Friday, December 23rd 2011
TSMC 18-inch Wafer Volume Production On Course for 2015
TSMC told industry observers that its plans to test large 18 inch wafers are on schedule for 2012-13, and should reach volume production in 2015. Silicon chips are manufactured on large discs known as wafers, and cut out of them. Like pizza, the sizes of wafers are measured by their diameters. The 18 inch diameter wafer has been something TSMC has been working on. Larger the wafer, the more chips can be cut out of a single wafer. It works to reduce production costs. TSMC expects to have 95% of its 18 inch wafer production equipment installed in 2014, and commence volume production by 2015. Currently, TSMC faces technical hurdles that have to be solved in collaboration with equipment and material suppliers.
Source:
DigiTimes
11 Comments on TSMC 18-inch Wafer Volume Production On Course for 2015
Especially when you can dip them in melted chocolate or have them with a huge tub of icecream....
... I'm also wondering how many chips they can get out of one of those 18" pizza pies?
Or is it just economy rule?