MonsterLabo, a team of four people best known for their work on "The First" PC case, are at it again with giant pieces of PC component tech. This time, they took tried and true designs and sizes of CPU and GPU coolers and threw them into an enlargement ray, coming up with what they are calling "The Heart". As it stands, and it stands higher and heavier than all other cooling solutions hitherto, "The Heart" is a cooling solution that extends from your CPU through to your GPU, cooling both with its design of densely stacked fins.

Dimensions is where "The Heart" is bold, with the cooler measuring 200 by 185 mm and 265 mm tall. Adding insult to injury, its weight comes in at 6.6 lbs (3 Kg for us metric system aficionados). MonsterLabo rates the cooler's dissipation capabilities at 100 W CPU load and a 120 W GPU. Adding a 500-RPM 140 mm fan would bump those numbers to 140 W and 160 W, respectively. Mind these numbers apply to cases where "The Heart" is installed into MonsterLabo's own The First case, but differences should be relatively minor in any other case, should you actually be able to install it there. Of course, the combined CPU and GPU design will be very hit or miss - your graphics card will have to be perfectly compatible with the cooler, with its GPU set just right on the PCB for it to be perfectly covered by it. If you want to risk that, you can always drop $200 or €180 for The Heart, in either black or white finishes. Inexpensive for a heart, yes, but extremely expensive as a cooler with expected limited compatibility.

According to the information obtained by Statesman, Samsung Electronics is shutting down its custom CPU design group within the company. Known for the designs of mobile SoCs like Exynos 9110, 9810 and 9820 just to name a few, it seems that there will be no more future developments of custom Exynos SoC for Samsung's mobile devices. Instead of designing its own cores, Samsung is now going to use ARM's reference A7x series of CPUs based on ARM v8 instruction set, with A76 or A77 being chosen as likely candidates for the high-performance workloads.

So far it is still unknown what will be inside new processors like the upcoming Exynos 9830 SoC, meant to power the next generation of mobile devices. But if things are like Samsung states, there should be reference ARM cores like A77 inside the new chip. Already announced chips like Exynos 990 are supposed to use a custom CPU core, while all future revisions of any new Exynos SoC will license a design IP from ARM. This decision is supposedly a by-product of being unable to compete with offers from Qualcomm, which offers faster "Snapdragon" SoCs. Samsung already uses the Snapdragon SoCs in its phones for the US and Chinese markets, while the rest of the world is getting an Exynos equivalent with the purchase of the same mobile device.

If you're one to pay more bucks for the same silicon in a bid to decrease risk of having a lower-performing overclocker than is possible with the latest AMD and Intel chips, this post is for you. Silicon Lottery has announced (absolutely expected) plans to bin AMD and Intel's latest high-performance processors starting this November.

AMD's Ryzen 9 3950X and Intel's Core i9 9900KS will be up for grabs in the website with guaranteed maximum clocks for you to peruse and then seat in your motherboard of choice. Just wait a little while longer for them to become available, since AMD's own Ryzen 9 3950X isn't yet available in the retail channel. Intel's own Core i9 9900KS has just been announced though, with availability just two days from now, on October 30th. So if you want to skip the hassle (or fun, as you see it) of finding just the right settings for your CPU of choice, keep refreshing Silicon Lottery's page. Availability is expected to be extremely limited on either part.

There were many rumors about Intel's 10 nm CPUs, many of them indicating that Intel will not manufacture 10 nm CPUs for desktop users, due to the 10 nm manufacturing process being in a bad shape. Those rumors were later countered by Intel, claiming that 10 nm is doing very well on improving yields and that we will see desktop CPUs based on the new node very soon.

Thanks to the Linux kernel mailing list (LKML), we now know that support for Ice Lake desktop and server CPUs has been added. A Patch titled "Add more CPU model number for Ice Lake" has many details about variants of Ice Lake with names like Ice Lake X for server Xeon CPU, Ice Lake D for Xeon D CPUs, Ice Lake L for mobile, and regular Ice Lake for desktop series of CPUs. This confirms Intel's claims that Ice Lake is on its way to desktop and server users in the near future. Possible launch date on these CPUs would be sometime in 2020, when Xe graphics cards are launched in July/August, so Intel could bundle both processors on the same 10 nm node.

AMD is going to launch its premium HEDT Threadripper CPUs, based on 7 nm manufacturing process, as soon as November 5th arrives. To prepare for the launch, manufacturers like GIGABYTE have been working hard to bring new CPUs to life, by integrating AMD's new chipsets into the new motherboard models. Dubbed "Castle Peak" and "Sharkstooth", the two new CPU variants will be accompanied by TRX40, TRX80 and WRX80 chipsets, each enabling additional features.

We now got a hold of the first picture of what appears to be GIGABYTE's AORUS motherboard based on TRX40 chipset. Coming in with the E-ATX form factor, this motherboard is similar in size with the previous X399 AORUS Xtreme model. It features four PCIe 4.0 x16 slots and eight slots that support four-channel DDR4 memory, so it is likely that TRX40 chipset is meant only for such configuration, with TRX80 and WRX80 chipsets being reserved for eight-channel memory configurations. Another thing to note is the presence of chipset fan, indicating that the TDP of these chipsets is high and it needs to be actively cooled in normal use cases. If you remember, plenty of X570 boards have a fan on chipset as well due to their TDP.

The folks over at Videocardz managed to snag some impressive information on AMD-s upcoming Threadripper lineup - their launch dates. According to the tech publication, a source within AMD provided information regarding previously-set dates for paper and hardware launches that stand at November 5th for the formal announcement of the next generation HEDT CPUs, followed by lifted embargos on reviews and actual product availability come November 19th. Apparently, AMD will only launch the Threadripper 3960X and 3970X come November 5th (remember remember the 5th of November), with a product announcement for the Threadripper 3990X which will only be launched in January 2020.

AMD will also formally unveil their next-gen Threadripper TRX40 platformon November 5th (which won't be compatible with previous-gen Threadrippers). This makes sense - CPUs without a platform to pin them onto doesn't seem like a conscientious business decision. No information was available on clockspeeds and core counts at this time, though the Threadripper 3960X, the base of the new lineup, is expected to sport 24 cores and 48 threads of Zen 2 goodness.

Following the success of their Touchaqua-branded Summit MS OLED CPU block earlier this year, which was for Intel platforms only at that time, Bitspower have decided to add the OLED display to their main brand in the form of the new Summit M CPU water block. The design is a departure from the squared-off Summit MS, with a smaller form factor that also increases CPU socket compatibility to the red camp out of the box. The OLED display is housed on a metal top plate, with an acrylic body enabling side views of the coolant, a temperature sensor enabling readout on the display, as well as the integrated dRGB LEDs for lighting options compatible with ASUS AURA Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome.

The cooling engine uses a nickel-plated copper base plate, with 0.3 mm CNC-machined fins and microchannels that are part of a split central-inlet flow promising high coolant flow directly over the fins to remove as much heat from the CPU as possible. This is similar to the vast majority of CPU block designs in practice, but manufacturers tend to experiment with the flow schematic to see if they can do better, so time will tell how the Summit M fares on the TechPowerUp test bench. In the meantime, it is available for direct purchase from the Bitspower store for 4500 NTD (~$150 USD) before any applicable taxes and shipping costs.

Intel's Omni-Path technology has been used primarily in high performance computing market, in order to provide high speed interconnect between Intel Xeon CPUs, with speeds reaching around 100 Gbps. Accompanied by different design and system integration that Omni-Path uses, it was a bit difficult to integrate into server system, while not adding much value that other technologies couldn't match or beat.

Because of these reasons, Intel is now discontinuing its last product capable of utilizing Omni-Path - the first generation Xeon Scalable CPUs. Carrying the suffix "F", these CPUs had an extra connector sticking out of CPU's PCB to enable the Omni-Path functionality (see images bellow). There were eight CPUs manufactured in total that had this extra feature, consisting out of two Xeon Platinum and six Xeon Gold CPUs, which have now reached end of life. Intel states that focus from these CPUs has shifted to other technologies like silicon photonics, which provides much greater speed reaching 100s of gigabits per second. Intel already demonstrated transceivers capable of reaching 400 Gb/s speeds with the magic of light, which will become available in 1H 2020.

MSI today inadvertently confirmed preparations for the release of TRX40-based motherboards, which will allow for AMD's next-gen, Zen 2-based Threadripper CPUs to slot in quite nicely in a bed of silicon. Via a promo page for new motherboard purchases, where MSI listed the eligible motherboards for a $25 Steam rebate after purchase, the company listed a number of their already-known motherboard quantities... And the new Creator TRX40. This is a new series of motherboards from MSI, first populated by the X299 motherboards, which caters to expandability and storage capabilities so as to accelerate content creation and production.

The reference to the Creator TRX40 has already been silently deleted in MSI's page.

The marriage of Intel and AMD IPs in the form of the Kaby Lake-G processors was met with both surprised grunts from the company and a sense of bewilderment at what could come next. Well, we now know what came next: Intel hiring several high-level AMD employees on the graphics space and putting together its own motley crew of discrete GPU developers, who should be putting out Intel's next-gen high-performance graphics accelerators sometime next year.

The Kaby Lake-G processors, however, showed promise, pairing both Intel's (at the time) IPC dominance and AMD's graphics IP performance and expertise on a single package by placing the two components in the same substrate and connecting them via a PCIe link. A new and succinct Intel notice on the Kaby Lake-G page sets a last order time (January 31, 2020, as the last date for orders, and July 31, 2020, as the date of last shipments), and explains that product market shifts have moved demand from Kaby Lake-G products "to other Intel products". Uptake was always slow on this particular collaboration - most of it, we'd guess, because of the chips' strange footprint arrangement for embedding in systems, which required custom solutions that had to be designed from scratch. And with Intel investing into their own high-performance graphics, it seems clear that there is just no need to flaunt their previous collaborations with other companies in this field. Farewell, Intel-AMD Kaby Lake-G. We barely knew you.

Cooler Master, a global leader in designing and manufacturing innovative computer components introduces the MasterAir MA620M CPU Air Cooler. Continuing the renowned MasterAir Series, the MA620M are dual aluminium towers equipped with a newly designed cross-platform mounting system to provide maximum air cooling.

Peak Performance, Unique Aesthetic
The MA620M features a unique dual tower heatsink with enlarged fins and utilizes 6 copper heat pipes for optimal air flow and cooling performance. Inspired by a stealth-like aesthetic design, the MA620M employs unique lighting effects across the top cover of the cooler, powered by addressable RGB.

AMD released their Zen 2-based Ryzen 3000 processors in July this year, and they instantly became a smash hit with gamers, due to their solid performance, and good pricing. The company's flagship processor at this time is the Ryzen 9 3900X, priced at $500, featuring 12-cores/24-threads, with clocks reaching up to 4.6 GHz. Now BIOSTAR has posted an update to their motherboard CPU support list, which mentions a previously unannounced "Ryzen 9 3900", without the "X", running at 3.1 GHz base clock and having a TDP of 65 W (the 3900X has 105 W TDP).

It looks like the Ryzen 9 3900 non-X is a more power-efficient version of the 3900X with lower clocks. It's possible that it is made from chips that failed the clock-frequency certification for the 4.6 GHz boost clock of the 3900X, but that work fine otherwise. By dialing down the TDP of their chip, AMD could also build an interesting SKU for OEMs, that want to market the high core counts, but aren't willing to drive up the cost of their power and cooling setup.

Intel is constantly having troubles with its silicon manufacturing business lately. Firstly the late delivery of 10 nm, then the shortage of 14 nm chips that started all the way back in 2018. Despite the making of $1 Billion investment into extending its 14 nm production capacity, there seems to be no end of troubles in sight.

According to sources close to DigiTimes, 14 nm production has fallen short of demand again and will likely cause many notebook manufacturers to delay their products to 2020. Most likely victim of this delay is the newly announced 10th generation mobile CPUs codenamed Comet Lake. Those CPUs were supposed to be built using Intel's "14nm++" revision of 14 nm technology which targets higher CPU frequencies and improved efficiency, but most likely due to continued shortage of 14nm, there will be only a few notebooks powered by these chips. As the source suggests, many manufacturers are likely to delay the launch of their products to 2020, when this situation is supposed to be resolved.

AMD has completed design phase of its "Zen 3" architecture and rumors are already appearing about its details. This time, Hardwareluxx has reported that AMD could bake a four-way simultaneous multithreading technology in its Zen 3 core to enable more performance and boost parallel processing power of its data center CPUs. Expected to arrive sometime in 2020, Zen 3 server CPUs, codenamed "MILAN", are expected to bring many architectural improvements and make use of TSMC's 7nm+ Extreme Ultra Violet lithography that brings as much as 20% increase in transistor density.

Perhaps the biggest change we could see is the addition of four-way SMT that should allow a CPU to have four virtual threads per core that will improve parallel processing power and enable data center users to run more virtual machines than ever before. Four-way SMT will theoretically boost performance by dividing micro-ops into four smaller groups so that each thread could execute part of the operation, thus making the execution time much shorter. This being only one application of four-way SMT, we can expect AMD to leverage this feature in a way that is most practical and brings the best performance possible.

Intel's upcoming Extreme Edition Core i9-10980XE from the Cascade Lake-X family. Cascade Lake-X (CSL-X) will be Intel's next take on the High End Desktop (HEDT) systems. The Core i9-10980XE is pegged as the flagship on that lineup, sporting an 18-core, 36-thread design, and are still based on Intel's 14 nm process node. These processors will be pin-compatible with Intel's LGA 2066 platform. Caches are expected to be set at 1.125 MB, 18 MB and 24.75 MB of L1, L2 and L3.

Base clocks set in the Geekbench 4 entry are set at 4.1 GHz, with a maximum boost of 4.7 GHz. That's a lot of frequency on a 14 nm CPU with 18 cores; if previous entries on the Intel HEDT family (such as the i9-9980XE) sported a 165 W TDP with clocks of 3.0 GHz and 4.4 GHz respectively, it seems highly unlikely that Intel will keep the same TDP for the i9-10980XE - and even if they do, power consumption will certainly be higher. Those reported clocks for the i9-10980XE may not be right, however - we don't know the conditions of the test run.

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.AMD's full statement is quoted below.

TSMC is on the vanguard of chipset fabrication technology at this exact point in time - its 7 nm technology is the leading-edge of all large volume processes, and is being tapped by a number of companies for 7 nm silicon. One of its most relevant clients for our purposes, of course, is AMD - the company now enjoys a fabrication process lead over arch-rival Intel much due to its strategy of fabrication spin-off and becoming a fabless designer of chips. AMD's current product stack has made waves in the market by taking advantage of 7 nm's benefits, but it seems this may actually become a slight problem in the not so distant future.

TSMC has announced a threefold increase in its delivery lead times for 7 nm orders, from two months to nearly six months, which means that orders will now have to wait three times longer to be fulfilled than they once did. This means that current channel supplies and orders made after the decision from TSMC will take longer to materialize in actual silicon, which may lead to availability slumps should demand increase or maintain. AMD has its entire modern product stack built under the 7 nm process, so this could potentially affect both CPUs and GPUs from the company - and let's not forget AMD's Zen 3 and next-gen RDNA GPUs which are all being designed for the 7 nm+ process node. TSMC is expected to set aside further budget to expand capacity of its most advanced nodes, whilst accelerating investment on their N7+, N6, N5, and N3 nodes.

InstLatX64 has posted a CPU dump of Intel's next-generation 10 nm CPUs codenamed Tiger Lake. With the CPUID of 806C0, this Tiger Lake chip runs at 1000 MHz base and 3400 MHz boost clocks which is lower than the current Ice Lake models, but that is to be expected given that this might be just an engineering sample, meaning that production/consumer revision will have better frequency.

Perhaps one of the most interesting findings this dump shows is the new L3 cache configuration. Up until now Intel usually put 2 MB of L3 cache per each core, however with Tiger Lake, it seems like the plan is to boost the amount of available cache. Now we are going to get 50% more L3 cache resulting in 3 MB per core or 12 MB in total for this four-core chip. Improved cache capacity can result in additional latency because of additional distance data needs to travel to get in and out of cache, but Intel's engineers surely solved this problem. Additionally, full AVX512 support is present except avx512_bf which supports bfloat16 floating-point variation found in Cooper Lake Xeons.

Intel is slowly realizing plans to "one up" its GPU game starting from first 10 nm Ice Lake CPUs that feature Gen11 graphics, equipping users of integrated GPUs with much more performance than they previously got. Fortunately, Intel doesn't plan to stop there. Thanks to the recent pull request found on GitLab Mesa repository, we can now expect to receive biggest GPU performance bump in over a decade with the arrival of Gen12 based GPUs, found on next generation Tiger Lake processors.

In this merge request, Francisco Jerez, member of Intel's open source Linux graphics team, stated the following: "Gen12 is planned to include one of the most in-depth reworks of the Intel EU ISA since the original i965. The encoding of almost every instruction field, hardware opcode and register type needs to be updated in this merge request. But probably the most invasive change is the removal of the register scoreboard logic from the hardware, which means that the EU will no longer guarantee data coherency between register reads and writes, and will require the compiler to synchronize dependent instructions anytime there is a potential data hazard..."

Bitspower informed us earlier today that they have a new mono block out for the ASUS Crosshair VIII Hero motherboard based on AMD's X570 chipset. Titled the BP-MBASX570CVIIIH, it features an acrylic top to allow the end user to see through into the cooling engine and the coolant flow in use and a nickel-plated copper coldplate. The latter, as with any mono block, is massive relative to just a CPU water block since it covers the CPU in addition to the critical power delivery section of the motherboard to ensure no thermal throttling, be it direct or indirect.

The direct injection of the coolant over the microfins via the split central-inlet flow design allows for the CPU to be cooled first, before a parallel split through the VRM section and also a flow indicator wheel as seen in the images below. The mono block also has integrated lighting support via Bitspower's digital RGB LEDs, which in turn are compatible with ASUS Aura Sync and onboard LED headers in addition to Bitspower's TouchAqua dRGB controller. Bitspower also teased more mono blocks on the way, with owners of the ASRock X570 Taichi and Gigabyte X570 Auros Master going to see support coming up shortly.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to announce a new addition to its AMD socket AM4 motherboards with the BIOSTAR X470MH. Built for office workers looking to smoothly cruise through their daily tasks without setbacks and for home users looking for a strong and stable platform to run their HTPC, the X470MH is equipped with the latest features the PC industry has to offer while maintaining an affordable price point. And for those looking to push the limit, the X470MH offers overclocking possibilities giving the user the added performance benefit for faster gaming and task management without risking to damage their investment.

The BIOSTAR X470MH, equipped with AMD's X470 chipset and AMD AM4 CPU socket, brings support for AMD's latest 3rd Gen Ryzen 7 nm processors. Built to make your daily computer needs a breeze, the X470MH is a Micro ATX motherboard featuring USB 3.1 Gen1 support (5 Gb/s) providing fast transfer speeds and support to a wide array of peripherals, PCI-e M.2 at 32 Gb/s for increased system responsiveness, as well as HDMI 4K resolution to sooth the eye while watching Netflix or Youtube, and a VGA port for a wider range of monitor compatibility. In addition, the Internet and network connectivity will not be a drag with the onboard Realtek GbE LAN. Overclockers are not left out either with enough room for 2x DDR4 RAM slots which support up to 32 GB and overclocks at 3200 MHz, making multitasking a pleasant experience.

Primate Labs, developers of the ubiquitous benchmarking application GeekBench, have announced the release of version 5 of the software. The new version brings numerous changes, and one of the most important (since if affects compatibility) is that it will only be distributed in a 64-bit version. Some under the hood changes include additions to the CPU benchmark tests (including machine learning, augmented reality, and computational photography) as well as increases in the memory footprint for tests so as to better gauge impacts of your memory subsystem on your system's performance. Also introduced are different threading models for CPU benchmarking, allowing for changes in workload attribution and the corresponding impact on CPU performance.

On the Compute side of things, GeekBench 5 now supports the Vulkan API, which joins CUDA, Metal, and OpenCL. GPU-accelerated compute for computer vision tasks such as Stereo Matching, and augmented reality tasks such as Feature Matching are also available. For iOS users, there is now a Dark Mode for the results interface. GeekBench 5 is available now, 50% off, on Primate Labs' store.

TE Connectivity, the maker of various kinds of connectivity solutions for computer systems, has released its latest iteration of the LGA socket for the next generation of Xeon Scalable CPUs. Being validated by Intel, the LGA 4189-4 and LGA 4189-5 are going to power the next generation of 10 nm Xeon CPUs, based on the Ice Lake architecture, and up to 56-core 2nd generation Xeon Scalable CPUs. While there are two models of the socket, TE Connectivity didn't reveal what the differences are between them. Socket P4 (LGA 4189-4) and P5 (LGA 4189-5) also feature exactly the same pin count, 0.9906 mm hex pitch and 2.7 mm SP height, so we can only speculate that the "4" or "5" in the revision is supposed to indicate details like higher power delivery capability or support for Ice Lake CPUs.

In addition to providing a new socket for Ice Lake, these sockets have support for PCI-Express Gen 4.0 and eight-channel memory (supported memory configurations are vendor dependent), meaning that we are getting two more memory channels than previous Xeon CPUs with a faster and newer PCIe standard.

World famous overclocker Der8auer published his survey of boost clocks found on 3rd generation Ryzen CPUs. Collecting data from almost 3,000 entries from people around the world, he has found out that a majority of the 3000 series Ryzen CPUs are not hitting their advertised boost speeds. Perhaps one of the worst results from the entire survey are for the 12-core Ryzen 9 3900X, for which only 5.6% of entries reported have managed to reach the boost speeds AMD advertises. However, the situation is better for lower-end SKUs, with about half of the Ryzen 5 3600 results showing that their CPU is boosting correctly and within advertised numbers.

Der8auer carefully selected the results that went into the survey, where he discarded any numbers that used either specialized cooling like water chillers, Precision Boost Overdrive - PBO or the results which were submitted by "fanboys" who wanted to game the result. Testing was purely scientific using Cinebench R15 and clock speeds were recorded using HWinfo (which got recommendation from AMD), so he could get as precise data as possible.

It is no secret that silicon manufacturing is an expensive and difficult process which requires big investment and a lot of effort to get right. Take Intel's 10 nm for example. It was originally planned to launch in 2015, but because of technical difficulties, it got delayed for 2019. That shows how silicon scaling is getting more difficult than ever, while costs are rising exponentially. Development of newer nodes is expected to cost billions of Dollars more, just for the research alone and that is not even including the costs for the setting up a manufacturing facility. In order to prepare for the moment when the development of ever-decreasing size nodes becomes financially and physically unfeasible, researchers are exploring new technologies that could replace and possibly possess even better electrical properties than silicon. One such material (actually a structure made from it) is Carbon Nanotube or CNT in short.

Researchers from MIT, in collaboration with scientists from Analog Devices, have successfully built a CPU based on RISC-V architecture entirely using CNTs. Called RV16X Nano, this CPU is currently only capable of executing a classic "Hello World" program. CNT is a natural semiconductor, however, when manufactured, it is being made as a metallic nanotube. That is due to the fact that metallic nanotubes are easier to integrate into the manufacturing ecosystem. Its has numerous challenges in production because CNTs tend to position themselves randomly in XYZ axes. Researchers from MIT and Analog Devices solved this problem by making large enough surfaces so that enough random tubes are positioned well.