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Amazon Introduces All-New Fire HD 8 Tablets Built for Entertainment

Amazon today announced the next generation of Fire HD 8 tablets, launching four new models: Fire HD 8, Fire HD 8 Plus, Fire HD 8 Kids Pro, and Fire HD 8 Kids. The all-new Fire HD 8, powered by a 30% faster processor and all-day battery life, provides customers with a premier entertainment experience and the ability to get more things done at home or on the go. And for the first time, customers can select a Disney Design bundle for the Fire HD 8 Kids featuring Mickey Mouse or Disney Princess cases. The new Fire HD 8 tablets are available for pre-order today and will begin shipping next month.

"Our best-selling tablet this year just got even better for customers. The all-new Fire HD 8 tablets are faster, lighter, and powered by all-day battery life, delivering great entertainment for the whole family," said Kevin Keith, vice president of Amazon Devices. "For a complete kids tablet experience, the all-new Fire Kids tablets include one year of Amazon Kids+, a virtual playground of thousands of ad-free games, videos, books, apps, and more, kid-friendly case, a two-year worry-free guarantee, and easy-to-use parental controls."

AMD Introduces Instinct MI210 Data Center Accelerator for Exascale-class HPC and AI in a PCIe Form-Factor

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

Intel's Sapphire Rapids Xeons to Feature up to 64 GB of HBM2e Memory

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

Apple Introduces M1 Pro and M1 Max: the Most Powerful Chips Apple Has Ever Built

Apple today announced M1 Pro and M1 Max, the next breakthrough chips for the Mac. Scaling up M1's transformational architecture, M1 Pro offers amazing performance with industry-leading power efficiency, while M1 Max takes these capabilities to new heights. The CPU in M1 Pro and M1 Max delivers up to 70 percent faster CPU performance than M1, so tasks like compiling projects in Xcode are faster than ever. The GPU in M1 Pro is up to 2x faster than M1, while M1 Max is up to an astonishing 4x faster than M1, allowing pro users to fly through the most demanding graphics workflows.

M1 Pro and M1 Max introduce a system-on-a-chip (SoC) architecture to pro systems for the first time. The chips feature fast unified memory, industry-leading performance per watt, and incredible power efficiency, along with increased memory bandwidth and capacity. M1 Pro offers up to 200 GB/s of memory bandwidth with support for up to 32 GB of unified memory. M1 Max delivers up to 400 GB/s of memory bandwidth—2x that of M1 Pro and nearly 6x that of M1—and support for up to 64 GB of unified memory. And while the latest PC laptops top out at 16 GB of graphics memory, having this huge amount of memory enables graphics-intensive workflows previously unimaginable on a notebook. The efficient architecture of M1 Pro and M1 Max means they deliver the same level of performance whether MacBook Pro is plugged in or using the battery. M1 Pro and M1 Max also feature enhanced media engines with dedicated ProRes accelerators specifically for pro video processing. M1 Pro and M1 Max are by far the most powerful chips Apple has ever built.

DRAM Prices Projected to Enter Period of Downswing in 2022 as Demand Lags Behind Supply, Says TrendForce

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

AAEON Introduces the BOXER-6643-TGU Compact Industrial System with Intel Tiger lake Processor

AAEON, an industry leader in embedded solutions, introduces the BOXER-6643-TGU compact industrial system. With rugged construction, the system delivers the performance and innovative technologies of the 11th Generation Intel Core U processors (formerly Tiger Lake) to applications in tough environments, providing wide operating temperature range and 5G support, to power embedded controller and Industrial IoT (IIoT) gateway applications.

The BOXER-6643-TGU is powered by the 11th Generation Intel Core U processors, delivering greater performance over previous generations, with innovative Intel technologies ensuring more accurate, secure data processing. With up to 64 GB of memory, the system allows users to utilize the full extent of the system's processing capabilities, and with the Intel Iris Xe embedded graphics, users can leverage more powerful GPU processing to power AI and Edge Computing industrial applications. With dual HDMI ports, the system can also support 4K high definition video on two monitors, perfect for powering digital signage.

Samsung Develops 512 GB DDR5 Memory Modules Running at 7.2 Gbps

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

New AMD Radeon PRO W6000X Series GPUs Bring Groundbreaking High-Performance AMD RDNA 2 Architecture to Mac Pro

AMD today announced availability of the new AMD Radeon PRO W6000X series GPUs for Mac Pro. The new GPU product line delivers exceptional performance and incredible visual fidelity to power a wide variety of demanding professional applications and workloads, including 3D rendering, 8K video compositing, color correction and more.

Built on groundbreaking AMD RDNA 2 architecture, AMD Infinity Cache and other advanced technologies, the new workstation graphics line-up includes the AMD Radeon PRO W6900X and AMD Radeon PRO W6800X GPUs. Mac Pro users also have the option of choosing the AMD Radeon PRO W6800X Duo graphics card, a dual-GPU configuration that leverages high-speed AMD Infinity Fabric interconnect technology to deliver outstanding levels of compute performance.

Thermaltake Announces Larger Capacity TOUGHRAM XG RGB Memory

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to announce the launch of new capacities for TOUGHRAM XG RGB DDR4 Memory Kits, aiming to meet the toughest needs of creators while producing video, animation or exporting large files.

The memory kits are forged with frequencies up to 3600 and 4000 MHz and capacities up to 32 GB (16 GB x2) and 64 GB (32 GB x2). The TOUGHRAM XG RGB series inherits the same craftsmanship and quality expected from the TOUGHRAM name; they are compatible with the latest AMD and Intel motherboards and they have been through rigorous tests to select tightly-screened ICs, designed with a with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. Designed with 2 different colors of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB is ambitioned at providing an exclusive style for users standing out from the normal.

Redesigned Apple MacBook Pro Coming This Summer with up to 64 GB of RAM and 10-Core Processor

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

IBASE Launches 3.5" SBC IB953 Powered by 11th Gen Intel Tiger Lake Processors

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel's Upcoming Sapphire Rapids Server Processors to Feature up to 56 Cores with HBM Memory

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

ASUS Announces Mini PC PB62

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

Chinese Manufacturer Asgard Launches 4,800 MHz DDR5 Memory Modules

In the name of Odin, Chinese manufacturer Asgard has launched their first DDR5 memory modules to market - beating some competing western companies that are still "gearing up" for it. Owned by the much less interestingly-named Shenzhen Jiahe Jinwei Electronic Technology Co., Ltd., Asgard likewise lost some of its flair in naming these DDR5 sticks - the best they could do was VMA5AUK-MMH224W3. The modules will be available in 32 GB, 64 GB and 128 GB per-stick densities.

The initial modules don't have any flair - they're built with the same green PCB that's actually the forerunner of today's colored ones. The company hs also announced that the modules win run at a relatively mild 4,800 MHz (the DDR5 specification goes up to 8,400 MHz), and that its timings coincide with JEDEC's "B" classification, which should mean 40-40-40. The voltage likewise remains at the JEDEC-set standard of 1.1 V. The company announced that mass-production rollout will only occur after there are actual CPUs and platforms that can take advantage of the DDR5 memory spec, and said that they expect Intel's Alder-Lake, Sapphire Rapids and Tiger Lake-U from the blue team, as well as Van Gogh and Rembrandt APUs from the AMD camp. No word on consumer pricing was available at time of writing.

Prices of NAND Flash Controller ICs Poised to Rise by 15-20% due to Tightening Production Capacity for Foundry Services, Says TrendForce

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

Oversupply to Continue Affecting NAND Flash Prices, with 10-15% QoQ Decline Expected in 1Q21, Says TrendForce

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

HyperX Increases DRAM Density With New Impact SODIMM DDR4 Lineup

HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

TeamGroup Launches T-CREATE Classic 10L DDR4 Memory Modules Aimed at Creators

TeamGroup recently announced another addition to their DDR4 memory lineup especially aimed at creators. The new, aptly named T-Create lineup features clean, back-to-basics aesthetics with slim metal heatspreaders that aren't too gaudy and are absent of any RGB. The new chips are available in capacities ranging from 16 GB (2 x 8 GB) through to 64 GB (2x 32 GB). Available speeds are set at DDR4-3200 (22-22-22-52 timings and 1.20 V) and DDR4-2666 (19-19-19-43 timings and 1.20 V).

The TeamGroup T-Create Classic 10L feature a 10-layer PCB and limited lifetime warranty, and are available in silvery-white. Pricing starts at $56.99 for the 2x 8 GB 2666 MHz kit and goes up to $216.99 for the 2x 32 GB 3200 MHz one.

GeIL Announces ORION Series DDR4 Memory

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced ORION series memory for gamers and content creators providing high speed as well as massive memory capacity scalable up to 4000 MHz CL18 64 GB (2 x 32 GB) kit.

High speed and low latencies used to be gamers' favorite while massive memory capacity which greatly helps the multimedia creation is preferred for content creators. Scaling up to 2x 32 GB 4000 MHz CL18, GeIL ORION series memory is an exceptionally balanced choice designed to satisfy multiple needs, especially for users require both extraordinary performance for gaming and massive memory capacity for multimedia creation.

Patriot Viper Gaming Announces 32GB VIPER STEEL SODIMMs and UDIMMs

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is excited to announce the launch of their new 32 GB memory modules into the VIPER STEEL SERIES DDR4 PERFORMANCE MEMORY. The new 32 GB modules are available in both UDIMM and SODIMM. The frequencies from 3000 MHz to 3600 MHz are available for UDIMM and the frequencies from 2400 MHz to 3000 MHz for SODIMM. The new modules are built from rigorously tested memory chips and components on a ten-layer PCB for optimum performance in gaming desktops and laptops.

The VIPER STEEL provides extra gaming performance and stability for the most demanding desktop and laptop environments across the latest Intel and AMD platforms. The VIPER STEEL modules bring Intel XMP 2.0 performance to the next level by offering hardcore gamers and enthusiasts the possibility to upgrade their gaming systems with more DRAM memory capacity and further extending their potential.

VIPER GAMING Launches New 64GB Kits of High-Performance VIPER 4 BLACKOUT DRAM

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, today is proud to announce the launch of their 32 GB memory module kits as part of the VIPER 4 BLACKOUT DDR4 PERFORMANCE MEMORY, offering gamers and video content creators the ability to equip their systems with more memory and further extending the potential performance. The VIPER 4 BLACKOUT series modules have long been an excellent choice for enthusiastic builders who are looking for high-speed memory with headroom for performance tweaking and overclocking.

The series was created to be performance-oriented,and with outstanding compatibility across the latest Intel and AMD platforms, the VIPER 4 BLACKOUT series 64 GB kit are available in speeds from 3000 MHz up to 3600 MHz and built from strictly tested memory chips and components on a 10-layer PCB. Each of the 32 GB modules is wrapped by a military-grade aluminium heatspreader with an advanced pin array to maximize efficiency and thermal performance."The VIPER 4 BLACKOUT DRAM is an award-winning series and has been highly recommended by mainstream PC hardware media last year.Influencefrompositive customer feedback from our 16 GB kits encouraged us to expand the VIPER 4 BLACKOUT series to include a much larger 64 GB kit," said Roger Shinmoto, the Vice President of VIPER GAMING by PATRIOT.
Viper 4 Blackout Series DDR4 Viper 4 Blackout Series DDR4 Viper 4 Blackout Series DDR4

GeIL Announces DDR4 3200 MHz SO-DIMM 64 GB Kit

GeIL has today announced a new line of memory for Intel 10th Gen and AMD Ryzen 4000 series mobile processors. The new 64 GB kit offered as 2x 32 GB DDR4-3200 modules is simply called "SO-DIMM". This new kit features high-density chips and a standard operating voltage of 1.2 V which helps maximize system performance. The new series of modules will also feature lower speed kits in DDR4 2933 MHz 64 GB and DDR4 2666 MHz 64 GB. The 3200 MHz kit comes with a latency of 22-22-22-52 while the 2933 Mhz features 21-21-21-48 and the 2666 MHz 19-19-19-43 which are all similar to other vendors offerings. These new kits should offer gamers and content creators a robust memory upgrade path for mobile devices, pricing and availability were not announced.

XMG APEX 15 is a Laptop with AMD Ryzen 3950X CPU Inside

Have you ever wondered how a laptop with a desktop CPU that has 16 cores and 32 threads would look like on a laptop? Well, today is your lucky day as XMG, a German laptop maker, has decided to launch a laptop that has AMD's latest and greatest desktop CPU - the Ryzen 3950X 16C/32T monster. The 3950X CPU, while featuring a regular TDP of 105 W, has been configured to 65 W in Eco Mode, and it runs anywhere from 2.6 to 4.2 GHz. The CPU also isn't soldered to the motherboard and there is a full AM4 socket, that is capable of housing any 3000 series desktop CPU.

Besides a powerful CPU, there are options for NVIDIA GeForce RTX 2060 or RTX 2070 graphics cards, which drive a 15.6-inch Full HD 144 Hz IPS panel equipped with anti-glare technology. The GPUs are a "Max-P incarnation" as XMG calls it, which presumably means that they are designed for maximum performance i.e. possibly higher boost speeds. Additionally, you can configure the laptop with up to 64 GB of DDR4 2666 MHz RAM. This configuration, containing Ryzen 9 3950X, RTX 2070, 32 GB of RAM and 1 TB NVM, costs around 2631 EUR. For more configuration options, you can check out this website. Availability is supposed to be in 6-8 weeks.
XMG APEX 15 XMG APEX 15 XMG APEX 15 XMG APEX 15

Razer Presents Tomahawk Gaming Desktop

At this year's CES, Razer presented its Tomahawk gaming desktop based on Intel's Compute Element - an all in one solution that packs CPU, RAM, and storage on the same PCB. The Tomahawk presents a complete solution, meaning that it is a pre-built PC that you can spec out to your liking. Available with up to Intel 9th generation Core i9, 64 GB of RAM and NVIDIA's GeForce RTX 2080 graphics card, the Tomahawk is marketed as a powerful small form factor gaming PC.

When it comes to connectivity options, the Tomahawk is featuring all of the ports that are available on Ghost Canyon NUC 9, meaning two Thunderbolt 3 ports, six USB-A ports, one HDMI and two LAN ports, plus video output from the graphics card. On the PCB than connects the Compute Element and the GPU, there is also one PCIe 3.0 M.2 NVMe SSD slot available. Razer also announced that they will make this case available on its own to please all the DIYers, and it will be called the Tomahawk N1. For now, however, it is a pre-built only.

Intel's Frost Canyon NUC 10 Mini PC is now Available

Intel's latest NUC (Next Unit of Computing) series of Mini PCs, based on the 10th generation of Intel "Core" processors, is now available for purchase. Dubbed Frost Canyon, this NUC series is featuring Intel's 10th generation Comet Lake CPUs at its base. All of the available configurations are based around the Intel Core i7-10710U processor, Intel i219-V Gigabit Lan, Bluetooth 5.0 and Intel WiFi 6 AX200 networking module. Configurations are varying by the amount of pre-installed RAM and storage and the option of whatever you want OS pre-installed or not.

The NUC 10 supports up to 64 GB of DDR4 memory, while the storage options include space for one 2.5 inch SSD/HDD in smaller variants or two 2.5 inch SSD/HDD drives in taller variants, with one NVMe M.2 SSD slot available in both versions. Pricing starts at $679 for the base models, while higher-end configurations cost upward of $1,295. Additionally, it is worth pointing out that all CPUs inside the new NUC are configured to run at 25 W of TPD, regardless of the model. This will result in higher performance compared to 15 W versions of processors found in most laptop solutions.
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