Monday, January 21st 2008
![Intel](https://tpucdn.com/images/news/intel-v1723816949774.png)
New Intel Wolfdale Stock Cooler Pictured
The new 45nm Wolfdale Core 2 Duo E8000 CPUs have a new cooler bundled with the BOX package. As you can see below, the cooler is similar than the one found in Intel's 65nm Conroes. This move probably helps Intel trim down the manufacturing costs, but mostly comes to show one big plus of the 45nm process and that's the lower heat output.
Sources:
TechConnect Magazine, matbe
34 Comments on New Intel Wolfdale Stock Cooler Pictured
But then again if its not needed, copper is more expensive and is going up still last I knew.
also, it weighs more, so shipping a bunch at one time would cost more.
i'm always thinking...
:toast:
Not true.
There is no such thing as element-specific "heat dissipation factor".
I don't know if its anything noticeable or that really makes a decent difference, but I have read that there is a reason behind it before. Who knows.... As far as I'm concerned as long as my processor idles within 5-10 F of my room temperature I'm happy.
Aluminium 237
Copper 401
E8200 @ 4.4GHz with TRUE does 40c load :D
Heres mine:
As for the small HSF, it's to fit more applications inc sff cases. For those wishing to OC, an OEM HSF is obviously going to be better but for all other applications the std HSF is going to be fine.
Your point eludes me. :confused: Not exactly.
Thermal resistance only affects how well a given material conducts heat. It alone has no impact on how long a time it takes to heat/cool a mass of an object from AºC to BºC - atleast not for low-mass/volume objects like heatsink fins. Why do the fins stay cool? And for how long?
What you're talking about is thermal capacitance (tc). Alu has much higher tc compared to copper, but for use in electronics' heatsinks higher tc has no purpose at all as the only scenario a high tc would be beneficial would be a situation where the time heat was "injected" was non-continuous. Continuous heat loads, that for example, CPUs produce causes the aluminum fins' temperature to raise to a point where it is almost on-par to that of the copper heatpipes but due to inferior heat conductivity a tempereture gradient will form between the heatpipe-fin contact point and the far-end of the fin. An all-copper heatsink would spike the temps more quickly but it would max at a lower ºC for both the cooled chip & the heatsink itself. HS with copper base&pipes+alu fins would have a slower temperature climb but both the chip&heatsink would max a few ºC higher than the one made of copper.
Infact, a material with extremely poor heat capacity and high conductivity would be an ideal heatsink material as it would heat up quickly thus making more efficient use of it's surface area. carbon nanotubes being an example of such a material. Another ideal HS material would be the opposite: an "exotic material" with insane thermal capacity that it would just absorb all the heat injected in it thus warming up very, very slowly. By "exotic material" (with insane heat capacity) I mean that such material doesn't exist.
@ Largon thanks for taking the time to clarify for them.
The ones that come with the Yorkfield (QX 9650) are awesome in fact Mandelore could play with his QX9650 pretty well on stock-cooling.
This is the one (owner: Mandelore)
His stock-cooled OC spree
It's the high 5_00+ series that have these. Or atleast have HAD.