MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

Intel's upcoming Xeon "Sapphire Rapids" enterprise processor come come with CPU core-counts as high as 80, according to the latest round of photo-leaks. An earlier article predicted the chip cram up to 56 cores alongside on-package HBM. The processor reportedly features up to 80 cores, spread across four 20-core chiplets. Unlike on the latest AMD EPYC processor, there doesn't appear to be a centralized I/O controller die. This particular processor is based in the LGA4189 package, which features additional pins compared to the LGA4577-X socket from the 56-core leak. The newer socket has additional pins that enable next-gen I/O, which include PCI-Express Gen 5.0, and CXL 1.1 interface.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

Linksys, a global leader in home and business Wi-Fi solutions, today announces the availability of the market's first Wi-Fi 6E certified systems, the Linksys Hydra Pro 6E and award-winning Linksys Atlas Max 6E. Built with Velop Intelligent Mesh and utilizing the newly opened 6GHz band, the Linksys Hydra Pro and Linksys Atlas Max expand the user's network for the fastest speeds possible to every corner of the home. Wi-Fi 6E offers the 6GHz band connection that is needed for device-heavy homes and ensures optimal performance for video conferencing, working and learning from home, as well as the latest AR and VR devices.

"Wi-Fi 6E is driving a surge in technology innovation and we're proud to deliver next-level solutions that harness 6E speeds and efficiency, coupled with built-in Velop Intelligent Mesh," says Harry Dewhirst, vice president of business development, Linksys. "As the market's first Wi-Fi 6E system certified by the Wi-Fi Alliance we remain steadfast in our commitment to provide our customers reliable, innovative and secure Wi-Fi solutions."

AAEON, an industry leader of AI and IOT solutions, is excited to celebrate the launch of Intel's latest scalable platform, the 3rd Generation Intel Xeon Scalable Processors (formerly Ice Lake-SP). As an associate member of the Intel IoT Solutions Alliance, AAEON is excited to bring this new technology to market with the ARES-WHI0 industrial ATX server board and other future products.

The 3rd Generation Intel Xeon Scalable Processors deliver the next generation of high-end computing performance and support for vital data integrity and security technologies. This new generation of Xeon SP brings higher processing speeds and Intel's Deep Learning Boost technology, allowing for greater acceleration and more efficient processing for AI server applications.

Starting today, Microsoft Defender for Endpoint expands its use of Intel Threat Detection Technology (Intel TDT) beyond accelerated memory scanning capabilities to activate central processing unit (CPU) based cryptomining machine learning (ML) detection. This move further accelerates endpoint detection and response for millions of customers without compromising experience.

"This is a true inflection point for the security industry as well as our SMB, mid-market and enterprise customers that have rapidly adopted Windows 10 with built-in endpoint protections. Customers who choose Intel vPro with the exclusive Intel Hardware Shield now gain full-stack visibility to detect threats out of the box with no need for IT configuration. The scale of this CPU-based threat detection rollout across customer systems is unmatched and helps close gaps in corporate defenses," said Michael Nordquist, senior director of Strategic Planning and Architecture in the Business Client Group at Intel.

Intel Corporation today reported first-quarter 2021 financial results. "Intel delivered strong first-quarter results driven by exceptional demand for our leadership products and outstanding execution by our team. The response to our new IDM 2.0 strategy has been extraordinary, our product roadmap is gaining momentum, and we're rapidly progressing our plans with re-invigorated focus on innovation and execution," said Pat Gelsinger, Intel CEO. "This is a pivotal year for Intel. We are setting our strategic foundation and investing to accelerate our trajectory and capitalize on the explosive growth in semiconductors that power our increasingly digital world."

First-quarter 2021 GAAP operating margin, net income, tax rate, and EPS results reflect the impact of a charge related to VLSI litigation. Intel strongly disagrees with the jury's verdict in March and intends to appeal. In the first quarter, the company generated $5.5 billion in cash from operations, paid dividends of $1.4 billion, and used $2.3 billion to repurchase stock.

AAEON, an industry leader in embedded solutions, announces the GENE-CML5 3.5" subcompact board featuring the 10th Generation Intel Core processors (formerly Comet Lake). The GENE-CML5 brings the latest in computing technology and flexibility, enabling developers to deploy their next generation industrial and AI Edge applications.

The GENE-CML5 brings the LGA1200 socket 10th Generation Intel Core i3/i5/i7 processors, as well as Intel Pentium and Celeron processors to the 3.5" subcompact form factor. Supporting processors up to 4.4 GHz CPU frequency, the GENE-CML5 leverages the socket-type chipset to allow developers and end users to easily maintain, scale, and upgrade the platform to suit their processing requirements. Combined with 64 GB DDR4 memory, the GENE-CML5 delivers fast processing speeds on par with desktop systems. Additionally, the chipset allows the compact board to take advantage of Intel vPro and Intel Active Management Technology (iAMT), enabling remote system monitoring and management.

AMD via its official YouTube channel shared a video of two of its Epyc chips destroying Cinebench's R23 benchmark, setting a new world record in the process. The record-setting feat was achieved with two off-the shelf Epyc 7763 CPUs - the ones with 64 physical CPUs and 128 threads of Zen 3 IPC. The system, which was built on top of a reference server motherboard and paired with server-grade aircooling, reached a grand total of 113,631 points - completing the benchmark run is around ten (10) measly seconds and soaring through the previous record-holder, a heavily overclocked Ryzen Threadripper 3990X (105,170 points).

The AMD system crushes the closest-priced Intel Xeon CPUs in performance - a dual Intel Xeon Platinum 8380 (Ice Lake-SP generation) configuration reached a comparably paltry 74,630 points - and AMD wins in the price-performance ratio again, with each of its Epyc 7763 CPUs costing $7,890 compared to $8,100 for each of the Intel Xeon platinum 8380. AMD's name of choice for their server-grade CPUs offering up a justification for its admittedly 15-year-old naming scheme. Catch the AMD video after the break.

Prices of retail 11th Gen Intel Core "Rocket Lake" desktop processors are beginning to settle down close to the "1,000-unit tray" prices on Amazon (US). The 1K-unit tray prices have traditionally served as a de facto baseline for retail prices, and as of today (April 16), we see several SKUs popular with gamers and PC enthusiasts approach levels close to the baseline. This wouldn't strictly be a price-cut, since they are still higher than the baseline, but would be a trimming of the retailer mark-ups traditionally attached to new processor launches.

As of this writing, the retail Core i7-11700K is listed on Amazon (US) for USD $404, practically identical to the $399 1K-unit tray price. The i7-11700 (non-K) can be had for $339.99, very close to the $323.99 tray price. The Core i5-11600K is going for $264.99, which is almost identical to the $262 tray price. Lesser "locked" SKUs such as the i5-11500 are within $10-15 of their tray pricing. It's only the top-dog Core i9-11900K and i9-11900KF that remain heavily marked up by sellers on Amazon. At these prices, the 11th Gen Core processors are expected to apply pressure on sellers of AMD Ryzen 5000 series processors to review the prices of SKUs such as the Ryzen 7 5800X and Ryzen 5 5600X; and on AMD to release cheaper Ryzen 5000 series SKUs in the retail channel.

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.Download CPU-Z Version 1.96 Here.

NVIDIA has recently announced the company's first standalone Grace CPU that will come out as a product in 2023. NVIDIA has designed Grace on Arm ISA, likely ARM v9, to represent a new way that data centers are built and deliver a whole new level of HPC and AI performance. However, the CPU competition in a data center space is considered one of the hardest markets to enter. Usually, the market is a duopoly between Intel and AMD, which supply x86 processors to server vendors. In the past few years, there have been few Arm CPUs that managed to enter the data canter space, however, NVIDIA is aiming to deliver much more performance and grab a bigger piece of the market.

As a self-proclaimed leader in AI, Intel is facing hard competition from NVIDIA in the coming years. In an interview with Fortune, Intel's new CEO Pat Gelsinger has talked about NVIDIA and how the company sees the competition between the two. Mr. Gelsinger is claiming that Intel is a leader in CPUs that feature AI acceleration built in the chip and that they are not playing defense, but rather offense against NVIDIA. You can check out the whole quote from the interview below.

Microsoft's hardware legacy stretches back more than four decades to the early days of personal computing. As Windows built and inspired new computing experiences, new Microsoft hardware accessories helped people interact with them. At this intersection of hardware and software, magical experiences are possible. This core belief is at the heart of every product we build at Microsoft, and it's especially true of our Surface products. For almost a decade, Surface has pioneered breakthrough experiences that immerse people in their creative flow, eliminating friction that often exists between people and technology.

Surface allows people to adapt to new ways of working and creating through innovative and versatile devices that offer premium design and performance, quality typing and trackpads, exceptional cameras and mics, and immersive touchscreen display technologies. From the student learning on their Surface Go or Surface Laptop Go, to the knowledge worker on their Surface Pro 7+, to the creative professional working on a Surface Book 3, these products now serve as a lifeline to connections, content and work. It's inspiring to consider all that can be achieved on a Surface.

ASUS today announced ASUS Chrome Enterprise devices, an exciting offering that combines the benefits of top-notch ASUS hardware with the business capabilities of Chrome OS. ASUS Chrome Enterprise devices are specifically built for business—enabled with Chrome Enterprise and housed in versatile, lightweight and robust ASUS Chrome devices to provide professionals with the tools they need to be effective and productive.

The lineup of ASUS Chrome Enterprise devices spans Chromebooks with clamshell and convertible designs and various form factors, as well as Chromebox models tailored to different business needs. With this offering, businesses can enjoy features such as zero-touch enrollment and Parallels Desktop for Chrome OS to optimize workflows for cloud-first devices.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

Dell's gaming subsidiary, Alienware, has launched a product designed to reintroduce products of a company that was abandoned in the laptop sector a long time ago. Alienware's last AMD-based gaming laptop made an appearance in 2007, and for 14 years there wasn't an Alienware laptop with an AMD processor inside it. For all those years, the heart of Alienware laptops was promised to Intel, however, that is no longer the case. Today, Alienware has introduced a Ryzen edition of the m15 R5 gaming laptop, powered by... you guessed it, AMD Ryzen 5000 series of mobile processors.

The new Alienware m15 R5 Ryzen Edition laptop is set to bring the balance to the force. Featuring AMD's flagship Ryzen 9 5900HX overclockable processor, the CPU is paired with NVIDIA's GeForce RTX 3070 graphics card. All of that is crammed inside a 15-inch body that offers QHD 240Hz or FHD 360Hz panels for the best possible gaming experience. For the cherry on top, the laptop offers Cherry MX keyboard switches with per-key RGB lighting. The new Ryzen edition Alienware laptop will be available for purchase in the U.S. with select configurations on April 20 starting at $1793.98. You can check out some pictures of the laptop below.More pictures follow.

In the course of our Core i5-11400F "Rocket Lake" processor review, we discovered that the Gear 2 memory mode has the potential to offer higher performance than Gear 1. The Gear 1 mode runs the memory frequency and memory controller frequency in 1:1 sync, while the Gear 2 mode runs them at 1:2, meaning that the memory controllers run at half the memory frequency, allowing you additional memory overclocking headroom. At lower, more stable, memory frequencies, it should be logical to use Gear 1. Our testing springs some surprising results.

Overall, a stock Core i5-11400F paired with DDR4-3733 MHz memory, was found to be 1.5% faster with Gear 2, when averaged across all our CPU tests, compared to Gear 1 at the same 3733 MHz frequency. Gear 2 was 3.42% faster in Cinebench R23 multi-threaded, and a staggering 6% in MySQL. Across rendering and media workloads that scale across all cores, we find Gear 2 faster by 1-3%. It's only with less parallelized workloads such as gaming, where we see Gear 2 lag behind Gear 1, though not by much. In our i5-11400F review, we show that by running your processor in Gear 2, you're making your memory controllers pull less power, freeing up power budget for the CPU cores, translating into the nT performance gains we see here. We discovered that the uncore can pull anywhere between 5 to 10 W more power in Gear 1 mode. This is valuable power eating into the already constrained power-budget of this 65 W TDP chip.

Read the Intel Core i5-11400F TechPowerUp Review

Intel today is launching its 3rd Generation Xeon Scalable processor bringing its first major IPC uplift to the enterprise space in five years. The Xeon Scalable processors are built on the 10 nm SuperFin process, and the "Ice Lake-SP" microarchitecture that bring new "Sunny Cove" CPU cores to the server space, including support for PCI-Express 4.0 I/O capabilities, a wider memory interface, and a more feature-rich AVX-512 instruction-set, along with DLBoost for HPC. join us for its launch live-blog.14:59 UTC: CEO Pat Gelsinger and Data Platforms group head Navin Shenoy are expected to take centerstage. Xeon and memory group head Lisa Spelman could announce relevant platform products. This is Gelsinger's first major launch since taking office.

15:01 UTC: What will you solve for?

Tianshu Zhixin, a Chinese startup company dedicated to designing advanced processors for accelerating various kinds of tasks, has officially entered the production of its latest GPGPU design. Called "Big Island" GPU, it is the company's entry into the GPU market, currently dominated by AMD, NVIDIA, and soon Intel. So what is so special about Tianshu Zhixin's Big Island GPU, making it so important? Firstly, it represents China's attempt of independence from the outside processor suppliers, ensuring maximum security at all times. Secondly, it is an interesting feat to enter a market that is controlled by big players and attempt to grab a piece of that cake. To be successful, the GPU needs to represent a great design.

And great it is, at least on paper. The specifications list that Big Island is currently being manufactured on TSMC's 7 nm node using CoWoS packaging technology, enabling the die to feature over 24 billion transistors. When it comes to performance, the company claims that the GPU is capable of crunching 37 TeraFLOPs of single-precision FP32 data. At FP16/BF16 half-precision, the chip is capable of outputting 147 TeraFLOPs. When it comes to integer performance, it can achieve 317, 147, and 295 TOPS in INT32, INT16, and IN8 respectively. There is no data on double-precision floating-point numbers, so the chip is optimized for single-precision workloads. There is also 32 GB of HBM2 memory present, and it has 1.2 TB of bandwidth. If we compare the chip to the competing offers like NVIDIA A100 or AMD MI100, the new Big Island GPU outperforms both at single-precision FP32 compute tasks, for which it is designed.Pictures of possible solutions follow.

Razer, the maker of various gaming peripherals and gaming PCs/Laptops, has been a long-time user of Intel CPUs in their laptops devices. However, that might be changing just about now. According to some findings by @_rogame, there was a 3D Mark benchmark run that featured AMD Ryzen 5000 series "Cezanne" mobile processors. What is more interesting is the system it was running in. Called Razer PI411, this system is officially Razer's first AMD-powered laptop. While we don't have many details about it, we have some basic system configuration details. For starters, the laptop carries AMD's top-tier Ryzen 9 5900HX overclockable mobile processor. Carrying a configured TDP of 45 Watts (the maximum is 54 W), the system is likely not equipped with sufficient cooling for overclocking.

When it comes to the rest of the laptop, it features NVIDIA's GeForce RTX 3060 GPU, 16 GB of RAM, and 512 GB of storage. Being that this laptop was codenamed PI411, it could indicate a 14-inch model. However, we still don't know if it is ever going to hit consumer shelves. Being that Razer never carried an AMD CPU option, this could just be an engineering sample that the company was experimenting with, so we have to wait to find out more.

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

Rapid evolution in AI technology is infusing IoT devices with new capabilities, leading to the new trend of AIoT. Simply speaking, IoT devices acquire data then transmit that data through the network to an integrated backend system. Typical applications include automation, remote control, and connection with other IoT devices. AIoT brings the power of AI to these IoT devices, so that machine equipment and factories can play a more active role in the process and learn intelligently. Accumulation of data, continuous learning, and data analysis can achieve failure prevention or autonomous operation to implement a fully-fledged "smart factory." The GP-3000 is Cincoze's highly-acclaimed flagship model for AI and machine vision applications, combining high-end computing performance, rich high-speed I/O, and harsh environment resilience to enable edge computing in the AIoT framework. It is the first choice for effectively implementing multiple applications on the field side, such as smart manufacturing and transportation.

The key to rapid smart manufacturing upgrades is introducing high-efficiency GPU computers as the on-site data processing center. To that end, the GP-3000 supports an Intel Xeon /Core (Coffee Lake-R & Coffee Lake) processor and sports the Intel C246 chipset, with up to two sets of DDR4-2666 ECC/non-ECC SO-DIMMs for a maximum of 64 GB of total memory. This setup provides the coveted combination of efficient processing and parallel processing. The GPU Expansion Box (GEB) supports up to two 250 W high-end full-length (≤328 mm) GPU cards to further enhance its processing capabilities. The high-speed I/O ports, with the simple addition of a camera, become the machine equipment's eyes, allowing for the quick and accurate inspection and categorization of high-definition image inputs.

XPG, a fast growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts,is pleased to announce a new Intel collaboration for a 15.6"performance EVO certified ultrabook with thin and light form factor, the XPG XENIA Xe.

With a sleek and modem design, XPG XENIA Xe is built with a premium CNC anodized aluminium chassis with an overall thickness of only 14.9 mm (0.58 in) and weight of 1.65 kg (3.6 lbs). The ultrabook sports an Intel 11th Gen Core i5-1135G7 or i7-1165G7 processor, Intel Iris Xe graphics, a low power, high brightness 1080P Full HD IPS 15.6" display with capacitive touch, as well as XPG's very own PCIe Gen 4 high speed M.2 solid state drive (SSD).

In the past few years, Intel has struggled a lot with its semiconductor manufacturing. Starting from the 10 nm fiasco, the company delayed the new node for years and years, making it seem like it is never going to get delivered. The node was believed to be so advanced that it was unexpectedly hard to manufacture, giving the company more problems. Low yields have been present for a long time, and it is only recently that Intel has started shipping its 10 nm products. However, its competitor, TSMC, has been pumping out nodes at an amazing rate. At the time of writing, the Taiwanese giant is producing the 5 nm node, with a 4 nm node on the way.

So to remain competitive, Intel would need to apply a new tactic. The company has a 7 nm node in the works for 2023 when TSMC will switch to the 3 nm+ nodes. That represents a marketing problem, where the node naming convention is making Intel inferior to its competitors. To fix that, the company will likely start node renaming and give its nodes new names, that are corresponding to the industry naming conventions. We still have no information how will the new names look like, or if Intel will do it in the first place, so take this with a grain of salt.

G.SKILL is excited to announce a series of high speed DDR4 kits for the new Intel Z590 platform. , including DDR4-5333 CL22 16 GB (8GBx2), DDR4-4800 CL17 16 GB (8GBx2), DDR4-4800 CL20 32 GB (16GBx2), and DDR4-4600 CL20 64 GB (32GBx2) under the Trident Z Royal, Trident Z RGB, and Ripjaws V series. These new DDR4 memory specifications offer a perfect choice for those pursuing extreme memory overclocking performance, building a powerful workstation, or for the ultimate gaming experience.

Ultimate Performance DDR4-5333 on the Intel Z590 Platform
Dedicated to developing ever-faster extreme overclocking memory, G.SKILL is pushing the 16 GB (8GBx2) kit capacity to a blistering speed of DDR4-5333. This demonstrates the remarkable memory overclocking support on the latest Intel Z590 platform, which has been validated on the ASUS ROG STRIX Z590-E GAMING WIFI, ASUS ROG MAXIMUS XIII APEX, and MSI MEG Z590I UNIFY motherboards with the latest Intel Core i9-11900K processor, as shown in the screenshots below: