Thursday, April 28th 2022
AMD MI300 Compute Accelerator Allegedly Features Eight Logic Dies
AMD's next-generation MI300 compute accelerator is expected to significantly scale up the logic density, according to a rumor by Moore's Law is Dead. Based on the CDNA3 compute architecture, the MI300 will be a monstrous large multi-chip module with as many as 8 logic dies (compute dies), each with its dedicated HBM3 stack. The compute dies (logic dies), will be 3D-stacked on top of I/O dies that pack the memory controllers, and the interconnect that performs the inter-die, and inter-package communication.
The report even goes on to mention that the compute die at the top level of the stack will be built on TSMC N5 (5 nm) silicon fabrication process, while the I/O die below will be TSMC N6 (6 nm). At this point it's not known if AMD will use the package to wire the logic stacks to the memory stacks, or whether it will take the pricier route of using a silicon interposer, but the report supports the interposer theory—that an all-encompassing interposer seats all eight compute dies, all four I/O dies (each with two compute dies), and the eight HBM3 stacks. An interposer is a silicon die that facilitates high density microscopic wiring between two dies on a package, which are otherwise not possible through large package substrate wiring.
Sources:
VideoCardz, Moore's Law is Dead (YouTube)
The report even goes on to mention that the compute die at the top level of the stack will be built on TSMC N5 (5 nm) silicon fabrication process, while the I/O die below will be TSMC N6 (6 nm). At this point it's not known if AMD will use the package to wire the logic stacks to the memory stacks, or whether it will take the pricier route of using a silicon interposer, but the report supports the interposer theory—that an all-encompassing interposer seats all eight compute dies, all four I/O dies (each with two compute dies), and the eight HBM3 stacks. An interposer is a silicon die that facilitates high density microscopic wiring between two dies on a package, which are otherwise not possible through large package substrate wiring.
19 Comments on AMD MI300 Compute Accelerator Allegedly Features Eight Logic Dies
Nvidia wins the electric bill with 900W
"This peasant doesn't run 240V three phase! What a l4m3r"
*Yes, Intel has many different areas its R&D budget must be divided amongst, but I'd be willing to bet the share it allocates to x86 and GPU are larger than AMD's respective allocations. Either way, when considering what AMD is able to achieve with its comparably smaller financial resources, it's seriously impressive.
Open Delta is usually without a neutral wire, the other kind of three phase, which again is common in Europe it's in a Y configuration with a neutral wire.
Our Y config usually has a neutral connected in the center (between all phases) but it's not always necessary to included it for 3 phase loads.
So we aren't expecting 8k cores, current 250x already has more than that. We are expecting 2x-4x current cores.