Japan's Nikkan Kogyo Shimbun newspaper believes that Rapidus will be installing a grand total of ten "extreme ultraviolet (EUV) exposure tools" at two cutting-edge semiconductor production sites. Government subsidies have assisted in boosting Japan's semiconductor industry to new highs—Rapidus is reportedly catching up with the likes of TSMC. Its 2 nm-class process node could be up and running by 2027, at the currently under-construction Innovative Integration for Manufacturing One (IIM-1) facility. This location welcomed its first ASML NXE:3800E EUV lithography machine last December—this occasion marked the debut deployment of said technology in Japan.

The Nikkan Kogyo Shimbun report cites statements made by Rapidus CEO, Atsuyoshi Koike—according to the boss, ten new machines will be distributed across two fabrication facilities: at the aforementioned IIM-1, as well as IIM-2. The second location is expected to come online not long after the completion of IIM-1. It is not clear whether the foundries will be installing more examples of ASML's NXE:3800E model, and an exact timeframe was not disclosed. An older Nikkei article suggests that a trial run—utilizing 2 nm generation gate-all-around (GAA) technology—will begin around April (2025) at the primary Rapidus fab. A theorized schedule proposes that initial samples are due for shipment to Broadcom (in the USA) by mid-year.