A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

Samsung Electronics America, the leader in advanced memory technology, today unveiled upgrades to its PRO Plus memory cards, designed for professional and enthusiast photographers, videographers, and content creators. The Samsung PRO Plus microSD and full-size SD cards boast increased read and write speeds of up to 180 MB/s and 130 MB/s, a 12 percent and 8 percent increase, respectively, over their predecessors.

Optimized for professional use, the new PRO Plus microSD and SD cards allow users to seamlessly capture 4K ultra-high definition (UHD) and Full HD (FHD) videos and photos. The cards also support a video speed class rating of V30, enabling professionals to quickly move large video files while editing. Available in capacities up to 512 GB, Samsung memory cards provide ample storage for up to 207,159 4K UHD photos or 30 hours of 4K UHD video.[1] Professionals need memory cards that make it easy to save and retrieve data, while also safeguarding their valuable images and video files. With the additional Samsung Card Reader supporting USB 3.0 and providing backward compatibility with USB 2.0, consumers can use Samsung memory cards on any device with a USB port.

MSI, a world leader in high-performance and innovative computing solutions, announced the PRO DP10 13M Business & Productivity Mini PC. This pint-sized enclosure is packed with more technology than what meets the eye. Featuring a compact chassis, powerful processor options, exclusive software, and Thunderbolt 4, the PRO DP10 13M is designed with efficiency and productivity in mind.

Powerful Ideas with Limitless Potential
PRO DP10 provides limitless potential while being less than 1.1 liters in volume. The small design helps tidy up a desk and save space, while the available robust hardware and software configurations support users in multitasking. Up to a 13th Gen Intel Core i7 processor with 12 cores and Iris Xe Graphics enables users to edit graphics and work with multiple programs faster and more seamlessly than previous generations. Furthermore, it supports up to 64 GB memory with a dual-channel design to address specific task requirements, delivering a robust and stable computing performance. In addition, the rich selection of IO ports includes one DP-out, one HDMI-out, one D-Sub (VGA), and one Thunderbolt 4, which supports up to 40Gb transfer speed and display output up to 8K resolution. The PRO DP10 can support up to four displays simultaneously, so users can view different programs in great detail.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

The newest 2023 Lenovo Legion lineup of battle-ready PCs, monitors, and accessories are unveiled today, setting a new standard in PC gaming for 2023 that gives gamers the edge they need to top the leaderboards. Lenovo is harnessing the pure power of PC gaming with its new lineup for CES 2023, unlocking the freedom to dominate the battlefield with AI-tuned performance that lets gamers crush both framerates and the competition. Brand new for 2023 is the new Lenovo LA AI chip, the world's first dedicated AI chip on a gaming laptop, installed on the new Lenovo Legion Pro 7 and 7i (16", 8) laptops and the Lenovo Legion Pro 5 and 5i (16", 8) laptops.

Lenovo AI Engine+, powered by the Lenovo LA AI chip, deploys a software machine learning algorithm to optimally tune system performance. The chip uses software machine learning, deployed through Lenovo Vantage, to help monitor in-game FPS and dynamically adjust for the highest performance output. Offering up to 15% higher TDP, this chip and machine learning software combo allows Legion Pro Series laptops to deliver higher performance compared to previous generations. Lenovo Legion Pro 7i and Lenovo Legion Pro 5 and 5i laptops also come with Tobii Horizon, providing gearless head tracking that gives players an extra level of immersion when playing their favorite games, as well as Tobii Aware.

Apple today introduced the new iPad with an all-screen design featuring a large 10.9-inch Liquid Retina display. The new iPad is powered by the A14 Bionic chip, which delivers even faster performance with incredible power efficiency for demanding tasks while still providing all-day battery life. Updated cameras include an Ultra Wide 12MP front camera located along the landscape edge of iPad for an even better video calling experience, and an updated 12MP back camera to capture sharp, vivid photos and 4K video. A USB-C port supports a wide range of accessories, Wi-Fi 6 brings even faster connections, and cellular models feature superfast 5G so users can stay connected on the go. Designed specifically for the new iPad, the all-new Magic Keyboard Folio features an incredible typing experience, a click-anywhere trackpad, and a versatile two-piece design. With iPadOS 16 and support for Apple Pencil (1st generation), iPad offers users more ways to be creative and productive. The new iPad is available to order starting today, with availability in stores beginning Wednesday, October 26.

"We're so excited to bring the completely redesigned iPad to our most advanced iPad lineup ever," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "With a large 10.9-inch Liquid Retina display, powerful A14 Bionic chip, a first-ever landscape front camera, fast wireless connectivity, USB-C, and support for incredible accessories like the new Magic Keyboard Folio, the new iPad delivers more value, more versatility—and is simply more fun."

Apple today announced the next generation of Apple TV 4K—more powerful, entertaining, and affordable than ever, and offering impressive cinematic quality. Driven by the A15 Bionic chip that delivers faster performance and more fluid gameplay, the new Apple TV 4K features endless entertainment options for everyone to enjoy on the biggest screen in the home. HDR10+ support joins Dolby Vision on Apple TV 4K, so users can watch their favorite movies and TV shows in the best quality possible across more TVs. Running tvOS, the powerful and intuitive OS for the living room, and featuring the popular Siri Remote, Apple TV 4K simplifies the way users discover and enjoy their favorite content. Its seamless integration with other Apple devices and services magically transforms the living room in different ways for the entire family, while also adding convenience as a smart home hub.

The new Apple TV 4K is available in two configurations: Apple TV 4K (Wi-Fi), which offers 64 GB of storage; and Apple TV 4K (Wi-Fi + Ethernet), which offers support for Gigabit Ethernet for fast networking and streaming, Thread mesh networking protocol to connect even more smart home accessories, and twice the storage for apps and games (128 GB). Customers can order the new Apple TV 4K with Siri Remote today at a new starting price of $129, with availability beginning Friday, November 4.

Amazon today introduced Kindle Scribe—the next generation of Kindle that unites reading with writing. Kindle Scribe features the world's first 10.2-inch, 300 pixels per inch (ppi), Paperwhite display, and an included pen that never needs charging. The premium, front-lit, and glare-free display feels like reading and writing on paper, with crisp text and ample space for larger fonts, images, charts, and documents. Designed for reading and notetaking in millions of books, adding notes to documents, journaling, and more, Kindle Scribe is available for preorder today from just $339 and will ship later this year.

"Kindle Scribe is the best Kindle we've ever built, creating a reading and writing experience that feels like real paper," said Kevin Keith, vice president of Amazon Devices. "It's inspired by the Kindle customers who have added billions of notes and highlights to books over the years, and it's also ideal for reviewing and marking up documents, managing your to-do list, or doodling over a big idea. Plus, it offers all the Kindle benefits customers know and love—millions of books on demand, adjustable fonts, premium reading features, and weeks and weeks of battery life—with the benefit of a beautiful, large display."

Acer today announced support for the new 13th Gen Intel Core processors on the Predator Orion 7000 (PO7-650) series desktops, delivering serious power and further elevating users' PC gameplay. Engineered for hard-core gaming enthusiasts and creators, the upgradable gaming desktop pushes the limits of high-performance multi-tasking and next-level computing power.

"With the new 13th Gen Intel Core desktop processors, the Predator Orion 7000 powers extraordinary performance for even the most demanding game titles," said Jeff Lee, General Manager, Stationary Computing, IT Products Business, Acer Inc. "The Predator Orion 7000 continues to deliver best-in-class gameplay experiences beyond what gamers expect, and we're excited to be among the first to bring the new CPUs to market."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new extreme overclocked performance DDR5 memory specifications to its flagship Trident Z5 RGB series: DDR5-6800 CL32-45-45-108 32 GB (2x 16 GB) and DDR5-6400 CL32-39-39-102 64 GB (2x 32 GB). These memory kits come with Intel XMP 3.0 memory overclocking profiles and have been validated on the latest 12th Gen Intel Core desktop processor and Intel Z690 chipset platform.

Dedicated to developing extreme overclock speed memory kits, the G.SKILL Trident Z5 RGB DDR5-6800 CL32-45-45-108 2x 16 GB memory kit is the ideal choice for overclocking enthusiasts to experience extreme DDR5 frequency performance. The screenshot below shows the DDR5-6800 memory kit validated with Intel Core i7-12700K desktop processor and ASUS ROG Maximus Z690 Hero motherboard.

Amazon today announced the next generation of Fire HD 8 tablets, launching four new models: Fire HD 8, Fire HD 8 Plus, Fire HD 8 Kids Pro, and Fire HD 8 Kids. The all-new Fire HD 8, powered by a 30% faster processor and all-day battery life, provides customers with a premier entertainment experience and the ability to get more things done at home or on the go. And for the first time, customers can select a Disney Design bundle for the Fire HD 8 Kids featuring Mickey Mouse or Disney Princess cases. The new Fire HD 8 tablets are available for pre-order today and will begin shipping next month.

"Our best-selling tablet this year just got even better for customers. The all-new Fire HD 8 tablets are faster, lighter, and powered by all-day battery life, delivering great entertainment for the whole family," said Kevin Keith, vice president of Amazon Devices. "For a complete kids tablet experience, the all-new Fire Kids tablets include one year of Amazon Kids+, a virtual playground of thousands of ad-free games, videos, books, apps, and more, kid-friendly case, a two-year worry-free guarantee, and easy-to-use parental controls."

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

Apple today announced M1 Pro and M1 Max, the next breakthrough chips for the Mac. Scaling up M1's transformational architecture, M1 Pro offers amazing performance with industry-leading power efficiency, while M1 Max takes these capabilities to new heights. The CPU in M1 Pro and M1 Max delivers up to 70 percent faster CPU performance than M1, so tasks like compiling projects in Xcode are faster than ever. The GPU in M1 Pro is up to 2x faster than M1, while M1 Max is up to an astonishing 4x faster than M1, allowing pro users to fly through the most demanding graphics workflows.

M1 Pro and M1 Max introduce a system-on-a-chip (SoC) architecture to pro systems for the first time. The chips feature fast unified memory, industry-leading performance per watt, and incredible power efficiency, along with increased memory bandwidth and capacity. M1 Pro offers up to 200 GB/s of memory bandwidth with support for up to 32 GB of unified memory. M1 Max delivers up to 400 GB/s of memory bandwidth—2x that of M1 Pro and nearly 6x that of M1—and support for up to 64 GB of unified memory. And while the latest PC laptops top out at 16 GB of graphics memory, having this huge amount of memory enables graphics-intensive workflows previously unimaginable on a notebook. The efficient architecture of M1 Pro and M1 Max means they deliver the same level of performance whether MacBook Pro is plugged in or using the battery. M1 Pro and M1 Max also feature enhanced media engines with dedicated ProRes accelerators specifically for pro video processing. M1 Pro and M1 Max are by far the most powerful chips Apple has ever built.

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

AAEON, an industry leader in embedded solutions, introduces the BOXER-6643-TGU compact industrial system. With rugged construction, the system delivers the performance and innovative technologies of the 11th Generation Intel Core U processors (formerly Tiger Lake) to applications in tough environments, providing wide operating temperature range and 5G support, to power embedded controller and Industrial IoT (IIoT) gateway applications.

The BOXER-6643-TGU is powered by the 11th Generation Intel Core U processors, delivering greater performance over previous generations, with innovative Intel technologies ensuring more accurate, secure data processing. With up to 64 GB of memory, the system allows users to utilize the full extent of the system's processing capabilities, and with the Intel Iris Xe embedded graphics, users can leverage more powerful GPU processing to power AI and Edge Computing industrial applications. With dual HDMI ports, the system can also support 4K high definition video on two monitors, perfect for powering digital signage.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

AMD today announced availability of the new AMD Radeon PRO W6000X series GPUs for Mac Pro. The new GPU product line delivers exceptional performance and incredible visual fidelity to power a wide variety of demanding professional applications and workloads, including 3D rendering, 8K video compositing, color correction and more.

Built on groundbreaking AMD RDNA 2 architecture, AMD Infinity Cache and other advanced technologies, the new workstation graphics line-up includes the AMD Radeon PRO W6900X and AMD Radeon PRO W6800X GPUs. Mac Pro users also have the option of choosing the AMD Radeon PRO W6800X Duo graphics card, a dual-GPU configuration that leverages high-speed AMD Infinity Fabric interconnect technology to deliver outstanding levels of compute performance.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to announce the launch of new capacities for TOUGHRAM XG RGB DDR4 Memory Kits, aiming to meet the toughest needs of creators while producing video, animation or exporting large files.

The memory kits are forged with frequencies up to 3600 and 4000 MHz and capacities up to 32 GB (16 GB x2) and 64 GB (32 GB x2). The TOUGHRAM XG RGB series inherits the same craftsmanship and quality expected from the TOUGHRAM name; they are compatible with the latest AMD and Intel motherboards and they have been through rigorous tests to select tightly-screened ICs, designed with a with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. Designed with 2 different colors of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB is ambitioned at providing an exclusive style for users standing out from the normal.

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.