Responding to IBM and its development partners that took the lead in the nm battle by announcing the availability of a high-k and metal-gate 32nm offering, Taiwan Semiconductor Manufacturing (TSMC) today outlined more details about its 32nm process. Rick Tsai, president and chief executive of the company said "We will have high-k and metal-gate at 32nm," during a keynote at the 2008 Technology Symposium. Jack Sun, vice president of research and development, also indicated that TSMC will develop a third-generation triple-gate oxide technology for its 32nm low-power process. For its 32nm high-performance process, TSMC will offer a high-k and metal gate technology, Sun added.