Other World Computing, the leading provider of computer hardware, accessories, and software that bring artistic expression and the digital world together for creative professionals and consumers of technology, today unveiled SoftRAID 8, a groundbreaking new software release that redefines RAID management for Mac and Windows environments.

Quickly accessing data with the right safeguards is a difficult balance. Whether it is enhancing multimedia production workflows, protecting critical business files, or ensuring uninterrupted access to valuable data, OWC's SoftRAID is the ideal solution to manage RAID arrays. SoftRAID implements the latest performance technology unleashing remarkable speeds on a RAID system. Simply connect the drive array, format the preferred RAID level, and experience the breakneck speeds first-hand. RAID management has never been this powerful and easy to use.

ITHome has highlighted several third-party protective cases listings for 12.9-inch iPad Air and Pro 2024 models—the Amazon product pages state that these accessories "will be on the shelves on March 26." The publication believes that this date could align with an official Apple unveiling—Mark Gurman, a Bloomberg reporter, predicted a planned announcement "around the end of March or April" in a recent "Power On" newsletter. MacRumors has tracked relevant activity on Weibo—based on claims made by Instant Digital (a well known Chinese leaker) they reckon that a possible March 26 presentation could be used to introduce: "pre-order availability, with shipping dates to follow."

We last heard about the rumored 2024 lineup of iPad Pro and Air models sporting some "revised physical dimensions." It was speculated that an upgrade to OLED panels has granted slimmer profiles—these possess fewer layers when compared to custom mini-LED parts on current generation premium tablets. LG is reported to be contracted for mass manufacturing of upcoming 13-inch iPad OLED tech, while Samsung (allegedly) takes care of 11-inch panels. With the launch of their M3 chipset-equipped MacBook Air 2024 range out of the way, Apple can concentrate on its next wave of new generation portable products.

NVIDIA is bringing OpenUSD-based Omniverse enterprise digital twins to the Apple Vision Pro. Announced today at NVIDIA GTC, a new software framework built on Omniverse Cloud APIs, or application programming interfaces, lets developers easily send their Universal Scene Description (OpenUSD) industrial scenes from their content creation applications to the NVIDIA Graphics Delivery Network (GDN), a global network of graphics-ready data centers that can stream advanced 3D experiences to Apple Vision Pro.

In a demo unveiled at the global AI conference, NVIDIA presented an interactive, physically accurate digital twin of a car streamed in full fidelity to Apple Vision Pro's high-resolution displays. The demo featured a designer wearing the Vision Pro, using a car configurator application developed by CGI studio Katana on the Omniverse platform. The designer toggles through paint and trim options and even enters the vehicle - leveraging the power of spatial computing by blending 3D photorealistic environments with the physical world.

In the world where the largest companies are riding the AI train, the biggest of them all—Apple—seemed to stay quiet for a while. Even with many companies announcing their systems/models, Apple has stayed relatively silent about the use of LLMs in their products. However, according to Bloomberg, Apple is not pushing out an AI model of its own; rather, it will license Google's leading Gemini models for its iPhone smartphones. Gemini is Google's leading AI model with three variants: Gemini Nano 1/2, Gemini Pro, and Gemini Ultra. The Gemini Nano 1 and Nano 2 are designed to run locally on hardware like smartphones. At the same time, Gemini Pro and Ultra are inferenced from Google's servers onto a local device using API and the internet.

Apple could use a local Gemini Nano for basic tasks while also utilizing Geminin Pro or Ultra for more complex tasks, where a router sends user input to the available model. That way, users could use AI capabilities both online and offline. Since Apple is readying a suite of changes for iOS version 18, backed by Neural Engine inside A-series Bionic chips, the LLM game of Apple's iPhones might get a significant upgrade with the Google partnership. While we still don't know the size of the deal, it surely is a massive deal for Google to tap into millions of devices Apple ships every year and for Apple to give its users a more optimized experience.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

Apple introduced its new generation of MacBook Air subcompact laptops last week—their press material focused mostly on the "powerful M3 chip" and its more efficient Neural Engine. Storage options were not discussed deeply—you had to dive into the Air M3's configuration page or specification sheet to find out more. Media outlets have highlighted a pleasing upgrade for entry-level models, in the area of internal SSD transfer speeds. Apple has seemingly taken onboard feedback regarding the disappointing performance of its basic MacBook Air M2 model—its 256 GB storage solution houses a lone 3D NAND package. Max Tech's Vadim Yuryev was one of the first media personalities to discover the presence of two NAND flash chips within entry-level MacBook Air M3 systems—his channel's video teardown can be watched below.

The upgrade from a single chip to a twin configuration has granted higher read and write speeds—Yuryev shared Blackmagic SSD speed test results; screengrabs from his video coverage are attached to this article. M3 MacBook Air's 256 GB solution achieved write speeds of 2,108 MB/s, posting 33% faster performance when compared to an equivalent M2 MacBook Air configuration. The M3 model recorded read speeds of 2,880 MB/s—Wccftech was suitably impressed by this achievement: "making it a whopping 82 percent than its direct predecessor, making it quite an impressive result. The commendable part is that Apple does not require customers to upgrade to the 512 GB storage variants of the M3 MacBook Air to witness higher read and write speeds." Performance is still no match when lined up against "off-the-shelf" PCIe 3.0 x4 drives, and tech enthusiasts find the entry price point of $1099 laughable. Apple's lowest rung option nets a 13-inch model that packs non-upgradable 8 GB of RAM and 256 GB of storage. Early impressions have also put a spotlight on worrying thermal issues—Apple's fan-less cooling solution is reportedly struggling to temper their newly launched M3 mobile chipset.

According to renowned Apple analyst Ming-Chi Kuo, Apple is actively working on a foldable 20.3-inch MacBook, with mass production expected to begin in 2027. In a recent post on X/Twitter, Kuo stated that this foldable MacBook is currently Apple's only foldable product with a clear development schedule. Kuo's revelation comes amidst frequent inquiries about whether Apple plans to mass-produce a foldable iPhone or iPad in 2025 or 2026. His latest survey indicates that while Apple may explore these options, the foldable MacBook is the only device with a definitive timeline. This is not the first time rumors have circulated about a potential foldable MacBook from Apple. In 2022, display industry analyst Ross Young and Bloomberg's Mark Gurman both reported that Apple was interested in launching a foldable device with a screen size of around 20 inches.

Details about the foldable MacBook's design remain scarce, but it is expected to feature a single foldable OLED display that can be used in various configurations, such as a laptop mode with a virtual keyboard on the lower half of the screen or as a large tablet when fully unfolded. While competitors like Samsung, Motorola, and Huawei have already released foldable smartphones, Apple appears to be more cautious, focusing on perfecting the technology before bringing a product to market. As the foldable device market evolves, it will be interesting to see how Apple's unique take on the form factor fares. As Apple's first foldable product, it will be interesting to see what design choices are made and what hardware configuration will be present. But we are still relatively far away from the actual release of 2027.

Apple today announced the new MacBook Air with the powerful M3 chip, taking its incredible combination of power-efficient performance and portability to a new level. With M3, MacBook Air is up to 60 percent faster than the model with the M1 chip and up to 13x faster than the fastest Intel-based MacBook Air. And with a faster and more efficient Neural Engine in M3, MacBook Air continues to be the world's best consumer laptop for AI. The 13- and 15-inch MacBook Air both feature a strikingly thin and light design, up to 18 hours of battery life, a stunning Liquid Retina display, and new capabilities, including support for up to two external displays and up to 2x faster Wi-Fi than the previous generation.

With its durable aluminium unibody enclosure that's built to last, the new MacBook Air is available in four gorgeous colors: midnight, which features a breakthrough anodization seal to reduce fingerprints; starlight; space gray; and silver. Combined with its world-class camera, mics, and speakers; MagSafe charging; its silent, fanless design; and macOS, MacBook Air delivers an unrivaled experience—making the 13-inch model the world's bestselling laptop and the 15-inch model the world's bestselling 15-inch laptop. Customers can order starting today, with availability beginning Friday, March 8.

A South Korean website, gamma0burst, has combed through many LinkedIn profiles in an attempt to find unintentional technology leaks—last week's investigation targeted big companies including Apple, AMD, Google and Qualcomm. Employee work histories occasionally display confidential project information—gamma0burst's latest "hidden in plain sight" discovery has linked Apple a TSMC 2 nm process node. Late January reports suggested that the American multinational technology corporation was already queued up for an N2 process technology that utilizes gate-all-around (GAA) nanosheet transistors. Information gleaned from a severely redacted screenshot of an Apple employee profile indicates that work has started on 2 nm chip designs, in partnership with Taiwan's premier foundry. Additionally, the portion of revealed text also mentions that this unnamed Apple staffer is/was engaged in "TS3nm" and "TS5nm" designs.

Apple and TSMC's close relationship is well documented—the iPhone/iPad/MacBook maker enjoys preferential access to the latter's best fabrication services. The upcoming M4 and Bionic A18 chipsets have been linked to an "enhanced" 3 nm process node—as mid-February reports suggest. At the time, inside sources proposed that Apple had: "strengthened the AI computing performance of mobile devices and greatly increased the computing power of its own processors, which has simultaneously increased its wafer investment in TSMC. According to industry sources, Apple's wafer production volume for TSMC's 3 nm enhanced version process this year is expected to increase by more than 50% compared with last year, making it firmly the largest customer of TSMC." DigiTimes Asia and MacRumors think that: "Apple is...the first company that will receive chips built on TSMC's future 2 nm process, which is expected to go into production in the second half of 2025. Known simply as 'N2,' it is expected to offer a 10 to 15 percent speed improvement at the same power, or a 25 to 30 percent power reduction at the same speed compared to chips made with the supplier's 3 nm technology."

TrendForce underscores that the primary momentum for server shipments this year remains with American CSPs. However, due to persistently high inflation and elevated corporate financing costs curtailing capital expenditures, overall demand has not yet returned to pre-pandemic growth levels. Global server shipments are estimated to reach approximately. 13.654 million units in 2024, an increase of about 2.05% YoY. Meanwhile, the market continues to focus on the deployment of AI servers, with their shipment share estimated at around 12.1%.

Foxconn is expected to see the highest growth rate, with an estimated annual increase of about 5-7%. This growth includes significant orders such as Dell's 16G platform, AWS Graviton 3 and 4, Google Genoa, and Microsoft Gen9. In terms of AI server orders, Foxconn has made notable inroads with Oracle and has also secured some AWS ASIC orders.

Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

Mid-January reportage indicated that LG and Samsung plants in South Korea had commenced construction of next-gen Apple iPad OLED parts—while expert analysis has predicted a second quarter launch of 11 and 13-inch "Pro" tablet models. Omdia—an independent analyst and consultancy firm—has compiled its Apple field research into a forecasted roadmap of various portable products. Company analysts believe that: "LG Display (LGD) and Samsung Display (SDC) are preparing to mass-produce RGB tandem stack and Hybrid OLEDs from their half-Gen 6 fabs. Apple also plans to launch the MacBook Pro with OLED displays in 2026. BOE, LGD, and SDC are preparing their fab investments to produce RGB tandem stack and hybrid OLEDs at half-Gen 8.7 fabs."

9to5Mac's insider network detected whispers of possible Apple tablet physical profile adjustments—suggesting that a larger next-gen iPad Air is in the pipeline, alongside a thinner iPad Pro design update: "(we) first reported last year that Apple has been working on two new versions of the iPad Air, codenamed J507 and J537. While one of these models will look pretty much like the current iPad Air, the other will have a larger display. If true, this will be the first time Apple will offer the iPad Air in two different sizes. And according to our sources, this larger iPad Air will have essentially the same dimensions as the current 12.9-inch iPad Pro, suggesting that the screen size will also be almost identical. The smaller iPad Air is unlikely to have any significant design changes."

Apple has just been hit with a massive €500 million fine by the European Union over a complaint filed by Spotify over anti-competitive practices. The crux of the complaint is that while Spotify subscriptions purchased on its website are competitive to those of Apple Music, subscriptions purchased on Apple devices via the App Store incur a 30% commission to Apple, which would result in Spotify having to increase its subscription prices, making Spotify lose competitiveness to Apple Music, which comes pre-installed on iOS devices, is deeply integrated with the operating system, and costs less. The Spotify complaint was filed with the European Commission way back in 2019, with the ruling coming out just now. Apple is already facing the EU's heat over barriers to App Store alternatives in the Epic Games case. The company is implementing several platform-level changes with the upcoming iOS 17.4 update scheduled for March 2024, as well as changes to its terms of service. Hopefully Spotify gets its due.

Apple CEO, Tim Cook, discussed planned generative AI software features during an early February earnings call: "As we look ahead, we will continue to invest in these and other technologies that will shape the future. That includes artificial intelligence, where we continue to spend a tremendous amount of time and effort, and we're excited to share the details of our ongoing work in that space later this year." His "prepared" statement did not provide any specific insights into involved technologies, but many iPhone experts believe that the upcoming release of iOS 18 could be "the biggest update" in Apple mobile operating system history. The American multinational technology giant is seemingly taking a relaxed approach with internal artificial intelligence developments—rival smartphone maker, Samsung, has already jumped into the on-the-go AI deep end with its recently launched Galaxy S24 series. Qualcomm's Snapdragon 8 Gen 3 (for Galaxy) chipset is ready to take on all sorts of artificial intelligence-augmented tasks, while a next-gen ARM Cortex-X "Blackhawk" unit (leveraging "great" LLM performance) is in the pipeline for a late 2024 rollout.

Taiwan's Economic Daily News has reached out to insider contacts, albeit on the hardware side of things—their sources reckon that Apple is working on next generation processors that sport "significantly upgraded Neural Engine performance with additional cores." Tipsters believe that plans for 2024 include an effort to "significantly strengthen the AI computing power of the (existing) M3 and A17 processors," while the true "new generation" M4 and Bionic A18 chipsets will be augmented with greater AI computing core counts. Taiwan's top foundry is reportedly in the mix: "Apple has strengthened the AI computing performance of mobile devices and greatly increased the computing power of its own processors, which has simultaneously increased its wafer investment in TSMC. According to industry sources, Apple's wafer production volume for TSMC's 3 nm enhanced version process this year is expected to increase by more than 50% compared with last year, making it firmly the largest customer of TSMC."

A new forecast from International Data Corporation (IDC) shows shipments of artificial intelligence (AI) PCs - personal computers with specific system-on-a-chip (SoC) capabilities designed to run generative AI tasks locally - growing from nearly 50 million units in 2024 to more than 167 million in 2027. By the end of the forecast, IDC expects AI PCs will represent nearly 60% of all PC shipments worldwide.

"As we enter a new year, the hype around generative AI has reached a fever pitch, and the PC industry is running fast to capitalize on the expected benefits of bringing AI capabilities down from the cloud to the client," said Tom Mainelli, group vice president, Devices and Consumer Research. "Promises around enhanced user productivity via faster performance, plus lower inferencing costs, and the benefit of on-device privacy and security, have driven strong IT decision-maker interest in AI PCs. In 2024, we'll see AI PC shipments begin to ramp, and over the next few years, we expect the technology to move from niche to a majority."

iFixit has finally posted photos of the Apple Vision Pro's inner bits, following on from the release of a video teardown (uploaded last week)—the American e-commerce and how-to website spent plenty of hours exploring the expensive mixed reality headset's "creepy" features, before breaking seals and deconstructing the device's highly complex interior. The iFixit teardown team have often complained about Apple computer products being notoriously difficult to deal with—the Vision Pro is no exception, but they eventually managed to isolate the headset's logic board. The onboard M2 octa-core chipset is identified as a APL1109/339S01081E part, while its assistant R1 sensor co-processor sports an APL1W08/339S01186 identifier. Micron has supplied 8 GB of LPDDR5 SDRAM memory (MT62F1G64D8WT-031 XT), and Kioxia has Apple covered with its K5A4RC2097 256 GB NAND flash.

Tech experts have spent time poring over iFixit's latest set of snaps, as laid out in their teardown guide—one such enthusiast, Yining Karl Li, posted an intriguing Apple Vision Pro Logic Board observation to social media: "There's this interesting shot of the main logic board (in Step 1). The R1 chip (in the red box) has interesting lines all over it dividing the surface into sub-boxes. Is the R1 chip using a chiplet design?" A small debate erupted from this quick inspection—one commenter believes that the co-processor is not all that fancy: "(it is) likely sporting low-latency fan-out memory," citing the presence of very faint horizontal and vertical lines. As pointed out by Wccftech, Li also presented a chiplet design example (for comparison purposes)—a close-up shot of Intel's Ponte Vecchio Xe-HPC GPU. The lines are a lot more pronounced on Team Blue's chip design.

Team Group, the global memory provider of top-of-the-line storage solutions, today announced the release of the MagSafe-compatible Team Group PD20M Magnetic External SSD. It is one of the lightest and thinnest MagSafe-related products on the market. Weighing merely 40 g and measuring only 0.82 cm, the PD20M is easy to grip and take on the go. You can attach it to a mobile device without any additional accessories, and its elegant curved design allows you to comfortably hold it in your hands.

The Team Group PD20M Magnetic External SSD has a magnetic strength of over 0.8 kg, making it able to snap on a mobile device instantly. The stylish and portable design allows users to store valuable data on their phones in a variety of situations. The PD20M Magnetic External SSD uses the USB Type-C interface and is compatible with most devices that use it. These include the Apple iPhone 15 Pro and Pro Max smartphones, which have a maximum transfer speed of 10 Gbps. Able to store data in a flash, the PD20M delivers performance and convenience, making it the ideal solution for expanding storage capacity.

Apple's Vision Pro mixed reality headset is due to launch on February 2—many rival companies in the AR/VR market space will be taking notes once the slickly designed device (with a $3499 starting price) reaches customers. The Wall Street Journal claims that the executive team at Meta is hopeful that Apple's headset carves out a larger space within a niche segment. The latter's "more experimental" products sometimes have surprising reach, although it may take a second (i.e cheaper) iteration of the Vision Pro to reach a mainstream audience. Meta is reported to have invested around $50 billion into its Quest hardware and software development push—industry experts reckon that this product line generates only ~1% of the social media giant's total revenue.

Insider sources suggest that CEO Mark Zuckerberg and his leadership team are keen to see their big money "gamble" finally pay off—Apple's next release could boost global interest in mixed reality headsets. The Wall Street Journal states that Meta staffers "see the Quest and its software ecosystem emerging as a primary alternative to Apple in the space, filling the role played by Google's Android in smartphones." They hope that the Quest's relatively reasonable cost-of-entry will look a lot more attractive when compared to the premium Vision Pro. The report also shines a light on Meta's alleged push to focus more on mixed reality applications, since taking "inspiration" from Apple's WWDC23 presentation: "In addition, some developers are simplifying their apps and favor Apple's design that allows wearers to use their eyes and fingers to control or manipulate what they see. Meta's Quest primarily relies on the use of controllers for games or applications, although it can work with finger gestures."

A Taiwan Economic Daily news article proposes that a couple of high profile clients are considering TSMC's 2 nanometer process—Apple is widely believed to be the first customer to join the foundry's queue for cutting edge services. The report posits that Intel is also signed up on the Taiwanese firm's 2 nm reservation list—TSMC is expected to start production in 2025—insiders reckon that Team Blue's "Nova Lake" CPU family is the prime candidate here. Its CPU tile is alleged to utilize TSMC 2 nm node. Intel's recent "Core" processor roadmaps do not display any technologies beyond 2025—many believe that "Nova Lake" is pencilled in for a loose 2026 launch window, perhaps within the second half of the year.

The existence of "Nova Lake" was revealed late last year by HWiNFO patch notes—a short entry mentioned preliminary support for the family's integrated GPU. Intel is engaged in hyping up of its own foundry's 20A and 18A processes, but remain reliant on TSMC plants for various bits of silicon. Industry tipsters reckon that aspects of "Lunar Lake" CPUs are based on the Taiwanese foundry's N3B node. Team Blue Corporation and United Microelectronics Corporation (UMC) announced a new development partnership last week, but initial offerings will arrive on a relatively passé "12-nanometer semiconductor process platform." TSMC's very advanced foundry services seem to be unmatched at this juncture.

For Backbone's first-ever game collaboration, we've partnered with the legendary Kojima Productions to bring you the Backbone One - DEATH STRANDING Limited Edition controller. This collaboration commemorates the release of DEATH STRANDING DIRECTOR'S CUT for iOS. The Backbone One controller features custom product and packaging designs that blend the innovative design of the Backbone One with the artistic vision of Hideo Kojima and his award-winning title, DEATH STRANDING. Backbone One - DEATH STRANDING Limited Edition includes a free copy of DEATH STRANDING DIRECTOR'S CUT for iOS. Your complimentary copy of the game also gives you the ability to play it on iPad and Mac. The best way to experience DEATH STRANDING on your iPhone 15 is with Backbone! Tomorrow Is In Your Hands.

Designed in Partnership with Kojima Productions
Hideo Kojima, the mastermind behind DEATH STRANDING and founder of Kojima Productions, is renowned for his innovative storytelling and game design approach. His collaboration with Backbone is a further testament to his vision of pushing the boundaries of gaming, blurring the lines between console and mobile experiences.

A DigiTimes Asia report posits that TSMC is preparing another VVIP foundry lane for Apple Inc.—insiders claim that the Taiwanese foundry giant is in the process of expanding production capacity into next generation 2 nm nanometer fields. This expensive and time consuming endeavor is only made possible with the reassurance of big customers being added to the foundry's order books. TSMC's 2 nm-class N2, N2P, and N2X process technologies are due in 2025 and beyond (according to recent presentation slides)—these advanced packages are set to drop with all sorts of innovations: nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance metal-insulator-metal (SHPMIM). According to a DigiTimes source "Apple is widely believed to be the initial client to utilize the (next-gen) process."

Apple and NVIDIA were reported to be ahead of many important clients in the queue for TSMC's 3 nm process nodes, so it is not surprising to see old patterns repeat (according to industry rumors) again. Apple is expected to update its next generation iPhones, iPad, and Mac laptop product lines with more advanced Bionic and M-series chipsets in 2025. Last year's roster included a rollout of 3 nm TSMC silicon across Apple A17 Pro and M3 ARM-based processors.

New York-based security firm Trail of Bits has identified a security vulnerability with various GPU models, which include AMD, Qualcomm, and Apple. This vulnerability, named LeftoverLocals, could potentially allow attackers to steal large amounts of data from a GPU's memory. Mainstream client-GPUs form a sizable chunk of the hardware accelerating AI and LLMs, as they cost a fraction of purpose-built data-center GPUs, and are available in the retail market. Unlike CPUs, which have undergone extensive hardening against data leaks, GPUs were primarily designed for graphics acceleration and lack similar data privacy architecture. To our knowledge, none of the client GPUs use virtualization with their graphics memory. Graphics acceleration in general is a very memory sensitive application, and requires SIMD units to have bare-metal access to memory, with as little latency as possible.

First the good news—for this vulnerability to be exploited, it requires the attacker to have access to the target device with the vulnerable GPU (i.e. cut through OS-level security). The attack could break down data silos on modern computers and servers, allowing unauthorized access to GPU memory. The potential data breach could include queries, responses generated by LLMs, and the weights driving the response. The researchers tested 11 chips from seven GPU makers and found the vulnerability in GPUs from Apple, AMD, and Qualcomm. While NVIDIA, Intel, and Arm first-party GPUs did not show evidence of the vulnerability, Apple, Qualcomm, and AMD confirmed to wired that their GPUs are affected, and that they're working on a security response. Apple has released fixes for its latest M3 and A17 processors, but older devices with previous generations of Apple silicon remain vulnerable. Qualcomm is providing security updates, and AMD plans to offer mitigations through driver updates in March 2024.

Insider information emerging from an LG Display manufacturing plant points to OLED screen production ramping up in the coming months for fitting on next generation Apple iPad Pro models. According to Korea's The Elec, LG as well as rival Samsung's Display division are about to begin production on thin film transistor (TFT) layering for prosumer iOS-driven tablets. LG is allegedly contracted to manufacture upcoming 13-inch iPad Pro display tech, while Samsung is tasked with producing an 11-inch parts. The Korean report proposes that Apple is hoping to get its 13-inch and 11-inch OLED iPad Pro models into a mass production phase by March. Industry insiders think that M3 (ARM-based) chipsets are a natural choice to power these devices.

An Apple analyst—Ming-Chi Kuo—reckons that OLED-equipped iPad Pro models are scheduled for a second quarter 2024 launch, which lands anywhere between April to June. The multinational technology company had a sluggish 2023, in terms of hardware sales, and is likely keen to generate interest with its next-gen iPad Pro range—the addition of OLED technology (a first for Apple tablets) seems to be a key strategy. Mac Rumors believes that: "Apple's OLED iPad Pro shipments forecast for the year have reportedly decreased to 8 million units, down from the 10 million units that were projected for 2024 last year. The reduction is said to be a reflection of broadly sluggish performance across Apple's product lineup. Apple did not release any new iPad models last year, so it will be interesting to see if pent-up demand can offset poor sales."

Apple today announced Apple Vision Pro will be available beginning Friday, February 2, at all U.S. Apple Store locations and the U.S. Apple Store online. Vision Pro is a revolutionary spatial computer that transforms how people work, collaborate, connect, relive memories, and enjoy entertainment. Vision Pro seamlessly blends digital content with the physical world and unlocks powerful spatial experiences in visionOS, controlled by the most natural and intuitive inputs possible—a user's eyes, hands, and voice.

An all-new App Store provides users with access to more than 1 million compatible apps across iOS and iPadOS, as well as new experiences that take advantage of the unique capabilities of Vision Pro. Pre-orders for Apple Vision Pro begin Friday, January 19, at 5 a.m. PST. "The era of spatial computing has arrived," said Tim Cook, Apple's CEO. "Apple Vision Pro is the most advanced consumer electronics device ever created. Its revolutionary and magical user interface will redefine how we connect, create, and explore."

Intel Core Ultra "Meteor Lake" mobile processor may be the the company's most efficient, but isn't a generation ahead of the 13th Gen Core "Raptor Lake" mobile processors in terms of performance. This isn't just because it has an overall lower CPU core count in its H-segment of SKUs, but also because its performance cores (P-cores) actually post a generational reduction in IPC, as David Huang in his blog testing contemporary mobile processors found out, through a series of single-threaded benchmarks. Huang did a SPECint 2017 performance comparison of Intel's Core Ultra 7 155H, and Core i7-13700H "Raptor Lake," with AMD Ryzen 7 7840HS, 7840H "Phoenix, Zen 4," and Apple M3 Pro and M2 Pro.

In his testing, the 155H, an H-segment processor, was found roughly matching the "Zen 4" based 7840U and 7840HS; while the Core i7-13700H was ahead of the three. Apple's M2 Pro and M3 Pro are a league ahead of all the other chips in terms of IPC. To determine IPC, Huang tested all processors with only one core, and their default clock speeds, and divided SPECint 2017 scores upon average clock speed of the loaded core logged during the course of the benchmark. Its worth noting here that the i7-13000H notebook was using dual-channel (4 sub-channel) DDR5 memory, while the Core Ultra 7 155H notebook was using LPDDR5, however Huang remarks that this shouldn't affect his conclusion that there has been an IPC regression between "Raptor Lake" and "Meteor Lake."