Tuesday, April 25th 2023
Micron to Set up a Chip Packaging and Assembly Plant in India
Micron Technology is setting up a manufacturing facility in India at an investment of $1 billion, with the Indian Government set to clear certain approvals that incentivize its operations in the country. The plant will deal with chip packaging—the process of encasing bumped silicon chips into fiberglass or ceramic substrates, and wiring them out into pins or balls that get soldered onto PCBs. Besides packaging, the facility will be involved in testing, binning, marking, and logistical packaging of finished chips (into reels or trays). The plant could deal with the spectrum of Micron products spanning NAND flash, and various generation DRAM. The new Indian facility will join 11 manufacturing sites Micron has either operational or under-development, in countries such as Japan, Malaysia, Taiwan, Singapore, and China, besides the company's main home turf of the U.S.
Source:
Business Standard
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