Phil Spencer, head of the Xbox division at Microsoft, posted a picture of the semi-custom SoC at the heart of the company's upcoming "Project Scarlett" Xbox Series X game console as his Twitter avatar. The picture reveals a chip that looks visibly similar to that of "Project Scorpio" (Xbox One X). The picture was also taken from an angle that reveals the pinkish/auburn tinge of 7 nm AMD chips made at TSMC. You'll find the same tinge on chips such as "Navi 10" when viewed from an angle. The die unabashedly bears the "Project Scarlett" and "8K" markings.

Next-generation game consoles are marketing 4K 60 Hz and 8K gaming capability. They likely use a combination of dynamic resolution-scale and variable rate shading to achieve this. The "Project Scarlett" SoC is a semi-custom chip co-designed by Microsoft and AMD, and uses CPU cores based on the company's "Zen 2" microarchitecture, combined with a powerful GPU based on RDNA2, which features hardware-accelerated ray-tracing and variable-rate shading. Hardware enthusiasts on Twitter are abuzz with estimating the die-size of the SoC, with calculations pinning it around the 350 mm² mark ±10 mm², or roughly similar to that of "Project Scorpio," but one must factor in the switch to 7 nm from 16 nm significantly increasing transistor-density.

While many users were likely expecting AMD to launch their lower-tier alternatives B550 and A520 chipset solutions for their Ryzen 2 CPUs shortly after their release to the market last year, users who want to pair a more inexpensive motherboard have had to wait in the rain until now. At the time, industry sources pointed towards fabrication of ASMedia's B550 and A520 chipsets for the AM4 platform to begin shipping to motherboard manufacturers in Q4 2019.

Now, new reports say that production of these chipsets (simpler in features, and thus, in price, whilst also not requiring active cooling) will only begin in Q1 2020, which means likely retail availability (at least in significant volumes) in Q2 at the earliest. It seems that users will, for the time being, have to make do with the usually top-of-the-line chipset option for the AMD platform - which is, coincidentally, the one with bigger margins for AMD.

AMD veterans yesterday must've sneakily left their respective offices yesterday for a well-deserved rest and a glass of champagne - and if they didn't, they deserved it. The company yesterday broke their previous all-time stock pricing record achieved way back in June 2000, at $47.50 per share, when it traded at $49.10 per share yesterday.

It's been a long time coming for AMD, and irrespective of any brand loyalty, it certainly pays, as a consumer and as an enthusiast, to see a company that nearly went bankrupt in 2016 - who had to sell and then lease back their own headquarters for a quick cash infusion, spin-off its manufacturing division in a change of strategy that couldn't have been easy on morale - achieve such a colossal feat. Even more impressive this is should you even be considering the blue behemoth the company actually has to contend with - a $260.35B Intel who, by both happenstance and poor CPU execution vision, is being fired upon on all markets by comparative David AMD, today valued at $51.07B. Here's hoping all AMD employees got their well-deserved party and standing ovation from each other. None of them - not even Lisa Su - achieved this alone.

Not content to let AsRock call out all of the enthusiast's attention for today, XFX has (perhaps not so inadvertently) leaked their upcoming interpretation of the AMD RX 5600 XT. Named the THICC II PRO STAGING (that's somewhere between a mouthful and two), it apparently features the same cooling solution as the RX 5500 XT THICC II PRO as well as a similar color scheme - black and bronze. According to XFX, the RX 5600 XT does indeed feature 2304 Stream Processors and 6 GB of 12 Gbps GDDR6 in a 192-bit memory configuration.

The graphics card isn't actually that bad of a looker with its rounded edges and almost full-black industrial design. XFX are quoting a game clock at 1460 MHz, which is higher than what has been leaked as the AMD reference. Video output includes 1x HDMI and 3x DisplayPort. XFX offers a three year limited warranty on the graphics card.

Here's the first press-shot of an upcoming Radeon RX 5600 XT custom-design graphics card, this one from ASRock. The RX 5600 XT Phantom Gaming OC appears to combine a compact PCB with a long triple-fan cooling solution that's 29 cm in length. The cooling solution features an aluminium fin-stack heatsink that's ventilated by a trio of 80 mm spinners. The card draws power from a single 8-pin PCIe power connector, indicating a significantly lower power draw target than the RX 5700-series. The card's box confirms 6 GB of GDDR6 memory, and factory-overclocked speeds, which according to VideoCardz are 1560 MHz gaming.

From an older report, we know that the RX 5600 XT is designed to compete with NVIDIA's GeForce GTX 1660 Ti. It's armed with 2,304 stream processors, 144 TMUs, possibly 48 ROPs, and a 192-bit wide GDDR6 memory interface holding 6 GB of memory, which ticks at 12 Gbps. The RX 5600 XT appears to be carved from the 7 nm "Navi 10" silicon, with a quarter of its memory interface disabled. AMD is expected to debut the card at its International CES 2020 presser, later this month.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

In the press-deck of its 3rd Generation Ryzen Threadripper 3970X/3960X launch, AMD teased its flagship HEDT part for the TRX40 platform, the Ryzen Threadripper 3990X, with a 2020 launch date. It should come as little surprise then, that the core-count gap between the 3970X and the 3990X has an SKU in the middle - the 3980X. This SKU reportedly surfaced in CPU-Z 1.91 code. The 3980X is a 48-core/96-thread monstrosity for when 64 cores are too many, and 32 too few.

Like the 3990X, the 3980X will likely be built with eight "Zen 2" CCDs (chiplets) for optimal IFOP bandwidth utilization and heat-spread. Each CCD will likely be configured with 6 cores (3 per CCX), adding up to 48 cores on the package. Much like the 3990X, clock-speeds of the 3980X remain under the wraps. AMD is expected to launch the two some time in 2020, featuring compatibility with existing AMD TRX40 chipset motherboards. The company could target a sub-$3,000 price-point to make the Xeon W-3175X obsolete both in performance and value.

AMD's upcoming Radeon RX 5600 XT graphics card features the same exact stream processor count as the $350 RX 5700, according to a leaked specs sheet of a an AIB partner's custom-design graphics card. With a stream processor count of 2,304, it's safe to assume that the RX 5600 XT is based on the same 7 nm "Navi 10" silicon as the RX 5700 series. What set the RX 5600 XT apart from the RX 5700, besides lower clock-speeds, is the memory subsystem, which is severely stripped down. The Radeon RX 5600 XT will be equipped with 6 GB of GDDR6 memory across a 192-bit wide memory interface. What's more, the memory ticks at 12 Gbps, compared to 14 Gbps on the RX 5700 series.

With these specs, the RX 5600 XT has 288 GB/s of memory bandwidth at its disposal, same as NVIDIA's GeForce GTX 1660 Ti. In contrast, with 8 GB of 256-bit GDDR6 running at 14 Gbps, the RX 5700 enjoys 448 GB/s. The specs sheet suggests that AMD has also dialed down the engine clock-speeds (GPU clocks) a bit, with up to 1620 MHz boost, up to 1460 MHz gaming, and 1235 MHz base. With these specs, it's highly likely that the RX 5600 XT outperforms the GTX 1660 Ti and gets close to the RTX 2060. It all boils down to pricing. The RX 5500 XT is a decent GTX 1650-series alternative with a lukewarm price thanks to NVIDIA's aggressive product-stack management by getting its partners to lower prices of the GTX 1660 and GTX 1660 Super. It would be interesting to see if AMD can outfox NVIDIA in the sub-$300 market.

AMD's upcoming Ryzen 4000 series processors will be based on the company's Zen 3 design, which will feature a deeply revised architecture aiming to offer increased performance (surprising no-one). AMD themselves have already said that Zen 3 will offer performance increases in line with the release of new architectures - and we all remember the around 15% increase achieved with the release of Zen 2 Ryzen 3000 series, which surprised even AMD on its performance capabilities. Several sources around the web are quoting an around 17% increase in performance, taking into account increased operating frequencies of Zen 3 (100 to 200 MHz at least for the enterprise solutions, which could pave the way for even higher increases in consumer-geared products) and increased IPC of its core design. The utilization of EUV in the 7 nm process shouldn't have much to do with the increased frequencies of the CPUs, and will mostly be used to reduce the number of masks that are required for production of AMD's Zen 3 CPUs (which in turn will lead to increased yields).

Sources are claiming an increase of up to 50% in Zen 3's Floating Point Units (FPU) compared to Zen 2, while integer operations should make do with a 10-12% increase. Cores should remain stable across the board - and with that increase in performance, I'd say an upper limit of 16 physical and 32 logic cores in a consumer-geared CPU is more than enough. Increased IPCs and frequencies will definitely make AMD an even better proposition for all markets - gaming in particular, where Intel still has a (slightly virtual) hold in consumer's minds.

AMD's upcoming RX 5600 XT will bring about a much needed power increase over the current baseline RX 5500 series, slotting smoothly between it and the mainstream, high-performance RX 5700 and RX 5700 XT. New benchmarks spotted by Videocardz place AMD's upcoming graphics card (which could feature a 6 GB VRAM with higher capacities likely to be offered as well) some 35% ahead of the RX 5500, as well as on the overall performance level of AMD's RX Vega 56. That AMD card debuted at $399 and now has performance 8% to 15% higher than NVIDIA's current GTX 1660 SUPER, exactly where AMD would want the RX 5600 XT's performance to land.

Other details come courtesy of another publication, where Igor Wallosseck over at Igor's Lab says that AMD could be looking at harvesting the Navi 10 dies that power the company's RX 5700 XT and RX 5700 by disabling one of four Asynchronous Compute Engines (ACEs). These four ACEs are found two each on one of Navi's Shader Engines (SEs), and disabling one ACE and subordinate hardware from the full Navi 10's 40 RDNA Units, 2,560 Stream Processors (SPs), 160 texture mapping units (TMUs) and 64 render output units (ROPs) would make up for an RX 5600 XT with 30 RDNA CUs, 1,920 SPs, 120 TMUs, 48 ROPs and expected 3 MB of L2 cache. AMD could be looking to position the AMD RX 5600 XT in the $249 price range, since top tier RX 5500 XT tend to go for $200.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

Following the previous report about AMD's upcoming "Renoir" APU lineup of processors for notebook and desktop, we have new information about the new processor models and their configurations. Supposed to launch in early 2020, the Renoir lineup is supposed to feature up to 8 cores and 16 threads in high-end models. Dubbed Ryzen 4000 series, the new APU lineup will be available in four configurations determined by its TDP: 15 W and 45 W chips for notebooks, and 35 W and 65 W variants meant for desktop.

According to WCCFTech, AMD will launch high-performance Ryzen 9 4900H and Ryzen 7 4800H APUs soon in the first notebooks. Supposed to be part of the "H" series of mobile APUs, these models will feature high core count, that can reach up to 8 cores, SMT support as well, all within TPD of 45 Watts. A power-optimized Ryzen 7 4800HS has also appeared in the listings as a lower clocked alternative to Ryzen 7 4800H, which is supposed to feature lower TDP as well. All of the former processors appear listed as the base of ASUSes upcoming GA401 and GA502 laptops, featuring 16 GB of RAM, Windows 10, and a 14-inch display. While configurations of the laptop will affect its price, Ryzen 7 4800HS powered model is currently listed at 1904 EUR, featuring 16 GB of RAM and 1 TB of storage, so we now have a ballpark price estimate to speculate upon.

PowerColor is readying a small form-factor friendly custom-design Radeon RX 5700 graphics card, called simply the PowerColor RX 5700 ITX. With a length of 17.5 cm, standard 11 cm height, and strictly 2-slot thickness, the card uses a dense aluminium fin-stack heatsink with four 6 mm-thick nickel-plated copper heat pipes that make direct contact with the GPU at the base, ventilated by a single 80 mm fan. More interestingly, the card draws power from a single 8-pin PCIe power connector (225 W max power input for the connector + PCIe slot).

Unsurprisingly, the PowerColor RX 5700 ITX sticks to AMD-reference clock-speeds of 1465 MHz base, 1625 MHz gaming, and 1725 MHz boost, with the memory ticking at 14 Gbps (GDDR6-effective). Despite its compact cooling solution, the card does not skimp on idle-fan-off. Display outputs include two DisplayPort 1.4, and one HDMI 2.0. Based on the 7 nm "Navi 10" silicon, the RX 5700 features 2,304 stream processors across 36 RDNA compute units, 144 TMUs, 64 ROPs, and a 256-bit wide GDDR6 memory interface, holding 8 GB of memory. PowerColor didn't reveal pricing of the card, as it will formally launch it later this month.

Intel's latest talent acquisition from rival AMD, as it builds a GPU product lineup, is Masooma Bhaiwala. "After 15+ amazing years at AMD, I have decided to take on a different opportunity... It was a truly fun ride, with an incredible team, during which we built some truly cool chips," she wrote in a LinkedIn post. According to her profile, Bhaiwala takes the role of Vice President, discrete GPU SoCs, and works under Intel's Graphics and Throughput Computing Hardware Engineering group headed by Raja Koduri.

Koduri's team has been a glassdoor for former AMD executives and tech-leads. While it has hired engineering talent such as Balaji Kanigicherla, Kalyan Thumaty and Joseph Facca; it has simultaneously lost client-graphics marketing talent, with the likes of Chris Hook, Heather Lennon, and Jon Carvill waltzing out of the company in less than a year of their association. Besides Koduri's Intel's most priced tech talent acquisition is Jim Keller, who is working on a future high-IPC CPU core design for the company. While working for AMD, Keller's "Zen" microarchitecture coupled with CEO Lisa Su's leadership have scripted one of the biggest turnarounds in Silicon Valley.

AMD today posted the latest version of Radeon Software Adrenalin 2020 Edition. Version 19.12.3 ships with a "focus on stability improvements," according to Terry Makedon, who heads the company's software strategy and user-experience. The company addressed close to two dozen issues related to the first Adrenalin 2020 Edition release (version 19.12.2). To begin with game and boost clocks incorrectly reporting for RX 5500 XT has been fixed. A bug with the installing failing to detect AMD graphics hardware when a certain WiFi adapter is enabled in the system has been fixed. A "Rocket League" application crash when task-switching has been fixed. The Radeon Overlay shortcut appearing in fullscreen 3D apps even after disabling Overlay, has been fixed.

A bug with streaming, where audio from custom scenes continues to play after recording has stopped, is fixed. The volume of the installer's splash screen audio has been reduced. Bugs with tessellation-related settings in Radeon Software have been fixed. ReLive missing or not being available for installation on some machines with Hyper-V enabled, has been fixed. Also fixed are buges related to newly added game profiles failing to enable. Performing an auto-update from Adrenalin 2019 (19.12.1 and older) to Adrenalin 2020 fails with an error code, which has been fixed now. Radeon Chill experience with "gaming mice" has been fixed. Stuttering observed when switching between borderless to fullscreen display modes in some games with Overlay enabled, has been fixed.

DOWNLOAD: AMD Radeon Software Adrenalin 19.12.3

TechPowerUp is partnering with Cooler Master and ASUS to bring our readers from the United States and Canada, a chance to receive a full set of components put together in a gaming desktop. The TUF Gaming brand was originally created by ASUS and represents aspiration and value for gamers putting together a stable and reliable rig on a budget. Our build set also includes components from AMD, Team Group, and Apacer.

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AMD's upcoming "Renoir" silicon will be the company's most important, as it will sit at the heart of not just desktops, but also notebooks and ultraportables. A brilliant report by _rogame on Reddit compiles the chip's many iGPU variants along with iGPU device-IDs, and slots them in various platform variants. Renoir will target four key market segments characterized by TDP: 15 W ultraportables, 45 W mainstream notebooks, 65 W mainstream desktops, and 35 W low-power desktops.

As for the iGPU itself, "Renoir" was last reported as being a processor that combines "Zen 2" CPU cores with an iGPU that has SIMD machinery from the "Vega" architecture, but with updated display- and multimedia-engines from "Navi." According to _rogame, Renoir's iGPU will have up to 13 NGCUs, which work out to 832 stream processors. AMD internally marks the iGPU as RV B##, where RV refers to "Radeon Vega," and B## referring to the iGPU variant. The commercial name of the iGPU will be different. B12 is the highest variant, with 12-13 CUs, B10 has 10-11 CUs, B8 has 8-9 CUs, B6 has 6 CUs, and B4 has 3-4 CUs. The B12 configuration will be exclusive to the mobile parts. The desktop parts cap out at B10. Renoir is expected to dominate AMD's processor launch cycle through the first half of 2020.

FEMFX is a multithreaded CPU library for deformable material physics, using the Finite Element Method (FEM). Solid objects are represented as a mesh of tetrahedral elements, and each element has material parameters that control stiffness, how volume changes with deformation, and stress limits where fracture or plastic (permanent) deformation occur. The model supports a wide range of materials and interactions between materials. We intend for these features to complement rather than replace traditional rigid body physics. The system is designed with the following considerations:

AMD today announced that it has joined the Blockchain Game Alliance (BGA) and forged partnerships with leading technology providers to help promote the development and proliferation of new blockchain-powered gaming platforms.

The Blockchain Game Alliance is committed to driving awareness and adoption of blockchain technologies within the game industry, providing an open forum for individuals and companies to share knowledge and collaborate, create common standards, establish best practices, and network. As the first major hardware manufacturer to join the BGA, AMD plans to enable alliance members with efficient and high-performance computing technologies for next-generation blockchain-based gaming platforms that could potentially transform the way games are created, published, purchased and played.

Hardware-accelerated ray tracing and variable-rate shading will be the design focal points for AMD's next-generation RDNA2 graphics architecture. Microsoft's reveal of its Xbox Series X console attributed both features to AMD's "next generation RDNA" architecture (which logically happens to be RDNA2). The Xbox Series X uses a semi-custom SoC that features CPU cores based on the "Zen 2" microarchitecture and a GPU based on RDNA2. It's highly likely that the SoC could be fabricated on TSMC's 7 nm EUV node, as the RDNA2 graphics architecture is optimized for that. This would mean an optical shrink of "Zen 2" to 7 nm EUV. Besides the SoC that powers Xbox Series X, AMD is expected to leverage 7 nm EUV for its RDNA2 discrete GPUs and CPU chiplets based on its "Zen 3" microarchitecture in 2020.

Variable-rate shading (VRS) is an API-level feature that lets GPUs conserve resources by shading certain areas of a scene at a lower rate than the other, without perceptible difference to the viewer. Microsoft developed two tiers of VRS for its DirectX 12 API, tier-1 is currently supported by NVIDIA "Turing" and Intel Gen11 architectures, while tier-2 is supported by "Turing." The current RDNA architecture doesn't support either tiers. Hardware-accelerated ray-tracing is the cornerstone of NVIDIA's "Turing" RTX 20-series graphics cards, and AMD is catching up to it. Microsoft already standardized it on the software-side with the DXR (DirectX Raytracing) API. A combination of VRS and dynamic render-resolution will be crucial for next-gen consoles to achieve playability at 4K, and to even boast of being 8K-capable.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce that ADATA and XPG DDR4 memory modules are compatible with latest 3rd Gen AMD Ryzen and Ryzen Threadripper HEDT (High-end Desktop) platforms. Whether for creators that demand high-capacity modules or gamers and overclockers seeking high-performance modules, ADATA and XPG offer memory products that meet their specific needs.

ADATA and XPG have always strove to ensure high compatibility of their memory modules through the use of high-quality, rigorously tested IC chips and PCB boards. With the recent launch of AMD's most powerful desktop processors- Ryzen 9 3950X processor with X570 platform and AMD HEDT Ryzen Threadripper 3960X/3970X processor with TRX40 platform, ADATA's and XPG's commitment to high compatibility remains a key consideration, in addition to robust performance and sufficient capacity.

TUL Corporation, parent of the leading and innovative AMD Graphics Card Manufacturing brand, PowerColor, announces their latest cards in their lineup, PowerColor Red Dragon RX 5500 XT 8 GB and PowerColor RX 5500 XT 4 GB. Powered by the the newest and most advanced 7 nm RDNA architecture with GDDR6 VRAM, the RX 5500 series features performance delivery optimized for better visuals such as volumetric lighting, motion blurring effects, depth of field, and multi-level cache hierarchy for reduced latency and a highly responsive gaming experience.

PowerColor's newest RX 5500 XT series is a perfect match for 1080p gaming, reaching 60 FPS on AAA gaming titles on high graphics settings, and over 90 FPS on the leading e-sports titles. AMD's newest lineup of features on their Radeon Graphics Drivers enhances the experience further with settings such as Radeon Image Sharpening and FidelityFX for maximum performance and insane immersive gaming experiences as well Radeon Anti-Lag for highly responsive gaming.

AMD today announced the Radeon RX 5500 XT graphics card for the DIY (retail) channel, launched exclusively through its add-in board partners. Based on the 7 nm "Navi 14" silicon, the RX 5500 XT has the same exact core-configuration as the RX 5500 launched in October to OEMs. This means only 22 out of the 24 RDNA compute units are enabled, and the XT doesn't max the silicon out. These work out to 1,408 stream processors. Other vital specs include 88 TMUs, 32 ROPs, and a 128-bit wide GDDR6 memory interface. The RX 5500 XT will still end up faster than the RX 5500 OEM card from last month, since it has a higher engine "game clocks" of 1717 MHz, while the RX 5500 OEM ships with roughly 1670 MHz game clocks. Engine boost clocks for the RX 5500 XT are rated at up to 1845 MHz.

The Radeon RX 5500 XT comes in two variants based on memory size, 4 GB and 8 GB. Both variants use 14 Gbps GDDR6 memory chips across the chip's 128-bit wide memory bus. The 4 GB variant uses four commonly available 8 Gbit chips, while the 8 GB variant typically uses high-density 16 Gbit memory chips. AMD is pricing the Radeon RX 5500 XT at USD $169.99 for the 4 GB variant, and $199.99 for the 8 GB variant. It competes with a spectrum of NVIDIA cards including the GeForce GTX 1650 and GTX 1650 Super.

Read the TechPowerUp Reviews of the Sapphire Radeon RX 5500 XT 4 GB Pulse OC and MSI Radeon RX 5500 XT 8 GB Gaming XThe complete AMD slide deck follows.

AMD's Radeon RX 5600-series could see the company take on the top-end of NVIDIA's GeForce 16-series, such as the GTX 1660 Super and the GTX 1660 Ti. A report from earlier this month pegged a December 2019 product announcement for the RX 5600-series and subsequent availability in the weeks following. Regulatory filings by AMD AIB (add-in board) partners with the Eurasian Economic Commission (EEC) shed more light on the product differentiation within the RX 5600 series. The filings reveal that the RX 5600 and RX 5600 XT feature 6 GB and 8 GB sub-variants.

The regulatory filing by ASUS references products across its ROG Strix, TUF Gaming, and Dual lines of graphics cards. As mentioned in the older report, we expect AMD to carve the RX 5600 series out of the larger "Navi 10" silicon, by disabling many more RDNA compute units than the RX 5700, and narrowing the GDDR6 memory bus to 192-bit for the 6 GB variants. AMD has an opportunity to harvest "Navi 10" chips down to stream processor counts such as 1,792 (28 CUs) or 2,048 (32 CUs). It also has the opportunity to use cost-effective 12 Gbps GDDR6 memory chips.