AMD's 3rd generation Ryzen (3000-series) processors will overcome a vast number of memory limitations faced by older Ryzen chips. With Zen 2, the company decided to separate the memory controller from the CPU cores into a separate chip, called "IO die". Our resident Ryzen memory guru Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen, found technical info that confirms just how much progress AMD has been making.

The third generation Ryzen processors will be able to match their Intel counterparts when it comes to memory overclocking. In the Zen 2 BIOS, the memory frequency options go all the way up to "DDR4-5000", which is a huge increase over the first Ryzens. The DRAM clock is still linked to the Infinity Fabric (IF) clock domain, which means at DDR4-5000, Infinity Fabric would tick at 5000 MHz DDR, too. Since that rate is out of reach for IF, AMD has decided to add a new 1/2 divider mode for their on-chip bus. When enabled, it will run Infinity Fabric at half the DRAM actual clock (eg: 1250 MHz for DDR4-5000).

With the 2019 Computex almost upon us, motherboard vendors are ready with socket AM4 motherboards based on AMD X570 chipset, which launches alongside the company's first wave of 3rd generation Ryzen "Matisse" processors based on the 7 nm "Zen 2" architecture. MSI put out a teaser animation of its flagship motherboard based on the AMD X570, the MEG X570 Ace. MEG, or MSI Extreme Gaming, is the company's top tier of client-segment motherboards, positioned above MPG (MSI Performance Gaming), and MAG (MSI Arsenal Gaming). Within MEG, MSI has three known sub-brands, GODLIKE, Creation, and Ace. The MEG Ace brand is the cheapest of the three, and designed to offer the most high-end features at its price-point.

Given that the company is teasing a MEG Ace product, it could be testing the waters with "Zen 2," and probably begin working on a GODLIKE product only if these processors establish a superiority over not just the i9-9900K, but also the upcoming 10-core "Comet Lake" chip. AMD's flagship is rumored to be the Ryzen 9 3850X, a mammoth 16-core/32-thread chip clocked up to 5.10 GHz. The "5 6 7" artwork with interposing "3000" indicate three distinct things: The highlighted "6" indicates onboard 802.11ax (Wi-Fi 6) controller. The 5 and 7 could indicate the X570 chipset. The "3000" of course references Ryzen 3000 series.

AMD is giving finishing touches to its 3rd generation Ryzen socket AM4 processor family which is slated for a Computex 2019 unveiling, followed by a possible E3 market availability. Based on the "Matisse" multi-chip module that combines up to two 8-core "Zen 2" chiplets with a 14 nm I/O controller die, these processors see a 50-100 percent increase in core-counts over the current generation. The Ryzen 5 series now includes 8-core/16-thread parts, the Ryzen 7 series chips are 12-core/24-thread, while the newly created Ryzen 9 series (designed to rival Intel Core i9 LGA115x), will include 16-core/32-thread chips.

Thai PC enthusiast TUM_APISAK confirmed the existence of the Ryzen 9 series having landed himself with an engineering sample of the 16-core/32-thread chip that ticks at 3.30 GHz with 4.30 GHz Precision Boost frequency. The infamous Adored TV leaks that drew the skeleton of AMD's 3rd generation Ryzen roadmap, referenced two desktop Ryzen 9 parts, the Ryzen 9 3800X and Ryzen 9 3850X. The 3800X is supposed to be clocked at 3.90 GHz with 4.70 GHz boost, with a TDP rating of 125W, while the 3850X tops the charts at 4.30 GHz base and a staggering 5.10 GHz boost. The rated TDP has shot up to 135W. We can now imagine why some motherboard vendors are selective with BIOS updates on some of their lower-end boards. AMD is probably maximizing the clock-speed headroom of these chips out of the box, to preempt Intel's "Comet Lake" 10-core/20-thread processor.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, introduces the A68N-2100E SoC Motherboard featuring a compact mini-ITX form-factor powered by the energy efficient AMD E1-2150 Processor and AMD Radeon HD8210 graphics. The BIOSTAR A68N-2100E is designed for homes and businesses that need a capable but energy efficient desktop PC for basic tasks such as browsing the internet, running office applications, and other essentials that most students and professionals use in computers today.

The BIOSTAR A68N-2100E is powered by the AMD Kabini architecture-based E1-2150 dual-core processor with an energy efficient thermal design power (TDP) of 9 watts. It supports the low-cost DDR3 memory with maximum support of up to 16GB memory, which is well suited for home and business use. Its flexible mini-ITX form factor makes it compatible to a wide selection desktop cases, HTPCs, and small-form-factor cases.

Intel's semiconductor manufacturing business has had a terrible past 5 years as it struggled to execute its 10 nanometer roadmap forcing the company's processor designers to re-hash the "Skylake" microarchitecture for 5 generations of Core processors, including the upcoming "Comet Lake." Its truly next-generation microarchitecture, codenamed "Ice Lake," which features a new CPU core design called "Sunny Cove," comes out toward the end of 2019, with desktop rollouts expected 2020. It turns out that the 10 nm process it's designed for, will have a rather short reign at Intel's fabs. Speaking at an investor's summit on Wednesday, Intel put out its silicon fabrication roadmap that sees an accelerated roll-out of Intel's own 7 nm process.

When it goes live and fit for mass production some time in 2021, Intel's 7 nm process will be a staggering 3 years behind TSMC, which fired up its 7 nm node in 2018. AMD is already mass-producing CPUs and GPUs on this node. Unlike TSMC, Intel will implement EUV (extreme ultraviolet) lithography straightaway. TSMC began 7 nm with DUV (deep ultraviolet) in 2018, and its EUV node went live in March. Samsung's 7 nm EUV node went up last October. Intel's roadmap doesn't show a leap from its current 10 nm node to 7 nm EUV, though. Intel will refine the 10 nm node to squeeze out energy-efficiency, with a refreshed 10 nm+ node that goes live some time in 2020.

Considering your reaction, you certainly remember Crytek's Neon noir raytracing scene that we shared with you back in march. At the time, the fact that raytracing was running at such mesmerizing levels on AMD hardware was arguably the biggest part of the news piece: AMD's Vega 56 graphics card with no dedicated raytracing hardware, was pushing the raytraced scene in a confident manner. Now, Crytek have shared some details on how exactly Neon noir was rendered.

The AMD Radeon Vega 56 pushed the demo at 1080p/30 FPS, with full-resolution rendering of raytraced effects. Crytek further shared that raytracing can be rendered at half resolution compared to the rest of the scene, and that if they did so on AMD's Vega 56, they could push a 1440p resolution at 40+ FPS. The raytraced path wasn't running on any modern, lower-level API, such as DX12 or Vulkan, but rather, on a custom branch of Crytek's CryEngine, version 5.5.

Lenovo has released a trio of new Windows 10 laptops based on new, 2nd generation AMD Ryzen PRO processors, in their famous ThinkPad form factor. There are two models that are part of the T series of ThinkPads, while one is part of X series. For reminding, the T series is the flagship line that offers the best balance between ruggedness, features, processing power, and portability in a 14 or 15-inch unit, while the X series focuses on portability.

The new ThinkPads use the second generation of AMD Ryzen PRO processors, which are 12nm improvements of the previous 14nm Ryzen Family. They carry the 3000 name branding but are similar to the 2000 series of desktop CPUs.

Red Hat Systemd (system and service manager) lead developer Lennart Poettering discovered that AMD A6-6310 "Beema" SoC that's popular among low-cost notebooks, has a faulty implementation of the RdRand random-number generation instruction. The processor's hardware random number generator (RNG) loses "randomness" after the machine resumes from a suspended state (i.e. waking up the notebook from sleep by opening its lid while it's powered on). Modern computers rely on RNGs for "entropy," critical to generation of unpredictable keys on the fly for SSL. However, the entropy source needn't be hardware, and isn't so by default. Software RNGs exist, and by default the Linux kernel does not use RdRand to generate entropy. Windows is not known to use RdRand for basic ACPI functions such as suspend/resume; however a faulty hardware RNG is not without implications for the platform, and applications that run on it.

Users on GitHub and Bugzilla report that with this bug, you cannot make a machine suspend a second time after waking it up from a suspended state, if your kernel uses RdRand. Commit cc83d51 to Systemd introduced optional randomness generation based on RdRand instruction. So, if RdRand instruction is present, it is used to generate UUIDs for invocation IDs. Michael Larabel of Phoronix comments that the RdRand bug is only found on older generations of AMD processors, "Excavator" and older; and does not affect the latest "Zen" processors. This bug report chronicles what's wrong with RdRand on the affected processors, as does this Linux kernel bugzilla thread. By avoiding RdRand usage on the system as part of generating a UUID, the reported systemd issue no longer happens. Red Hat is working on a solution to this bug.

The U.S. Department of Energy today announced a contract with Cray Inc. to build the Frontier supercomputer at Oak Ridge National Laboratory, which is anticipated to debut in 2021 as the world's most powerful computer with a performance of greater than 1.5 exaflops.

Scheduled for delivery in 2021, Frontier will accelerate innovation in science and technology and maintain U.S. leadership in high-performance computing and artificial intelligence. The total contract award is valued at more than $600 million for the system and technology development. The system will be based on Cray's new Shasta architecture and Slingshot interconnect and will feature high-performance AMD EPYC CPU and AMD Radeon Instinct GPU technology.

Rumors of AMD's next-generation performance-segment graphics card are gaining traction following a leak of what is possibly its PCB. Tweaktown put out a boatload of information of the so-called Radeon RX 3080 XT graphics card bound for an 2019 E3 launch, shortly after a Computex unveiling. Based on the 7 nm "Navi 10" GPU, the RX 3080 XT will feature 56 compute units based on the faster "Navi" architecture (3,584 stream processors), and 8 GB of GDDR6 memory across a 256-bit wide memory bus.

The source puts out two very sensational claims: one, that the RX 3080 XT performs competitively with NVIDIA's $499 GeForce RTX 2070; and two, that AMD could start a price-war against NVIDIA by aggressively pricing the card around the $330 mark, or about two-thirds the price of the RTX 2070. Even if either if not both hold true, AMD will fire up the performance-segment once again, forcing NVIDIA to revisit the RTX 2070 and RTX 2060.

ASRock has announced BIOS updates for AMD X470/B450/X370/B350 and A320 series motherboards to support the soon to be released new AMD Ryzen processors. The latest BIOS update will be available for download from specific product pages on ASRock website or simply update through ASRock APP Shop. The latest BIOS for each motherboard are listed as below. BIOS are expected to be released in May.

We've all taken a look at AMD's March 2019 product roadmap, which showed us the upcoming 2019 tech the company would be bringing to the table in its "non-stop product momentum". However, it seems that this non-stop product momentum might be coming to an unexpected twist of fate that might delay it from entering the last station - the Zen 2-based Threadripper. In the company's latest May earnings call roadmap, the company silently removed the Zen 2 Threadripper from its product roadmap - where it used to sit right after the launch of Zen 2-based Ryzen products for consumers, is now just a big crop of the space it occupied.

This might mean many things, and a mistake on someone's part while cropping the PowerPoint slide could be the only thing going on here. However, the best and most plausible speculation that can be entertained when one considers this is simple - a supply problem. With the 7 nm node being the newest, most dense fabrication process possible, and with AMD having to share TSMC's 7 nm wafer production with a number of high profile companies - such as Qualcomm, for instance - may mean that supply is simply too tight to support Zen 2-based products across so many product stacks - Ryzen and Epyc - at the same time.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, introduces the new A68N-5600E SoC motherboard featuring a power efficient AMD PRO A4-3350B Processor and AMD Radeon R4 graphics. The BIOSTAR A68N-5600E is perfect for home entertainment and everyday home computing from web browsing to basic office applications. Watch videos on Netflix and YouTube with high-definition and immersive visuals, thanks to the AMD Radeon graphics, and high-resolution display with HDMI support. The A68N-5600E sports an ultra-compact Mini-ITX form factor, perfect for small-form-factor PCs and HTPCs.

Remember to bring your osmosis process to the table here, as a good deal of salt is detected present in this story's environment. Some online webstores from Vietnam and Turkey have started listing AMD's 3000 series CPUs based on the Zen 2 architecture. The present company stands at a Ryzen 9 3800X, Ryzen 7 3700X, and Ryzen 5 3600X, and the specs on these are... Incredible, to say the least.

The Ryzen 9 3800X is being listed with 32 threads, meaning a base 16-core processor. Clock speeds are being reported as 3.9 GHz base with up to 4.7 GHz Turbo on both a Turkish and Vietnamese etailer's webpages. The Turkish Store then stands alone in listing AMD's Ryzen 7 3700X CPU, which is reported as having 12 cores, 24 threads, and operating at an extremely impressive 4.2 GHz base and 5.0 GHz Boost clocks. Another listing by the same website, in the form of the Ryzen 5 3600X, details the processor as having 8 physical cores and running at 4.0 GHz base and 4.8 Boost clocks.

As we draw closer to the release of Rage 2, publisher Bethesda has released the official PC system requirements for the game. The original Rage pushed the boundaries of rendering technology with its Mega Texture technology (which featured some slight streaming issues as available textures were rendered visible according to the scene).

The least of the requirements are set at an Intel Core i5-3570 or an AMD Ryzen 3 1300X CPU, paired with 8 GB of RAM and the long-in-the-tooth GTX 780 3 GB or R9 280 3GB. Recommended configurations will have to pack, at least, an Intel Core i7-4770 or AMD Ryzen 5 1600X CPU with 8 GB of RAM and an Nvidia GTX 1070 8GB or AMD Vega 56 8GB graphics card. The 8 GB of RAM in the recommended settings is a welcome surprise, in that most games have now been requiring 16 GB of system RAM. Unfortunately, Bethesda didn't mention what gameplay experience can be expected from the recommended system configuration. RAGE 2 releases on May 14th.

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today has announced the release of their latest Signature Premium series line of DDR4 UDIMM memory, which are Non-ECC unbuffered memory designed to deliver outstanding quality, rock solid stability and great performance expected by today's mainstream PC builder.

Signature Premium DDR4 memory provides a wide range of capacities allowing the builder to choose from a variety of speeds and capacities starting with 4GB single modules up to 32GB dual channel kits. The minimalist heat spreader design offers great heat dissipation and is made from high-purity aluminum. Signature Premium DDR4 series modules offer reliability to those who upgrade or build systems for work or business and are cost effective too.

The headline of this post makes it seem a touch more innocuous than the story may lead to, at least if you believe the rumor mills abound. There has been an ongoing issue with AMD systems using Ryzen CPUs and the HTC Vive wireless adapter (powered by Intel WiGig) to where the systems have frozen or even had a BSOD. HTC acknowledged this as early as Nov, 2018, noting that they have seen this with a subset of Ryzen-based motherboards when the PCIe wireless adapter is installed and running. It took until last week to get a solution of sorts, and unfortunately reports from users indicate this is not a true fix for everyone.

The hotfix update 1.20190410.0 was made available April 25 to attempt to combat this issue, which was garnering a lot of attention in the VR-community on whether there was more Intel could be doing to help AMD customers. This hotfix update is available automatically once an end user with the Vive wireless adapter checks for an update, and HTC acknowledge that they continue to test this, as well as partner with Intel and AMD to help resolve this once and for all. In the meantime, users report mixed success to date, including some we know personally as well, and it remains a thorn in the side of wireless VR to get to the PC successfully.

AMD today announced revenue for the first quarter of 2019 of $1.27 billion, operating income of $38 million, net income of $16 million and diluted
earnings per share of $0.01. On a non-GAAP(*) basis, operating income was $84 million, net income was $62 million and diluted earnings per share was $0.06.

"We delivered solid first quarter results with significant gross margin expansion as Ryzen and EPYC processor and datacenter GPU revenue more than doubled year-over-year," said Dr. Lisa Su, AMD president and CEO. "We look forward to the upcoming launches of our next-generation 7nm PC, gaming
and datacenter products which we expect to drive further market share gains and financial growth."

AMD has filed a trademark for an updated design on their Vega logo. The original Vega logo was made out of two full triangles, arranged in such a way as to form the letter "V". The updated trademark has since made an appearance on AMD's professional line of graphics cards, in the form of packaging for the Radeon Pro WX 9100 - likely an effort from AMD to further separate its professional and consumer graphics.

The new logo is the old being revisited, with the same prismatic arrangement, but with added detailing for a 3D effect, which makes sense in the 3D rendering world that AMD's professional graphics cards are used in. Perhaps this AMD investment in updating the branding means a refresh could be coming for its professional graphics card market that still uses the Vega architecture, though this is mere speculation at this point.

TechPowerUp today released GPU-Z 2.20.0 as a very quick follow-up to version 2.19.0 from a few hours ago. We have come across a few critical bugs with the older version that needed immediate fixing. To begin with, your overclock getting reset on NVIDIA graphics cards with Boost when using GPU-Z, has been fixed. A crash noticed on machines with NVIDIA "Pascal" GPUs with no driver loaded, has also been fixed. Crashes noticed on Apple machines (i.e. Windows on Apple) with AMD Radeon Vega 12 GPU have been fixed. We touched up the memory bus-width read-out to show "bit" instead of "Bit," while we were at it. Grab the download from the link below.

DOWNLOAD: TechPowerUp GPU-Z 2.20.0The change-log follows.

ASUS today has posted a full listing of the motherboards that are receiving BIOS updates to allow for full compatibility with AMD's upcoming Ryzen 3000 series CPUs. These range across the B350, X370, B450, and X470 chipsets, with everything from ROG to TUF to Prime-branded motherboards receiving the support update. Conspicuously absent, though, are ASUS' A-series motherboards, based on the A320 chipset - despite it supporting the same electrical load as its B350 counterpart.

An ASUS remark claiming that "new models to be listed" gives some hope, but there have been unofficial rumors of A-series-based motherboards not supporting AMD's latest CPUs - and that ASUS claim could well be directed to some unlisted motherboards between the already mentioned chipsets.

As we gear up for launch of AMD-s Ryzen 3000 series, details are bound to come up with increasing frequency. One of the latest, regarding AMD's in-house developed X570 chipset, which brings a renewed feature set to the AM4 platform, pertains to its PCIe lanes. AMD has included a grand total of 40 PCIe 4.0 lanes on the chipset, which will be distributed between PCIe uplink, USB 3.1 Gen2, USB 2.0 and SATA, as the spec sheet below (which may not be real) indicates. That's a whole load of bandwidth for the PC platform, not counting those PCIe lanes that are to be provided by the Ryzen CPUs.

It seems AMD will be using PCIe support level as a differentiator factor for its chipsets. The X570 is reported to be the only chipset to feature PCIe 4.0 support, while all other chipsets below it (B550 and so on) will only support PCIe 3.0. These lower-end chipsets should be manufactured by ASMedia.

Canada Computers put out details of Ryzen 7 2700X 50th Anniversary Edition, officially known as the Ryzen 7 2700X Gold Edition, a commemorative SKU of the 2700X which has been pictured in our older story. At the time we reported that the new SKU commands a roughly $50 premium over the regular 2700X with a fancy new box design and a facsimile of AMD CEO Lisa Su's signature on the processor's IHS. Turns out, you get a whole lot more.

The Ryzen 7 2700X 50th Anniversary Edition includes not just the processor and a Wraith Prism RGB cooling solution, but also two AAA games: Tom Clancy's "The Division 2" Gold Edition, and "World War Z," a black cotton T-shirt with AMD 50 artwork on both sides, and a special case-badge with another signature of the CEO, besides the Ryzen 7 case-badge. The 2 Free Games offer is being extended to the entire Ryzen 2000 AM4 desktop processor family, and several Radeon GPU models, including Radeon VII, RX 500 series, and RX Vega series. The offer is subject to retailer participation.

Pictures of an upcoming AMD Radeon "Navi" graphics card bare PCB made it to the web over the weekend. The picture reveals a fairly long (over 25 cm) board with AMD markings, and a layout that doesn't match with any reference-design PCB AMD launched so far. At the heart of the PCB is a large ASIC pad that appears to be within 5 percent of the size of a "Polaris10" chip. The ASIC is surrounded by eight GDDR6 memory pads. We could guess they're GDDR6 looking at the rectangularity of their pin-layout compared to GDDR5.

The PCB has provision for up to two 8-pin PCIe power inputs, and an 8+1 phase VRM that uses premium components such as rectangular tantalum capacitors, DrMOS, and a high-end VRM controller chip. There's also provision for dual-BIOS. The display I/O completely does away with DVI provisioning, and only includes the likes of DisplayPort, HDMI, and even USB-C based outputs such as VirtualLink. The fan header looks complex, probably offering individual fan-speed control for the card's multi-fan cooling solution that could resemble that of the Radeon VII. Looking purely at the feature-set on offer, and the fact that "Navi" will be more advanced than "Vega 2.0," we expect this card to be fairly powerful, going after the likes of NVIDIA's RTX 2070 and RTX 2060. AMD is expected to unveil this card at the 2019 Computex, this June.

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.