MSI, the world leading gaming motherboard manufacturer, takes initiative to release BIOS updates for AMD motherboards. This latest AMD Combo PI version 1.0.0.4 Patch B (SMU v46.54) has a massive improvement at all points concerning debugs and optimization for the previous version. Specifically, optimized system boot up procedure allows users to shorten boot time and speed up the boot process. Compared to previous 1.0.0.3 version, the boot speed entering into BIOS is faster by 20%.

At the moment, the BIOS for X570 motherboards will be ready for users to download and update in the end of October. The updated BIOS version supports Ryzen 5 2400G and Ryzen 3 2200G running in X570 platform. On the other hand, it also supports RAID function including SATA- and NVMe-based drives for X570 motherboards. We are still working hard on other existing lineup of 300- and 400-series motherboard and will be released soon in November.

One of the first reviews of Intel's new flagship HEDT processor, the Core i9-10980XE, just hit the web. Lab501.ro got their hands on a freshly minted i9-10980XE and put it through their test bench. Based on the "Cascade Lake-X" silicon, the i9-10980XE offers almost identical IPC to "Skylake-X," but succeeds the older generation with AI-accelerating DLBoost instruction-set, an improved multi-core boosting algorithm, higher clock speeds, and most importantly, a doubling in price-performance achieved by cutting the cores-per-Dollar metric by half, across the board.

Armed with 18 cores, the i9-10980XE is ahead of the 12-core Ryzen 9 3900X in rendering and simulation tests, although not by much (for a chip that has 50% more cores). This is probably attributed to the competing AMD chip being able to sustain higher all-core boost clock speeds. In tests that not only scale with cores, but are also hungry for memory bandwidth, such as 7-zip and Media, Intel extends its lead thanks to its quad-channel memory interface that's able to feed its cores with datasets faster.

AMD has released the Radeon Software Adrenalin 19.10.2 beta drivers. These drivers bring improved support for "Call of Duty: Modern Warfare," which sees up to 18% better performance on the Ultra preset when using a Radeon RX 5700 XT. "The Outer Worlds" also sees improved support and sees 8% better performance at the Very High preset again on the Radeon RX 5700 XT. Improved support and better performance are always welcome; however, this release also offers some much-needed fixes, including application hang in Borderlands 3, which will likely make quite a few gamers happy. For a full list of fixes and known issues, check the full change-log below. Otherwise, you can grab the new driver from the link below.DOWNLOAD: AMD Radeon Software Adrenalin 19.10.2 Beta
The change-log for 19.10.2 follows.

In today's world, computer security is becoming very important due the exponential increase in malware and ransomware attacks. Various studies have shown that a single malicious attack can cost companies millions of dollars and can require significant recovery time. With the growth of employees working remotely and connected to a network considered less secure than traditional corporate network, employee's computer systems can be perceived as a weak security link and a risk to overall security of the company. Operating System (OS) and independent hardware vendors (IHV) are investing in security technologies which will make computers more resilient to cyberattacks.

Just in time for AMD's 3rd generation Ryzen Threadripper processors and the AMD TRX40 chipset, GIGABYTE launched the AORUS Gen4 AIC Adapter, an add-on card that converts a PCI-Express 4.0 x16 upstream link to four M.2-22110 slots with PCI-Express 4.0 x4 wiring, each. This isn't the first card of this kind, but is certified to work with PCIe gen 4.0 SSDs. The TRX40 platform provides at least two PCI-Express 4.0 x16 slots, from which one can be allocated to your graphics cards, and the other to a fast storage solution like this, so you can use your motherboard's NVMe RAID features. The card is backwards compatible with older generations of PCIe.

The card features a large copper heatsink that cools the drives under the airflow of a fan. The PCB of this card features a PCI-Express 4.0 x16 interface, four M.2-22110 slots with PCI-Express 4.0 x4 wiring, each, and a controller that uses eight thermal diodes to sense drive temperatures and accordingly adjust the speed of the 50 mm lateral-flow fan that pushes air through the heatsink and out of the rear panel. The card also has four LEDs that provide link+activity indication. It meets the electrical specification of PCI-Express gen 4.0, and features gen 4.0 re-drivers. An aluminium alloy shroud and back-plate with brushed-metal finish and diamond-cut edges make for the rest of it. We expect this card to be priced around USD $130. A credible source tells us that the card will also be included with some of GIGABYTE's premium TRX40 motherboards.

EK, the a premium liquid cooling gear manufacturer based in Europe, is releasing an AMD AM4 socket based monoblock belonging to the Quantum Line of products, the EK-Quantum Momentum ROG Crosshair VIII Hero D-RGB. This monoblock is engineered specifically for the ROG Crosshair VIII Hero motherboard. The addressable D-RGB LED in the monoblock is compatible with ASUS Aura Sync RGB control, thus offering a full lighting customization experience for every single diode at any given time.

This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Ryzen AMD processors and the monoblock is compatible with the X570 based ROG Crosshair VIII Hero motherboard. This monoblock uses the latest generation of EK cooling engine used on the Quantum Lineup to ensure the best possible CPU cooling while not reducing flow to other components. This water block directly cools the AMD4 socket type CPU, as well as the voltage regulation (MOSFET) module. Liquid flows directly over all critical areas, providing the enthusiasts with a great solution for high and stable overclocks. Like with every EK monoblock, the EK-Quantum Momentum ROG Crosshair VIII Hero D-RGB features high flow design and it can be easily used with the system using weaker water pumps or lower pump speed settings as well. The Momentum monoblock also comes with sophisticated D-RGB (addressable) lightning which connects to a standard 3-pin 5 V D-RGB header.

AMD's upcoming Ryzen 9 3950X socket AM4 processor beats Intel's flagship 18-core processor, the Core i9-10980XE, by a staggering 24 percent at 3DMark Physics, according to a PC Perspective report citing TUM_APISAK. The 3950X is a 16-core/32-thread processor that's drop-in compatible with any motherboard that can run the Ryzen 9 3900X. The i9-10980XE is an 18-core/36-thread HEDT chip that enjoys double the memory bus width as the AMD chip, and is based on Intel's "Cascade Lake-X" silicon. The AMD processor isn't at a tangible clock-speed advantage. The 3950X has a maximum boost frequency of 4.70 GHz, while the i9-10980XE isn't much behind, at 4.60 GHz, but things differ with all-core boost.

When paired with 16 GB of dual-channel DDR4-3200 memory, the Ryzen 9 3950X powered machine scores 32,082 points in the CPU-intensive physics tests of 3DMark. In comparison, the i9-10980XE, paired with 32 GB of quad-channel DDR4-2667 memory, scores just 25,838 points as mentioned by PC Perspective. Graphics card is irrelevant to this test. It's pertinent to note here that the 3DMark physics test scales across practically any number of CPU cores/threads, and the AMD processor could be benefiting from a higher all-core boost frequency than the Intel chip. Although AMD doesn't mention a number in its specifications, the 3950X is expected to have an all-core boost frequency that's north of 4.00 GHz, as its 12-core sibling, the 3900X, already offers 4.20 GHz all-core. In contrast, the i9-10980XE has an all-core boost frequency of 3.80 GHz. This difference in boost frequency, apparently, even negates the additional 2 cores and 4 threads that the Intel chip enjoys, in what is yet another example of AMD having caught up with Intel in the IPC game.

AMD is going to launch its premium HEDT Threadripper CPUs, based on 7 nm manufacturing process, as soon as November 5th arrives. To prepare for the launch, manufacturers like GIGABYTE have been working hard to bring new CPUs to life, by integrating AMD's new chipsets into the new motherboard models. Dubbed "Castle Peak" and "Sharkstooth", the two new CPU variants will be accompanied by TRX40, TRX80 and WRX80 chipsets, each enabling additional features.

We now got a hold of the first picture of what appears to be GIGABYTE's AORUS motherboard based on TRX40 chipset. Coming in with the E-ATX form factor, this motherboard is similar in size with the previous X399 AORUS Xtreme model. It features four PCIe 4.0 x16 slots and eight slots that support four-channel DDR4 memory, so it is likely that TRX40 chipset is meant only for such configuration, with TRX80 and WRX80 chipsets being reserved for eight-channel memory configurations. Another thing to note is the presence of chipset fan, indicating that the TDP of these chipsets is high and it needs to be actively cooled in normal use cases. If you remember, plenty of X570 boards have a fan on chipset as well due to their TDP.

The folks over at Videocardz managed to snag some impressive information on AMD-s upcoming Threadripper lineup - their launch dates. According to the tech publication, a source within AMD provided information regarding previously-set dates for paper and hardware launches that stand at November 5th for the formal announcement of the next generation HEDT CPUs, followed by lifted embargos on reviews and actual product availability come November 19th. Apparently, AMD will only launch the Threadripper 3960X and 3970X come November 5th (remember remember the 5th of November), with a product announcement for the Threadripper 3990X which will only be launched in January 2020.

AMD will also formally unveil their next-gen Threadripper TRX40 platformon November 5th (which won't be compatible with previous-gen Threadrippers). This makes sense - CPUs without a platform to pin them onto doesn't seem like a conscientious business decision. No information was available on clockspeeds and core counts at this time, though the Threadripper 3960X, the base of the new lineup, is expected to sport 24 cores and 48 threads of Zen 2 goodness.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce an extreme low-latency, high-speed DDR4 memory kit at DDR4-4000 CL15-16-16-36 in a 32 GB (8 GB x4) capacity configuration under the classic Trident Z and the RGB-enabled Trident Z Royal memory series. Once again, these extraordinary memory kits are manufactured using high-performance Samsung B-die ICs to achieve the world's lowest latency of CL15 at DDR4-4000.

At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. This means pushing for lower latency timings. Previously, the best CAS latency that memory kits at the DDR4-4000 level could achieve was at CL17. This is surpassed by the new DDR4-4000 CL15-16-16-36 32 GB (8 GB x4) memory kit running under 1.5 V, shown validated on the MSI MEG Z390 ACE motherboard and Intel Core i7-9700K processor in the screenshot below.

AMD late Thursday released the Radeon Software Adrenalin 19.10.1 WHQL. These drivers are identical to the Adrenalin 19.10.1 Beta drivers released earlier this month, with the only difference being WHQL certification. AMD is picking up the pace with WHQL releases of Radeon Software, as more OEMs are implementing Radeon RX 5700-series and upcoming RX 5500-series GPUs, and prefer WHQL-signed drivers. The 19.10.1 drivers introduce support for AMD's new Radeon RX 5500 series graphics cards based on its new 7 nm "Navi 11" silicon, along with fixes for "Borderlands 3" running in DirectX 12 mode, optimization for "GRID," and fixes certain display problems with high refresh-rate settings.

DOWNLOAD: AMD Radeon Software Adrenalin 19.10.1 WHQLChange-log for 19.10.1 follows.

AMD's latest Product Master guide (since taken down but immortalized in the interweb) has a surprise in store for AMD's Ryzen 7 desktop CPU lineup. Sandwiched in-between the Ryzen 7 3700X and the Ryzen 7 3800X, a new entry has reared its head, in the form of the Ryzen 7 3750X. The new CPU is specified to keep the same 105 W TDP of its elder sibling Ryzen 7 3800X, instead of keeping the Ryzen 7 3700X's 65 W TDP. Technically, this is possible to achieve in both pricing and performance: the Ryzen 7 3750X, if it ever is launched (it could be a specific release for system integrators or other interested parties outside the usual mainstream desktop suspects) could sport increased base clocks compared to the Ryzen 7 3700X's 3.6 GHz base / 4.4 GHz boost clocks... But not easily, considering the Ryzen 7 3800X starts at 3.9 GHz base / 4.5 GHz boost. It's possible to release the 3750X with a 200 MHz boost on base clocks and the same 4.4 GHz boost, but does it make any sense to do so?

It could - even if with some forced optimism - should AMD price it closer to the Ryzen 7 3700X than to the Ryzen 7 3800X. The $329 and $399 prices for those CPUs, respectively, leave a gap that could be filled by the Ryzen 7 3750X at around the $349 mark, for example. It's likely most users would be making the jump from the 65 W CPU than dropping less cash compared to the 3800X, so AMD's margins per sale would definitely improve. At the same time, this could be a way for AMD to cope with TSMC's 7 nm increase in lead-times and lower availability of CPUs by moving stock from the 65 W CPU to the pricier 3750X in parts that can actually run at those frequencies. Driving their lineup's ASP up ensures AMD can keep a steady stream of income should availability decline - less parts sold at a greater price can shore up some of the lost cash influx.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to launch a new addition to its 4th generation of RACING motherboards with the powerful yet humble BIOSTAR RACING X570GTA. Built with designers and content creators in mind, the RACING X570GTA combines a set of onboard features to ensure that quality content can be produced with a system that users can rely on. The BIOSTAR RACING X570GTA is tastefully designed with the iconic BIOSTAR RACING GEN 4 features and grey lightning strikes that represents the lightning-fast performance and ultra-responsives that gives gamers the competitive edge to take their gaming experience to the next level.

The BIOSTAR RACING X570GTA, equipped with the latest X570 chipset for AMD socket AM4, brings support for 3rd Gen Ryzen processors, an essential tool for content creators. While designers rely on high performance and responsiveness to render videos or 3D content, which is supported by the RACING X570GTA PCI-e 4.0 lanes (offering bandwidth of 64 GB/s and compatibility for the latest as well as previous generation graphics cards), the users can rest assured their investment in high-end hardware is secured with the BIOSTAR's exclusive Iron Slot Protection on the x16 lanes which helps handle heavier graphics cards, prevent bending, and extend the longevity of the slots. In addition, PCI-e 4.0 also opens the door to PCI-e M.2 4.0, the latest storage interface which delivers the highest bandwidth (64 GB/s) and offers lower latency, making launching programs such as video and photo editing software, and accessing heavy files a flash.

With its 3rd generation Ryzen Threadripper "Castle Peak" HEDT processor family, AMD isn't bothering with 16-core models as the company's mainstream desktop socket AM4 platform already offers those many cores with the upcoming Ryzen 9 3950X. The lineup will begin with the Ryzen Threadripper 3960X, which is the 24-core/48-thread part. The model number "3950X" is already taken up by the 16-core socket AM4 chip. Confirmation of this came from an "Ashes of the Singularity" screenshot that references an "AMD Ryzen Threadripper 3960X 24-core Processor."

AMD's decision to start the lineup at 24 cores is interesting, as it looks to keep up its competitiveness against Intel, which recently launched its 10th generation "Cascade Lake-X" Core i9 HEDT processor series, with all parts priced under $1000, including the range-topping 18-core/36-thread one. It remains to be seen if the Threadripper 3960X can beat it while holding onto a sub-$1,000 price. The previous-generation 24-core 2970WX beat the i9-9980XE in some rendering and simulation tests that scaled with cores and which weren't too heavy on memory bandwidth. With its 3rd generation Threadripper series, AMD is eliminating a key memory bottleneck, giving each core on the chip an equal access to the processor's monolithic quad-channel memory interface.

Here is the first picture of a motherboard based on AMD's upcoming mid-range desktop motherboard chipset, the AMD "B550A," the ASRock B550AM Gaming. The board was spied inside a pre-built desktop at a Best Buy store. This is the first time we've seen the mid-range chipset being referenced as "B550A" and not "B550." The "A" may not be part of the motherboard's model name as the "M" denotes Micro-ATX and usually succeeds the chipset model in ASRock's nomenclature. The B550(A) will be an important chipset for AMD as it will enable motherboards priced under the $150 mark that support AMD's 3rd generation Ryzen processor's I/O natively.

While the X570 is an in-house development by AMD, the B550 is sourced from ASMedia, and is expected to be a new version of the "Promontory-LP" silicon. The only thing that sets this chip apart from the 400-series "Promontory-LP" is PCI-Express gen 3.0 certification. The chipset talks to the AM4 SoC over a PCI-Express 3.0 x4 link, and puts out up to 8 PCI-Express gen 3.0 downstream lanes. A 3rd gen Ryzen processor on a B550 motherboard still puts out PCI-Express gen 4.0 connectivity, which means you get one PCI-Express 4.0 x16 slot, and one M.2 slot with PCI-Express 4.0 x4 wiring. The rest of the chipset's I/O will be similar to the 400-series, which includes six SATA 6 Gbps ports, up to two 10 Gbps USB 3.1 ports, up to four 5 Gbps USB 3.1 ports, and eight USB 2.0/1.1 ports. If the AM4 SoC installed is a 3rd gen Ryzen, then you'll get a couple more 10 Gbps USB 3.1 ports. AMD partners could use the opportunity to launch some of the more upscale B550 motherboards with the latest 2.5 GbE wired LAN, and 802.11ax Wi-Fi 6.Update (16/10): We learn later down in the referenced Reddit thread, including from comments by AMD's Robert Hallock, that the B550A is a rebranded B450 targeted at OEMs. The B550 (non-A) is what is the upcoming chipset detailed in this article.

Following the success of their Touchaqua-branded Summit MS OLED CPU block earlier this year, which was for Intel platforms only at that time, Bitspower have decided to add the OLED display to their main brand in the form of the new Summit M CPU water block. The design is a departure from the squared-off Summit MS, with a smaller form factor that also increases CPU socket compatibility to the red camp out of the box. The OLED display is housed on a metal top plate, with an acrylic body enabling side views of the coolant, a temperature sensor enabling readout on the display, as well as the integrated dRGB LEDs for lighting options compatible with ASUS AURA Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome.

The cooling engine uses a nickel-plated copper base plate, with 0.3 mm CNC-machined fins and microchannels that are part of a split central-inlet flow promising high coolant flow directly over the fins to remove as much heat from the CPU as possible. This is similar to the vast majority of CPU block designs in practice, but manufacturers tend to experiment with the flow schematic to see if they can do better, so time will tell how the Summit M fares on the TechPowerUp test bench. In the meantime, it is available for direct purchase from the Bitspower store for 4500 NTD (~$150 USD) before any applicable taxes and shipping costs.

These could very well be the first pictures of a custom-design Radeon RX 5500 graphics card. Pictures of the purported XFX Radeon RX 5500 THICC II made it to the web courtesy VideoCardz. It's very likely that this is the RX 5500 looking at its power-connectivity, which includes just a single 8-pin PCIe input. An RX 5700-series product would at least feature an 8+6-pin input design. The display I/O is also peculiar, with not one but two dual-link DVI-D connectors (no analog pins on either), and one each of DisplayPort and HDMI. The card has the same design language as its THICC series siblings from the RX 5700-series.

The cooling solution uses two shrouds (the front shroud and the back-plate) that meet in the middle in symmetry. Two fans ventilate an aluminium fin-stack heatsink that features two or three 8 mm-thick copper heat pipes. The cooler is longer than the card itself. Based on the 7 nm "Navi 11" silicon, the Radeon RX 5500 features 22 RDNA compute units working out to 1,408 stream processors, boost frequencies of up to 1848 MHz, and up to 8 GB of GDDR6 memory across a 128-bit wide memory interface.

EK, the leading premium computer liquid cooling gear manufacturer, is releasing the EK-AC Radeon RX 5700 +XT D-RGB water block as a part of the Fluid Gaming lineup. This water block is compatible with reference design AMD Radeon RX 5700 and 5700 XT graphics cards as well. One of the current best-buy graphics cards just got a best-buy block made of aluminium to make the ultimate combo for budget-oriented buyers that value silence and maximum performance with enhanced reliability and longevity.

This aluminium water block directly cools the GPU, 8 GB of GDDR6 memory, and VRM (voltage regulation module) as cooling liquid is channeled directly over these critical areas. The base of the block is made of high-quality aluminium while the top is made of glass-like acrylic material. The entire water block is lit up with D-RGB (Addressable) LED. Sealing is ensured by high-quality EPDM O-Rings with the standoffs already pre-installed allowing for a safe and easy installation procedure.

The AMD Embedded business provides SoCs and discrete GPUs that enable casino gaming companies to create immersive and beautiful graphics for the latest in casino gaming platforms, which are adopting the same high-quality motion graphics and experiences seen in modern consumer gaming devices. AMD Embedded provides casino and gaming customers a breadth of solutions to drive virtually any gaming system. The AMD Ryzen Embedded V1000 SoC brings CPU and GPU technology together in one package, providing the capability to run up to four 4K displays from one system. The AMD Ryzen Embedded R1000 SoC is a power efficient option while providing up to 4X better CPU and graphics performance per dollar than the competition.

Beyond SoCs, AMD also offers embedded GPUs to enable stunning, immersive visual experiences while supporting efficient thermal design power (TDP) profiles. AMD delivers three discrete GPU classes to customers with the AMD Embedded Radeon ultra-high-performance embedded GPUs, the AMD Embedded Radeon high-performance embedded GPUs and the AMD Embedded Radeon power-efficient embedded GPUs. These three classes enable a wide range of performance and power consumption, but most importantly offer features that the embedded industry demands including planned longevity, enhanced support and support for embedded operating systems.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced a new kit of its award-winning CORSAIR VENGEANCE LPX DDR4 Memory, becoming the first commercially available high-frequency DRAM to break the 5,000 MHz barrier. This record-setting Micron-based memory is available now in a 2x 8 GB kit, reaching its full potential in select MSI X570 motherboards running 3rd Gen AMD Ryzen Desktop Processors.

VENGEANCE LPX once again sets a new milestone in the world of performance memory, continuing to deliver on its long-standing tradition of excellence thanks to the partnership between CORSAIR, MSI, and AMD. The new modules have been specifically designed and fully tested to achieve their record-breaking maximum frequency of 5,000 MHz on the Ryzen 3000 platform in MSI MEG X570 GODLIKE, MSI MEG X570 ACE, MSI MEG X570 UNIFY, and PRESTIGE X570 CREATION motherboards using their included automated overclocking utilities.

AMD is giving finishing touches to its 3rd generation Ryzen Threadripper HEDT processor lineup, and the first wave of these chips, starting with a 24-core model, will launch alongside the AMD TRX40 chipset. It turns out that the chipset won't be compatible with 1st and 2nd generation Ryzen Threadripper processors. The upcoming 3rd generation Threadripper chips won't be backwards-compatible with the AMD X399 chipset, either. We've been hearing from reliable sources rumors of this segmentation from AMD for a few days now, and tech journalist ReHWolution just tweeted its confirmation having obtained info on upcoming motherboards from a leading brand.

The underlying reason between this restriction remains a mystery. We know that the EPYC "Rome" MCM is pin-compatible with first-generation EPYC "Naples" chips due to the fact that the newer chips are drop-in compatible with older servers via a BIOS update. The TR4 socket, too, is nearly identical to SP3r2, but for four out of eight memory channels being blanked out. It remains to be seen if for TRX40 motherboards, AMD re-purposed these unused pins for something else, such as additional PCIe connectivity or more electrical pins. We'll find out in November, when AMD is expected to launch these chips.

MSI today inadvertently confirmed preparations for the release of TRX40-based motherboards, which will allow for AMD's next-gen, Zen 2-based Threadripper CPUs to slot in quite nicely in a bed of silicon. Via a promo page for new motherboard purchases, where MSI listed the eligible motherboards for a $25 Steam rebate after purchase, the company listed a number of their already-known motherboard quantities... And the new Creator TRX40. This is a new series of motherboards from MSI, first populated by the X299 motherboards, which caters to expandability and storage capabilities so as to accelerate content creation and production.

The reference to the Creator TRX40 has already been silently deleted in MSI's page.

The upcoming single-player Star Wars Jedi: Fallen order will be a tall calling for Respawn. Few franchises are as loved as Star Wars, and this one will definitely leave a mark in the company's legacy. It's unlikely EA will "pull an EA" on the studio even if it flops, though: Apex Legends remains an incredibly successful release form Respawn Entertainment, and it should be enough to hold EA's reins - at least for a while.

The system requirements for the highly-awaited, story-driven single-player game have been outed, and they're in the usual side of things. Minimum requirements call for an AMD FX-6100 or an Intel Core i3-3220, paired with 8 GB of RAM and an AMD Radeon HD 7750 or NVIDIA GeForce GTX 650 - alongside 65 GB of storage. The recommended specs are relatively standard as well, and nothing to throw users in an upgrade fit... We're looking at an AMD AMD Ryzen 7 1700 or an Intel i7-6700K, 16 GB of system RAM, An AMD RX Vega 56 or NVIDIA GTX 1070 graphics cards. Star Wars Jedi: Fallen Order drops on November 15th.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

Sony's next-generation PlayStation 5 could land under many Christmas trees...in the year 2020, as the company plans a Holiday 2020 launch for the 4K-ready, 8K-capable entertainment system that has a semi-custom chip many times more powerful than the current generation, to support its lofty design goals. By late-2020, Sony calculates that some form of ray-tracing could be a must-have for gaming, and is working with its chip designer AMD to add just that - hardware-acceleration for ray-tracing, and not just something that's pre-baked or emulated over GPGPU.

Mark Cerny, a system architect at Sony's US headquarters, in an interview with Wired, got into the specifics of the hardware driving the company's big platform launch for the turn of the decade. "There is ray-tracing acceleration in the GPU hardware," he said, adding "which I believe is the statement that people were looking for." Besides raw processing power increases, Sony will focus on getting the memory and storage subsystems right. Both are interdependent, and with fast NAND flash-based storage, Sony can rework memory-management to free up more processing resources. AMD has been rather tight-lipped about ray-tracing on its Radeon GPUs. CEO Lisa Su has been dismissive about the prominence of the tech saying "it's one of the many technologies these days." The company's mid-2019 launch of the "Navi" family of GPUs sees the company skip ray-tracing hardware. The semi-custom chip's GPU at the heart of PlayStation 5 was last reported to be based on the same RDNA architecture.