Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8 Gb/s NAND interface speed, superior power efficiency, and heightened density

Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies' revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

The days of 32-bit software support in NVIDIA's drivers are coming to an end, and with that, so does the support for the once iconic PhysX real-time physics engine. According to NVIDIA's engineers on GeForce forums, the lack of PhysX support has been quietly acknowledged, as NVIDIA's latest GeForce RTX 50 series of GPUs are phasing out support for 32-bit CUDA software, slowly transitioning the gaming world to the 64-bit software entirely. While older NVIDIA GPUs from the Maxwell through Ada generations will maintain 32-bit CUDA support, this update breaks backward compatibility for physics acceleration in legacy PC games on new GPUs. Users running these titles on RTX 50 series cards may need to rely on CPU-based PhysX processing, which could result in suboptimal performance compared to previous GPU generations.

A Reddit user reported frame rates dropping below 60 FPS in Borderlands 2 while using basic game mechanics with a 9800X3D CPU and RTX 5090 GPU, all because 32-bit CUDA application support on Blackwell architecture is depreciated. When another user booted up a 64-bit PhysX application, Batman Arkham Knight, PhysX worked perfectly, as expected. It is just that a massive list of older games, which gamers would sometimes prefer to play, is now running a lot slower on the most powerful consumer GPU due to the phase-out of 32-bit CUDA app support.

French indie developer Exalted Studio and independent publisher Dear Villagers are proud to announce that Big Helmet Heroes (trailer, website, press kit), the zany 3D beat'em up that combines charismatic heroes with unique powers, exhilarating action and beautifully detailed animations is now available on PC (Steam, EGS), Nintendo Switch, PlayStation 5 and Xbox Series X/S.

The game is available at the price of 24,99 USD for the base edition on all platforms, and 29,99 USD for the Exalted Edition (includes an art book and the OST) on Steam, Epic Games Store, Nintendo Switch and PlayStation 5.

Clear River Games, a video game publisher specialising in classic and retro games, in conjunction with Japanese publisher and developer City Connection, announced today that celebrated arcade shooter Under Defeat is now available on PC, PS4, PS5, Xbox, and Nintendo Switch.

The ultimate version of the classic arcade shooter. Under Defeat has been developed by retro port specialists City Connection, and includes DLC content previously only available in Japan. Alongside an 'Arcade Mode' that faithfully replicates the original arcade experience, a fresh 'New Order Mode' adapts the game for modern displays, while 'New Order Mode+' brings brand new elements to the game, including a 'WARNING GAUGE', which mixes up the classic shooter formula.

Samsung Electronics today announced a partnership with game developers Nexon Korea and Neople to deliver unparalleled 3D experiences in the upcoming game 'The First Berserker: Khazan.' The game's 3D elements are being specially customized and designed during development, utilizing Samsung technology and the advanced capabilities of the Odyssey 3D monitor to create an immersive 3D gaming experience.

Through this partnership, Nexon, Neople and Samsung have been working closely to tailor the 3D visuals, carefully adjusting them based on the composition of characters, backgrounds and cinematics throughout the game. This process gives the developers an unprecedented level of control over the 3D effects, enabling them to bring their creative visions to life with precision.

Welcome to the middle of January and a busy week of new game releases. We kick off this week with some driving, on tracks though, as these cars might not be entirely road legal. If cars aren't your thing, then how about a city builder, but in the sky? If that doesn't tickle your fancy, how about a unique looking ARPG? This is followed by something of a PC clone of recent Zelda games, just without any defined goals. This brings us a futuristic side scroller where you fight demons. We round off the week with some Chinese hack and slash action back in the feudal era.

Assetto Corsa EVO / This week's major release / Thursday 16 January
As with its predecessor, Assetto Corsa EVO will include cars from different classes spanning across years of motoring history. From road cars, classics, hypercars, and race cars. The most iconic representation of the automotive and motorsport world. Each vehicle is reproduced through an advanced system that simulates mechanical, electronic, and aerodynamic performance, combined with the fidelity of the circuits created using Laserscan technology. Steam link

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the CH351—a wireless gaming headset that redefines immersive audio. With built-in 3D surround sound, the CH351 is designed to deliver dynamic audio. Whether you're gaming, working, watching movies or listening to music, the CH351 offers seamless connectivity and rich sound, elevating your experience to a new level.

Key features and benefits of the CH351 include:

• Versatile connectivity: Switch between Bluetooth, 2.4 GHz wireless, and 3.5 mm wired connections for the ultimate flexibility.
• Smart, seamless Bluetooth: Seamless pairing with up to three devices, effortlessly switchable with the push of a button.
• Clear voice chat: Unidirectional microphone minimizes background noise, sidetone confirms your voice is clear.
• Ergonomic design: A Y-frame design minimizes sound leakage while providing all-day comfort.
• Range and power: With up to 30 hours of battery life and a 20-meter range in 2.4 GHz mode, the CH351 ensures uninterrupted use whether you're at your desk or on the move.

With two colorways, black and macaron, the CH351 is the ultimate choice for anyone who wants a clear sound experience in a sleek and stylish package.

An SSD from Chinese manufacturer Zhitai has demonstrated impressive performance metrics, reaching sequential read speeds of up to 14.5 GB/s. Under the hood, the TiPro9000 2 TB SSD combines domestic YMTC 5th Generation 3D TLC NAND technology with Silicon Motion's SM2508 controller. The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4.0 architecture. While initial testing revealed peak sequential read and write speeds of 14,527 MB/s and 13,869 MB/s respectively, these rates are sustained through the SLC cache for approximately 24 seconds. Performance testing showed distinct operational phases. After the initial burst speed period, transfer rates stabilize at around 4,000 MB/s for 325 seconds before dropping to 1,700-1,800 MB/s. The drive then demonstrates recovery capabilities, returning to 4,000 MB/s after 259 seconds.

Random performance specifications are equally impressive, with the manufacturer claiming up to 2 million IOPS for reads and 1.6 million IOPS for writes. The TiPro9000's performance metrics position it competitively among top-tier PCIe 5.0 x4 drives. This shows the capabilities of Chinese-manufactured YMTC NAND memory technology paired with Silicon Motion's controller expertise, putting a lot of faith in China-made NAND Flash. With growing needs for AI and big data applications, performant storage systems are becoming key to many systems. However, Chinese companies still need a solid (pun intended) controller to compete with Western technology to complete storage manufacturing. Alibaba is working on a RISC-V-based controller, while InnoGrit has also been sampling controllers. We have yet to see commercial applications based on these two.

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, proposes a novel 3D integrated charge-coupled device (CCD) that can operate as a block-addressable buffer memory, in support of data-intensive compute applications. Memory operation is demonstrated on a planar proof-of-concept CCD structure which can store 142 bits. Implementing an oxide semiconductor channel material (such as IGZO) ensures sufficiently long retention time and enables 3D integration in a cost-efficient, 3D NAND-like architecture. Imec expects the 3D CCD memory density to scale far beyond the DRAM limit.

The recent introduction of the compute express link (CXL) memory interface provides opportunities for new memories to complement DRAM in data-intensive compute applications like AI and ML. One example is the CXL type-3 buffer memory, envisioned as an off-chip pool of memories that 'feeds' the various processor cores with large data blocks via a high-bandwidth CXL switch. This class of memories meets different specifications than byte-addressable DRAM, which increasingly struggles to maintain the cost-per-bit-trend scaling line.

Hyper Light Breaker, the sequel to the massively popular indie hit, Hyper Light Drifter, is set to release on Steam on January 15, 2025. The only catch is that the game will release into early access, meaning it will likely change significantly during its first year on the market. At launch, Hyper Light Breaker will cost $29.99.

While Hyper Light Breaker shares a name with and hits a lot of the same aesthetic notes as Hyper Light Drifter, it isn't exactly a sequel in the classical sense. Hyper Light Breaker is set "decades before" the events of Hyper Light Drifter, and the aesthetic looks like an upgraded version of the hyper stylized 3D graphics we saw from Heart Machine in Solar Ash, as opposed to the top-down 2D pixel art of Hyper Light Drifter. Unlike Solar Ash, though, the core gameplay loop will rely on rogue-lite mechanics and hack and slash combat, making it a unique entry in the Hyper Light universe. Additionally, Hyper Light Breaker will be a co-op game, with support for up to three players in a squad.

During the prestigious IEDM 2024 conference, NVIDIA presented its vision for the future AI accelerator design, which the company plans to chase after in future accelerator iterations. Currently, the limits of chip packaging and silicon innovation are being stretched. However, future AI accelerators might need some additional verticals to gain the required performance improvement. The proposed design at IEDM 24 introduces silicon photonics (SiPh) at the center stage. NVIDIA's architecture calls for 12 SiPh connections for intrachip and interchip connections, with three connections per GPU tile across four GPU tiles per tier. This marks a significant departure from traditional interconnect technologies, which in the past have been limited by the natural properties of copper.

Perhaps the most striking aspect of NVIDIA's vision is the introduction of so-called "GPU tiers"—a novel approach that appears to stack GPU components vertically. This is complemented by an advanced 3D stacked DRAM configuration featuring six memory units per tile, enabling fine-grained memory access and substantially improved bandwidth. This stacked DRAM would have a direct electrical connection to the GPU tiles, mimicking the AMD 3D V-Cache on a larger scale. However, the timeline for implementation reflects the significant technological hurdles that must be overcome. The scale-up of silicon photonics manufacturing presents a particular challenge, with NVIDIA requiring the capacity to produce over one million SiPh connections monthly to make the design commercially viable. NVIDIA has invested in Lightmatter, which builds photonic packages for scaling the compute, so some form of its technology could end up in future NVIDIA accelerators

Sony Electronics is setting a new benchmark for immersive 3D experiences with its cutting-edge ELF-SR2 (27-inch) and ELF-SR1 (15.6-inch) Spatial Reality Displays and the NVIDIA Omniverse development platform. The combination of Sony's unmatched 3D display technology and Omniverse's powerful real-time 3D design and simulation capabilities is poised to revolutionize industries from gaming and entertainment to architecture, engineering, and automotive design—without the need for VR headsets or special glasses.

With Sony's Spatial Reality Display and the new NVIDIA Omniverse, creators can now experience real-time rendering like never before. NVIDIA Omniverse is a platform of application programming interfaces, software development kits, and services that enable developers to seamlessly combine Universal Scene Description (OpenUSD) and NVIDIA RTX rendering technologies into existing software tools. By connecting OpenUSD-based applications developed on NVIDIA Omniverse with Sony's Spatial Reality Display, creators can instantly view and manipulate their 3D assets in real time. This allows creators to turn their digital designs into holographic-like experiences, giving them the freedom to explore all aspects of their work from every angle, no extra hardware required.

The Khronos Group, an open consortium of industry leaders in interoperability standards, has announced the launch of the new Slang Initiative. This initiative will oversee and advance the open-source Slang shading language and compiler, building on 15 years of research, development, and deployment experience. Supported by NVIDIA since 2017, Slang has been widely adopted in production projects across the industry.

Slang empowers real-time graphics developers with innovative features that complement existing shading languages, including modular code development, portable deployment to multiple target APIs, and neural computation in graphics shaders. Hosting under multi-company governance at Khronos will enable and foster industry-wide collaboration to drive Slang's continued evolution.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

Samsung is currently mass-producing its 9th generation V-NAND flash memory chips with 286 layers unveiled this April. According to the Korean Economic Daily, the company targets V-NAND memory chips with at least 400 stacked layers by 2026. In 2013, Samsung became the first company to introduce V-NAND chips with vertically stacked memory cells to maximize capacity. However, stacking beyond 300 levels proved to be a real challenge with the memory chips getting frequently damaged. To address this problem, Samsung is reportedly developing an improved 10th-generation V-NAND that is going to use the Bonding Vertical (BV) NAND technology. The idea is to manufacture the storage and peripheral circuits on separate layers before bonding them vertically. This is a major shift from the current Co-Packaged (CoP) technology. Samsung stated that the new method will increase the density of bits per unit area by 1.6 times (60%), thus leading to increased data speeds.

Samsung's roadmap is truly ambitious, with plans to launch the 11th generation of NAND in 2027 with an estimated 50% improvement in I/O rates, followed by 1,000-layer NAND chips by 2030. Its competitor, SK hynix, is also working on 400-layer NAND aiming to have the technology ready for mass production by the end of 2025, as we previously mentioned in August. Samsung, the current HBM market leader with a 36.9% market share have also plans for its DRAM sector intending to introduce the sixth-generation 10 nm DRAM, or 1c DRAM by the first half of 2025. Then we can expect to see Samsung's seventh-generation 1d nm (still on 10 nm) in 2026, and by 2027 the company hopes to release its first generation sub-10 nm DRAM, or 0a DRAM memory that will use a Vertical Channel Transistor (VCT) 3D structure similar to what NAND flash utilizes.

Motion Twin, of Dead Cells fame, has announced the early access release date for its next roguelite, Windblown, which looks to be a much more cheerful affair than the grim-dark Dead Cells, and it's designed for multiplayer, too. Windblown will feature many of the same gameplay elements as Dead Cells, though, including fast-paced hack-and-slash combat, platforming, and permanent death. This time, though, Motion Twin has gone for an isometric perspective, instead of the side-scroller style, and the pixel graphics are swapped out for a cutesy cartoon style and color palette somewhat reminiscent of the likes of Paladins. There also appear to be some nifty bullet-hell-style battles thrown into the mix.

As for the release date and playable demo, Motion Twin has not yet announced when the game will fully release, but a Windblown demo will launch on October 14 during the upcoming Steam Next Fest, and Steam Early Access for the full game arrives on October 24. Motion Twin also says that any progress and unlocks achieved during the playable demo will carry over once the full game launches, which is a nice touch.

AVer Information Europe B.V. is proud to introduce the FONE700, a cutting-edge ceiling-mounted speakerphone designed to transform hybrid meetings by delivering superior audio quality and seamless video integration. Poor audio often hampers virtual communication, but the FONE700 solves this issue with 360-degree audio coverage, ensuring participants can be heard clearly, no matter where they are in the room.

Clear Audio, Clutter-Free Design
The FONE700's ceiling-mounted design provides a clean, professional look while offering better sound quality than traditional table-top speakerphones. By elevating the microphone and speaker, it removes the need for participants to cluster around a central device, delivering consistent, crisp audio throughout the room.

Microsoft's Direct3D and HLSL teams have unveiled plans to integrate SPIR-V support into DirectX 12 with the upcoming release of Shader Model 7. This significant transition marks a new era in GPU programmability, as it aims to unify the intermediate representation for graphical-shader stages and compute kernels. SPIR-V, an open standard intermediate representation for graphics and compute shaders, will replace the proprietary DirectX Intermediate Language (DXIL) as the shader interchange format for DirectX 12. The adoption of SPIR-V is expected to ease development processes across multiple GPU runtime environments. By embracing this open standard, Microsoft aims to enhance HLSL's position as the premier language for compiling graphics and compute shaders across various devices and APIs. This transition is part of a multi-year development process, during which Microsoft will work closely with The Khronos Group and the LLVM Project. The company has joined Khronos' SPIR and Vulkan working groups to ensure smooth collaboration and rapid feature adoption.

While the transition will take several years, Microsoft is providing early notice to allow developers and partners to plan accordingly. The company will offer translation tools between SPIR-V and DXIL to facilitate a gradual transition for both application and driver developers. For those not familiar with graphics development, graphics APIs ship with virtual instruction set architectures (ISA) that abstracts standard hardware features at a higher level. As GPUs don't follow the same ISA as CPUs (x86, Arm, RISC-V), this virtual ISA is needed to define some generics in the GPU architecture and allow various APIs like DirectX and Vulkan to run. Instead of focusing support on several formats like DXIL, Microsoft is embracing the open SPIR-V standard, which will become de facto for API developers in the future, allowing focus on more features instead of constantly replicating each other's functions. While DXIL is used mainly for gaming environments, SPIR-V has adoption in high-performance computing as well, with OpenCL and SYCL. Gaming presence is also there with Vulkan API, and we expect to see SPIR-V join DirectX 12 games.

Japanese professor Tsumoru Shintake of the Okinawa Institute of Science and Technology (OIST) has unveiled a revolutionary extreme ultraviolet (EUV) lithography technology that promises to significantly push down semiconductor manufacturing costs. The new technology tackles two previously insurmountable issues in EUV lithography. First, it introduces a streamlined optical projection system using only two mirrors, a dramatic simplification from the conventional six or more. Second, it employs a novel "dual line field" method to efficiently direct EUV light onto the photomask without obstructing the optical path. Prof. Shintake's design offers substantial advantages over current EUV lithography machines. It can operate with smaller EUV light sources, consuming less than one-tenth of the power required by conventional systems. This reduction in energy consumption also reduces operating expenses (OpEx), which are usually high in semiconductor manufacturing facilities.

The simplified two-mirror design also promises improved stability and maintainability. While traditional EUV systems often require over 1 megawatt of power, the OIST model can achieve comparable results with just 100 kilowatts. Despite its simplicity, the system maintains high contrast and reduces mask 3D effects, which is crucial for attaining nanometer-scale precision in semiconductor production. OIST has filed a patent application for this technology, with plans for practical implementation through demonstration experiments. The global EUV lithography market is projected to grow from $8.9 billion in 2024 to $17.4 billion by 2030, when most nodes are expected to use EUV scanners. In contrast, ASML's single EUV scanner can cost up to $380 million without OpEx, which is very high thanks to the power consumption of high-energy light UV light emitters. Regular EUV scanners also lose 40% of the UV light going to the next mirror, with only 1% of the starting light source reaching the silicon wafer. And that is while consuming over one megawatt of power. However, with the proposed low-cost EUV system, more than 10% of the energy makes it to the wafer, and the new system is expected to use less than 100 kilowatts of power while carrying a cost of less than 100 million, a third from ASML's flagship.

Fractal Design has released the 3D printing files for their highly sought-after Raspberry Pi case, dubbed Project: North Pi. The tiny case, which caused a sensation at this year's Computex trade show, can now be produced by anyone with access to a 3D printer. The Project: North Pi case first caught the public's eye during Fractal Design's product launch at Computex, where it was used as a playback device alongside a mini computer. Its diminutive size and sleek design, reminiscent of the company's North series, quickly captured the imagination of attendees and media alike. The case's popularity even threatened to overshadow Fractal Design's other new products, including the Mood ITX case, Refine office chair, and Scape headset. Following the overwhelmingly positive response, Fractal Design has decided to share the case's design with the public.

The company has published a dedicated product page containing free downloadable files and comprehensive instructions for 3D printing the case at home. The Project: North Pi case consists of 17 components (11 unique parts) and measures a compact 105 × 50 × 96 mm size. Despite its tiny nature, the case includes space for up to two 40 mm fans behind its front panels, ensuring adequate cooling for the Raspberry Pi. This move by Fractal Design caters to the DIY community and represents a shift in how companies might approach product distribution in the future. By embracing 3D printing technology, Fractal Design has effectively turned its customers into manufacturers, potentially changing the way enthusiasts interact with and customize their tech accessories. As the 3D printing community eagerly begins to produce their own Project: North Pi cases, we wait to see different color combinations and use cases from enthusiasts.

Gigabyte has quietly added a new SSD to its growing lineup and this time around it's something quite different. The drive is part of Gigabyte's new AI TOP (Trillions of Operations per Second) and was announced at Computex with little fanfare. At the show, the company only announced that it would have 150x the TBW compared to regular SSDs and that it was built specifically for AI model training. What that 150x means in reality is that the 2 TB version of the AI TOP 100E SSD will deliver no less than 219,000 TBW (TeraBytes Written), whereas most high-end 2 TB consumer NVMe SSDs end up somewhere around 1,200 TBW. The 1 TB version promises 109,500 TBW and both drives have an MTBF time of 1.6 million hours and a five-year warranty.

Gigabyte didn't reveal the host controller or the exact NAND used, but the drives are said to use 3D NAND flash and both drives have a LPDDR4 DRAM cache of 1 or 2 GB depending on the drive size. However, the pictures of the drive suggest it might be a Phison based reference design. The AI TOP 100E SSDs are standard PCIe 4.0 drives, so the sequential read speed tops out at 7,200 MB/s with the write speed for the 1 TB SKU being up to 6,500 MB/s, with the 2 TB SKU slightly behind at 5,900 MB/s. No other performance figures were provided. The drives are said to draw up to 11 Watts in use, which seems very high for PCIe 4.0 drives. No word on pricing or availability as yet.

At Computex 2024, Colorful has launched an ultra-exclusive new graphics card - the iGame Lab 4090. This limited edition GPU is squarely targeted at hardcore overclockers and performance enthusiasts willing to pay top dollar for the absolute best. With only 300 units produced globally, the iGame Lab 4090 represents the pinnacle of Colorful's engineering efforts. Each chip was hand-selected from thousands after rigorous binning to ensure premium silicon capable of extreme overclocks. The card's striking aesthetics feature a clean white shroud with silver accent armor. Beyond the intricate design, the real draw is performance. The iGame Lab 4090 has already shattered records, with professional overclocker CENs pushing it past 3.8 GHz under 3D load. It set a new world record 3DMark Time Spy Extreme score of 24,103 points. Out of the box, the card features a base clock of 2235 MHz, a boost clock of 2520 MHz, and a turbo mode of 2625 MHz, all while being a 3-slot design.

Asetek, innovator of gaming hardware for next-level immersive gaming experiences and the creator of the all-in-one (AIO) liquid cooler, today announced a strategic partnership with Fabric8labs, a leading innovator in metal 3D printing. This exclusive partnership with Fabric8Labs covers the commercial and consumer desktop markets and introduces a revolutionary advancement in liquid cooling technology, showcased in the AI Optimized Cold Plate. Leveraging Fabric8Labs' cutting-edge Electrochemical Additive Manufacturing (ECAM) technology, Asetek has developed a cold plate design that will redefine industry leading performance.

The partnership embodies a shared commitment to innovation that drives superior performance, high quality, and lasting reliability. The AI Optimized Cold Plate demonstrates a significant improvement over previous generations, highlighting the effectiveness of this collaboration. Fabric8Labs' unique 3D printing technology plays a pivotal role in this innovation. Their ECAM method allows for the creation of complex, high-resolution structures that significantly improve thermal capabilities through enhanced fluid dynamics. Also, by eliminating the need for post-processing, ECAM ensures the highest quality and integrity of each cold plate and is massively scalable to support high-volume production demands.