will announce its 12th Gen successor, the Core "Alder Lake-S" in September 2021.

"Alder Lake-S" will be Intel's first mainstream desktop processor built on its new 10 nm SuperFin silicon fabrication process. The chip is expected to be a "hybrid" processor, combining an equal number of larger "Golden Cove" cores, and smaller "Gracemont" cores, to offer significantly improved energy efficiency. Built in the new Socket LGA1700 package, "Alder Lake-S" is expected to feature more general-purpose SoC connectivity than LGA1200 chips. It will also herald new platform standards, such as DDR5 memory and possibly even mainstreaming of ATX12VO. The processor will launch alongside new Intel 600-series chipset. AMD's response is expected to be the "Zen 4" microarchitecture, a new silicon built on the 5 nm process, and the new AM5 socket that introduces DDR5 memory support.

Intel has today reported its Q4 2020 earnings disclosing full-year revenue with the current CEO Bob Swan, upcoming new CEO Pat Gelsinger, and Omar Ishrak, Chairman of Intel's board. During the call, company officials have talked about Intel's earnings and most importantly, addressing the current problems about the company's manufacturing part - semiconductor foundries. Incoming Intel CEO, Pat Gelsinger, has talked about the state of the 7 nm node, giving shareholders reassurance and a will to remain in such a position. He has made an argument that he has personally reviewed the progress of the "health and recovery of the 7 nm program."

The 7 nm node has been originally delayed by a full year amid the expectations, and as with the 10 nm node, we have believed that it is going to experience similar issues. However, the incoming CEO has reassured everyone that it is very much improving. The new 7 nm node is on track for 2023 delivery, when Intel is expected to compete with the 3 nm node of TSMC. Firstly, Intel will make a debut of the 7 nm node with client processors scheduled for 1H 2023 arrival, with data center models following that. The company leads have confirmed that Intel will stay true to its internal manufacturing, but have stressed that there will still be a need for some outsourcing to happen.

Intel in its FY 2020 + Q4 2020 earnings release revealed two important development milestones from its two core businesses. As part of its Q4 2020 business highlights disclosures, the company revealed that it has commenced mass-production of its next-generation Xeon Scalable "Ice Lake-SP" enterprise processors. These chips implement the "Ice Lake" microarchitecture, with "Sunny Cove" CPU cores that offer higher IPC over "Cascade Lake," and are built on the company's 10 nm silicon fabrication node. Our older article details the 10 nm "Ice Lake-SP" silicon, where each die offers up to 28 cores, and enables Intel to build processors with up to 56 cores using two such dies on multi-chip modules.

Next up, the company states that it has "started shipping" its 11th Gen Core "Rocket Lake-S" desktop processors. "Shipping" in this context could even mean commencement of mass-production, and transfer of inventory down the supply chain, in the build up to a market availability date. At its digital keynote address on the sidelines of the 2021 International CES, Intel revealed many more details of "Rocket Lake-S," including its flagship Core i9-11900K 8-core processor, which it claims retakes the gaming performance lead that the company recently lost to AMD's Ryzen 5000 series. Multiple sources confirmed that these processors should be available only after mid-March, 2021.

Intel Corporation today reported fourth-quarter and full-year 2020 financial results. The company also announced that its board of directors approved a cash dividend increase of five percent to $1.39 per share on an annual basis. The board declared a quarterly dividend of $0.3475 per share on the company's common stock, which will be payable on March 1 to shareholders of record on February 7.

"We significantly exceeded our expectations for the quarter, capping off our fifth consecutive record year," said Bob Swan, Intel CEO. "Demand for the computing performance Intel delivers remains very strong and our focus on growth opportunities is paying off. It has been an honor to lead this wonderful company, and I am proud of what we have achieved as a team. Intel is in a strong strategic and financial position as we make this leadership transition and take Intel to the next level."

Research and development spending by semiconductor companies worldwide is forecast to grow 4% in 2021 to $71.4 billion after rising 5% in 2020 to a record high of $68.4 billion, according to IC Insights' new 2021 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry. Total R&D spending by semiconductor companies is expected to rise by a compound annual growth rate (CAGR) of 5.8% between 2021 and 2025 to $89.3 billion.

When the world was hit by the Covid-19 virus health crisis in 2020, wary semiconductor suppliers kept a lid on R&D spending increases, even though total semiconductor industry revenue grew by a surprising 8% in the year despite the economic fallout from the deadly pandemic. Semiconductor R&D expenditures as a percentage of worldwide industry sales slipped to 14.2% in 2020 compared to 14.6% in 2019, when research and development spending declined 1% and total semiconductor revenue fell 12%. Figure 1 plots semiconductor R&D spending levels and the spending-to-sales ratios over the past two decades and IC Insights' forecast through 2025.

The original "Nehalem" CPU microarchitecture from 2008 was pivotal to Intel, as it laid the foundation for Intel's mainline server and client x86 processors for the following 12-odd years. Glenn Hinton, the lead architect behind "Nehalem," announced that he is rejoining Intel after 3 years of retirement, to work on a new high-performance CPU project. Hinton states that his decision to rejoin Intel out of his retirement was influenced by Pat Gelsinger joining the company as its new CEO. Jim Keller, a CPU architecture lead behind several commercially-successful architectures, recently left Intel after a brief stint leading an undisclosed CPU core project. Keller later took up the mantle of CEO at hardware start-up Tenstorrent.

Pat Gelsinger leading Intel is expected to have a big impact on its return to technological leadership in its core businesses, as highlighted in Gelsinger's recent comments on the need for Intel to be better than Apple (which he referred to as "that lifestyle company") at making CPUs, in reference to Apple's new M1 chip taking the ultraportable notebook industry by storm. The other front Intel faces stiff competition from, is AMD, which has achieved IPC parity with Intel, and is beating it on energy-efficiency, taking advantage of the 7 nm silicon fabrication process.

HP Inc. announced five new Chromebooks to help teachers and students stay connected, productive, focused, and secure whether at home, in the classroom, or a blend of both. The PC has never been more essential in education. There has been a 46% increase in device shipments for teachers and students over the past year and 66% of teachers expect blended learning to continue after the pandemic. With nearly 70% of teachers and students feeling less connected to each other during the pandemic,4 HP's technology solutions foster collaboration and community during this time of unprecedented change, ensuring teachers can find new ways to connect with students, and students can be seen and heard regardless of their location.

"HP is committed to enabling better learning outcomes for 100 million people by 2025. With education no longer confined to the four walls of the classroom, HP is creating technology that helps teachers, students, as well as parents, thrive in blended learning environments," said Bill Avey, General Manager and Global Head of Education, Personal Systems, HP Inc. "HP's innovative Chromebook lineup gives educators and students access to flexible, engaging, and personalized devices that are critical to ensuring a quality education."

Acer today announced the new TravelMate Spin B3 (TMB311R-32) convertible laptop with military-grade durability, a device specially designed for classrooms. The touchscreen device features a Full HD webcam and blazing-fast Intel Wi-Fi 6, providing students with everything they need to succeed in interactive or virtual classrooms that make heavy use of media-based teaching materials.

Ultimately, the Acer TravelMate Spin B3 is a reliable device that strives to provide protection against common accidents, allowing parents and teachers to focus on what matters most: learning.

Intel has just launched its Rocket Lake-S desktop lineup of processors during this year's CES 2021 virtual event. However, the company is under constant pressure from the competition and it seems like it will not stop with that launch for this year. Today, thanks to the popular leaker @momomo_us on Twitter, we have the first SiSoftware entries made from the anonymous Alder Lake-S system. Dubbed a heterogeneous architecture, Alder Lake is supposed to be Intel's first desktop attempt at making big.LITTLE style of processors for general consumers. It is supposed to feature Intel 10 nm Golden Cove CPU "big" cores & Gracemont "small" CPU cores.

The SiSoftware database entry showcases a prototype system that has 16 cores and 32 threads running at the base frequency of 1.8 GHz and a boost speed of 4 GHz. There is 12.5 MB of L2 cache (split into 10 pairs of 1.25 MB) and 30 MB of level-three (L3) cache present on the processor. There is also an Alder Lake-S mobile graphics controller that runs at 1.5 GHz. Intel Xe gen 12.2 graphics is responsible for the video output. When it comes to memory, Alder Lake-S is finally bringing the newest DDR5 standard with a new motherboard chipset and socket called LGA 1700.

Pricing for Intel's upcoming Rocket Lake-S series of desktop processors has recently been leaked by a Dutch computer store. The 11th Generation Intel Core i5, i7, and i9 processors will feature the new Comet Lake CPU architecture while the lower-end Intel Core i3, and Intel Pentium processors will retain the older Cypress Cove CPU architecture. The new Intel Core i9 processors have returned to an 8 core 16 thread design down from the 10 core 20 thread design found in 10th generation processors.

The Intel 11th Generation Core i9 series will be approximately 6.6% cheaper than their predecessors but with 2 fewer cores and 4 fewer threads. The other new processors all see price increases from their 10th generation versions with an average increase of 6.5%. The new Comet Lake CPU architecture is expected to bring significant IPC improvements which may allow them to regain the title of best gaming CPU.

Intel has quietly announced the discontinuation of all Optane Memory SSDs for the consumer market. The company also confirmed that going forward they had no plans to release any new consumer Optane-Only SDDs. The Intel Optane Memory M10, 800P, 900P, and 905P series SSDs have now all been discontinued with final shipments going out next month. Intel has directed users to look at their Optane Memory H20 with Solid State Storage as a potential replacement, the H20 is a QLC M.2 SSD with 32 GB of Optane memory offered in 1 TB and 2 TB configurations. If you are looking to purchase an Intel Optane-Only SSD you will have to act quickly as once stocks run out they won't be returning.

Intel's future CEO Pat Gelsinger, who supersedes current CEO Bob Swan come February 15th, has reportedly compared Intel with Apple's efforts, in wake of that company's decision to leave the Intel ecosystem in favor of in-house designed ARM CPUs. As Apple M1-powered devices hit reviewers' tables, the opinions mostly went one-sided in favor of Apple's decision, clamoring for that particular CPU design to be only lightly short of a computing miracle, considering the amount of computing power provided at that chip's TDP, and running circles around Apple's previous Intel implementations.

According to The Oregonian, a local newspaper from (you guessed it) Oregon where Intel has a strong branch presence, Intel held an all-hands meeting of its Oregon workforce, attended by future Intel CEO Pat Gelsinger, who is quoted as having remarked that "We [Intel] have to deliver better products to the PC ecosystem than any possible thing that a lifestyle company in Cupertino makes. We have to be that good, in the future." Considering how Apple's M1 has raised the world's attention to the ARM architecture as a competitor with strong enough arguments to face the x86 ecosystem (as if ARM powering the world's current fastest supercomputer wasn't a strong enough argument), that seems like a strong yet adequate statement. We'll see how Intel fares with its Alder lake CPUs, which essentially bring ARM's design philosophy of an heterogeneous CPU with both high-performance and high-efficiency cores to the x86 table.

The midnight bell seems to have struck for Intel CEO Bob Swan, with Intel announcing his departure from the CEO position effective February 15th. The news comes after a two-year tenure as Intel's CEO, in addition to seven additional months in which Bob Swan served as interim Intel CEO before officially assuming the position. VMWare CEO Pat Gelsinger will take over the CEO chair, and following this announcement, Intel's stock surged by more than 10%, while VMWare's stock dipped by 5% on the prospect of losing its CEO.

Patrick Gelsinger formerly served under Intel, where he climbed the ranks until reaching the coveted CTO position - and also served as Senior Vice-president and General Manager of the Digital Enterprise Group. He is also credited as being one of the driving forces behind the creation of standards such as USB and Wi-Fi, architected the 80486, and played key roles in 14 generations of Intel Core and Xeon processors. Investors expect Gelsinger's technical background to help steer Intel into less troubled waters when it comes to strategy and execution. in wake of Bob Swan's departure, Intel also announced that it expects fourth quarter 2020 revenue and earnings to exceed prior guidance, and that it will take to its January 21st earnings report to discuss the "strong progress" achieved by the company in the in-development 7 nm node.

According to a market analysis from TrendForce, Intel's manufacturing efforts with TSMC will go way beyond a potential TSMC technology licensing for that company's manufacturing technology to be employed in Intel's own fabs. The market research firm says that Intel will instead procure wafers directly from TSMC, starting on 2H2021, in the order of 20-25% of total production for some of its non-CPU products. But the manufacturing deal is said to go beyond that, with TSMC picking up orders for Intel's Core i3 CPUs in the company's 5 nm manufacturing node - one that Intel will take years to scale down to on its own manufacturing capabilities.

According to TrendForce, that effort will scale upwards with TSMC manufacturing certain allotments of Intel's midrange and high-end CPUs using the semiconductor manufacturer's 3 nm technology in 2022. TrendForce believes that increased outsourcing of Intel's product lines will allow the company to not only continue its existence as a major IDM, but also maintain and prioritize in-house production lines for chips with high margins, while more effectively spending CAPEX on advanced R&D due to savings on fabrication technology scaling - fewer in-house chips means lower needs for investment in capacity increases, which would allow the company to sink the savings into further R&D. The move would also allow Intel to close the gap with rival AMD's manufacturing advantages in a more critical, timely manner.

Intel is betting big on an 8-core processor to revive its gaming performance leadership, and that chip is the 11th Generation Core "Rocket Lake-S," coming this March. In its 2021 International CES online event, Intel disclosed more details about "Rocket Lake-S," including the first true-color die-shot. PC enthusiast @Locuza_ on Twitter annotated the die for your viewing pressure. For starters, nearly half the die-area of the "Rocket Lake-S" is taken up by the uncore and iGPU, with the rest going to the eight "Cypress Cove" CPU cores.

The "Cypress Cove" CPU core is reportedly a back-port of "Willow Cove" to the 14 nm silicon fabrication node, although there are some changes, beginning with its cache hierarchy. A "Cypress Cove" core is configured with the same L1I and L1D cache sizes as "Willow Cove," but differ with L2 and L3 cache sizes. Each "Cypress Cove" core is endowed with 512 KB of dedicated L2 cache (which is a 100% increase from the 256 KB on "Skylake" cores); but this pales in comparison to the 1.25 MB L2 caches of "Willow Cove" cores on the "Tiger Lake-U" silicon. Also, the L3 cache for the 8-core "Rocket Lake-S" die is 16 MB, spread across eight 2 MB slices; while the 4-core "Tiger Lake-U" features 12 MB of L3, spread across four 3 MB slices. Each core can address the whole L3 cache, across all slices.

Intel at its recent 2021 International CES call confirmed the existence of an 8-core version of its 11th Gen Core "Tiger Lake" processor, and held the chip for the camera. The visibly bigger chip will be slated in Intel's H-segment (35 W to 45 W TDP), meaning it will only power gaming notebooks and mobile workstations; while the mainstream mobility segment will still be in the hands of its 4-core "Tiger Lake-H35" silicon. The 8-core "Tiger Lake-H" processor will also receive reasonably high clock-speeds, boosting up to 5.00 GHz.

Assuming the cache hierarchy and uncore/iGPU setup is unchanged between the 8-core and 4-core dies, we're looking at 24 MB of shared L3 cache, and 1.25 MB of dedicated L2 cache per core. These alone take up a big slice of the die-area. Add to this, the uncore features a PCI-Express Gen 4 root-complex and memory controllers that support dual-channel DDR4 and LPDDR4x memory types. The iGPU is expected to be based on the same Gen12 Xe-LP architecture as the 4-core die; although its execution unit count remains to be seen. In all likelihood, the 8-core "Tiger Lake-H" silicon is based on the same 10 nm SuperFin node.

Alienware, the gaming division of Dell Technologies, has today announced a lineup refresh, meaning that all of the existing products will get upgraded to versions with the latest hardware. And to start off, the company has equipped their thin and powerful Alienware m15 R4 and m17 R4 laptops with the latest hardware we saw announced just yesterday. The laptops are equipped with 12-phase voltage regulation modules to power the newest NVIDIA GeForce RTX 3000 series of mobile GPUs. To pair with a strong GPU, Alienware decided to use 10th generation Intel Comet Lake-H designs. These new laptops can be equipped with up to 4 TB of PCIe 3.0 NVMe SSD storage and up to 32 GB of 2933 MHz RAM. For display, options range from FHD LCD to a 4K OLED panel and 360 Hz refresh rate for the m17 R4 model.