Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

ASUS today rolled out the latest in its series of M.2 NVMe RAID add-on cards, the Hyper M.2 x16 Card V2. A successor to a similar card ASUS released back in 2017, this one comes with improved electrical components, so each of its four slots is guaranteed to put out 14 Watts of power. The card splits a PCI-Express 3.0 x16 link to four M.2-22110 slots, each with PCI-Express 3.0 x4 wiring. There's no PCIe switch logic involved, so your motherboard is required to support PCIe lane segmentation (most HEDT motherboards since 2016 do). The card supports Intel VROC (virtual RAID on CPU), and is tested to work on AMD Ryzen Threadripper processors. ASUS didn't change the thermal solution. You still get a chunky aluminium shroud covering the whole card, and lateral-flow fan pushing air across the drives, which can be turned off. The company didn't reveal pricing.

AMD Lisa Su at Computex 2019 confirmed to Tom's hardware that the company wasn't licensing anymore of its x86 IP portfolio to China-based companies. AMD entered a technology license agreement with China's Tianjin Haiguang Advanced Technology Investment Co. Ltd. (THATIC) in 2016. As part of the agreement to license its x86 and SoC IP for chip development, AMD received a cash infusion worth $293 million (plus royalties).

As a result, Chinese chipmaker Hygon started delivering their "Dhyana" CPUs, which looked like copies of AMD's Zen-based Epyc chips with added, Chinese-government approved cryptographic capabilities. AMD had to go through some hoops to get this deal done, but it did. However, now the technology refinement pipe is draining for the Chinese companies, as AMD won't be delivering its post-Zen updates to the core design. It remains to be seen if AMD's intellectual property was enough for Chinese companies to ignite their own in-country CPU development, or if the ongoing US-China trade war will keep on draining the company of CPU independence.

AMD today announced the Radeon Pro Vega II and Pro Vega II Duo graphics cards, making their debut with the new Apple Mac Pro workstation. Based on an enhanced 32 GB variant of the 7 nm "Vega 20" MCM, the Radeon Pro Vega II maxes out its GPU silicon, with 4,096 stream processors, 1.70 GHz peak engine clock, 32 GB of 4096-bit HBM2 memory, and 1 TB/s of memory bandwidth. The card features both PCI-Express 3.0 x16 and InfinityFabric interfaces. As its name suggests, the Pro Vega II is designed for professional workloads, and comes with certifications for nearly all professional content creation applications.

The Radeon Pro Vega II Duo is the first dual-GPU graphics card from AMD in ages. Purpose built for the Mac Pro (and available on the Apple workstation only), this card puts two fully unlocked "Vega 20" MCMs with 32 GB HBM2 memory each on a single PCB. The card uses a bridge chip to connect the two GPUs to the system bus, but in addition, has an 84.5 GB/s InfinityFabric link running between the two GPUs, for rapid memory access, GPU and memory virtualization, and interoperability between the two GPUs, bypassing the host system bus. In addition to certifications for every conceivable content creation suite for the MacOS platform, AMD dropped in heavy optimization for the Metal 3D graphics API. For now the two graphics cards are only available as options for the Apple Mac Pro. The single-GPU Pro Vega II may see standalone product availability later this year, but the Pro Vega II Duo will remain a Mac Pro-exclusive.

AMD and Samsung today announced a key strategic partnership in high performance graphics technologies for the mobile space. The agreement means that Samsung will license AMD's Radeon graphics IP in its latest RDNA iteration, no less, for integration on smartphone graphics processing. Let me stress how impressive this can be: that AMD developed a graphics architecture that can scale from a high-performance GPU down to a nimble, fast, power-sipping module for mobile graphics processing.

This is a huge strategic win for AMD, in that more and more products will be infused with their technology. As Lisa Su puts it, the Radeon user base and development ecosystem will be greatly increased with this Samsung integration - as will AMD's revenue, for sure. Perhaps we'll see a "Powered by AMD Radeon" sticker or engraving in our future Samsung smartphones, as we do with Leica partnerships, for example.)

The Wheel of Rumors turns, and assumptions come and pass, sometimes leaving unfulfilled hopes and dreams. In this case, the rumor mill, in what seems like a push from sweclockers, places Navi not as a "built from the ground-up" architecture, but rather as a highly customized iteration of GCN - iterated in the parts that it actually implements AMD's RDNA architecture, to be exact. And this makes sense from a number of reasons - it's certainly not anything to cry wolf about.

For one, AMD's GCN has been a mainstay in the graphics computing world since it was first introduced back in 2012, succeeding the company's TeraScale architecture. Game engines and assorted software have been well optimized already to take advantage of AMD's design - even with its two ISAs and assorted improvements over the years. One of the most important arguments is derived from this optimization effort: AMD's custom designs for the console market employ architectures that are GCN-based, and thus, any new architecture that would be used by both Microsoft and Sony for their next-generation consoles would have to be strictly backwards compatible.

ECS at its Computex 2019 booth showed off its next generation of LIVA branded mini PCs and a new AMD platform SFF desktop. We begin with the retro-looking SF110-A320, an SFF desktop measuring 205 mm x 176 mm x 33 mm (WxDxH), with an AM4 socket, and the ability to power 35W TDP APUs. Its mainboard is driven by an AMD A320 chipset. We know that the A320 supports 12 nm Ryzen 3000-series "Picasso" APUs. It's quite possible that these desktops could ship with them, particularly their low-TDP variants. The iGPU of these chips are wired out to two DisplayPorts, an HDMI, and a D-sub (VGA) output. You drop in your own DDR4 SO-DIMM modules, an M.2-2280 SSD, or 2.5-inch SATA drive. Networking options include 802.11ac WLAN, Bluetooth 4.2, and 1 GbE wired networking. ECS includes a 90W power-brick.

The company also showed off its latest LIVA Z3 Plus series mini PCs that appear to be ready for 10th generation Core "Ice Lake-U" SoCs, although the company won't mention it. There are two physical variants of the Z3 Plus, a shorter one that lacks a 2.5-inch drive bay, making you rely entirely on an M.2-2280 slot for internal storage (PCIe + SATA); and a taller variant with an additional 2.5-inch drive bay with SATA 6 Gbps. The shorter variant measures 117 mm x 128 mm x 37 mm (WxDxH), and the taller one about 47 mm in height. Both variants ship with 120W power bricks, take in two DDR4 SO-DIMM modules, one M.2-2280 SSD, and put out connectivity that includes HDMI and mDP display outputs, dual 1 GbE wired + 802.11ac + Bluetooth 4.2 networking, and four USB 3.1 gen 2 ports, from which one is a type-C.

This shouldn't really need to be spelled out, but AMD clarified that you can't have PCI-Express gen 4.0 running an upcoming Ryzen 3000 "Matisse" processor on older socket AM4 motherboards based on AMD 300-series and 400-series chipsets, and that the processor's PCIe root-complex will run at PCI-Express gen 3.0 speeds. AMD's official reason for this is that the older motherboards can't guarantee reliable signaling needed for PCI-Express gen 4.0 and hence the company decided to blanket-disable PCIe gen 4.0 for the older platforms. This statement was put out by Robert Hallock, senior technical marketing head for CPUs and APUs, on Reddit.

Unofficially, though, we believe there are technological barriers standing in the way of PCI-Express gen 4.0 on the older motherboards, the least of which are the lack of external PCIe gen 4.0-certified re-driver/equalizer components, and lane-switching on boards that split one x16 PEG link to two x8 links. There may be other less technical issues such as PCI-SIG certification for the older platforms. Intel faced a similar challenge with its 3rd generation Core "Ivy Bridge" processors, which introduced PCI-Express gen 3.0 to the mainstream desktop platform, and were backwards-compatible with Intel 6-series chipset (eg: Z68 Express). The older 6-series motherboards could only put out PCIe gen 2.0 with the newer processors.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

Motherboard vendors are betting big on the success of AMD's "Valhalla" desktop platform that combines a Ryzen 3000-series Zen 2 processor with an AMD X570 chipset motherboard, and have responded with some mighty premium board designs. GIGABYTE deployed its full spectrum of Aorus branding, including Ultra, Elite, ITX Pro, Master, and Xtreme. The X570 I Aorus Pro WiFi mini-ITX motherboard is an impressive feat of engineering despite its designers having to wrestle with the feisty new PCIe gen 4 chipset. It draws power from a combination of 24-pin and 8-pin connectors, and conditions power for the SoC with an impressive 8-phase VRM that uses high-grade PowIRstage components. A rather tall fan-heatsink cools the X570 chipset, with a 30 mm fan.

Connectivity options on the X570 I Aorus Pro WiFi are surprisingly aplenty. The sole expansion slot is a PCI-Express 4.0 x16, but the storage connectivity includes not one, but two M.2-2280 slots (reverse side of the PCB), each with PCI-Express 4.0 x4 and SATA 6 Gbps wiring. Four SATA 6 Gbps ports make for the rest of the storage connectivity. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0 (Intel , and 1 GbE, all pulled by Intel-made controllers. USB connectivity includes six 5 Gbps USB 3.2 gen 1, and two 10 Gbps USB 3.2 gen 2 ports (of which one is type-C), and two 5 Gbps ports by headers. The onboard audio solution has 6-channel analog output, but is backed by a premium Realtek ALC1220VB Enhance CODEC (114 dBA SNR).

We were pleasantly mistaken when we thought ASRock would stop at the X570 Phantom Gaming X or the X570 Taichi for AMD's new "Valhalla" enthusiast desktop platform. It turns out that they have a roughly-$1,000 monster motherboard in the pipes, called the X570 Aqua. Pictured below, the board is based on a slight variation of the X570 Phantom Gaming X PCB. The biggest change of course is the aluminium shroud that covers most of the board's front side. There's also a metal back-plate.

Beneath the metal shroud is what gives the board its name: a massive liquid-cooling monoblock that cools not just your processor (including heavyweights such as overclocked Ryzen 9 3900X chips), but also the CPU VRM, and the feisty AMD X570 chipset. The coolant channel first goes over the CPU through a large micro-fin lattice, then onto the X570 chipset, and finally over the CPU VRM on its way out. Much like the Phantom Gaming X, this board features daisy-chained dual-channel DDR4 memory slots designed to make the most OC out of 2-module setups.

It looks like SSDs will beat graphics cards to utilizing (and benefiting) from the bandwidth of PCI-Express gen 4.0 bus. AMD X570 platform motherboards offer 2-3 M.2 slots with PCIe gen 4.0 x4 wiring (64 Gbps). Corsair formally launched the MP600, and now ADATA joins the party with its unnamed drive. Based on the Silicon Motion SM2267 controller, the drive comes in an unbelievable capacity of up to 8 TB, probably using 96-layer QLC NAND flash.

The controller features DRAM cache, and dynamic SLC caching (all of the NAND flash is treated as SLC until storage demands force portions of them to be treated as MLC, TLC, and eventually QLC). It takes advantage of NVMe 1.3 protocol. As for performance, ADATA claims sequential speeds of up to 4000 MB/s reads. Such speeds were impossible of PCIe gen 3.0 x4 due to various overheads. Sequential writes are still up to 3000 MB/s. 4K random read/write access is rated at 400k IOPS. The company didn't reveal availability details.

ASRock is ready with its own mini-ITX motherboard based on the AMD X570 chipset, the X570 Phantom Gaming-ITX TB3. This tiny powerhouse one-ups other mini-ITX motherboards in its category by offering 40 Gbps Thunderbolt 3 connectivity over USB type-C, in addition to USB 3.2. This Thunderbolt port also includes a DP pass-through from your discrete graphics card.

Expansion includes one PCI-Express 4.0 x16. Storage connectivity includes one M.2-2280 with PCI-Express 4.0 x4 and SATA 6 Gbps connectivity; and four SATA 6 Gbps ports. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0, and 1 GbE driven by Intel i211-AT. The board pulls power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it for the SoC with a 6+2 phase VRM. A chunky fan-heatsink cools the chipset, shedding some of its heat to the enlarged VRM heatsink cloaked under the I/O shroud.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions is thrilled to introduce its latest product to gamers, enthusiasts, power users and system builders with the release of the COLORFUL first AMD X570-based motherboard. The new COLORFUL CVN X570 GAMING PRO V14 serves as a foundation for new AMD builds and supports AM4 socket processors including 3rd Gen AMD Ryzen desktop processors.

The CVN X570 GAMING Pro is ready for the future with support for AMD's new 7nm processor based on their Zen2 architecture, while still supporting both 2nd Gen and 1st Gen Ryzen products. This provides and easier and more cost effective upgrade path into the latest hardware. Making its debut is PCIe 4.0 on this motherboard giving it extra bandwidth for high-speed connections with devices. The motherboard also comes rich with USB connectivity including USB3.1 Gen2 and also features wireless LAN.

While its honestly staggering see how many products ASUS had on display at Computex this year, I think the number of laptops might take the cake. They had just about everyone imaginable on hand except a kitchen sink. The ROG lineup was represented by the Zephyrus M GU502, Zephyrus S GX502, Zephyrus G GA502, Strix Hero III, Strix SCAR III, and last but not least the Mothership. Meanwhile, the TUF Gaming brand demoed the FX705DU and FX505DU. More surprising is the fact AMD's Ryzen 3750H makes an appearance not only in the TUF Gaming laptops but in the Zephyrus series as well bringing a bit more selection to the once Intel dominated mobile market.

Taking a closer look at the Republic of Gamers lineup and our attention is immediately drawn to the ROG Mothership which due to its design is the most unique laptop on display here. Featuring a detachable keyboard with RGB lighting, eight heat pipes, liquid metal cooling, 4K G-SYNC display, Intel i9-8950H CPU overclocked, NVIDIA GeForce RTX 2080, and NVMe SSDs, it stands out from the crowd. Gone is the traditional clamshell if you so choose without sacrificing performance. It definitely proves to be an eye-catching product.

ASRock will be showing the world's first Thin Mini-ITX form factor - RX570TM-ITX/TBT graphics card, which adapts with AMD Radeon RX570 graphics card and supports Intel Thunderbolt 3 technology. The RX570TM-ITX/TBT graphics card is not only the first graphics card with a Thunderbolt 3 Type-C interface which supports 40Gb/s transfer rate and power delivery, but it also features 4 USB 3.1 Gen1 ports, Gigabit Ethernet, and SATA 6Gb/s interface.
The RX570TM-ITX/TBT graphics card is based on the Thin Mini-ITX concept. With this graphics card, All-in-One PC manufacturers can develop their own Thunderbolt monitors with 3D performance and power charging with less effort. Moreover, it would be able to fit in a mini ITX chassis. By connecting a notebook through Thunderbolt 3 Type-C interface, it helps to increase the notebook's 3D computing power and charge the notebook at the same time.

ASRock came to Computex 2019 with a fairly big selection of socket AM4 motherboards based on the AMD X570 chipset. The lineup is led by the X570 Taichi, launched as a single SKU and not differentiated into an "Ultimate" variant. ASRock retains the characteristic gearwheel style along the board's styling. Almost the entire bottom half of the board is covered by a metal shroud that spreads heat from the chipset heatsink, and three M.2 SSDs. The chipset heatsink's fan is concealed behind a grille to not look like an eyesore. New generation connectivity options from this board include 2.5 GbE wired + 2.4 Gbps 802.11ax WLAN, and USB 3.2 ports. The Taichi looks a little less understated than its predecessors, with more RGB LED embellishments.

We also spied the X570 Steel Legend, with its polarizing "urban camo" print, and bright metal meatsinks and I/O shrouds. The Steel Legend series motherboards command interesting sub-$200 price-points, and it will be interesting to see where this one lands. You get two M.2 NVMe slots, both with metal heatsinks, an M.2 E-key slot, open-ended x1 slots, and a reasonably powerful ALC1220-based onboard audio solution. We also spotted two Phantom Gaming products, the X570 Phantom Gaming X, and the X570 Phantom Gaming 4, with the Gaming X being the company's flagship X570 offering. This board maxes out the platform's connectivity with three M.2 NVMe slots, 802.11ax WLAN, 2.5 GbE wired networking, an additional 1 GbE interface driven by an Intel controller, USB 3.2, and a strong 16-phase VRM powering the AM4 socket. Like most other ASRock boards, the fan ventilating the chipset heatsink is concealed behind a grille.

Computer Upgrade King (CUK) is a new BTO (build-to-order) gaming PC manufacturer based out of Virginia, USA. Unlike other system integrators, CUK extends component choices all the way down to the cases. At Computex, the company showed off its Stratos Mini high-end desktop (HEDT), powered by an AMD Ryzen Threadripper 2990WX processor, AMD Radeon VII graphics, 32 GB of quad-channel DDR4-3000 memory, an ASRock X399M Taichi motherboard, and a SeaSonic Prime 1300W 80 Plus Gold PSU. Also shown off was the Continuum Mini, a compact powerhouse built around a mini-ITX motherboard. Its chops include the Core i9-9900K processor seated on an MSI MPG Z390I Gaming Edge AC motherboard; GeForce RTX 2080 Ti graphics, 16 GB of dual-channel DDR4-3200 Apacer NoX memory; and a 750W power supply.

With motherboard vendors going big on the AMD "Valhalla" platform (a combination of 3rd generation Ryzen processor and AMD X570 chipset), we got to see MSI pull out every single high-end motherboard label it has, including MEG GODLIKE and MEG Creation. We sneaked into the MSI booth to take some snaps of the other X570 boards, including a close-up of the MEG X570 Ace, and three other MPG series boards. The MEG X570 Ace is largely carved out of the MEG X570 GODLIKE with a little toning down of the style and features. This is still a formidable board built for serious manual overclocking. We also get the sense that MSI is replacing its "Gaming M7" moniker with MEG Ace in its product stack, as we couldn't find an "X570 Gaming M7" anywhere.

With the MEG GODLIKE and MEG Creation expected to be priced north of $300, the MEG X570 Ace could be priced around the $260-mark. Positioned below it around $200-220, is the MPG X570 Gaming Pro Carbon. This board offers everything you need to build a super high-end rig where the focus is on gaming. It has decent CPU overclocking chops, too. The onboard audio and networking features are premium, and we expect MSI to deploy 802.11ax Wi-Fi. The new MPG X570 Gaming Edge is a lighter variant of the Gaming Pro Carbon, and is largely based on the same PCB. If you don't care all that much about board design, the MPG Gaming Edge is the way to go, with its roughly-$180 price. The MPG X570 Gaming Plus is a cost-effective product, and has all of the essentials gamers need for this platform. It is expected to go for around $150.

AMD at its 2019 Computex keynote unveiled its Ryzen 3000 series desktop processors with the more glamorous Ryzen 7 and Ryzen 9 SKUs while glossing over its more high-volume Ryzen 5 3000 series. It turns out that AMD will launch even these chips on the 7th of July. The Ryzen 5 lineup includes the 3600X and 3600. Both these chips are 6-core/12-thread, and AMD is taking the fight to Intel's 9th generation Core i5 series by not touching the core-count and instead focusing on higher IPC and clock-speeds than Intel's offerings.

The Ryzen 5 3600X ticks at 3.80 GHz, with a boost frequency of 4.40 GHz, which is among the highest in the lineup. Its TDP is rated at 95W. The Ryzen 5 3600 is the 'cooler' offering of the two, with 3.60 GHz nominal and 4.20 GHz boost clocks, and 65W TDP. You get the same 512 KB of L2 cache per core, and 32 MB of shared L3 cache, as the 8-core Ryzen 7 series offerings. AMD is expected to price the two along expected lines, with the 3600X going for roughly USD $239, and the 3600 at $199.

ASUS at a private pre-Computex event gave us a closer look at a treasure of upcoming products. The star-attractions, however, were its AMD X570 motherboard family that's spread across nearly every brand: ROG Crosshair, ROG Strix, TUF Gaming, Prime, and for the very first time for the AM4 platform, the WS series. The crown jewel of course is the mini-ITX form-factor product, the ROG Strix X570-I Gaming. This board is quite an engineering feat considering the ≥15 Watts TDP of the X570 chipset, which requires active cooling in most cases. An intricate network of heatsinks suspended along heat-pipes leading up to a dense aluminium fin-stack ventilated by a 30 mm fan, cools both the chipset and CPU VRM. ASUS designed this board to handle even the 12-core Ryzen 9 3900X, but we don't expect too much overclocking headroom.

AMD at its 2019 Computex private showcase for the media following its CEO's keynote address, unveiled several premium motherboards based on the new AMD X570 chipset. The X570 is an in-house design effort by AMD, and unlike the X470, isn't sourced from ASMedia. The chipset supports PCI-Express gen 4.0 end-to-end, which means not only is the chipset-bus gen 4.0, but also the downstream PCIe lanes it puts out. The chipset connects to the AM4 socket over a PCI-Express 4.0 x4 link (64 Gbps).

It has a downstream PCIe lane budget of 16 lanes, which the motherboard designers can spread out as up up to two M.2 NVMe slots, an x4 (physical x16) slot, a bunch of x1 slots, and newer generation connectivity such as 802.11ax WLAN, 2.5/5.0/10 GbE wired networking, and a larger number of USB 3.2 ports, including newer 20 Gbps portsn over external controllers. This chipset runs hotter than the X470, with a TDP rumored to be around 15W, probably because of the PCIe gen 4.0 implementation. Many of the motherboards we spotted had active fan-heatsinks over the chipset.

AMD at its 2019 Computex keynote today unveiled the Radeon RX 5000 family of graphics cards that leverage its new Navi graphics architecture and 7 nm silicon fabrication process. Navi isn't just an incremental upgrade over Vega with a handful new technologies, but the biggest overhaul to AMD's GPU SIMD design since Graphics CoreNext, circa 2011. Called RDNA or Radeon DNA, the new compute unit by AMD is a clean-slate SIMD design with a 1.25X IPC uplift over Vega, an overhauled on-chip cache hierarchy, and a more streamlined graphics pipeline.

In addition, the architecture is designed to increase performance-per-Watt by 50 percent over Vega. The first part to leverage Navi is the Radeon RX 5700. AMD ran a side-by-side demo of the RX 5700 versus the GeForce RTX 2070 at Strange Brigade, where NVIDIA's $500 card was beaten. "Strange Brigade" is one game where AMD fares generally well as it is heavily optimized for asynchonous compute. Navi also ticks two big technology check-boxes, PCI-Express gen 4.0, and GDDR6 memory. AMD has planned a July availability for the RX 5700, and did not disclose pricing.

AMD CEO Dr. Lisa Su at her 2019 Computex keynote address announced the 3rd generation Ryzen desktop processor family, which leverages the company's Zen 2 microarchitecture, and are built on the 7 nm silicon fabrication process at TSMC. Designed for the AM4 CPU socket, with backwards compatibility for older AMD 300-series and 400-series chipset motherboards, these processors are multi-chip modules of up to two 8-core "Zen 2" CPU chiplets, and a 14 nm I/O controller die that packs the dual-channel DDR4 memory controller and PCI-Express gen 4.0 root complex, along with some SoC connectivity. AMD claims an IPC increase of 15 percent over Zen 1, and higher clock speeds leveraging 7 nm, which add up to significantly higher performance over the current generation. AMD bolstered the core's FPU (floating-point unit), and doubled the cache sizes.

AMD unveiled three high-end SKUs for now, the $329 Ryzen 7 3700X, the $399 Ryzen 7 3800X, and the $499 Ryzen 9 3900X. The 3700X and 3800X are 8-core/16-thread parts with a single CPU chiplet. The 3700X is clocked at 3.60 GHz with 4.40 GHz maximum boost frequency, just 65 Watts TDP and will be beat Intel's Core i7-9700K both at gaming and productivity. The 3800X tops that with 3.90 GHz nominal, 4.50 GHz boost, 105W TDP, and beat the Core i9-9900K at gaming and productivity. AMD went a step further at launched the new Ryzen 9 brand with the 3900X, which is a 12-core/24-thread processor clocked at 3.80 GHz, which 4.60 boost, 72 MB of total cache, 105W TDP, and performance that not only beats the i9-9900K, but also the i9-9920X 12-core/24-thread HEDT processor despite two fewer memory channels. AMD focused on gaming performance with Zen 2, with wider FPU, improved branch prediction, and several micro-architectural improvements contributing to a per-core performance that's higher than Intel's. The processors go on sale on 7/7/2019.

An AMD-based system's most important performance pairing lies in the CPU and system RAM, as a million articles written ever since the introduction of AMD's first generation Ryzen CPUs have shown (remember the races for Samsung B-die based memory?). There are even tools that allow you to eke out the most performance out of your AMD system via fine memory overclocking and timings adjustment, which just goes to show the importance the enthusiast community derives from such tiny details that maximize your AMD Zen-based CPU performance. Now, notorious leaker @momomo_us has seemingly confirmed that AMD has worked wonders on its memory controller, achieving a base JEDEC 3200 MHz specification - up from the previously officially supported DDR4-2666 speeds in the first-gen Ryzen (updated to DDR4-2933 speeds on the 12 nm update).