Our Computex 2025 coverage continues as the team heads over to the TRYX booth, checking out the latest cooling and PC enclosures the manufacturer has prepared. First up was the updated STAGE cooler. Instead of hiding under a plain cover, it features two 4-inch concave displays and a mirrored base that turns your CPU pump into a mini 3D performance arena. You can showcase animated logos, system stats or your own artwork right on the cooler. Early hands-on tests showed smooth animations and excellent cooling, even when running intense workloads. Coming with an MSRP of $199.99, it will be available by end of September.

The fight continues in Capcom Fighting Collection 2, packed with 8 iconic fighting games from across Capcom's history! Get ready to battle now! From beloved crossovers to 3D fighters, 8 classics return to pack a real punch! Fight as one of many colorful characters from the Capcom vs SNK series, cross fists with the extensive roster of the final installment of Street Fighter Alpha, make the world your weapon in the Power Stone series, and experience the thrilling story and intense action of Project Justice and Plasma Sword: Nightmare of Bilstein.

All games will feature online play and rollback netcode! Get a great deal with Capcom Fighting Collection 1 & 2 Bundle available now (on Steam)! Featuring 18 iconic games including games from the Street Fighter and the Darkstalkers series, the fighting action is endless! To celebrate the launch of Capcom Fighting Collection 2 we're giving away free player profile cards as a gift! Use one of 18 designs and post it on Twitter/X with the hashtag #MyCFC2Card to find new friends to play with!

At the recent AI Semiconductor Forum in Seoul, Samsung Electronics revealed that it will adopt hybrid bonding in its upcoming HBM4 memory stacks. This decision is intended to reduce thermal resistance and enable an ultra‑wide memory interface, qualities that become ever more critical as artificial intelligence and high‑performance computing applications demand greater bandwidth and efficiency. Unlike current stacking methods that join DRAM dies with tiny solder microbumps and underfill materials, hybrid bonding bonds copper‑to‑copper and oxide‑to‑oxide surfaces directly, resulting in thinner, more thermally efficient 3D assemblies. High‑bandwidth memory works by stacking multiple DRAM dies on top of a base logic die, with through‑silicon vias carrying signals vertically through each layer. Traditionally, microbumps routed horizontal connections between dies, but as data rates increase and stack heights grow, these bumps introduce significant electrical and thermal limitations.

Hybrid bonding addresses those issues by allowing interconnect pitches below 10 micrometers, which lowers both resistance and capacitance and improves overall signal integrity. SK hynix has taken a different path. The company is enhancing its molded reflow underfill (MR‑MUF) process to produce 16‑Hi HBM4 stacks that comply with JEDEC's maximum height requirement of 775 micrometers. The company believes that if its advanced MR‑MUF technique can achieve performance on par with hybrid bonding, they will avoid the substantial capital investment needed for the specialized equipment that true 3D copper bonding requires. The cost and space demands of hybrid bonding equipment are significant. Specialized lithography and alignment tools occupy more clean‑room real estate, increasing capital expenditures. Samsung may mitigate some of these costs through Semes, its in‑house equipment subsidiary, but it remains uncertain whether Semes can deliver production‑ready hybrid bonding systems in time for mass production. If Samsung successfully qualifies its HBM4 stacks using hybrid bonding, which it plans to begin manufacturing in 2026, the company could gain a competitive edge over Micron and SK hynix.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family—the industry-first 1T1C- and 3T0C-based 3D X-DRAM cell, a transformative solution designed to deliver unprecedented density, power efficiency, and scalability for the most demanding data applications.

Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND, enabling cost-effective, high-yield production with densities up to 512 Gb—a 10x improvement over conventional DRAM.
"With the introduction of the 1T1C and 3T0C 3D X-DRAM, we are redefining what's possible in memory technology," said Andy Hsu, Founder & CEO of NEO Semiconductor. "This innovation pushes past the scaling limitations of today's DRAM and positions NEO as a frontrunner in next-generation memory."

AI-powered image generation has progressed at a remarkable pace—from early examples of models creating images of humans with too many fingers to now producing strikingly photorealistic visuals. Even with such leaps, one challenge remains: achieving creative control. Creating scenes using text has gotten easier, no longer requiring complex descriptions—and models have improved alignment to prompts. But describing finer details like composition, camera angles and object placement with text alone is hard, and making adjustments is even more complex.

Advanced workflows using ControlNets—tools that enhance image generation by providing greater control over the output—offer solutions, but their setup complexity limits broader accessibility. To help overcome these challenges and fast-track access to advanced AI capabilities, NVIDIA at the CES trade show earlier this year announced the NVIDIA AI Blueprint for 3D-guided generative AI for RTX PCs. This sample workflow includes everything needed to start generating images with full composition control. Users can download the new Blueprint today.

TSMC today unveiled its next cutting-edge logic process technology, A14, at the Company's North America Technology Symposium. Representing a significant advancement from TSMC's industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company's experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.

Welcome to the last full week of April and this week we have a packed week of new games, especially if you're into various types of RPG games. This week's major release is a RPG that takes place in a Belle Époque inspired world. This is followed by a more traditional RPG game with swords and dragons, a horror survival game, a futuristic RPG with mechs, some classic RTS action with a familiar vibe and finally a Lovecraft inspired horror adventure. There are loads of other games launching this week as well, so check them out at the bottom of the list.

Clair Obscur: Expedition 33 / This week's major release / Thursday 24 April
Explore an enchanting realm populated by surreal adversaries. Wander through breathtaking landscapes, from the Island of Visages to the Forgotten Battlefield, discovering secrets and hidden quests along the way. Find allies of fortune in creatures of legend. Recruit special companions to access new travel methods and discover secret areas in the World Map. Steam link

Fireshine Games is delighted to introduce Duskfade, an all-new 3D action-platformer inspired by classic platformers of times gone by, coming to the PlayStation 5 (PS5) system, Xbox Series X|S, and PC in 2026.

Embark on an unforgettable adventure as Zirian, a young workshop apprentice, as he sets out to restore time itself in a world enshrouded by eternal night. Shatter the shackles of time as you jump, swing, and slash through a vibrant clockpunk world, blending nostalgia with modern gameplay in this timeless love letter to action-platformer classics.

Samsung Electronics America today announced its plans to strengthen its presence in the U.S. gaming industry with the upcoming release of its latest gaming monitor, Odyssey 3D. From March 24-28, Samsung hosted "eXperience 2025," an exclusive event for key North American customers at Fairmont Austin in Texas. This year, the event brought together nearly 600 major clients, including MicroCenter, Best Buy, Amazon and Walmart.

The event served as a platform for Samsung to unveil its newest gaming monitor lineups in front of customers, including its 2025 flagship products—Odyssey 3D (G90XF), Odyssey OLED G8 (G81SF) and Odyssey G9 (G91F) models.

My name is Patrick, and I am the Art Director for Zockrates Laboratories, the indie studio currently developing Ruffy and the Riverside. Together with our publisher, Phiphen Games, we are proud to announce that Ruffy and the Riverside will be released on PlayStation 5 on June 26, 2025. We are happy to contribute to Playstation's tradition of representing innovative and unique gameplay.

A platformer adventure with unique gameplay
Ruffy and the Riverside is a platformer adventure with truly unique gameplay. When Ruffy isn't jumping, running, skating, or gliding, he is using his unique Swap ability. With the Swap, you can copy and paste textures to change the game world, solve puzzles, beat enemies, and eventually save the world. Just grab a texture and throw it somewhere else, and the world will change! It is as easy as it sounds and has huge impacts: Transform water into ice to cross an ocean. Throw a climbing vine onto a waterfall, and you can climb up. With the Swap, you can exchange materials, symbols, the sun for the moon, and all colors. If you color birds the same color, they might end up as a couple. Apples are more yummy when they are red, and some bushes will drop coins if they have a golden look. Of course, the Swap can help in combat, too. Why not freeze an enemy or catch him in flight by turning him into stone? The elements are on your side if you swap them wisely. Use your imagination and make it happen. It really feels magic to swap things.

Remastered, remade, remixed, this is the definitive version of Yooka-Laylee! With shiny, new 4K graphics and visual effects, a brand-new control scheme, entirely new moves and the ability to swiftly chain moves together, it's a quicker, slicker platforming experience. Yooka-Replaylee builds on our nearing 10 years of growth and experience since making Yooka-Laylee, as well as taking on board a whole bunch of community feedback over the years. It's jam-packed with brand new content that we think platforming fans new and old will love! Each world in Yooka-Replaylee has been expanded by default, no longer requiring players to do that themselves, giving us the opportunity to fill each world with new challenges, new collectibles, and new THINGS added to every corner!

Quills!
Quills have new purpose in Yooka-Replaylee! Now, each world has its own Quill colour, and with all of Yooka & Laylee's abilities now unlocked from the start, Trowzer has had to up his game and provide some new goodies! Quills can be traded to Trowzer for things like level exclusive cosmetic items and health/energy upgrades!

AMD's next-generation Zen 6-based "Medusa Point" mobile APUs will not feature RDNA 4 graphics as previously speculated, according to recent code discoveries in AMD GPUOpen Drivers on GitHub. The Device ID "GfxIp12" associated with RDNA 4 architecture has been reserved only for discrete GPUs, confirming that the current Radeon RX 9000 series will exclusively implement AMD's latest graphics architecture. Current technical documentation indicates AMD will instead extend RDNA 3.5 implementation beyond the Zen 5 portfolio while potentially positioning UDNA as the successor technology for integrated graphics.

The chiplet-based Medusa Point design will reportedly pair a single 12-core Zen 6 CCD manufactured on TSMC's 3 nm-class node with a mobile client I/O die likely built on N4P. This arrangement is significantly different from current monolithic mobile solutions. Earlier speculation indicates the Medusa Point platform may support 3D V-Cache variants, leveraging the same vertical stacking methodology employed in current Zen 5 implementations. The mobile processor's memory controllers and neural processing unit are expected to receive substantial updates. However, compatibility limitations with AMD's latest graphics features, like FSR 4 technology, remain a concern due to the absence of RDNA 4 silicon. The Zen 6-powered Medusa Point processor family is scheduled for release in 2026, targeting premium mobile computing applications with a performance profile that builds upon AMD's current Strix Halo positioning.

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it offers a new 3D Hall-effect sensor technology that can measure speed and direction through three-dimensional magnetic field detection for its foundry customers.

The Hall-effect sensor is a device that measures the strength of a magnetic field using the Hall-effect, which detects the voltage difference generated when a conductor or semiconductor passes through a magnetic field. The measured magnetic field is utilized in applications that leverage the position, speed, rotation, direction, and current of devices.

Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8 Gb/s NAND interface speed, superior power efficiency, and heightened density

Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies' revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

The days of 32-bit software support in NVIDIA's drivers are coming to an end, and with that, so does the support for the once iconic PhysX real-time physics engine. According to NVIDIA's engineers on GeForce forums, the lack of PhysX support has been quietly acknowledged, as NVIDIA's latest GeForce RTX 50 series of GPUs are phasing out support for 32-bit CUDA software, slowly transitioning the gaming world to the 64-bit software entirely. While older NVIDIA GPUs from the Maxwell through Ada generations will maintain 32-bit CUDA support, this update breaks backward compatibility for physics acceleration in legacy PC games on new GPUs. Users running these titles on RTX 50 series cards may need to rely on CPU-based PhysX processing, which could result in suboptimal performance compared to previous GPU generations.

A Reddit user reported frame rates dropping below 60 FPS in Borderlands 2 while using basic game mechanics with a 9800X3D CPU and RTX 5090 GPU, all because 32-bit CUDA application support on Blackwell architecture is depreciated. When another user booted up a 64-bit PhysX application, Batman Arkham Knight, PhysX worked perfectly, as expected. It is just that a massive list of older games, which gamers would sometimes prefer to play, is now running a lot slower on the most powerful consumer GPU due to the phase-out of 32-bit CUDA app support.

French indie developer Exalted Studio and independent publisher Dear Villagers are proud to announce that Big Helmet Heroes (trailer, website, press kit), the zany 3D beat'em up that combines charismatic heroes with unique powers, exhilarating action and beautifully detailed animations is now available on PC (Steam, EGS), Nintendo Switch, PlayStation 5 and Xbox Series X/S.

The game is available at the price of 24,99 USD for the base edition on all platforms, and 29,99 USD for the Exalted Edition (includes an art book and the OST) on Steam, Epic Games Store, Nintendo Switch and PlayStation 5.

Clear River Games, a video game publisher specialising in classic and retro games, in conjunction with Japanese publisher and developer City Connection, announced today that celebrated arcade shooter Under Defeat is now available on PC, PS4, PS5, Xbox, and Nintendo Switch.

The ultimate version of the classic arcade shooter. Under Defeat has been developed by retro port specialists City Connection, and includes DLC content previously only available in Japan. Alongside an 'Arcade Mode' that faithfully replicates the original arcade experience, a fresh 'New Order Mode' adapts the game for modern displays, while 'New Order Mode+' brings brand new elements to the game, including a 'WARNING GAUGE', which mixes up the classic shooter formula.

Samsung Electronics today announced a partnership with game developers Nexon Korea and Neople to deliver unparalleled 3D experiences in the upcoming game 'The First Berserker: Khazan.' The game's 3D elements are being specially customized and designed during development, utilizing Samsung technology and the advanced capabilities of the Odyssey 3D monitor to create an immersive 3D gaming experience.

Through this partnership, Nexon, Neople and Samsung have been working closely to tailor the 3D visuals, carefully adjusting them based on the composition of characters, backgrounds and cinematics throughout the game. This process gives the developers an unprecedented level of control over the 3D effects, enabling them to bring their creative visions to life with precision.

Welcome to the middle of January and a busy week of new game releases. We kick off this week with some driving, on tracks though, as these cars might not be entirely road legal. If cars aren't your thing, then how about a city builder, but in the sky? If that doesn't tickle your fancy, how about a unique looking ARPG? This is followed by something of a PC clone of recent Zelda games, just without any defined goals. This brings us a futuristic side scroller where you fight demons. We round off the week with some Chinese hack and slash action back in the feudal era.

Assetto Corsa EVO / This week's major release / Thursday 16 January
As with its predecessor, Assetto Corsa EVO will include cars from different classes spanning across years of motoring history. From road cars, classics, hypercars, and race cars. The most iconic representation of the automotive and motorsport world. Each vehicle is reproduced through an advanced system that simulates mechanical, electronic, and aerodynamic performance, combined with the fidelity of the circuits created using Laserscan technology. Steam link

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the CH351—a wireless gaming headset that redefines immersive audio. With built-in 3D surround sound, the CH351 is designed to deliver dynamic audio. Whether you're gaming, working, watching movies or listening to music, the CH351 offers seamless connectivity and rich sound, elevating your experience to a new level.

Key features and benefits of the CH351 include:

• Versatile connectivity: Switch between Bluetooth, 2.4 GHz wireless, and 3.5 mm wired connections for the ultimate flexibility.
• Smart, seamless Bluetooth: Seamless pairing with up to three devices, effortlessly switchable with the push of a button.
• Clear voice chat: Unidirectional microphone minimizes background noise, sidetone confirms your voice is clear.
• Ergonomic design: A Y-frame design minimizes sound leakage while providing all-day comfort.
• Range and power: With up to 30 hours of battery life and a 20-meter range in 2.4 GHz mode, the CH351 ensures uninterrupted use whether you're at your desk or on the move.

With two colorways, black and macaron, the CH351 is the ultimate choice for anyone who wants a clear sound experience in a sleek and stylish package.

An SSD from Chinese manufacturer Zhitai has demonstrated impressive performance metrics, reaching sequential read speeds of up to 14.5 GB/s. Under the hood, the TiPro9000 2 TB SSD combines domestic YMTC 5th Generation 3D TLC NAND technology with Silicon Motion's SM2508 controller. The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4.0 architecture. While initial testing revealed peak sequential read and write speeds of 14,527 MB/s and 13,869 MB/s respectively, these rates are sustained through the SLC cache for approximately 24 seconds. Performance testing showed distinct operational phases. After the initial burst speed period, transfer rates stabilize at around 4,000 MB/s for 325 seconds before dropping to 1,700-1,800 MB/s. The drive then demonstrates recovery capabilities, returning to 4,000 MB/s after 259 seconds.

Random performance specifications are equally impressive, with the manufacturer claiming up to 2 million IOPS for reads and 1.6 million IOPS for writes. The TiPro9000's performance metrics position it competitively among top-tier PCIe 5.0 x4 drives. This shows the capabilities of Chinese-manufactured YMTC NAND memory technology paired with Silicon Motion's controller expertise, putting a lot of faith in China-made NAND Flash. With growing needs for AI and big data applications, performant storage systems are becoming key to many systems. However, Chinese companies still need a solid (pun intended) controller to compete with Western technology to complete storage manufacturing. Alibaba is working on a RISC-V-based controller, while InnoGrit has also been sampling controllers. We have yet to see commercial applications based on these two.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, proposes a novel 3D integrated charge-coupled device (CCD) that can operate as a block-addressable buffer memory, in support of data-intensive compute applications. Memory operation is demonstrated on a planar proof-of-concept CCD structure which can store 142 bits. Implementing an oxide semiconductor channel material (such as IGZO) ensures sufficiently long retention time and enables 3D integration in a cost-efficient, 3D NAND-like architecture. Imec expects the 3D CCD memory density to scale far beyond the DRAM limit.

The recent introduction of the compute express link (CXL) memory interface provides opportunities for new memories to complement DRAM in data-intensive compute applications like AI and ML. One example is the CXL type-3 buffer memory, envisioned as an off-chip pool of memories that 'feeds' the various processor cores with large data blocks via a high-bandwidth CXL switch. This class of memories meets different specifications than byte-addressable DRAM, which increasingly struggles to maintain the cost-per-bit-trend scaling line.

Hyper Light Breaker, the sequel to the massively popular indie hit, Hyper Light Drifter, is set to release on Steam on January 15, 2025. The only catch is that the game will release into early access, meaning it will likely change significantly during its first year on the market. At launch, Hyper Light Breaker will cost $29.99.

While Hyper Light Breaker shares a name with and hits a lot of the same aesthetic notes as Hyper Light Drifter, it isn't exactly a sequel in the classical sense. Hyper Light Breaker is set "decades before" the events of Hyper Light Drifter, and the aesthetic looks like an upgraded version of the hyper stylized 3D graphics we saw from Heart Machine in Solar Ash, as opposed to the top-down 2D pixel art of Hyper Light Drifter. Unlike Solar Ash, though, the core gameplay loop will rely on rogue-lite mechanics and hack and slash combat, making it a unique entry in the Hyper Light universe. Additionally, Hyper Light Breaker will be a co-op game, with support for up to three players in a squad.

During the prestigious IEDM 2024 conference, NVIDIA presented its vision for the future AI accelerator design, which the company plans to chase after in future accelerator iterations. Currently, the limits of chip packaging and silicon innovation are being stretched. However, future AI accelerators might need some additional verticals to gain the required performance improvement. The proposed design at IEDM 24 introduces silicon photonics (SiPh) at the center stage. NVIDIA's architecture calls for 12 SiPh connections for intrachip and interchip connections, with three connections per GPU tile across four GPU tiles per tier. This marks a significant departure from traditional interconnect technologies, which in the past have been limited by the natural properties of copper.

Perhaps the most striking aspect of NVIDIA's vision is the introduction of so-called "GPU tiers"—a novel approach that appears to stack GPU components vertically. This is complemented by an advanced 3D stacked DRAM configuration featuring six memory units per tile, enabling fine-grained memory access and substantially improved bandwidth. This stacked DRAM would have a direct electrical connection to the GPU tiles, mimicking the AMD 3D V-Cache on a larger scale. However, the timeline for implementation reflects the significant technological hurdles that must be overcome. The scale-up of silicon photonics manufacturing presents a particular challenge, with NVIDIA requiring the capacity to produce over one million SiPh connections monthly to make the design commercially viable. NVIDIA has invested in Lightmatter, which builds photonic packages for scaling the compute, so some form of its technology could end up in future NVIDIA accelerators