Wednesday, August 6th 2008

Maximum PC Builds First Nehalem System

This is for all of you, who are impatiently waiting for that new CPU, the X58 boards with that new socket and that triple channel DDR3 support. Maximum PC has managed to get their hands on everything needed to build one of these systems. They give single, dual and triple channel memory setups a try as well. To top things off, they have even taken a few images. One image from Maximum PC can be seen below, but make sure to take a look at all the other ones on their site.
Source: Maximum PC
Add your own comment

57 Comments on Maximum PC Builds First Nehalem System

#1
chron
wish I worked there...

lol the last photo is amusing: "This computer seems to have Tylersburg motherboard chipset... Do you wish to create a hardware report now and submit it to Lavalys?"
Posted on Reply
#2
ShadowFold
Looks like we will need new cpu coolers, look at the huge socket!
Posted on Reply
#3
Fitseries3
Eleet Hardware Junkie
nope.... the new boards use the same heatsinks as 775.
Posted on Reply
#4
ShadowFold
fitseries3nope.... the new boards use the same heatsinks as 775.
Really? Well then the Xigamtek S1284 might work great with that huge cpu ihs then.
Posted on Reply
#5
Fitseries3
Eleet Hardware Junkie
the die of the chip is not any bigger than a 65nm die. it's just got more on it. it should run cooler too.
Posted on Reply
#6
erocker
*
The mounting holes are further apart. I just hope I can get a different bracket for my Dtek fuzion!
Maximum PCThe new LGA1366 socket is also a bit larger, of course. As such, previous LGA775 heatsinks will not be compatible with the new CPU. Some coolers may possibly be adapted to work with Bloomfield with new mounting brackets but most will need new heat sinks.
Posted on Reply
#7
WarEagleAU
Bird of Prey
Glad to see Im not the only one who reads Maximum PC!!!
Posted on Reply
#8
Darksaber
Senior Editor & Case Reviewer
WarEagleAUGlad to see Im not the only one who reads Maximum PC!!!
I read Maximum PC since Boot 02. so the second mag that came out... ;) But since I no longer live in the continental US, I only buy it when I am over there for work or fun ^^

cheers
DS
Posted on Reply
#9
Cold Storm
Battosai
No PS2 slots!?? What will the people stuck in the 90's do!? :laugh: War. You aren't the only one. Not by a long shot! :p
Posted on Reply
#10
J-Man
Looks exciting. I hope I can afford a good X58 board and a good CPU and some 4GB 1800MHZ RAM.
Posted on Reply
#11
freakshow
wow :eek: *drool

i cant wait to get one :D

*additional Comment

i hope they make an adapter for my Scythe infinity
Posted on Reply
#12
tkpenalty
fitseries3the die of the chip is not any bigger than a 65nm die. it's just got more on it. it should run cooler too.
FYI the socket/IHS IS bigger. Xiggy owners will be blessed with being able to change the bracket though :)...
Posted on Reply
#13
Fitseries3
Eleet Hardware Junkie
the socket is but the die is about the same size as a 65nm cpu. the nehalem's are 45nm though.
Posted on Reply
#14
selway89
Looks like one hell of a pincount on those bad boys. I hope this doesn't send AMD to the grave, or they can at least bring a Phenom that is just kickass at a kickass price, no doubt these will be expensive.
Posted on Reply
#15
Morgoth
Fueled by Sapphire
allmost time for my new comp ^^
Posted on Reply
#16
farlex85
Morgothallmost time for my new comp ^^
Hey morgoth or anyone else know what the oc features are that they are referring to in that article. They said intel has discussed it before but they have to keep hush hush on it for now, I'm not sure what they're talking about.
Posted on Reply
#17
Morgoth
Fueled by Sapphire
i have researched the ocing and futeres for bloomfield
i have readed that it got flexible ocing futeres
like turn 2 cores off and increas power of first 2 cores
or increas multieplyer of all 4 cores easly could hit 4ghz
also QPI can be increased
Posted on Reply
#18
CDdude55
Crazy 4 TPU!!!
I dont care for Nehalem. I just want to play games decently.
Posted on Reply
#19
farlex85
Morgothi have researched the ocing and futeres for bloomfield
i have readed that it got flexible ocing futeres
like turn 2 cores off and increas power of first 2 cores
or increas multieplyer of all 4 cores easly could hit 4ghz
also QPI can be increased
Nice, I like that idea of turning off cores. That is a great function considering many programs don't use multiple threads that well yet. That was one of the main things I was thinking may hold nehalem back until software evolves, since there isn't much in the way of raw speed advantage over core 2. But maybe that's just b/c we haven't seen how they oc yet. Very nice.
Posted on Reply
#20
Morgoth
Fueled by Sapphire
CDdude55I dont care for Nehalem. I just want to play games decently.
you sould buy games that your comp can handel if you dont care abouth more advanced technology
Posted on Reply
#21
Cold Storm
Battosai
And the G*D of the Nehalem comes in.. Morgoth, I am waiting for that thread of yours! I bet the first 10 posts will just be yours! :rockout:
Posted on Reply
#22
CDdude55
Crazy 4 TPU!!!
Morgothyou sould buy games that your comp can handel if you dont care abouth more advanced technology
Ya, I really dont need Nehalem to runs the new games. I can just pick up a good LGA 775 CPU and be able to run games like Far Cry 2 and Project Origin , HL2:EP3. Nehalem should be a decent increase in performance but its not enough to change my mobo. I like that technology is moving forward, but i personally dont need the absolute best of whats out. As long as my CPU can play the games that are coming out, i will be fine.:)
Posted on Reply
#23
HTC
fitseries3the die of the chip is not any bigger than a 65nm die. it's just got more on it. it should run cooler too.
It's bigger, dude:



Also, the pin count is almost double: 775 VS 1366.
Posted on Reply
#24
Fitseries3
Eleet Hardware Junkie
HTCIt's bigger, dude:



Also, the pin count is almost double: 775 VS 1366.
omg... THE DIE OF THE CHIP. NOT the whole chip. the DIE. the DIE is covered by the IHS so no one can see it to prove or disprove me wrong or right.

its totally obvious that the whole chip is bigger and so is the socket.

from what i've read intel is trying to use the same hole pattern as the 775 uses. MAYBE that has changed.

im not trying to be mean but like 3-4 people have misunderstood me now. im JUST clarifying what i meant.
Posted on Reply
#25
HTC
fitseries3omg... THE DIE OF THE CHIP. NOT the whole chip. the DIE. the DIE is covered by the IHS so no one can see it to prove or disprove me wrong or right.

its totally obvious that the whole chip is bigger and so is the socket.

from what i've read intel is trying to use the same hole pattern as the 775 uses. MAYBE that has changed.

im not trying to be mean but like 3-4 people have misunderstood me now. im JUST clarifying what i meant.
Sorry, dude: i miss understood you :(

As for the hole pattern, since in the LGA775 its so much bigger then the actual socket, it would stand to reason that it would be compatible with the Nehalem socket, despite it being quite a bit bigger: my guess is the Motherboard makers will have the final say about this.
Posted on Reply
Add your own comment
Nov 27th, 2024 19:28 EST change timezone

New Forum Posts

Popular Reviews

Controversial News Posts