We are nearing the arrival of AMD's Radeon RX 6x50XT graphics card refresh series, and benchmarks are starting to appear. Today, we received a 3DMark TimeSpy benchmark of the AMD Radeon RX 6950XT GPU and compared it to existing solutions. More notably, we compared it to NVIDIA's GeForce RTX 3090 Ti and came to a surprise. The Radeon RX 6950XT GPU scored 22209 points in the 3DMark TimeSpy test and looking at Graphics score, while the GeForce RTX 3090 Ti GPU scored 20855 points in the same test. Of course, we have to account that 3DMark TimeSpy is a synthetic benchmark and tends to perform very well on AMD RDNA2 hardware, so we have to wait and see for official independent testing like TechPowerUp's reviews.

AMD Radeon RX 6950XT card was tested with Ryzen 7 5800X3D CPU paired with DDR4-3600 memory and pre-released 22.10-220411n drivers on Windows 10. We could experience higher graphics scores with final drivers and see better performance of the upcoming refreshed SKUs.

As AMD is preparing to launch a highly-anticipated refresh of the Radeon RX 6000 series, codenamed RX 6x50 XT series. Alongside AMD, add-in board partners (AIBs) will have their say as well, and today we get to take a look at the alleged specifications of Sapphire's highest-end upcoming products. According to Chiphell member RaulMee, who claims to possess the specification of the newest Sapphire models, we are expected to see a bit higher total board power (TGP) with the arrival of this refresh. First and foremost, the Sapphire RX 6950XT TOXIC is the fastest air-cooled model from Sapphire, with a boost clock of up to 2565 MHz (255 MHz over AMD's reference 2310 MHz model), carrying a TGP of 364 Watts in OC BIOS. Regular TGP for this model is 332 Watts with a boost speed of up to 2532 MHz. Please note that this includes the power output of GPU and memory.

Next up, we have Sapphire's RX 6950XT NITRO+ SKUs. The non-SE card is a minor improvement over the AMD Radeon RX 6950XT reference GPU and offers a Silent BIOS option. The RX 6950XT NITRO+ Special Edition can go up to 325 Watts and 2435 MHz with OC BIOS applied. Silent BIOS is also an option, and it lowers the TGP to 303 Watts and 2368 MHz. The alleged specification chart also carries Sapphires' RX 6750XT & 6650XT NITRO+ GPUs, of which you can check the clock speeds and TGPs below.

Magic Leap's next-generation augmented reality (AR) headset could be AMD-powered according to a Basemark benchmark listing seen by _Rogame. The chip driving this headset is codenamed "Mero," and is a semi-custom SoC made by AMD. The SoC combines a CPU based on the "Zen 2" microarchitecture, with an iGPU based on RDNA2. Basemark reads this as 8 CPU cores, although it's possible this is 4-core/8-thread.

At this point, the RDNA2 compute unit (CU) count is unknown. Magic Leap uses an Android 10-derived OS for the x86-64 machine architecture, and the system name reads as "Magic Leap Demophon" to Basemark (which could just be the prototype's network machine name). The AR display-head is 720 x 920 pixels, and the memory available to the OS is 1 GB (not counting the memory shared to the iGPU).

A new list of specifications of AMD's next-generation "Navi 3x" GPUs based on the RDNA3 graphics architecture emerged, with lower CU counts than previously reported. It turns out that the large "Navi 31" GPU comes with 12,288 stream processors across 48 WGP (workgroup processors), 12 SA (shader arrays), and 6 SE (shader engines). This still amounts to a 140% increase in stream processors over the Navi 21. This chip will power SKUs that succeed the Radeon RX 6800-series and RX 6900-series.

The second largest silicon from the series is the Navi 32, with two-thirds the number-crunching machinery of the Navi 31. That's 8,192 stream processors across 32 WGPs, 8 SAs, and 4 SEs. The Navi 32 silicon powers successors of the RX 6700-series. The third largest chip is the Navi 33, with half the muscle of the Navi 32, and one-third that of the Navi 31. This means 4,096 stream processors spread across 16 WGP, 4 SA, and 2 SE. There's no word on other specs such as memory bus width, but we've heard rumors of AMD doubling down on the Infinity Cache memory technology, by giving these chips even larger on-die caches. RDNA3 is also expected to improve ray tracing performance, as more of the ray tracing pipeline is handled by fixed-function hardware.

A technological race is brewing between NVIDIA and AMD over which brand's GPU reaches the 100 TFLOP/s peak FP32 throughput mark first. AMD's TeraScale graphics architecture and the "RV770" silicon, were the first to hit the 1 TFLOP/s mark, way back in 2008. It would take 14 years for this figure to reach 100 TFLOP/s for flagship GPUs. NVIDIA's next generation big GPU based on the "Ada Lovelace," the AD102, is the green team's contender for the 100 TFLOP/s mark, according to kopite7kimi. To achieve this, all 144 streaming multiprocessors (SM) or 18,432 CUDA cores, of the AD102 will have to be enabled.

From the red team, the biggest GPU based on the next-generation RDNA3 graphics architecture, "Navi 31," could offer peak FP32 throughput of 92 TFLOP/s according to greymon55, which gives AMD the freedom to create special SKUs running at high engine clocks, just to reach the 100 TFLOP/s mark. The Navi 31 silicon is expected to triple the compute unit count over its predecessor, resulting in 15,360 stream processors. Both the AD102 and Navi 31 are expected to be built on the same TSMC N5 (5 nm EUV) node, and product launches for both are expected by year-end.

According to TrendForce research, due to vigorous stocking of various terminal applications causing a shortage of wafers in 2021, the global IC industry was severely undersupplied. This, coupled with spiking chip prices, boosted 2021 revenue of the global top ten IC design companies to US$127.4 billion, or 48% YoY. TrendForce further indicates three major disparities from the 2020 ranking. First, NVIDIA surpassed Broadcom to take the second position. Second, Taiwanese companies Novatek and Realtek rose to sixth and eighth place, respectively. Originally ranked tenth, Dialog was replaced at this position by Himax after Dialog was acquired by IDM giant Renesas.

Qualcomm continues its reign as number one in the world, primarily due to 51% and 63% growth YoY in sales of mobile phone SoC (System on Chip) and IoT chips, respectively. The addition of diversified development in its RF and automotive chip businesses were key to a 51% increase in revenue. NVIDIA implemented an integration of software and hardware, demonstrating its ambitions in creating a "comprehensive computing platform." Driven by annual growth of gaming graphics card and data center revenue at 64% and 59%, respectively, NVIDIA successfully climbed to second place. Broadcom benefited from the stable sales performance of network chips, broadband communication chips, and storage and bridging chips, with revenue growing 18% YoY. AMD's computer and graphics revenue grew by 45% YoY due to strong sales of the Ryzen CPU and Radeon GPU and rising average selling price. Coupled with accelerating demand from cloud companies, the annual revenue of AMD's enterprise, embedded, and semi-customized divisions increased by 113%, driving annual growth of total revenue to 68%.

AMD's next-generation MI300 compute accelerator is expected to significantly scale up the logic density, according to a rumor by Moore's Law is Dead. Based on the CDNA3 compute architecture, the MI300 will be a monstrous large multi-chip module with as many as 8 logic dies (compute dies), each with its dedicated HBM3 stack. The compute dies (logic dies), will be 3D-stacked on top of I/O dies that pack the memory controllers, and the interconnect that performs the inter-die, and inter-package communication.

The report even goes on to mention that the compute die at the top level of the stack will be built on TSMC N5 (5 nm) silicon fabrication process, while the I/O die below will be TSMC N6 (6 nm). At this point it's not known if AMD will use the package to wire the logic stacks to the memory stacks, or whether it will take the pricier route of using a silicon interposer, but the report supports the interposer theory—that an all-encompassing interposer seats all eight compute dies, all four I/O dies (each with two compute dies), and the eight HBM3 stacks. An interposer is a silicon die that facilitates high density microscopic wiring between two dies on a package, which are otherwise not possible through large package substrate wiring.

AMD's upcoming Socket AM5 Ryzen 7000-series "Raphael" desktop processors will ship with native support for DDR5-5200 memory speed, according to a marketing slide by memory maker Apacer (which also owns the overclocking memory brand ZADAK). The "Zen 4" based desktop processors will feature a dual-channel DDR5 (4 sub-channel) interface, just like the 12th Gen Core "Alder Lake," but with no backwards compatibility with DDR4.

AMD already stated that Ryzen 7000 processors have a design focus on memory overclocking capabilities, including AMD EXPO, a custom memory module SPD extension standard rivaling Intel XMP 3.0, which will come with fine-grained settings specific to the AMD memory controller architecture. Until now, AMD relied on A-XMP, a motherboard vendor-enabled feature based in the UEFI firmware setup program, which translates Intel XMP SPD profiles of memory modules into AMD-approximate settings.

DeepCool, a global brand in designing and manufacturing high-performance computer components for enthusiasts worldwide, announces a highly compatible CPU air cooler that offers impressive heat dissipation power in a compact and efficient design. With a slim profile, the AK400 air cooler serves as a thermal solution that can easily fit into mainstream ATX/MATX system builds. the unique design of the matrix form fin-stack and the non-RGB cover top offers a special aesthetic value to particular users.

The DeepCool AK400 Performance CPU Cooler is highly compatible and offers impressive heat dissipation power of 220 W in a compact and efficient design. Four direct touch copper heat pipes quickly transfer heat away from the processor into a dense matrix fin array heat sink for effective cooling performance.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today unveil their brand-new iMiner 660MX8D2 prebuilt mining rig. Designed with superior mining capability in a plug & play mining solution, BIOSTAR's new iMiner 660MX8D2 system brings maximum performance on a stable platform.

Built on top of BIOSTAR's TB360-BTC D+ motherboard, the new iMiner 660MX8D2 comes equipped with 8 AMD RX6600 series GPUs capable of executing an ETH hash rate of 248 MH/s (±5%)(Windows OS). With an operational capability of mining all major cryptocurrencies, such as ETH, ETC, RVN, ERG, etc.., the iMiner 660MX8D2 carries blockchain-grade hardware with BIOSTAR's superior product quality and capability.

AMD today released the latest version of AMD Software Adrenalin. Version 22.4.2 beta comes with optimization for "." A bug has been fixed where displays capable of 4K 120 Hz with FreeSync aren't shown that display mode on GPUs such as the Radeon RX 5700 XT. This is the only issue fixed with this release. Grab the driver from the link below.

DOWNLOAD: AMD Software Adrenalin 22.4.2 beta

The upcoming AMD Radeon RX 6750 XT has recently appeared in a benchmark listing on the GFXBench website where it performed 2% faster than the AMD Radeon RX 6700 XT. The Radeon RX 6750 XT is an upcoming refresh of the RX 6700 XT featuring faster GDDR6 memory running at 18 Gbps and increased clock speeds. The RX 6750 XT achieved a score of 366.5 FPS in the single GFXBench 5.0 Aztec Ruins High Tier off-screen entry which is 2% faster than the average RX 6700 XT score at 362.2 FPS for the same test. This initial test is not likely to be a representative sample of the card's performance but we would expect further tests to leak in the coming days. The AMD Radeon RX 6750XT is set to be officially unveiled on May 10th and will gradually replace existing RX 6700 XT offerings.

Update: The card has also been tested in various other GFXBench 5.0 tests including Aztec Ruins Normal Tier, Manhattan, and T-Rex where it achieves scores 6% - 12% above the RX 6700 XT.

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announced the BIOSTAR AMD Radeon RX 6400 graphics card to unleash next-level gaming performance.

Built on the high-performance, energy efficient AMD RDNA gaming architecture, the BIOSTAR AMD Radeon RX 6400 graphics card features high-bandwidth, low-latency AMD Infinity Cache memory technology, 4 GB of high-speed GDDR6 memory and a boost clock of 2321 MHz. It also supports Microsoft Windows 11 and Microsoft DirectX 12 Ultimate, AMD FidelityFX Super Resolution (FSR) and AMD Radeon Super Resolution (RSR) upscaling technologies, AMD Smart Access Memory technology, as well as other advanced features that provide visually stunning, high-refresh rate gaming experiences.

The unexpected parting-shot of Socket AM4 and "Zen 3" at Intel's new "Alder Lake" architecture, the AMD Ryzen 7 5800X3D, started selling. There is, however, a rude catch. On popular US retailer Newegg, the processor is going for as high as USD $589, or $140 higher than the $449 MSRP, a 30 percent mark-up. This would also put its price a vulgar $230 higher (64 percent higher) than the Ryzen 7 5800X, a price difference that can get you a reasonably good motherboard based on the AMD X570 chipset, or perhaps even a combination of a well-priced AMD B550 chipset motherboard and 16 GB of DDR4-3600 memory. It is important to note, however, though, that the Newegg listing is fulfilled by one of its marketplace vendors, and not Newegg directly. The site isn't selling the 5800X3D through its own fulfillment inventory.

The Ryzen 7 5800X3D thoroughly impressed us and several other tech reviewers. AMD stands good on its claim that the 5800X3D is faster than the Core i9-12900K at gaming, and it does end up trading blows with the i9-12900KS (an $800 chip) in several titles. The $589 marked-up price, however, erodes much of that goodwill, and for that kind of money, you're better off just getting a Core i9-12900 (non-K), and unshackling its power limits in the motherboard BIOS. The i9-12900 will trade blows with the 5800X3D at gaming, but will thoroughly outclass it at productivity. Both the i9-12900 and the 5800X3D are "locked."

MSI, a leading brand in True Gaming hardware, is proud to announce the new MSI AMD Radeon RX 6400 AERO ITX graphics card. The new graphics card is designed to make incredible 1080p gaming experiences for popular AAA and esports titles accessible to more gamers than ever.

Built on the high-performance, energy efficient AMD RDNA gaming architecture, AMD Radeon RX 6400 graphics cards feature high-bandwidth, low-latency AMD Infinity Cache memory technology and high-speed GDDR6 memory. They also support Microsoft Windows 11 and Microsoft DirectX 12 Ultimate, AMD FidelityFX Super Resolution (FSR) and AMD Radeon Super Resolution (RSR) upscaling technologies, AMD Smart Access Memory technology, as well as other advanced features that provide visually stunning, high-refresh rate gaming experiences.

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today announced the ASRock AMD Radeon RX 6400 Challenger ITX 4 GB graphics card. Built on the high-performance, energy efficient AMD RDNA 2 gaming architecture, AMD Radeon RX 6400 graphics cards feature high-bandwidth, low-latency AMD Infinity Cache memory technology and high-speed GDDR6 memory. They also support Microsoft Windows 11 and Microsoft DirectX 12 Ultimate, AMD FidelityFX Super Resolution (FSR) and AMD Radeon Super Resolution (RSR) upscaling technologies, AMD Smart Access Memory technology, as well as other advanced features that provide visually stunning, high-refresh rate gaming experiences.

In addition, ASRock AMD Radeon RX 6400 Challenger ITX 4 GB graphics card is also equipped with many unique features, including a compact single-fan Challenger ITX thermal design to provide excellent heat dissipation, and Super Alloy Graphics Card components that improves stability under long-term operation. In addition, without requiring an additional 8-pin power connector, the new graphics card is optimized for low power consumption and flexibility when upgrading an existing system.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the GIGABYTE Radeon RX 6400 EAGLE 4G and Radeon RX 6400 D6 Low Profile 4G graphics cards, equipped with the excellent GIGABYTE cooling system and engineered to deliver great 1080p gaming performance with remarkable efficiency. Blaze a trail into tomorrow and enjoy vivid virtual worlds and elevated experiences with the power of next-generation graphics.

Built on the high-performance, energy efficient AMD RDNA gaming architecture, the new graphics cards feature high-bandwidth, low-latency AMD Infinity Cache memory technology and high-speed GDDR6 memory. They also support Microsoft Windows 11 and Microsoft DirectX 12 Ultimate, AMD FidelityFX Super Resolution (FSR) and AMD Radeon Super Resolution (RSR) upscaling technologies, AMD Smart Access Memory technology, as well as other advanced features that provide visually stunning, high-refresh rate gaming experiences.

AMD formally launched the entry-level Radeon RX 6400 graphics card. At an MSRP of $159, this is the most affordable graphics card from the Radeon RX 6000 series. It is based on the same RDNA2 graphics architecture as the rest of the RX 6000 lineup, and the smallest silicon of them all, the "Navi 23." This chip is built on the TSMC N6 (6 nm) silicon fabrication process.

The RX 6400 shares the "Navi 23" silicon with the RX 6500 XT launched earlier this year. AMD enabled 12 out of 16 RDNA2 compute units on the silicon, resulting in 768 stream processors, 48 TMUs, 12 Ray Accelerators, and 32 ROPs. The memory configuration is similar to the RX 6500 XT, with 4 GB of GDDR6 memory across a 64-bit wide memory bus. This is the same 16 Gbps-rated memory, which means 128 GB/s bandwidth on tap. There's also 16 MB of Infinity Cache. The engine clocks (GPU clocks) are set at 2039 MHz (game) and 2321 MHz (boost). With its given specs, the RX 6400 has a typical graphics power (TGP) of just 53 W, and so cards can do without any power connectors.

AMD (NASDAQ: AMD) today announced the expansion of the AMD EPYC processor footprint within the cloud ecosystem, powering the new Oracle Cloud Infrastructure (OCI) E4 Dense instances. These new instances are part of the Oracle Cloud VMware Solution offerings, enable customers to build and run a hybrid-cloud environment for their VMware based workloads.

Based on 3rd Gen AMD EPYC processors, the new E4 Dense instances expand the AMD EPYC presence at OCI and are made to support memory and storage intense VMware workloads. The E4 Dense instances utilize the core density and performance capabilities of EPYC processors to provide customers a fast path to a cloud environment, enabling similar performance and advanced security features through enabling the AMD Secure Encrypted Virtualization (SEV) security feature for VMware workloads that they have on-premises.

AMD Radeon board partners BIOSTAR and XFX today released their custom-design RX 6400 graphics cards, in what could be a sign that board partners are allowed to quietly release the entry-level GPU. The BIOSTAR Radeon RX 6400 Gaming is a full-height graphics card with a simple aluminium mono-block fan-heatsink, and a lack of any additional power connectors. The XFX Radeon RX 6400 SWFT 105, on the other hand, is a low-profile, single-slot graphics card that may find appeal among the SFF crowd. It appears to be using an aluminium channel-type cooler with a 40-50 mm blower. The RX 6400 is carved out from the 6 nm "Navi 23" silicon by enabling 12 out of 16 RDNA2 compute units (768 stream processors), and comes with 4 GB of GDDR6 memory across the chip's 64-bit wide memory interface. We're hearing that at reference specs, the RX 6400 has a typical graphics power (TGP) of just 53 W, which is how it's able to make do without any power connectors.

AMD and the Mercedes-AMG Petronas Formula One (F1) Team today showcased how AMD EPYC processors improved aerodynamics testing capacity, contributing to the Mercedes-AMG Petronas team winning its eighth Constructors' Championship in the 2021 racing season. By using AMD EPYC processors, the team was able to achieve a 20 percent performance improvement for computational fluid dynamics (CFD) workloads that were used to model and test aerodynamic flow of their F1 car.

"We are proud to partner with the reigning Constructors' Champions, the Mercedes-AMG Petronas Formula One Team, operating at the cutting edge of racing and technology," said, Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "For F1 teams, having the most effective computational analysis of aerodynamics can mean the difference between winning and losing a race. With AMD EPYC processors, the Mercedes-AMG F1 team can iterate on vehicle design faster and more efficiently than their previous system."

AMD has unveiled a host of new laptop processors under its Ryzen PRO branding for corporate notebooks, although this time around, AMD has also tagged on an extra "50" to the model number. As such, the top of the range models are the Ryzen 9 Pro 6950H/HS, which appears to be more or less identical to the Ryzen 9 6900HX/HS. There's also a Ryzen 7 and 5 version in the H-series, as well as a Ryzen 7 and 5 in the U-series. In addition to these models, AMD also announced three new Ryzen PRO 5000 U-series models, which end up with the 75 suffix compared to the 25 suffix of the consumer models. These last three CPUs are based on the Zen 3 rather than the Zen 3+ architecture, just as with the consumer models.

AMD claims in excess of 26 hours of battery life from the Ryzen 7 PRO 6850U fitted inside an HP EliteBook 865 G9 with a 76 Wh battery pack. HP and Lenovo appear to be the launch partners for the new PRO series CPUs and HP will offer three different 800-series SKUs with the 6000-series processors and three other notebook series with the 5000-series processors. Lenovo on the other hand has its new Thinkpad Z13 and Z16 notebooks as AMD Ryzen 6000 PRO series exclusive models, as well as the four different Thinkpad models that will come with the same series of CPUs, plus several other models based on the 5000 series CPUs.

AMD's current generation flagship desktop processor, the Ryzen 9 5950X, can be had for a steal, with prices now ranging between $520 and $550. Prices of the 16-core/32-thread processor based on the "Zen 3" microarchitecture, have been on a sharp decline since the launch of the Core i9-12900K "Alder Lake," falling from the $750 launch price to $600 in early-March, with current (late-April) prices looking like $549 on Amazon, and $519 on the venerable MicroCenter website, with even lower prices expected in-store. At $520-550, prices of the 5950X would compare with the Core i9-12900 (non-K), but still be higher than the $385 Core i7-12700K. The 12-core/24-thread Ryzen 9 5900X can be had for $399 on Newegg.

ARCTIC, a leading manufacturer of low-noise PC coolers and components, is pleased to announce that all AM4-compatible ARCTIC coolers will also be compatible with AMD's new AM5 socket. AMD is expected to release the next-generation AMD Ryzen 7000 desktop processors (Zen 4) at the end of 2022. Since all mechanical dimensions remain identical, ARCTIC is able to guarantee compatibility with our coolers on AMD's new processors. Among the compatible ARCTIC coolers are its award-winning Liquid Freezer II series, the fan-favorite Freezer 34 eSports air cooler, and many more.