Intel is planning to debut its 11th Generation Core "Rocket Lake-S" desktop processor family with a fairly large selection of SKUs, according to leaked company slides shared by VideoCardz, which appear to be coming from the same source as an earlier report from today that talk about double-digit percent gaming performance gains over the previous generation. Just the Core i9 and Core i7 series add up to 10 SKUs between them. These include unlocked- and iGPU-enabled "K" SKUs, unlocked but iGPU-disabled "KF," locked but iGPU-enabled parts, and locked and iGPU-disabled "F" parts.

With "Rocket Lake-S," Intel appears to have hit a ceiling with the number of CPU cores it can cram onto a die alongside an iGPU, on the 75 mm x 75 mm LGA package, while retaining its 14 nm silicon fabrication node. Both the Core i9-11900 series and the Core i7-10700 series are 8-core/16-thread parts, with an identical amount of cache. They are differentiated on the basis of clock speeds as tabled below, and the lack of the Thermal Velocity Boost feature on the Core i7 parts. The Core i5 series "Rocket Lake-S" parts are reportedly 6-core/12-thread.

Demand for notebook computers is expected to remain strong throughout 2Q21 due to the persisting stay-at-home economy that arose in the wake of the pandemic, according to TrendForce's latest investigations. In response to the high demand for notebooks, PC OEMs are actively raising a consistent inventory of components, including client SSDs. Nonetheless, client SSDs are now in increasingly tight supply because the preexisting shortage of NAND Flash controllers is now exacerbated by the power outage at Samsung's Austin-based semiconductor plant. SSD manufacturers are therefore preparing to raise the prices of SSDs. Accordingly, TrendForce has also revised up its forecast of client SSD prices for 2Q21 from "mostly flat" to a 3-8% increase QoQ instead.

An alleged Intel marketing slide highlighting the gaming performance advances of the company's upcoming Core i9-11900K "Rocket Lake" processor was leaked to the web. The slide compares the i9-11900K to the previous generation i9-10900K "Comet Lake-S," showing that despite two fewer CPU cores, the new chip is able to post double-digit percent gaming performance gains. At 1080p resolution, which is relevant to CPU testing as it highlights bottlenecks at the CPU-level, the i9-11900K is claimed to gain over 13% in frame-rates with "Total War: Three Kingdoms," and a significant 14% with Microsoft Flight Simulator. "Gears 5" shows a 9% performance gain, while GRID 2019 is 8% faster.

The Core i9-11900K owes its gaming performance gains to the IPC increase (single-thread performance increase) from the new "Cypress Cove" CPU cores. The "Rocket Lake-S" silicon features up to 8 "Cypress Cove" cores, which are believed to be a back-port of the "Willow Cove" core to the 14 nm silicon fabrication node, albeit with modifications, such as lower L2 cache sizes. Intel is looking to restore PC gaming performance leadership with the 11th Gen Core desktop processor series. The chips are expected to launch later this month.

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

As we are getting closer to the launch of Intel's next-generation Alder Lake processors, more information is getting leaked. Today, thanks to the leaked presentation slide, we have some more details regarding Intel's Alder Lake offerings in the laptop sector. As a reminder, Alder Lake uses a hybrid approach to core configuration with the similar mindset Arm's big.LITTLE works. There are a few smaller cores for processing smaller tasks that don't need much power and, of course, there are a few big cores that are used for heavyweight processing as some advanced applications require. The small cores are going to be based on the Gracemont microarchitecture, while the big one will use the Golden Cove design.

Thanks to @9550pro on Twitter, we have a slide that showcases 19 different Alder Lake configurations for the laptop segment. At the very bottom, there are configurations with a TDP of just five Watts. That is achieved by having just one big, four smaller cores, 48 EU Gen 12 GPU and that is meant for the tablet segment. Going up, we have different ranges depending on the application device, and the highest end is a chip with 55 Watts of power. That model has eight small and eight big cores, combined with 32 EUs of Gen 12 graphics. All models include integrated graphics. The variations of big and small cores have allowed Intel to have as many as 19 different SKUs, that cover every segment needed, by simply balancing the core count. You can check out the rest of the models below for yourself.

Thermaltake today introduced the ToughRAM XG RGB line of DDR4 memory kits. The series debuts in 16 GB (2x 8 GB) dual-channel memory kits, with frequency-based variants of DDR4-3600, DDR4-4000, DDR4-4400, and DDR4-4600. The top DDR4-4600 kit (R016D408GX2-4600C19A) does its rated frequency with timings of 19-26-26-45, and 1.5 V DRAM voltage. The DDR4-4400 kit (R016D408GX2-4400C19A) runs at slightly tighter timings of 19-25-25-45, and 1.45 V. The DDR4-4000 kit (R016D408GX2-4000C19A) ticks at 19-23-23-42, with 1.35 V. At the same voltage, the DDR4-3600 kit (R016D408GX2-3600C18A) does 18-19-19-39.

Visually, the ToughRAM XG RGB module features a chunky aluminium heatspreader design with three distinct design tones, and three silicone addressable-RGB diffusers that hide 16 ARGB diodes. You can control the lighting using Thermaltake's NeonMaker app, or pretty much any ARGB control software, including Razer Chroma. Thermaltake guarantees advertised speeds on Intel X299, Z490, Z390, Z370, Z270, and Z170 chipset motherboards when paired with K-series processors; or AMD X570 and B550 motherboards with Ryzen 3000 "Matisse" or 5000 "Vermeer" processors. The modules are backed by lifetime warranties. The company didn't reveal pricing.

Intel published Linux kernel driver patches that reference a new CPU microarchitecture, codenamed "Lunar Lake." The patch comments refer to "Lunar Lake" as a client platform, and VideoCardz predicts that it could succeed "Meteor Lake." the microarchitecture that follows "Alder Lake," which was recently announced by Intel.

Targeting both mobile and desktop platforms, "Alder Lake" will herald a new 1,700-pin LGA socket for the client desktop, and debut hybrid CPU cores on the form-factor. Expected to be built on a newer silicon fabrication node, such as the 10 nm SuperFin, the chip will combine high-performance "Golden Cove" big cores, with "Gracemont" low-power cores. Its commercial success will determine if Intel continues to take the hybrid-core approach to client processors with future "Meteor Lake" and "Lunar Lake," or whether it will have sorted out its foundry woes and build "Lunar Lake" with a homogeneous CPU core type. With "Alder Lake" expected to debut toward the end of 2021 and "Meteor Lake" [hopefully] by 2022, "Lunar Lake" would only follow by 2023-24.

Intel today announced that it has signed an agreement with Defense Advanced Research Projects Agency (DARPA) to perform in its Data Protection in Virtual Environments (DPRIVE) program. The program aims to develop an accelerator for fully homomorphic encryption (FHE). Microsoft is the key cloud ecosystem and homomorphic encryption partner leading the commercial adoption of the technology once developed by testing it in its cloud offerings, including Microsoft Azure and the Microsoft JEDI cloud, with the U.S. government. The multiyear program represents a cross-team effort across multiple Intel groups, including Intel Labs, the Design Engineering Group and the Data Platforms Group, to tackle "the final frontier" in data privacy, which is computing on fully encrypted data without access to decryption keys.

"Fully homomorphic encryption remains the holy grail in the quest to keep data secure while in use. Despite strong advances in trusted execution environments and other confidential computing technologies to protect data while at rest and in transit, data is unencrypted during computation, opening the possibility of potential attacks at this stage. This frequently inhibits our ability to fully share and extract the maximum value out of data. We are pleased to be chosen as a technology partner by DARPA and look forward to working with them as well as Microsoft to advance this next chapter in confidential computing and unlock the promise of fully homomorphic encryption for all," said Rosario Cammarota, principal engineer, Intel Labs, and principal investigator, DARPA DPRIVE program.

Intel's new 8-core "Tiger Lake" silicon will play a major role in holding the company's dominance in the mobile processor space, with plans for new 6-core and 8-core SKUs being in motion. OneRaichu on Twitter, a reliable source with Intel leaks, points to several unreleased model numbers. The 8-core "Tiger Lake-H" die is expected to be built on the same 10 nm SuperFin process as the "Tiger Lake-U" silicon. The lineup is led by the Core i9-11980HK, an 8-core/16-thread processor that uses eight "Willow Cove" CPU cores, 2.60 GHz nominal- and 5.00 GHz max-Turbo frequency, and 3.30 GHz AVX512 frequency. This chip will be in a class of its own, as its TDP is rated at 65 W, significantly above the 35-45 W TDP range that constitutes the H-segment. It will likely power large gaming notebooks with elaborate cooling solutions. It will also come with an unlocked base-clock multiplier.

The Core i9-11900H is the next chip in the lineup, with slightly lower clock speeds of 2.50 GHz base, 4.90 GHz max-Turbo, and 2.10 GHz AVX512. This chip features a much lower 35 W TDP, and will come with aggressive power management compared to the i9-11980HK. The Core i7-11800H will be the slowest 8-core part, with clock speeds of 2.40 GHz nominal, 4.60 GHz max-Turbo, and 2.00 GHz AVX512. It comes with the same 35 W TDP as the i9-11900H. Next up, are 6-core/12-thread parts, likely under the Core i5 brand. These include the i5-11400H, clocked at 2.70 GHz nominal, 4.50 GHz max-Turbo, and 2.20 GHz AVX512. At the bottom of the pile is the i5-11260H, clocked at 2.60 GHz, with 4.40 GHz max-Turbo, and 2.10 GHz AVX512. Both Core i5 parts are 35-Watt.

We have recently received some early gaming benchmarks for the upcoming Intel Core i7-11700K after German retailer MindFactory released the chip early. The creator of CapFrameX has managed to get their hands on one of these processors and has put it to the test comparing it with the Intel Core i9-10900K in some gaming benchmarks. Intel has promised double-digit IPC improvements with the new Rocket Lake generation of processors however if the results from this latest benchmark are representative of the wider picture those improvements might be a bit more modest then Intel claims.

The processors were paired with an RTX 3090 and 32 GB of 3200 MHz memory as this is the new stock maximum speed supported versus 2933 MHz on the Core i9-10900K. The two processors were put to the test in Crysis Remastered, Cyberpunk 2077, and Star Wars: Jedi Fallen Order, with the i7-11700K coming ahead in all three tests by ~ 2% - 9%. These tests are unverified and might not be fully representative of performance but they give us a good indication of what Intel has to offer with these new 11th generation chips.

According to a new research report from the analyst firm Jon Peddie Research, the growth of PC-based Graphics Processor Units (GPU) shipments of all types worldwide reached 20.5 percent in Q4 2020 and 12.4 percent year over year. Overall, the installed base of GPUs will grow at a compound annual growth rate of 3.7 percent during 2020-2025 to reach a total of 419 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC will grow to reach a level of 21 percent.

As part of its ongoing research on the PC graphics market, Jon Peddie Research (JPR) has released its Market Watch report for the fourth quarter of 2020. Before 2020, the PC market was showing signs of improvement and settling into a new normal. The pandemic has distorted all models and predictions, as has the gold-rush in Ethereum. JPR's Market Watch report confirms that trend for the fourth quarter of 2020, but with cautious guidance for next year.

Intel announced their 'mainstream' 670p PCIe 3.0 QLC SSD family earlier this week with pricing more in line with what you would expect for PCIe 4.0 drives. Intel announced three 670p models with 512 GB, 1 TB, and 2 TB capacities, the advertised speeds varied with sequential reads of 3500 MB/s on the 1/2 TB models and 3000 MB/s for the 512 GB variant. Sequential write speeds were quoted as 1600 MB/s for the 512 GB, 2500 MB/s for the 1 TB, and 2700 MB/s for the 2 TB model. The latest QLC memory also brought a write endurance increase of 23% and the SSD's all came with a five-year warranty.

While these drives all offered respectable performance their pricing did not reflect their 'mainstream' target market with the drives priced at 90 USD, 155 USD, and 330 USD for the 512 GB, 1 TB, and 2 TB models respectively. It would appear that retailers are taking it upon themselves to correct this by reducing prices by up to 24% on the new drives. Newegg currently has the drives listed for 69.99 USD, 129.99 USD, and 249.99 USD which represents a price drop of 20 USD for the 512 GB, 25 USD for the 1 TB, and 80 USD for the 2 TB version. These new prices make the 670p series a much more viable PCIe 3.0 SSD however, it is yet to be seen if these are the new official prices or just a discount from an individual retailer.

A federal jury in Texas has ruled that Intel Corporation violated two patents of VLSI Technology and must pay 2.18 billion USD in damages. The damages include 1.5 billion for one patent and 675 million for the other. The patents are related to clock frequency control and minimum memory operating voltage technique and were awarded to Freescale Semiconductor Inc in 2012 and SigmaTel in 2010. Freescale bought SigmaTel gaining control of the two patents before being passed to NXP after the company acquired Freescale in 2015, these patents were then transferred to the newly resurrected VLSI Technology in 2019 with the sole purpose of launching a legal battle against Intel. In a comment to Tom's Hardware the company said "Intel strongly disagrees with today's jury verdict. We intend to appeal and are confident that we will prevail.". This legal battle will likely drag-out for several years as Intel plans to appeal the recent ruling. Intel recorded a net income of 5.9 billion USD in Q4 2020 so this fine is by no means insignificant.

Intel in a statement to Hardwareluxx has confirmed that the release date for the company's next-gen CPU family, codenamed Rocket Lake-S, will indeed see a global launch come March 30th. The 11000 family of CPUs is already being sold on Germany, however, via etailer Mindfactory.de, who apparently jumped the gun on the actual availability of said CPUs. Mindfactory only ships within Germany, meaning that that country is actually the sole current field for Intel's latest-gen CPUs. The etailer says that they have the right to sell the CPUs, and stands by its decision, which likely means that their supplier failed to convey the proper NDAs and launch dates when selling - or so we're led to believe. That's the reason why benchmarks of Intel's 11000-series are already in the wild - even for currently unannounced CPUs, such as the Core i7-11700K.

WCCFTech over the weekend got their hands on the full table for Intel's upcoming Core i9 and Core i7 products (at least those available at launch). Mainstream CPUs on the Core i5 family and below weren't listed, however. It remains to be seen whether the previously speculated March 15th launch date will actually be the official announcement date from Intel, of if something else is afoot for that particular day of March.

Some time ago, Intel has introduced the Performance Tuning Protection Plan (PTPP), which was used as a warranty for any damage that has occurred during overclocking. Customers of PTPP, mainly buyers of Intel Core processors having a "K" tag were able to get a replacement processor whenever they damaged their CPU by overclocking it. When it comes to the pricing of such a service, typical plans were spanning from $19.99 to $29.99, depending on the processor you had. However, there will no longer be such a program, as Intel is discontinuing its PTPP extended overclocking warranty. The company has updated its site to refer to End-Of-Life (EOL) page displaying a quote below.

All of the MSI Z490 motherboards will be supporting PCIe 4.0 with the coming Intel 11th Gen Intel Processors. Through an update to the latest BIOS, MSI Z490 motherboards offer great bandwidth and performance for PCIe 4.0 M.2 SSDs and graphics cards.

To be PCIe 4.0 compatible, several components on the motherboards are necessary, including PCIe 4.0 ready clock generator, lane switch, redriver, PCIe slots, and M.2 connectors. Thanks to the complete PCIe 4.0 solutions, MSI Z490 motherboards provide the most stable design for PCIe 4.0 and unlock the full performance of PCIe 4.0 devices.

Lenovo announced today its all new portfolio of embedded computers for the edge during the Embedded World 2021 DIGITAL virtual exhibition. Building from the existing edge portfolio from Lenovo, the ThinkEdge devices - the new ThinkEdge SE30 and ThinkEdge SE50 - are small, rugged, and powerful enough to meet the demanding needs of enterprise data processing, security and scalability at the edge.

The new Lenovo ThinkEdge devices are powered by Intel technology and built for the data needs of tomorrow. The embedded edge computers are for customers who need faster processing power, better security, and scalability. With the right data securely on hand for when it matters, businesses can be more efficient, insightful and competitive.

ASUS today rolled out the ThunderboltEX 4, an add-on card designed to give your PC full Thunderbolt 4 connectivity. The only catch here is that you'll need an ASUS motherboard with a Thunderbolt readiness header (which provides timing and other low-level system commands to the card). Also needed is a USB 2.0 header, of which you're likely to have plenty. The card features a PCI-Express 3.0 x4 host interface, and can be installed on any PCIe slot, x4 or larger. A 6-pin PCIe power input is also needed, as Thunderbolt 4 is capable of up to 100 W of power delivery per port, enabling single-cable RAID enclosures and monitors.

The ASUS ThunderboltEX 4 card puts out two Thunderbolt 4 ports in the USB type-C physical format, each with 40 Gbps of bi-directional bandwidth. The card provides DisplayPort passthrough for each port. You connect your graphics card to the ThunderboltEX 4 using the included DisplayPort to mini-DisplayPort cables. The card supports DisplayPort 1.4 passthrough, so you can scale all the way up to 8K resolution on the connected monitors, if your graphics card is game. Under the hood, the card features an Intel JHL8540 "Maple Ridge" Thunderbolt 4 controller. The company didn't reveal pricing.

It appears that Intel's DG2 refers to a number of HPG (High Performance Graphics) products within the same family, with rumors surfacing around a possible total of six different graphics products based on the company's latest high performance graphics architecture - and its debut on the high performance discrete market. It's been confirmed that Intel's DG2 products will not be manufactured in-house, via Intel's 10 nm SuperFin technology, but with recourse to foundry partner TSMC's 6 nm fabrication technology.

It seems that DG2 is currently slated for launch based on three different chip configurations: the first is the DG2 512EU, which will power the highest-performance, 4096 shading unit, 8 GB / 16 GB GDDR6 and 192-bit bus graphics card. Another chip is the DG12 384EU, estimated to come in at ~190 mm², available in three different shading unit configurations: 3072 shading units, with an accompanying 6/12 GB of GDDR6 memory and 192-bit bus; 2048 shading units, which reduces allotted memory to 4/8 GB configurations and a 128-bit memory bus; and finally, the further cut-down 1536 shading unit configuration, with a maximum of 4 GB of GDDR6 memory over the same 128-bit bus. The final (current) chip in the DG2 family is the DG2 128EU, with both 128EU and 96EU configurations (1024 and 768 shading units, respectively) carrying 4 GB VRAM over a pretty tight 64-bit bus. We'll see if these leaks actually materialize into final Intel products, and if these design choices are the possible best, considering Intel's technology, so as to assail the two-player party that is the discrete, high performance graphics market.

The upcoming Intel Core i7-11700K "Rocket Lake-S" desktop processor showed up on European Retailer Mindfactory.de as a pre-order, listed at 469€ (including VAT). This is a huge step up from the retailer's current selling price of the i7-10700K "Comet Lake-S" of 317.50€, although roughly in line with its launch price. The i7-11700K is an 8-core/16-thread processor, which steps up performance over the previous-gen using the updated "Cypress Cove" CPU cores that come with increased IPC. The processor features a maximum Turbo Boost Max 3.0 frequency of 5.00 GHz, and 16 MB of shared L3 cache. The chip is differentiated from the top-dog Core i9-11900K only by frequency, with the flagship chip featuring max boost frequency of 5.10 GHz, along with the Thermal Velocity Boost feature. The Core i7-11700K comes in a simple paperboard box that lacks an included cooling solution.

In 2011, computers were clogged with too many input/output (I/O) ports. There were USB ports for data; Ethernet ports for internet; and DisplayPort, HDMI and VGA ports for video. Despite being large enough to accommodate multiple ports, the computers still couldn't keep up with users' needs.

The solution? Intel launched Thunderbolt technology, which consolidated data, video and power on a single, small connector. Thunderbolt allowed users to move data quickly and confidently among connected smart devices - like PCs, docks, monitors, solid state drives, external hard drives and cameras - using that single connector. At the time, Thunderbolt boasted the ability to transfer a full-length, high-definition movie in less than 30 seconds and back up a full year of continuous MP3 music playback in just over 10 minutes.

Cincoze, a professional manufacturer of embedded systems, has announced its new flagship GPU edge computing system, the GP-3000. Its crowning feature is an exclusive GPU Expansion Box that provides expansion for up to two high-end GPU graphics cards and creating a high-performance industrial-grade GPU computer. Brandon Chien, General Manager of Cincoze, stated that "We already know AI will drive innovation and expansion for industrial applications. The GP-3000 is Cincoze's answer for intensive image processing and complex calculations, such as deep machine learning, autonomous driving, automated visual inspection, and mobile monitoring. As our latest flagship model, the GP-3000 multiplies edge computing efficiency, amplifies productivity and reliability, and accelerates AIoT automation."

The GP-3000's extreme computing power starts with an 8th or 9th generation Intel Xeon or Core i3/i5/i7 (Coffee Lake and Coffee Lake-R) CPU, Intel C246 chipset, and supports two sets of DDR4-2666 ECC/non-ECC SO-DIMM up to 64 GB and can support up to two 250 W high-end GPU graphics cards. With a total system power consumption of 720 W, it's easy to meet and exceed high-efficiency application requirements. A precision heat dissipation and cooling design quickly wick away heat, keeping the focus squarely on the breathtaking performance of the GP-3000.

Intel "Alder Lake" is the first processor generation coming from the company to feature the hybrid big.LITTLE type core arrangement and we are wondering how the configurations look like and just how powerful the next-generation processors are going to be. Today, a Geekbench submission has appeared that gave us a little more information about one out of twelve Alder Lake-S configurations. This time, we are getting an 8-core, 16-threaded design with all big cores and no smaller cores present. Such design with no little cores in place is exclusive to the Alder Lake-S desktop platform, and will not come to the Alder Lake-P processors designed for mobile platforms.

Based on the socket LGA1700, the processor was spotted running all of its eight cores at 2.99 GHz frequency. Please note that this is only an engineering sample and the clock speeds of the final product should be higher. It was paired with the latest DDR5 memory and NVIDIA GeForce RTX 2080 GPU. The OpenCL score this CPU ran has shown that it has provided the GPU with more than enough performance. Typically, the RTX 2080 GPU scores about 106101 points in Geekbench OpenCL tests. Paired with the Alder Lake-S CPU, the GPU has managed to score as much as 108068 points, showing the power of the new generation of cores. While there is still a lot of mystery surrounding the Alder Lake-S series, we have come to know that the big cores used are supposed to be very powerful.

Intel claims that its upcoming 11th Gen Core "Rocket Lake-S" desktop processors offer up to 11% higher storage performance than competing AMD Ryzen 5000 processors, when using the CPU-attached M.2 NVMe slot. A performance slide released by Intel's Ryan Shrout shows a Samsung 980 PRO 1 TB PCI-Express 4.0 x4 M.2 NVMe SSD performance on a machine powered by a Core i9-11900K processor, compared to one powered by an AMD Ryzen 9 5950X. PCMark 10 Quick System Drive Benchmark is used to evaluate storage performance on both machines. On both machines a separate drive is used as the OS/boot drive, and the Samsung 980 PRO is used as a test drive, free from any OS role.

The backup page for the slide provides details of the system configurations used for both machines. What it doesn't mention, however, is whether on the AMD machine, the 980 PRO was installed on the CPU-attached M.2 NVMe slot, or one that's attached to the AMD X570 chipset. Unlike the Intel Z590, the AMD X570 puts out downstream PCI-Express 4.0, which motherboard designers can use to put out additional NVMe Gen 4 slots. On the Intel Z590 motherboard, the M.2 NVMe Gen 4 slot the drive was tested on is guaranteed to be the CPU-attached one, as the Z590 PCH puts out PCIe Gen 3 downstream lanes. A PCI-Express 4.0 x4 link is used as chipset bus on the AMD X570, offering comparable bandwidth to the DMI 3.0 x8 (PCI-Express 3.0 x8) employed on the Intel Z590. A drive capable of attaining 7 GB/s sequential transfers should be in a sub-optimal situation on a chipset-attached M.2 slot. It would be nice if Intel clears this up in an update to its backup.

Update 02:51 UTC: In response to a specific question on Twitter, on whether the drives were tested on CPU-attached M.2 slots on both platforms, Ryan Shrout stated that a PCI-Express AIC riser card was used on both platforms to ensure that the drives are CPU-attached. 11% is a significant storage performance uplift on offer.

Intel and Google Cloud today announced a collaboration to develop telco cloud reference architectures and integrated solutions for communication service providers to accelerate 5G deployment across multiple network and edge locations.

"Communications service providers can adopt cloud-native technologies to harness the potential of 5G both as a connectivity solution and as a business services platform to deliver applications to the network edge," said Shailesh Shukla, vice president and general manager of networking at Google Cloud. "Expanding on our work with the telecommunications industry, we are excited to work with Intel to help customers plan, test and deploy the technology and infrastructure needed to accelerate the delivery of cloud-native 5G for consumer and enterprise use cases."