GIGABYTE has updated its Brix lineup of Mini-PCs with Intel's latest and greatest 10th generation Comet Lake mobile CPUs. Measuring 46.8 x 119.5 x 119.5 mm, the Brix mini PC is a small form factor machine with its 0,6-liter size. If anyone thinks that power is proportional to the size of a PC, the GIGABYTE Brix is here to prove them wrong. Available in four variants that differ only in CPU that is soldered inside, you can get anything from a dual-core Intel Core i3-10110U, all the way up to six-core Core i7-10710U CPU powerhouse. These CPUs are 15 W TDP models, so even though the Brix is small, its cooling solution should be able to handle the heat.

The Brix Mini-PC comes with a mounting bracket for 75 x 75 mm and 100 x 100 mm VESA mounts, meaning that you can place it behind a monitor. Storage options are limited to one 2.5-inch drive that can be up to 9.5 mm thick. For RAM, the Brix is using two SO-DIMM slots that can support up to 64 GB of DDR4 2666 MHz RAM. When it comes to connectivity options, GIGABYTE has equipped the Brix with Intel Dual Band Wireless-AC 3168 wireless adapter providing Bluetooth 4.2 and WiFi 802.11ac connectivity. The IO options are somewhat decent as Brix has three USB 3.2 Gen 2 ports at the front, along with a USB Gen 2 Type-C connector and 3.5 mm headphone jack. On the back, there are two HDMI 2.0a ports for video output, two additional USC 3.2 Gen 2 ports, power input, and of course an RJ45 Ethernet connector.

The UK government has set aside a budget of 1.2 billion GBP, which is roughly around 1.56 billion US Dollars. With this budget, the UK government plans to install the world's most powerful supercomputer used for weather forecasting in the year 2022. Previously, the UK government used three Cray XC40 supercomputers that are capable of achieving a maximum of 14 PetaFLOPs at its peak performance. The future system plans to take that number and make it look tiny. With plans to make it 20 times more powerful than the current machine, we can estimate that the future supercomputer will have above 200 PetaFLOPs of computing performance.

The supercomputer deployment will follow a series of cycles, where one is happening in 2022 and that supercomputer will be six times more powerful than the current solution. To get to that 20 times improvement, the supercomputer will get an upgrade over the next five years' time. While we do not know what will power the new machine, it will almost definitely be a CPU plus multi-GPU node configuration, as GPUs have gained a lot of traction in weather prediction models lately.

AMD has just recently launched its 3rd generation of Ryzen ThreadRipper CPUs, and it is already achieving some impressive stuff. In the world of PC gaming, there used to be a question whenever a new GPU arrives - "But can it run Crysis?". This question became meme over the years as GPU outgrew requirements for the Crysis game, and any GPU nowadays is capable of running the game. However, have you ever wondered if your CPU can run Crysis, alone without a GPU? Me neither, but Linus from LinusTechTips taught of that.

The CPU, of course, can not run any game, as it lacks the hardware for graphics output, but being that AMD's ThreadRipper 3990X, a 64 core/128 thread monster has raw compute power capable of running Crysis, it can process the game. Running in software mode, Linus got the CPU to process the game and run it without any help from a GPU. This alone is a massive achievement for AMD ThreadRipper, as it shows that CPUs reached a point where their raw computing power is on pair with some older GPU and that we can achieve a lot of interesting things. You can watch the video down below.

Intel's desktop Comet Lake-S lineup is close to being released and we are getting more leaks about the CPU models contained inside it. Perhaps one of the most interesting points for Comet Lake-S series is that it brings a boost in frequency and boost in core count, with the highest-end Core i9 processors going up to 10 cores. Thanks to Xfastest, a Hong Kong-based media outlet, we have first pictures of what appears to be an engineering sample of the upcoming Core i9-10900 processor.

Being a non-K version, this CPU is not capable of overclocking and has a fixed TDP rating of 65 Watts. Compared to 125 W of the K models like the upcoming Core i9-10900K, this CPU will output almost half the heat, thus requiring a less capable cooling solution. The CPU is installed in LGA1200 socket, which is a new home for Comet Lake-S CPUs and provides backward compatibility for coolers supporting LGA1151. In the sample processor pictured below, we can see a marking on the CPU that implies 2.5 GHz base clock. Previously rumors were suggesting that this CPU version has 2.8 GHz base clock, however, it can be an early engineering sample given that no official imprints are found on the CPU heat spreader.

EK, the leader in custom loop liquid cooling products is proud to announce the official launch of a product line that is meant for professional use. Characteristic properties of these products are robust, industrial material choices and no RGB whatsoever. The EK Professional Line of products is all about the use of high-quality materials, longevity and enhancing the power of your PC or computing unit. These new products are also suited for the most demanding customers, like servers, data centers, deep learning workstations, etc.

Xperi Corporation today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world's largest semiconductor manufacturers. The agreement includes access to Xperi's broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.

"We are delighted to announce the extension of our long-standing relationship with SK hynix, a world-renowned technology leader and manufacturer of memory solutions," said Craig Mitchell, President of Invensas, a wholly owned subsidiary of Xperi Corporation. "As the industry increasingly looks beyond conventional node scaling and turns toward hybrid bonding, Invensas stands as a pioneering leader that continues to deliver improved performance, power, and functionality, while also reducing the cost of semiconductors. We are proud to partner with SK hynix to further develop and commercialize our DBI Ultra technology and look forward to a wide range of memory solutions that leverage the benefits of this revolutionary technology platform."

Today, Arm announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm Cortex -M55 processor and Arm Ethos -U55 NPU, the industry's first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers. The new IP and supporting unified toolchain enable AI hardware and software developers with more ways to innovate as a result of unprecedented levels of on-device ML processing for billions of small, power-constrained IoT and embedded devices.

Microsoft today has released several microcode updates for Intel CPUs. The updates are meant to be applied in a case-by-case basis under their Windows 10 operating system, and these updates target several releases of that OS (ranging from version 1507 through version 1903/1909). These address several vulnerability exploits related to side-channel and speculative execution attacks on Intel CPUs.

The updates need to be installed specifically for the Windows OS version you're rocking, and on systems with CPUs affected by the vulnerabilities and covered by this microcode update release. These include Intel's Denverton (Atom C3000 series); Sandy Bridge, Sandy Bridge E and EP (2000 and 3000 series), Valleyview (Atom Z3000 series) and Whiskey Lake U CPUs (8000U series, 5000U series, and 4200U series). These updates must be installed manually by users.

NVIDIA will soon launch its next-generation lineup of graphics cards based on a new and improved "Ampere" architecture. With the first Tesla server cards that are a part of the Ampere lineup going inside Indiana University Big Red 200 supercomputer, we now have some potential specifications and information about its compute performance. Thanks to the Twitter user dylan552p(@dylan522p), who did some math about the potential compute performance of the Ampere GPUs based on NextPlatform's report, we discovered that Ampere is potentially going to feature up to 18 TeraFLOPs of FP64 compute performance.

With Big Red 200 supercomputer being based on Cray's Shasta supercomputer building block, it is being deployed in two phases. The first phase is the deployment of 672 dual-socket nodes powered by AMD's EPYC 7742 "Rome" processors. These CPUs provide 3.15 PetaFLOPs of combined FP64 performance. With a total of 8 PetaFLOPs planned to be achieved by the Big Red 200, that leaves just a bit under 5 PetaFLOPs to be had using GPU+CPU enabled system. Considering the configuration of a node that contains one next-generation AMD "Milan" 64 core CPU, and four of NVIDIA's "Ampere" GPUs alongside it. If we take for a fact that Milan boosts FP64 performance by 25% compared to Rome, then the math shows that the 256 GPUs that will be delivered in the second phase of Big Red 200 deployment will feature up to 18 TeraFLOPs of FP64 compute performance. Even if "Milan" doubles the FP64 compute power of "Rome", there will be around 17.6 TeraFLOPs of FP64 performance for the GPU.

According to VideoCardz, ASRock has already listed Intel's upcoming lineup of motherboards in its Polychrome Sync software for controlling the RGB lighting of your motherboard. In the installed program files, ASRock displays several of the models that are a part of Intel's upcoming LGA1200-based Comet Lake-S 10th generation of CPUs. There are a total of nine Z490 motherboards and they are ASRock Z490 AQUA, Phantom Gaming 4, Phantom Gaming 4 SR, Phantom Gaming 6, Pro4, Steel Legend, Taichi, Z490M ITX AC, and Z490M Pro4.

When it comes to the cheaper, non-overclockable H470 chipset, there are two motherboards listed - H470 Steel Legend and H470M ITX AC. Additionally, perhaps one of the most interesting finds is the appearance of W480 chipset meant for workstation solutions. The motherboard using the new chipset is a model named W480 Creator, which should be a new addition to the consumer motherboard lineup.

NZXT, a leading developer of software-powered hardware solutions for PC gaming, today announces the Kraken X-3 and Kraken Z-3 series, the next iterations in NZXT's award-winning line of RGB all-in-one liquid coolers. This new generation of Kraken gives PC builders more options to uniquely customize their builds while providing enhanced cooling performance backed by NZXT's industry-leading warranty.

New to the NZXT Kraken ecosystem, the Z-3 series (available in both 280 mm and 360 mm configurations) is the quintessential centerpiece to the ultimate gaming battlestation. A beautiful 2.36"(60 mm) LCD screen providing unlimited visual customization, powered by NZXT CAM, is capable of displaying vital system health data as well as any custom GIF. With unparalleled aesthetics, the Kraken Z-3 series provides builders the opportunity to express themselves in an all-new way.

European Processor Initiative (EPI) is a Europe's project to kickstart a homegrown development of custom processors tailored towards different usage models that the European Union might need. The first task of EPI is to create a custom processor for high-performance computing applications like machine learning, and the chip prototypes are already on their way. The EPI chairman of the board Jean-Marc Denis recently spoke to the Next Platform and confirmed some information regarding the processor design goals and the timeframe of launch.

Supposed to be manufactured on TSMC's 6 nm EUV (TSMC N6 EUV) technology, the EPI processor will tape-out at the end of 2020 or the beginning of 2021, and it is going to be heterogeneous. That means that on its 2.5D die, many different IPs will be present. The processor will use a custom ARM CPU, based on a "Zeus" iteration of Neoverese server core, meant for general-purpose computation tasks like running the OS. When it comes to the special-purpose chips, EPI will incorporate a chip named Titan - a RISC-V based processor that uses vector and tensor processing units to compute AI tasks. The Titan will use every new standard for AI processing, including FP32, FP64, INT8, and bfloat16. The system will use HBM memory allocated to the Titan processor, have DDR5 links for the CPU, and feature PCIe 5.0 for the inner connection.

Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.

The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.

CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced industry leading chipmaker Intel as its newest member. Intel is contributing the Advanced Interface Bus (AIB) to CHIPS Alliance to foster broad adoption.

CHIPS Alliance is hosted by the Linux Foundation to foster a collaborative environment to accelerate the creation and deployment of open SoCs, peripherals and software tools for use in mobile, computing, consumer electronics and Internet of Things (IoT) applications. The CHIPS Alliance project develops high-quality open source Register Transfer Level (RTL) code and software development tools relevant to the design of open source CPUs, SoCs, and complex peripherals for Field Programmable Gate Arrays (FPGAs) and custom silicon.

Intel's latest NUC (Next Unit of Computing) series of Mini PCs, based on the 10th generation of Intel "Core" processors, is now available for purchase. Dubbed Frost Canyon, this NUC series is featuring Intel's 10th generation Comet Lake CPUs at its base. All of the available configurations are based around the Intel Core i7-10710U processor, Intel i219-V Gigabit Lan, Bluetooth 5.0 and Intel WiFi 6 AX200 networking module. Configurations are varying by the amount of pre-installed RAM and storage and the option of whatever you want OS pre-installed or not.

The NUC 10 supports up to 64 GB of DDR4 memory, while the storage options include space for one 2.5 inch SSD/HDD in smaller variants or two 2.5 inch SSD/HDD drives in taller variants, with one NVMe M.2 SSD slot available in both versions. Pricing starts at $679 for the base models, while higher-end configurations cost upward of $1,295. Additionally, it is worth pointing out that all CPUs inside the new NUC are configured to run at 25 W of TPD, regardless of the model. This will result in higher performance compared to 15 W versions of processors found in most laptop solutions.

Today Intel's CPU based on yet unannounced architecture got revealed in the SiSoft benchmark database. Featuring six cores and twelve threads running at 3 GHz, it appears like a regular 14 nm CPU that's already available, however, when digging through the details, many things are revealed. The newly submitted CPU has a different L2 cache configuration from previous CPU offerings, with this chip featuring 1.25 MB of L2 cache per core, it is unlike anything else Intel currently offers. Ice Lake mobile chips feature 512 KB, while the highest amount of L2 cache is currently present on i9-10980XE, which features 1 MB of L2.

It is unknown where this CPU fits in the whole 14/10 nm lineup, as we don't know if this is an iteration of 10 nm Tiger Lake or the rumored 14 nm Rocket Lake CPU. All we know is that this CPU features new architecture compared to Skylake iterations that are currently being used, judging by L2 cache bump, which usually happens on new architectures. The platform used for benchmarking this CPU was SuperMicro X12DAi-N SMC X12 dual-socket motherboard, which featured two of these new CPUs for a total of 12 cores and 24 threads.

"Nothing Really Ends" is the title of a song from dEUS, a Belgian "art-rock" band. And it would seem this applies all too well to the world of technology too. Intel has issued a Product Change Notification (PCN) which has changed the previously dead and buried, Haswell-era, 22 nm Pentium G3420 from its "Discontinued" status back to a worded "canceling this Product Discontinuance completely per new roadmap decision and enabling the product long term once again." Which means the Pentium G3420 will have a new lease of life, and will be available to customers until May 2020, with final shipments on December of the same year.

This is clearly an attempt from Intel to increase part availability for OEMs and system manufacturers, who have already been quoted as considering AMD due to both increases in performance and efficiency in their processors, as well as constrained supply from Intel, with giant Dell already having pointed the finger at Intel as a cause for their lower than expected revenue.

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announces a broad Qualcomm Snapdragon Compute platform portfolio with long battery life, cellular connectivity, and AI accelerated performance to enable fanless, thin and light designs for modern computing. Built with mobility in mind, the portfolio accommodates the evolving needs of mobile consumers. The Snapdragon 7c and 8c now join the previously announced Snapdragon 8cx, delivering lightning fast cellular connectivity to premium, mainstream, and entry-level notebook PCs. The portfolio is available in various price points allowing partners to design always on, always connected PCs for a wide array of consumers. In addition, the Snapdragon 8cx enterprise compute platform brings connected security software and secured-core PC support for modern enterprises looking to bring mobility to their workers.

That news title should come as a surprise to no one, and extends to most other PC makers who are affected by Intel's inability to keep up with demand on its 14 nm (+++++?) node. News of Intel's factories being outputting less than the entire professional and consumer markets are required has already been covered multiple times and in multiple ways. Sand steps Intel has taken to mitigate this issue whilst trying to solve its 10 nm execution woes range from moving chipset production up from its 14 nm nodes to 22 nm to free capacity, increase production capacity over the already installed one, and even outsource some of its silicon manufacturing to other players in the industry. However, these measures won't actually take effect in the availability equation in a heartbeat, and of course PC makers such as Dell, who has already revised its revenue forecast and placed the blame on Intel, are looking to alternatives.

Amazon Web Services, a part of Amazon that is in charge of all things cloud, has announced plans to release 32 core CPU based on Arm Neoverse N1 microarchitecture that is designed to handle a diverse workload that today's cloud infrastructure needs. This new CPU should be the second iteration of AWS'es custom CPU based on the Arm architecture. First-generation AWS CPU was a processor called Graviton, which Amazon offered on-demand in the cloud.

The still-unnamed second-gen CPU will utilize a 7 nm manufacturing process if the Neoverce N1 core at its base is to be believed. Additionally, everything from the Neoverse line should translate to this next-gen CPU as well, meaning that there will be features like high frequency and high single-threaded performance, cache coherency, and interconnect fabric designed to connect special-purpose accelerators to the CPU complex. For reference, Arm's design of Neoverce N1 has a TDP of 105 W for the whole SoC and its packs 64 cores running at 3.1 GHz, delivering amazing power efficiency and high core count.

An independent study conducted by the European Hardware Association (EHA) has revealed that AMD now ranks higher than Intel in the CPU space. While we have seen this as recently as last week, where we reported on top sellers across some Amazon webstores in Europe, with AMD scoring most of the top sellers in both Germany and the UK, this is the first time a comprehensive study has put some verifiable, science-generated numbers for us to see.

According to the EHA, 60% of the European PC enthusiasts (in a sample of 10,000 respondents) showed a strong sentiment towards AMD as their favored manufacturer of CPUs, and would choose any sort of system with an AMD CPU over an Intel one (including APU, AMD + Radeon graphics cards and AMD + NVIDIA graphics cards). This is a far cry from the same time around last year, where AMD only held 40% of a similar sample's preferred buying intention, and up from the 50% shown in the same study, carried out in 2H2019. The same survey also shows a slightly increased preference for AMD's graphics cards, with the 1H2019 showing 19% preference compared to 23% in this latest study.

At its recent SC19 talk, AMD touched upon its upcoming "Zen 3" CPU microarchitecture. Designed for the 7 nm EUV silicon fabrication process that significantly increases transistor densities, "Zen 3" could post performance gains "right in line with what you would expect from an entirely new architecture," states AMD, referring to the roughly 15 percent IPC gains that were expected of "Zen 2" prior to its launch. "Zen 2" IPC ended up slightly over 15 percent higher than that of the original "Zen" microarchitecture. AMD's SC19 comments need not be a guidance on the IPC itself, but rather performance gains of end-products versus their predecessors.

The 7 nm EUV process, with its 20 percent transistor-density increase could give AMD designers significant headroom to increase clock speeds to meet the company's generational performance improvement targets. Another direction in which "Zen 3" could go is utilizing the additional transistor density to bolster its core components to support demanding instruction-sets such as AVX-512. The company's microarchitecture is also missing something analogous to Intel's DLBoost, an instruction-set that leverages fixed-function hardware to accelerate AI-DNN building and training. Even VIA announced an x86 microarchitecture with AI hardware and AVX-512 support. In either case, the design of "Zen 3" is complete. We'll have to wait until 2020 to find out how fast "Zen 3" is, and the route taken to get there.

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

A Geekbench database submission from an HP "17-ca2xxx" laptop (likely a prototype), spilled the beans on an upcoming AMD Athlon Gold 3150U processor, with nomenclature that looks inspired from the Pentium Gold. Intel uses the "Gold" and "Silver" brand extensions to distinguish processors based on its performance microarchitectures from those based on its low-power microarchitectures (eg: a "Skylake" based Pentium Gold, and a "Goldmont" based Pentium Silver). The addition of "Gold" to the Athlon brand could denote performance rivaling mobile versions of Pentium Gold found in entry-level full-size notebooks.

Moving on to the test itself, and we see the Athlon Gold 3150U being listed as a "Raven Ridge" derivative featuring a 2-core/4-thread CPU and Radeon graphics (likely "Vega 3" as with its desktop counterpart). The CPU is shown having a 2.40 GHz base frequency, and 3.30 GHz boost, 512 KB L2 cache per core, and 4 MB shared L3 cache. The chip scores 3,559 single-core points, and 7,336 points multi-core, comparable to entry-level dual-core processors from this generation. This makes us wonder what the Athlon "Silver" could be, and whether AMD is working on a new low-power microarchitecture in the near future.

Global supercomputer leader Cray, a Hewlett Packard Enterprise company, and leading Japanese information and communication technology company Fujitsu, today announced a partnership to offer high performance technologies for the Exascale Era. Under the alliance agreement, Cray is developing the first-ever commercial supercomputer powered by the Fujitsu A64FX Arm -based processor with high-memory bandwidth (HBM) and supported on the proven Cray CS500 supercomputer architecture and programming environment. Initial customers include Los Alamos National Laboratory, Oak Ridge National Laboratory, RIKEN Center for Computational Science, Stony Brook University, and University of Bristol. As part of this new partnership, Cray and Fujitsu will explore engineering collaboration, co-development, and joint go-to-market to meet customer demand in the supercomputing space.

"Our partnership with Fujitsu means customers now have a broader choice of processor technology to address their pressing computational needs," said Fred Kohout, senior vice president and CMO at Cray, a Hewlett Packard Enterprise company. "We are delivering the development-to-deployment experience customers have come to expect from Cray, including exploratory development to the Cray Programming Environment (CPE) for Arm processors to optimize performance and scalability with additional support for Scalable Vector Extensions and high bandwidth memory."