AMD Socket AM4 users are in for a treat, as the company plans two more processor models in the Ryzen 5000X3D series, according to chi11eddog, a reliable source with AMD leaks. Although based on the older "Zen 3" microarchitecture, these chips feature 3D Vertical Cache technology, which helps shore up their gaming performance to levels comparable at least to 12th Gen Intel Core "Alder Lake," giving Socket AM4 platform users a cost-effective upgrade path to prolong their gaming PC builds that could be as old as 5 years now. If you recall, AMD has formally extended "Zen 3" and 3D V-cache support to all Socket AM4 chipset generations, including AMD 300-series.

Among the two new processor models are the Ryzen 7 5700X3D, and the Ryzen 5 5500X3D. The 5700X3D is an 8-core/16-thread processor with 100 MB of total cache (that's 512 KB of L2 cache per core, plus 96 MB of L3 cache); while the Ryzen 5 5500X3D is a 6-core/12-thread chip with 99 MB of total cache. What sets the 5700X3D and 5500X3D apart from the 5800X3D and 5600X3D are lower clock speeds, and possibly, lower TDP. Both chips come with a base frequency of 3.00 GHz, compared to the 3.30 GHz of the 5600X3D and 3.40 GHz of the 5800X3D. The 5700X3D boosts up to 4.10 GHz compared to the 4.50 GHz of the 5800X3D; while the 5500X3D boosts up to 4.00 GHz when compared to 4.40 GHz of the 5600X3D. Both the 5800X3D and 5600X3D have their TDP rated at 105 W, so it's possible that AMD is using lower TDP and PPT values for the 5700X3D and 5500X3D. There's no word on when the two new chips are coming out, although AMD continues to release updates to the Socket AM4 AGESA microcode, with the latest version ComboAM4v2 1.2.0.B being released as recently as September 2023.

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

ASRock Rack Inc., the leading innovative server company, today is set to showcase a comprehensive range of servers for diverse AI workloads catering to scenarios from the edge, on-premises, and to the cloud at booth #1737 at SC 23 held at the Colorado Convention Center in Denver, USA. The event is from November 13th to 16th, and ASRock Rack will feature the following significant highlights:

At SC 23, ASRock Rack will demonstrate the NVIDIA-Qualified 2U4G-GENOA/M3 and 4U8G series GPU server solutions along with the NVIDIA H100 PCIe. The ASRock Rack 4U8G and 4U10G series GPU servers are able to accommodate eight to ten 400 W dual-slot GPU cards and 24 hot-swappable 2.5" drives, designed to deliver exceptional performance for demanding AI workloads deployed in the cloud environment. The 2U4G-GENOA/M3, tailored for lighter workloads, is powered by a single AMD EPYC 9004 series processor and is able to support four 400 W dual-slot GPUs while having additional PCIe and OCP NIC 3.0 slots for expansions.

AMD's "Phoenix" monolithic processor silicon drives the company's Ryzen 7040 series mobile processor lineup, and possible some of its upcoming Ryzen 7000G desktop processor models. It is the first chip from the AMD camp to feature an AI accelerator, besides up to 8 "Zen 4" CPU cores, and a large iGPU based on the latest RDNA3 graphics architecture, with up to 12 compute units, the latest display I/O and media acceleration capabilities. Over the course of its lifecycle, AMD realized that it can't use the nearly 200 mm² silicon built on the expensive 4 nm node to power lower-end processor SKUs, and so developed the smaller 137 mm² "Phoenix 2" silicon that lacks the AI accelerator, has a smaller iGPU with just 4 compute units, and a unique hybrid CPU with 2 "Zen 4" and 4 "Zen 4c" cores. We're now hearing that the company is designing even more derivatives.

The PCI ID Repository discovered two new IDs believed to reference the iGPU models of "Phoenix 3" and "Phoenix 4" chips. At this point we have no clue what the two chips could be, and what the mixture of their CPU, iGPU, and AI accelerator components could be, especially given that AMD is able to carve out Ryzen 3 SKUs from "Phoenix 2." We speculate that "Phoenix 3" and "Phoenix 4" could reference rebranding such as "Escher," although it could even be entirely new chips with different combinations of "Zen 4" and "Zen 4c" cores.

Today, Lenovo announced the new ThinkStation P8 tower workstation powered by AMD Ryzen Threadripper PRO 7000 WX-Series processors and NVIDIA RTX GPUs. Designed to deliver unparalleled performance, reliability and flexibility for professionals who demand the best from their workstations, the bold new ThinkStation P8 builds on the success of the award-winning P620, the world's first workstation powered by AMD Ryzen Threadripper PRO processors. Featuring an optimized thermal design in a versatile Aston Martin inspired chassis, the ThinkStation P8 combines Lenovo's legendary reliability, customer experience and innovation with breakthrough compute architecture courtesy of AMD and NVIDIA. ThinkStation P8 raises the bar for intense workloads across multiple segments focused on outcome-based workflow agility.

"At Lenovo, we understand that our customers need high-quality workstations that can adapt to their changing and diverse needs. That's why we collaborated with AMD and NVIDIA to create the ThinkStation P8, a workstation that combines power, flexibility and enterprise-grade features," said Rob Herman, vice president and general manager, Workstation and Client AI Business Unit, Lenovo. "Designed to offer unparalleled performance and scalability, whether to run complex simulations, render stunning visuals, or develop cutting-edge AI applications, the ThinkStation P8 can handle it all. And with Lenovo's certifications, security and support, you can trust that the ThinkStation P8 will exceed expectations."

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, continues to be a leader in cooling IT hardware efficiently and in developing diverse server platforms for Arm and x86 processors, as well as AI accelerators. At SC23, GIGABYTE (booth #355) will showcase some standout platforms, including for the NVIDIA GH200 Grace Hopper Superchip and next-gen AMD Instinct APU. To better introduce its extensive lineup of servers, GIGABYTE will address the most important needs in supercomputing data centers, such as how to cool high-performance IT hardware efficiently and power AI that is capable of real-time analysis and fast time to results.

Advanced Cooling
For many data centers, it is becoming apparent that their cooling infrastructure must radically shift to keep pace with new IT hardware that continues to generate more heat and requires rapid heat transfer. Because of this, GIGABYTE has launched advanced cooling solutions that allow IT hardware to maintain ideal performance while being more energy-efficient and maintaining the same data center footprint. At SC23, its booth will have a single-phase immersion tank, the A1P0-EA0, which offers a one-stop immersion cooling solution. GIGABYTE is experienced in implementing immersion cooling with immersion-ready servers, immersion tanks, oil, tools, and services spanning the globe. Another cooling solution showcased at SC23 will be direct liquid cooling (DLC), and in particular, the new GIGABYTE cold plates and cooling modules for the NVIDIA Grace CPU Superchip, NVIDIA Grace Hopper Superchip, AMD EPYC 9004 processor, and 4th Gen Intel Xeon processor.

MSI, a leading global server provider, is showcasing its latest GPU and CXL memory expansion servers powered by AMD EPYC processors and 4th Gen Intel Xeon Scalable processors, which are optimized for enterprises, organizations and data centers, at SC23, booth #1592 in the Colorado Convention Center in Denver from November 13 to 16.

"The exponential growth of human- and machine-generated data demands increased data center compute performance. To address this demand, liquid cooling has emerged as a key trend, said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's server platforms offer a well-balanced hardware foundation for modern data centers. These platforms can be tailored to specific workloads, optimizing performance and aligning with the liquid cooling trend."

AMD today announced the AMD Radeon PRO W7700, the most powerful professional workstation graphics card under $1,000, offering an ideal combination of reliability, stability and extraordinary price/performance for content creation, CAD and AI applications. The new workstation graphics card is designed to meet the evolving demands of professional workflows, including increasingly complex computer-generated designs, the continual growth in the development of visual effects and animations, a global surge in construction, and the explosive growth in advanced AI applications. The AMD Radeon PRO W7700 graphics card unleashes professionals' creativity through exceptional performance, stunning visuals and future-ready capabilities.

"We built and optimized the AMD Radeon PRO W7700 graphics cards to create premium workstation graphics experiences, enabling our customers to boost innovation and productivity," said Dan Wood, corporate vice president, Radeon product management at AMD.

ASUS today announced a showcase of the latest AI solutions to empower innovation and push the boundaries of supercomputing, at Supercomputing 2023 (SC23) in Denver, Colorado, from 12-17 November, 2023. ASUS will demonstrate the latest AI advances, including generative-AI solutions and sustainability breakthroughs with Intel, to deliver the latest hybrid immersion-cooling solutions, plus lots more - all at booth number 257.

At SC23, ASUS will showcase the latest NVIDIA-qualified ESC N8A-E12 HGX H100 eight-GPU server empowered by dual-socket AMD EPYC 9004 processors and is designed for enterprise-level generative AI with market-leading integrated capabilities. Related to NVIDIA announcement on the latest NVIDIA H200 Tensor Core GPU at SC23, which is the first GPU to offer HBM3E for faster, larger memory to fuel the acceleration of generative AI and large language models, ASUS will offer an update of H100-based system with an H200-based drop-in replacement in 2024.

Valve has announced an updated version of the Steam Deck and the headline feature is the new 7.4-inch OLED display. That's a mere 0.4-inches bigger than the original Steam Deck LCD display and it retains the same 1280 x 800 resolution. However, everything else related to the display has been improved and the refresh rate is now 90 Hz rather than 60 Hz. The display is also a lot brighter, with an SDR rating of 600 nits and an HDR rating of 1000 nits. Valve also claims a 110 percent P3 colour gamut, a one million to one contrast ratio and a sub 0.1 ms response time. On top of that, Valve has added what the company calls "high performance touch" which is said to improve the responsiveness of the display.

It's not just the display that has been improved, as Valve has moved to a 6 nm AMD Zen 2 based SoC which seems to allow the GPU to run at 1.6 GHz at all times, as Valve no longer lists a frequency range for the GPU. The power envelope remains the same though, with a range of 4-15 Watts. Paired with the new SoC is faster LPDDR5 memory at 6400 MT/s, up from 5500 MT/s, which should provide a small boost in gaming performance. An improved cooling solution is also part of the package, which is also likely a reason for the more constant GPU clocks. Gone are the entry level storage SKUs and the OLED version of the Steam Deck only comes with 512 GB or 1 TB of internal storage. The WiFi and Bluetooth module has also been overhauled and now supports WiFi 6E and Bluetooth 5.3. The battery has also been boosted from a 40 Whr pack to a 50 Whr pack and Valve now claims three to 12 hours of battery life during gaming, as well as faster charging times. Finally the weight has dropped by 29 grams, which might not be much, but still impressive considering the larger battery pack. The downside you ask? That would be the price, as Valve is asking for US$549/€569 for the 512 GB version, with the 1 TB coming at US$649/€679 when it becomes available on the 16th of November.

A curious piece of marketing material on the Chiphell forum has sent ripples through the tech community, featuring what appears to be an Alienware desktop equipped with an unannounced AMD Ryzen 9000-series processor. The authenticity of this flyer is up for debate, with possibilities ranging from a simple typo by Alienware to a fabricated image, or it could even suggest that AMD is on the cusp of unveiling its next-generation Ryzen CPUs for desktop PCs. While intrigue is high, it's important to approach such revelations cautiously, with a big grain of salt. AMD's existing roadmap points toward a 2024 release for its Zen 5-based Ryzen desktop processors and EPYC server CPUs, which casts further doubt on the Ryzen 9000 series appearing ahead of schedule.

We have to wait for AMD's major upcoming events, including the "Advancing AI" event on December 6, where the company will showcase how its partners and AMD use AI for applications. Next, we hope to hear from AMD about upcoming events such as CES in January and Computex in May, but we don't have any official information on product launches in the near term. If the company is preparing anything, the Alienware flyer pictured below should indicate it, if the source is confirmed. However, the doubt remains, and we should be skeptical of its truthfulness.

Micron Technology, Inc. (Nasdaq: MU), today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128 GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. These high-capacity, high-speed memory modules are engineered to meet the performance and data-handling needs of a wide range of mission-critical applications in data center and cloud environments, including artificial intelligence (AI), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads.

Powered by Micron's industry-leading 1β (1-beta) technology, the 32Gb DDR5 DRAM die-based 128 GB DDR5 RDIMM memory delivers the following enhancements over competitive 3DS through-silicon via (TSV) products:

• more than 45% improved bit density
• up to 24% improved energy efficiency
• up to 16% lower latency
• up to a 28% improvement in AI training performance

AMD is weaning the market off its older gaming graphics card series that predate the Radeon RX 5000 series. The company is reportedly putting older GPUs based on the "Vega" and "Polaris" graphics architectures on a slower driver update track, which means driver updates to these GPUs will be less frequent. The company's RX 5000, RX 6000, and RX 7000 series, on the other hand, will continue on with the current driver update track that includes one or more driver releases each month, including releases to fix glaring game bugs, or day-zero performance updates.

AMD over the past couple of months began segregating RDNA (RX 5000 series and later) and pre-RDNA (older than RX 5000 series) GPUs through their driver releases. The latest drivers come in an RDNA-only package (denoted by "rdna" in the installer's file name), which is around 600 MB in size; and a larger 1.1 GB package that supports both RDNA and pre-RDNA GPUs. The company now announced that the pre-RDNA GPUs will switch to a slower driver update track as is characteristic with older-generation GPUs that AMD wants to discontinue support for.

According to @momomo_us, Intel has discontinued its Cryo Cooling Technology as of July 1, 2023, marking the end of one of the tech industry's few sub-ambient cooling options. The technology, which could chill CPUs to 0 degrees Celsius to enhance performance, accompanied Intel's processors from the 10th-generation Comet Lake to the 13th-generation Raptor Lake. Despite its innovative approach to boosting CPU performance, the cooling solution was not widely embraced. The discontinuation comes just before the arrival of the 14th Generation Raptor Lake Refresh, which will not support the Cryo Cooling tech. Intel plans to maintain updates for the existing Cryo Cooling hardware until December 31, 2023.

This specialized cooling method did see some use in products like the Cooler Master MasterLiquid ML360 Sub-Zero and the EKWB EK-QuantumX Delta TEC waterblocks. Interestingly, the technology has managed to work even with non-Intel CPUs, which famous overclocker der8auer managed to get up and running on AMD's Ryzen 9 5950X. Some modifications were in place, but it was possible to do so. The likely reason for shutting down the cryo cooling project is the need for more financial sense to continue to pursue this technology and the effort to keep the cost of R&D down and make funds available for other projects at Intel's laboratories.

AMD is bundling "Avatar: Frontiers of Pandora," the hotly anticipated RPG based on the popular movie franchise, with its processors, graphics cards, and pre-builts that combine the two. The list of eligible product spans the higher end of the Ryzen 7000 series desktop processors, the entire Radeon RX 7000 series graphics cards (in the retail channel); and notebooks that combine select Ryzen 7000 series mobile processors and Radeon RX 6000M or 7000M series discrete graphics solutions.

The list of eligible desktop processors include Ryzen 9 7950X3D, 7950X, 7900X3D, 7900X, and 7900, and Ryzen 7 7800X3D. Eligible desktop graphics cards include Radeon RX 7900 XTX, RX 7900 XT, RX 7900 GRE, RX 7800 XT, RX 7700 XT, and RX 7600. For gaming notebooks, there must be a combination of the following processors and discrete graphics solutions: Ryzen 9 7945HX, 7845HX, 7940HS, Ryzen 7 7840HS, and 7735HS; and Radeon RX 7900M, RX 7700S, RX 7600S, RX 7600M XT, and RX 6550M. The promotion is open now, and runs until December 30, 2023; while the code redemption period closes January 27, 2024. The game itself releases on December 7.

LG Electronics USA announced today pricing and availability of two new models to its LG UltraGear gaming monitor lineup - the 45-inch LG UltraGear GR75DC and the 45-inch LG UltraGear GR65DC. The GR65DC is available to purchase for $799.99 now at LG.com and LG-authorized retailers. For a limited time, customers shopping on LG.com can preorder the LG UltraGear GR75DC for $899.99 and receive an UltraGear GP9 gaming speaker ($399 ARV) along with free expedited shipping.

The newest LG UltraGear models feature a 45-inch 32:9 Ultrawide Dual QHD screen - providing what is the equivalent of two 24-inch 16:9 QHD displays on one monitor at the same time. Engineered for multi-tasking, the built in PBP (picture by picture) and PIP (picture in picture) features allow users to play console games while simultaneously streaming content on an ultra-wide screen.

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

ASRock began rolling out UEFI firmware updates for its Socket AM5 motherboards that encapsulate AMD AGESA 1.1.0.0 ComboAM5PI microcode. This would be the second release of AGESA to support AMD's upcoming Ryzen 7000G "Phoenix" and "Phoenix 2" desktop APUs that the company reportedly plans to launch later this year. The AGESA 1.1.0.0 microcode comes with the SMU version 76.72.0 for "Phoenix" and "Phoenix 2," and continues with version 84.79.223 for "Raphael" and "Raphael-X" processors.

Unlike several past generations of Ryzen branded desktop APUs that only had 2-3 processor models in the retail channel, AMD is reportedly planning a slightly bigger lineup of APUs for the Socket AM5 platform, consisting of Ryzen 3, Ryzen 5, and possibly Ryzen 7 processor models, and their Ryzen PRO variants. The Ryzen 3 and Ryzen 5 models are expected to be based on the "Phoenix 2" silicon that has a combination of two "Zen 4" and four "Zen 4c" CPU cores and an iGPU with 4 compute units; while it is rumored that at least one Ryzen 5 and Ryzen 7 processor model will be built on "Phoenix," which has up to eight "Zen 4" cores, and a large iGPU with up to 12 compute units. So far we haven't seen reports of AMD bringing Ryzen AI to the desktop platform.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced direct liquid cooling (DLC) multi-node servers for NVIDIA Grace CPU & NVIDIA Grace Hopper Superchip. In addition, a DLC ready Intel-based server for the NVIDIA HGX H100 8-GPU platform and a high-density server for AMD EPYC 9004 processors. For the ultimate in efficiency, is also a new 12U single-phase immersion tank. All these mentioned products will be at GIGABYTE booth #355 at SC23.

Just announced high-density CPU servers include Intel Xeon-based H263-S63-LAN1 and AMD EPYC-based H273-Z80-LAN1. These 2U 4 node servers employ DLC for all eight CPUs, and although it is dense computing CPU performance achieves its full potential. In August, GIGABYTE announced new servers for NVIDIA HGX H100 GPU, and now adds the DLC version to the G593 series, G593-SD0-LAX1, for NVIDIA HGX H100 8-GPU.

AMD FidelityFX Super Resolution (FSR) is an open-source resolution upscaling technology that takes lower-resolution input and uses super-resolution temporal upscaling technology, frame generation using AMD Fluid Motion Frames (AFMF) technology, and built-in latency reduction technology to provide greater-resolution output images from lower-resolution settings. While the technology is open-source, it battles in market share with NVIDIA and the company's Deep Learning Super Sampling (DLSS). However, in the mobile space, there hasn't been much talk about implementing upscaling technology up until now. According to a popular leaker @Tech_Reve on X/Twitter, we have information that AMD is collaborating with Samsung and Qualcomm to standardize on upscaling technology implementations in mobile SoCs.

Not only does the leak imply that the AMD FSR technology will be used in Samsung's upcoming Exynos SoC, but some AMD ray tracing will be present as well. The leaker has mentioned Qualcomm, which means that future iterations of Snapdragon are up to adopt the FSR algorithmic approach to resolution upscaling. We will see how and when, but with mobile games growing in size and demand, FSR could come in handy to provide mobile gamers with a better experience. Primarily, this targets Android devices, which Qualcomm supplies, where Apple's iPhone recently announced MetalFX Upscaling technology with an A17 Pro chip.

AMD has released the latest version of the Adrenalin software, version 23.11.1 WHQL. The new AMD Software Adrenalin Edition 23.11.1 WHQL drivers add support for upcoming games, including Call of Duty: Modern Warfare III, Like a Dragon Gaiden: The Man Who Erased His Name, The Invincible, and JX3 Ultimate, and add Radeon Boost support for Alan Wake 2. The new drivers also add improvements and optimizations for Stable Diffusion, Adobe Lightroom, DaVinci Resolve, UL Procyon AI workloads on Radeon RX 600M, 700M, 6000, and 7000 series graphics cards.

In addition to new games support and optimizations, it also fixes several issues, including a fix for Performance Metrics Overlay FPS reporting in various games, performance issues with Radeon RX 7600 in Counter Strike 2, flickering issues in Total War: Pharaoh and Alan Wake, issues with rebuilding shader cache in Baldur Gate 3 on Vulkan API and Forza Motorsport, fix for driver crash in Forza Motorsport, and a fix for an intermittent black screen or code 31 error on some graphics cards, including the Radeon RX 6700 XT.

DOWNLOAD: AMD Software Adrenalin 23.11.1 WHQL

Today marks the end of support for Itanium's IA-64 architecture in the Linux kernel's 6.7 update—a significant milestone in the winding-down saga of Intel Itanium. Itanium, initially Intel's ambitious venture into 64-bit computing, faced challenges and struggled throughout its existence. It was jointly developed by Intel and HP but encountered delays and lacked compatibility with x86 software, a significant obstacle to its adoption. When AMD introduced x86-64 (AMD64) for its Opteron CPUs, which could run x86 software natively, Intel was compelled to update Xeon, based on x86-64 technology, leaving Itanium to fade into the background.

Despite ongoing efforts to sustain Itanium, it no longer received annual CPU product updates, and the last update came in 2017. The removal of IA-64 support in the Linux kernel will have a substantial impact since Linux is an essential operating system for Itanium CPUs. Without ongoing updates, the usability of Itanium servers will inevitably decline, pushing the (few) remaining Itanium users to migrate to alternative solutions, which are most likely looking to modernize their product stack.

BOXX Technologies, the leading innovator of high-performance computer workstations, rendering systems, and servers, today introduced APEXX T4 PRO, a workstation featuring new, AMD Ryzen Threadripper PRO 7000 WX- Series processors. The most powerful AMD platform ever, Ryzen Threadripper PRO delivers state-of-the-art performance for a variety of creative industries.

"The new AMD Ryzen Threadripper PRO 7000-WX Series provides an outstanding platform for APEXX T4 PRO," said BOXX founder and VP of Engineering Tim Lawrence. "The number of processing cores and innovative features, optimized by BOXX liquid cooling which is essential for high performance CPUs, will empower VFX artists, animators, motion media editors, architects, engineers, and data scientists, to create faster than ever before."

AMD today launched its first client processors that feature the compact "Zen 4c" CPU cores, with the Ryzen 5 7545U and Ryzen 3 7440U mobile processors for thin-and-light notebooks. The "Zen 4c" CPU core is a compacted version of the "Zen 4" core without the subtraction of any hardware components, but rather a high density arrangement of them on the 4 nm silicon. A "Zen 4c" core is around 35% smaller in area on the die than a regular "Zen 4" core. Since none of its components is removed, the core features an identical IPC (single thread performance) to "Zen 4," as well as an identical ISA (instruction set). "Zen 4c" also supports SMT or 2 threads per core. The trade-off here is that "Zen 4c" cores are generally clocked lower than "Zen 4" cores, as they can operate at lower core voltages. This doesn't, however, make the "Zen 4c" comparable to an E-core by Intel's definition, these cores are still part of the same CPU clock speed band as the "Zen 4" cores, at least in the processors that's being launched today.

The Ryzen 5 7545U and Ryzen 3 7440U mobile processors formally debut the new 4 nm "Phoenix 2" monolithic silicon. This chip is AMD's first hybrid processor, in that it has a mixture of two regular "Zen 4" cores, and four compact "Zen 4c" cores. The six cores share an impressive 16 MB of L3 cache. All six cores feature 1 MB of dedicated L2 cache. There is no complex hardware-based scheduler involved, but a software based solution that's deployed by AMD's Chipset Software, which tells the Windows scheduler to see the "Zen 4" cores as UEFI CPPC "preferred cores," and prioritize traffic to them, as they can hold on to higher boost frequency bins. The "Phoenix 2" silicon inherits much of the on-die power-management feature-set from the "Phoenix" and "Rembrandt" chips, and so are capable of a high degree of power savings with underutilized CPU cores and iGPU compute units.

AMD in its post Q3-2023 financial results call stated that it expects the Instinct MI300X accelerator to be the fastest product in AMD history to rake in $1 billion in sales. This would be the time it took for a product in its lifecycle to register $1 billion in sales. With the MI300 series, the company hopes to finally break into the AI-driven HPC accelerator market that's dominated by NVIDIA, and at scale. This growth is attributable to two distinct factors. The first of which is that NVIDIA is supply bottlenecked, and customers and looking for alternatives, and finally found a suitable one with the MI300 series; and the second is that with the MI300 series, AMD has finally ironed out the software ecosystem backing the hardware that looks incredible on paper.

It's also worth noting here, that AMD is rumored to be sacrificing its market presence in the enthusiast-class gaming GPU segment with its next-generation, with the goal of maximizing its foundry allocation for HPC accelerators such as the MI300X. HPC accelerators are a significantly higher margin class of products than gaming GPUs such as the Radeon RX 7900 XTX. The RX 7900 XTX and its refresh under the RX 7950 series, are not expected to have a successor in the RDNA4 generation. "We now expect datacenter GPU revenue to be approximately $400 million in the fourth quarter and exceed $2 billion in 2024 as revenue ramps throughout the year," said Dr. Lisa Su, CEO AMD, at the company's earnings call with analysts and investors. "This growth would make MI300 the fastest product to ramp to $1 billion in sales in AMD history."