TEAMGROUP today announces that T-FORCE VULCAN Z and DARK Z gaming memory will be the first to release the large capacity, 32 GB single stick memory. There are DDR4 2666 and DDR4 3000 two different frequency of memory modules available to offer desktop PC a complete selection of expansions. It can provide the powerful computer equipment with high storage speed and multitasking capabilities that creators need for video content creation and editing. It can also perfectly support all AMD and Intel's consumer platforms.

The invincible T-FORCE gaming series is your top choice in 2020 when it comes to large capacity upgrades. T-FORCE VULCAN Z and DARK Z, which are praised by the media around the world, will be the first to release the large capacity, 32 GB single stick memory. VULCAN Z launches DDR4-2666 MHz and DDR4-3000 MHz, two different frequencies of single channel kit and dual channel kit (32 GB X2). And DARK Z will mainly provide a DDR4-3000 MHz dual channel kit (32 GB X2). Consumers can choose a suitable specification based on their personal usage. Not only can process large files easily, but it can also upgrade capacity and handle multiple data computing at the same time. This can increase the applications of desktop computers.

Bitspower unveiled the Summit ELX line of CPU water blocks optimized for 3rd generation AMD Ryzen Threadripper processors. The block's coolant channel is designed keeping in mind the layout of the "Castle Peak" MCM, such that coolant flows over even the CCDs farthest away from the center, which has the I/O controller die. This design should particularly benefit users of the Threadripper 3990X, which has eight CCDs. The block supports both sTRX4 and older TR4 sockets.

The primary material is nickel-plated copper, with a mirror finish at the base. There are three variants based on the type of top. The first one called "DRGB," (BP-CPUELXTRX40-DRGB), features a clear acrylic top with embedded addressable-RGB LEDs that plug into a standard 3-pin ARGB header. The second variant is called "Metal" (BP-CPUELXTRX40-MT), and features a metal alloy top with a chrome finish. The third variant, called "POM," (BP-CPUELXTRX40-POM), features a matte-black POM acetal top. The Summit ELX supports standard G 1/4" fittings, and measures 115 mm x 75 mm x 18 mm (LxWxH). The DRGB variant is priced at NTD 2,800, the Metal variant NTD 3,255, and the POM variant NTD 2,635.

AMD today announced in the form of a blog post that its upcoming graphics cards based on RDNA 2 architecture will feature support for Microsoft's latest DirectX 12 Ultimate API. "With this architecture powering both the next generation of AMD Radeon graphics cards and the forthcoming Xbox Series X gaming console, we've been working very closely with Microsoft to help move gaming graphics to a new level of photorealism and smoothness thanks to the four key DirectX 12 Ultimate graphics features -- DirectX Raytracing (DXR), Variable Rate Shading (VRS), Mesh Shaders, and Sampler Feedback." - said AMD in the blog.

Reportedly, Microsoft and AMD have worked closely to enable this feature set and provide the best possible support for RDNA 2 based hardware, meaning that future GPUs and consoles are getting the best possible integration of the new API standard.

Microsoft Thursday released the DirectX 12 Ultimate logo. This is not a new API with any new features, but rather a differentiator for graphics cards and game consoles that support four key modern features of DirectX 12. This helps consumers recognize the newer and upcoming GPUs, and tell them apart from some older DirectX 12 capable GPUs that were released in the mid-2010s. For a GPU to be eligible for the DirectX 12 Ultimate logo, it must feature hardware acceleration for ray-tracing with the DXR API; must support Mesh Shaders, Variable Rate Shading (VRS), and Sampler Feedback (all of the four). The upcoming Xbox Series X console features this logo by default. Microsoft made it absolutely clear that the DirectX 12 Ultimate logo isn't meant as a compatibility barrier, and that these games will work on older hardware, too.

As it stands, the "Navi"-based Radeon RX 5000 series are "obsolete", just like some Turing cards from the GeForce GTX 16-series. At this time, the only shipping product which features the logo is NVIDIA's GeForce RTX 20-series and the TITAN RTX, as they support all the above features.

AMD released the Radeon Software Adrenalin 2020 Edition drivers just in time for Asia and ANZ regions to begin "razing hell" with DOOM Eternal. Version 20.3.1 adds day-one optimization for DOOM Eternal, including an up to 5 percent performance improvement with "Ultra Nightmare" graphics settings. Optimization is also added for "Half Life: Alyx" and the Vulkan API mode of "Ghost Recon: Breakpoint." The drivers also add a few Vulkan extensions: VK_EXT_post_depth_coverage (only supported on RDNA or later graphics architectures); VK_KHR_shader_non_semantic_info, VK_EXT_texel_buffer_alignment, and VK_EXT_pipeline_creation_cache_control. Grab the drivers from the link below and raze hell!

DOWNLOAD: AMD Radeon Software Adrenalin 20.3.1 BetaThe change log follows.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announces the A68N-2100K SoC motherboard that comes with an in-built AMD E1-6010 Processor. Throughout many decades, BIOSTAR has been revered as one of the best manufacturers of robust, highly reliable motherboards with a wide array of models on both Intel and AMD platforms to choose from and a plethora of supplementary components catering to many user preferences globally.

Modern technology meets sleek, refined form factor as BIOSTAR's A68N-2100K SoC Mini-ITX motherboard is unveiled to the world with an inbuilt AMD E1-6010 Processor and support for AMD Radeon R2 Graphics.

AMD earlier this week trimmed prices of its retail 3rd generation Ryzen desktop processors in the US, through promotions exclusive to Newegg and Amazon. The company is also including 3-month Xbox Game Pass subscriptions with select models. The discounts see the 12-core/24-thread Ryzen 9 3900X go for $449, $50 lower than its MSRP of $499. The company's fastest 8-core/16-thread part, the Ryzen 7 3800X, is now going for $359, or $40 lower than its $399 MSRP. The popular Ryzen 7 3700X 8-core/16-thread chip is selling for $304, a $25 discount from its $329 MSRP. AMD is applying similar $25 cuts to its 6-core/12-thread parts, with the Ryzen 5 3600X going for $224 compared to its $249 MSRP, and the popular Ryzen 5 3600 priced at $174 compared to its $199 MSRP.

Sony in a YouTube stream keynote by PlayStation 5 lead system architect Mark Cerny, detailed the upcoming entertainment system's hardware. There are three key areas where the company has invested heavily in driving forward the platform by "balancing revolutionary and evolutionary" technologies. A key design focus with PlayStation 5 is storage. Cerny elaborated on how past generations of the PlayStation guided game developers' art direction as the low bandwidths and latencies of optical discs and HDDs posed crippling latencies arising out of mechanical seeks, resulting in infinitesimally lower data transfer rates than what the media is capable of in best case scenario (seeking a block of data from its outermost sectors). SSD was the #1 most requested hardware feature by game developers during the development of PS5, and Sony responded with something special.

Each PlayStation 5 ships with a PCI-Express 4.0 x4 SSD with a flash controller that has been designed in-house by Sony. The controller features 12 flash channels, and is capable of at least 5.5 GB/s transfer speeds. When you factor in the exponential gains in access time, Sony expects the SSD to provide a 100x boost in effective storage sub-system performance, resulting in practically no load times.

A report via DigiTimes paints a bleak image on shipments for motherboards and GPUs. According to the publication, citing sources close to motherboard makers, the initial impact of the outbreak severely affected production - and the entire supply chain ecosystem needed to ferry these across the world. Alongside reduced demand in China (reported to be down 50% YoY and unlikely to pick up until July at the earliest) and other countries, the stage is set for a record low in some of our most favored hardware pieces.

Market observers had expected a seasonal increase in demand entering Q3 2020 which may never come to fruition, as DigiTimes also mentions AMD, Intel and NVIDIA as being unlikely to achieve their target sales for this time period. The reduced demand could see prices come down on components and various hardware pieces, should it linger for longer than the fabrication bottlenecks factories are currently facing. Some publications are pointing towards this drop in demand as a reason for NVIDIA to delay their expected GTC announcements, which the company's CEO, Jensen Huang, has already come out saying "Could wait".

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the ratification and public release of the Vulkan Ray Tracing provisional extensions, creating the industry's first open, cross-vendor, cross-platform standard for ray tracing acceleration. Primarily focused on meeting desktop market demand for both real-time and offline rendering, the release of Vulkan Ray Tracing as provisional extensions enables the developer community to provide feedback before the specifications are finalized. Comments and feedback will be collected through the Vulkan GitHub Issues Tracker and Khronos Developer Slack. Developers are also encouraged to share comments with their preferred hardware vendors. The specifications are available today on the Vulkan Registry.

Ray tracing is a rendering technique that realistically simulates how light rays intersect and interact with scene geometry, materials, and light sources to generate photorealistic imagery. It is widely used for film and other production rendering and is beginning to be practical for real-time applications and games. Vulkan Ray Tracing seamlessly integrates a coherent ray tracing framework into the Vulkan API, enabling a flexible merging of rasterization and ray tracing acceleration. Vulkan Ray Tracing is designed to be hardware agnostic and so can be accelerated on both existing GPU compute and dedicated ray tracing cores if available.

Here is the first die visualization of AMD's new "Renoir" processor. Having made its debut with Ryzen 4000 series mobile processors, "Renoir" succeeds a decade-long legacy of AMD APUs that combine CPUs with powerful iGPUs. AMD designed "Renoir" on TSMC's 7 nm silicon fabrication process. The die measures 156 mm², and has a transistor-count of 9.8 billion. The die shot reveals distinct areas that look like the processor's 8 CPU cores, a cluster of GPU compute units, the integrated memory controllers, southbridge, and PHYs for the chip's various I/O.

"Renoir" features 8 CPU cores based on the "Zen 2" microarchitecture, divided into two 4-core CCXs (CPU complexes). Unlike on 8-core chiplets meant for "Matisse" or "Rome" MCMs, the "Renoir" CCX only features 4 MB of shared L3 cache, probably because latencies to the memory controller are low enough. The L2 cache per core is unchanged at 512 KB. The "total cache" (L2 + L3 on silicon) adds up to 12 MB. The iGPU of "Renoir" is a hybrid between "Vega" and "Navi." The SIMD components are carried over from "Vega," while the display- and multimedia engines are from "Navi." The iGPU features 8 NGCUs that add up to 512 stream processors. Infinity Fabric covers much of the die area, connecting the various components on the die. AMD introduced a new dual-channel integrated memory controller that supports LPDDR4x at up to 4233 MHz, and standard DDR4 up to 3200 MHz.

Microsoft just put out of the complete hardware specs-sheet of its next-generation Xbox Series X entertainment system. The list of hardware can go toe to toe with any modern gaming desktop, and even at its production scale, we're not sure if Microsoft can break-even at around $500, possibly counting on game and DLC sales to recover some of the costs and turn a profit. To begin with the semi-custom SoC at the heart of the beast, Microsoft partnered with AMD to deploy its current-generation "Zen 2" x86-64 CPU cores. Microsoft confirmed that the SoC will be built on the 7 nm "enhanced" process (very likely TSMC N7P). Its die-size is 360.45 mm².

The chip packs 8 "Zen 2" cores, with SMT enabling 16 logical processors, a humongous step up from the 8-core "Jaguar enhanced" CPU driving the Xbox One X. CPU clock speeds are somewhat vague. It points to 3.80 GHz nominal and 3.66 GHz with SMT enabled. Perhaps the console can toggle SMT somehow (possibly depending on whether a game requests it). There's no word on the CPU's cache sizes.

Microsoft's upcoming Xbox Series X entertainment system is shaping up to be a technological monstrosity. Xbox group head at Microsoft, Phil Spencer, last revealed a picture of its semi-custom SoC back in January, by setting it as his Twitter display picture. Over the following weeks, many more technical details, such as the chip's 12 TFLOP/s combined compute power, would be let out. Spencer updated his display picture revealing a segment of the Xbox Series X mainboard with the SoC and memory chips surrounding it. The picture reveals the large SoC package in the center, surrounded on three sides by ten memory chips, possibly GDDR6, each with its own wiring to the SoC. This indicates that the SoC features a 320-bit wide memory interface.

As for the memory density, there's no way to tell. It could be 10 GB if those are 8 Gbit memory chips, or 20 GB if those are 16 Gbit. It boils down to which device the Xbox Series X the company wants to succeed. The Xbox One S features 8 GB of DDR3, while the spruced up Xbox One X features 12 GB of GDDR5. If the new Xbox Series X succeeds the latter, then it could very well feature 20 GB, more so given Microsoft's lofty design goals (4K UHD gaming with real-time ray-tracing). Microsoft leverages hUMA to use a common memory pool for both the CPU and GPU. Designed in collaboration with AMD on a TSMC 7 nm-class node (likely the N7P), the SoC features "Zen 2" CPU cores, and a GPU based on the RDNA2 graphics architecture.

ASUS today unveiled its top-spec ROG Strix GA35 series gaming desktop, the GA35-G35DX. This pre-built desktop comes with some serious hardware specs geared toward AAA gaming at 4K UHD resolution and future-proofing for many years. Under the hood is a potent combination of an AMD Ryzen 9 3950X 16-core processor, NVIDIA GeForce RTX 2080 Ti graphics, an ROG Strix X570 motherboard, and 64 GB of DDR4-3200 memory. Storage includes a 1 TB PCI-Express 4.0 x4 M.2 NVMe SSD, and a 2 TB SATA HDD. 802.11ac WLAN with Bluetooth 5.1, 1 GbE Ethernet, and SupremeFX integrated audio make for the rest of it.

ASUS is using a 240 mm AIO liquid CPU cooler for the Ryzen 9 3950X, while the graphics card retains ASUS's custom-cooling solution for the ROG Strix A11G variant of the RTX 2080 Ti. The ASUS in-house design case features several RGB embellishments which, along the with AIO and graphics card, can be controlled using the Aura Sync tab in Armory Crate. The case features a plastic handle along the top. The front hides a panel that reveals two 2.5-inch hot-swap drive bays with SATA 6 Gbps back-planes. Front-panel connectivity includes two USB 3.1 type-C, two USB 3.1 type-A, and HDA jacks. A 700 W 80 Plus PSU powers it. The desktop ships with Windows 10 Pro pre-installed. The company didn't reveal pricing.

TechPowerUp today released the latest version of GPU-Z, the popular graphics subsystem information and diagnostic utility. Version 2.30.0 introduces several new feature- and stability updates, and adds support for new GPUs. To begin with, support is added for AMD Radeon RX 590 GME, Radeon Pro W5500, Pro V7350x2, FirePro 2260, and Instinct MI25 MxGPU; Intel UHD (Core i5-10210Y), and a rare GeForce GTS 450 Rev 2. TechPowerUp GPU-Z 2.30.0 introduces support for reporting hardware-accelerated GPU scheduling in Windows 10 20H1 in the Advanced tab. The tab now also has the ability to show WDDM 2.7, Shader Model 6.6, DirectX Mesh Shaders, and DXR tier 1.1. A workaround for the DirectML detection on Windows 10 19041 built has been added. Graphics driver registry path is now displayed in the General section of the Advanced tab.

In the Sensors tab, the NVIDIA VDDC sensor has been renamed to "GPU voltage," and AMD's "GPU only power draw" sensor to "GPU chip-only power draw" to clarify that the sensor only measures the power draw of the GPU package and not the whole graphics card. AMD "Renoir" based processors and their iGPUs now show up as 7 nm. Windows Basic Display driver now no longer reports its status as WHQL or Beta. A crash during DirectX 12 detection has been fixed.DOWNLOAD: TechPowerUp GPU-Z 2.30.0

The change-log follows.

Stock markets around the world are experiencing a spectacular crash riding on COVID-19 investor fears, wiping out trillions of Dollars in investor wealth worldwide. Prominent indices around the world report some of the highest intra-day falls since the 2008 financial crisis. Tech stocks are hardly immune, with AMD reporting a 14.64% fall in share price settling down at 39.01 (it was over 48 right after the company's 2020 Financial Analyst Day just last week). NVIDIA is another big loser at the markets, with a 12.24% fall and 216.31 share price. Intel is right behind, with a 11.85% fall down to 45.54, and Micron Technology down 11.23% at 38.81.

BIOSTAR has been a manufacturer of robust and highly reliable motherboards for many years and has a wide range of models on both Intel and AMD platforms to choose from and a plethora of supplementary components catering to many user preferences.

Designed in the Mini-ITX form factor, the new BIOSTAR A10N-9630E motherboard is built with form and functionality to rival everything else in the market. With an inbuilt AMD A10-9630P quad-core processor and support for AMD Radeon R5 graphics, the BIOSTAR A10N-9630E is sleek, reliable and affordable suited for consumers who like to run basic tasks such as browsing the web, sending emails and running office applications and is perfect for many industrial applications because its ultra-small Mini-ITX form factor suited for small builds that save office space creating a neat, tidy workspace. The A10N-9630E motherboard is also designed for edge computing with better performance and low power consumption.

Bethesda today released the final system requirements for its upcoming massacre-fest Doom Eternal. The game, which is geared for release just 10 days from now (March 20th), promises to be one of the most impressive (and fluid) games in recent times, if the original, modern Doom is anything to go by.

Bethesda has even gone so far so as to list preferred specs for gamers that want to play in 4K at 60 FPS or in 1440p at 120 FPS: and these are pretty abusive, with an NVIDIA GeForce RTX 2080 Ti being required - likely because of its gargantuan 11 GB VRAM. AMD's Ryzen 7 3700X or Intel's Core i9-9900K are the requirements here, alongside 16 GB of system RAM. Check after the break for a breakdown on recommended specs for other resolutions and quality settings, and for Bethesda's trailer showing off customization options for your DOOM slayer. Do you have what it takes to run the game?

The B550 chipset has been absent for a while, meaning that mid-tier motherboard models were lacking and that space is about to be filled. So far, the only thing we got was a B550A chipset, which lacked proper support for PCIe 4.0 connection, based on the refreshed B450 chipset. The B550A supports only one PCIe 4.0 slot, the one connected directly to CPU, while the regular, non-A version is said to deliver proper PCIe 4.0 configuration. The first picture of AMD's upcoming B550 motherboard has appeared.

Thanks to the findings of VideoCardz, we have a picture of a B550 motherboard manufactured by SOYO, a Chinese motherboard manufacturer, and the brand behind Maxsun. Pictured below is a Micro-ATX format motherboard featuring two x16 PCIe 4.0 slots and one smaller, x1 slot. There are two DDR4 slots, along with M.2 PCIe 4.0 connector. Additionally, it has some interesting dragon-inspired masking as well.

Cybersecurity researcher Moritz Lipp and his colleagues from the Graz University of Technology and the University of Rennes uncovered two new security vulnerabilities affecting all AMD CPU microarchitectures going back to 2011, detailed in a research paper titled "Take A Way." These include "Bulldozer" and its derivatives ("Piledriver," "Excavator," etc.,) and the newer "Zen," "Zen+," and "Zen 2" microarchitectures. The vulnerabilities are specific to AMD's proprietary L1D cache way predictor component. It is described in the security paper's abstract as a means for the processor to "predict in which cache way a certain address is located, so that consequently only that way is accessed, reducing the processor's power consumption."

By reverse engineering the L1D cache way predictor in AMD microarchitectures dating from 2011 to 2019, Lipp, et al, discovered two new attack vectors with which an attacker can monitor the victim's memory accesses. These vectors are named "Collide+Probe," and "Load+Reload." The paper describes the first vector as follows: "With Collide+Probe, an attacker can monitor a victim's memory accesses without knowledge of physical addresses or shared memory when time-sharing a logical core." The second vector is described as "With Load+Reload, we exploit the way predictor to obtain highly-accurate memory-access traces of victims on the same physical core." The two vulnerabilities have not been assigned CVE entries at the time of this writing. The research paper, however, describes the L1D cache way predictor in AMD processors as being vulnerable to attacks that can reveal contents of memory or even keys to a vulnerable AES implementation. For now there is no mitigation to these attacks, but the company is reportedly working on firmware and driver updates. Access the research paper here.

When AMD pushed out the Radeon RX 590 in late-2018, its key spec was that the "Polaris 20" die had been ported to GlobalFoundries 12LPP (12 nm) silicon fabrication node, yielding headroom to dial up clock speeds over the 14 nm RX 580. The underlying silicon was labeled "Polaris 30" as it was the second major version of the "Polaris 10" die. NVIDIA's GeForce GTX 16-series beat the RX 590 both in performance and price, with even the GTX 1650 Super performing on-par, and the GTX 1660 beating it. It turns out that AMD has a lot of unsold 14 nm "Polaris 20" inventory to go around, and it wants to release them out as the new RX 590 GME.

An Expreview review of an XFX-branded RX 590 GME confirms that the the chip is indeed based on the "Polaris 20 XTR" silicon which is built on the 14 nm process. The card has GPU clock speeds that appear similar to reference clock speeds of the RX 590, with 1460 MHz base compared to 1469 MHz of the original RX 590. But this is where the similarities end. In its testing, Expreview found that the RX 590 GME is on average 5% slower than the RX 590, and performs halfway between the RX 580 and the original RX 590, which are differentiated by a roughly 10% performance gap. The 5% performance deficit would put the RX 590 GME on par with the new RX 5500 XT 4 GB, and trading blows with the GTX 1650 Super. Thankfully, the RX 590 GME is priced lower than RX 590 cards (about 7.7% cheaper), and could be very region-specific. The fact that the RX 590 GME is being sold with full AIB partner branding and retail packaging, shows that this isn't an OEM-only product. Read the complete review in the source link below.

AMD at its Financial Analyst Day 2020 presentation made a major clarification about its silicon fabrication process. It was previously believed that the company's upcoming "Zen 3" CPU microarchitecture and RDNA2 graphics architectures were based on TSMC's N7+ (7 nm EUV) silicon fabrication process because AMD would mark the two as "7 nm+" in its marketing slides. Throughout its Financial Analyst Day presentation, however, AMD avoided using that marker, and resorted to an amorphous "7 nm" marker, prompting one of the financial analysts to seek a clarification. At the time, AMD responded that they were aligning their marketing with that of TSMC, and hence chose to use "7 nm" in its new slides.

It turns out that the next step to TSMC N7, the company's current-generation 7 nm DUV silicon fabrication node, isn't N7+ (7 nm EUV), but rather it has a nodelet along the way, which the foundry refers to as N7P. This is a generational refinement of N7, but does not use EUV lithography, which means it may not offer the 15-20 percent gains in transistor densities offered by N7+ over N7. AMD clarified that "7 nm+" in its past presentations did not intend to signify N7+, and that the "+" merely denoted an improvement over N7. At the same time, it won't specify whether "Zen 3" and RDNA2 are based on N7P or N7+, so the company doesn't rule out N7+, either. We'll probably learn more as we near the late-2020 launch of "Zen 3" as EPYC "Milan."

At AMD CEO Dr Lisa Su's keynote address at the company's 2020 Financial Analyst Day, a curious slide element caught our eye - a never before seen graphics card design that bears AMD insignia. This is quite possibly AMD's upcoming reference design. The design fits into the language of sharp dark ridges and red accents the company adopted first with its Radeon RX 5700 XT MBA (made by AMD) graphics card, and the hypothetical RX 5600 XT reference design that never made it to the market as the SKU was a partner-exclusive.

In Reddit AMAs following the RX 5700 series launch, corporate vice-president and manager for Radeon, Scott Herkelman, mentioned that all subsequent Radeon RX products by the company would ditch the lateral-blower design in favor of an axial multi-fan design that's characteristic of most partner-designed cards. NVIDIA made that switch with its RTX 20-series Founders Edition cards, and AMD too implemented a triple axial fan design for its Radeon VII card, before switching back to a conventional lateral-blower design for its RX 5700 series. AMD would go on to give the reference design RX 5600 XT an axial dual-fan cooler.

With its 7 nm RDNA architecture that debuted in July 2019, AMD achieved a nearly 50% gain in performance/Watt over the previous "Vega" architecture. At its 2020 Financial Analyst Day event, AMD made a big disclosure: that its upcoming RDNA2 architecture will offer a similar 50% performance/Watt jump over RDNA. The new RDNA2 graphics architecture is expected to leverage 7 nm+ (7 nm EUV), which offers up to 18% transistor-density increase over 7 nm DUV, among other process-level improvements. AMD could tap into this to increase price-performance by serving up more compute units at existing price-points, running at higher clock speeds.

AMD has two key design goals with RDNA2 that helps it close the feature-set gap with NVIDIA: real-time ray-tracing, and variable-rate shading, both of which have been standardized by Microsoft under DirectX 12 DXR and VRS APIs. AMD announced that RDNA2 will feature dedicated ray-tracing hardware on die. On the software side, the hardware will leverage industry-standard DXR 1.1 API. The company is supplying RDNA2 to next-generation game console manufacturers such as Sony and Microsoft, so it's highly likely that AMD's approach to standardized ray-tracing will have more takers than NVIDIA's RTX ecosystem that tops up DXR feature-sets with its own RTX feature-set.

AMD at its 2020 Financial Analyst Day event unveiled its upcoming CDNA GPU-based compute accelerator architecture. CDNA will complement the company's graphics-oriented RDNA architecture. While RDNA powers the company's Radeon Pro and Radeon RX client- and enterprise graphics products, CDNA will power compute accelerators such as Radeon Instinct, etc. AMD is having to fork its graphics IP to RDNA and CDNA due to what it described as market-based product differentiation.

Data centers and HPCs using Radeon Instinct accelerators have no use for the GPU's actual graphics rendering capabilities. And so, at a silicon level, AMD is removing the raster graphics hardware, the display and multimedia engines, and other associated components that otherwise take up significant amounts of die area. In their place, AMD is adding fixed-function tensor compute hardware, similar to the tensor cores on certain NVIDIA GPUs.