AMD has today updated its Radeon Software Adrenalin 2020 Edition version 21.5.1 drivers, bringing many features on board as well as fixing a lot of issues that have appeared in the past. Starting with support for the Resident Evil Village PC game, AMD promises to deliver up to 13% better frame rate at 4K maximum settings, while using the Radeon RX 6800 XT graphics card. The comparison was conducted with a reference to the previous driver, 21.4.1, which didn't allow the card to reach as high FPS as it is now possible with the proper support for the game. Another game that is added to the support list is Metro Exodus PC Enhanced Edition. Some fixes have been implemented, as the incorrect performance metrics that may have incorrectly reported temperatures on Ryzen 5 1600 series processors. For a detailed list of bug fixes, please take a look at the list below.DOWNLOAD: AMD Radeon Software Adrenalin 2020 Edition 21.5.1

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of AMD X570 platform with AORUS MODEL X and AMD B550 platform with mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of extreme performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the full operation, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers an ease and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a must to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with compatibility and three-year whole system warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of Intel Z590 platform with AORUS MODEL X and mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of premium performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the overclocking, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers reassuring and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a standard to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with optimized compatibility, Expandability, and three-year warranty of whole system.

TrendForce's investigations find that DRAM suppliers and major PC OEMs are currently participating in the critical period of negotiating with each other over contract prices for 2Q21. Although these negotiations have yet to be finalized, the ASP of mainstream DDR4 1G*8 2666 Mbps modules has already increased by nearly 25% QoQ as of now, according to data on ongoing transactions. This represents a higher price hike than TrendForce's prior forecast of "nearly 20%". On the other hand, prices are likewise rising across various DRAM product categories in 2Q21, including DDR3/4 specialty DRAM, mobile DRAM, graphics DRAM, and in particular server DRAM, which is highly related to PC DRAM and is therefore also undergoing a higher price hike than previously expected. TrendForce is therefore revising up its forecast of overall DRAM price hike for 2Q21 from 13-18% QoQ to 18-23% QoQ instead. However, the actual increase in prices of various DRAM product categories will depend on the production capacities allocated to the respective products by DRAM suppliers.

Netac, a Chinese company based in Shenzen claiming to be the inventor of USB flash drive, has reportedly started the research and development process of DDR5 memory modules that will outperform everything on the market. Netac is rumored to have started the development of DDR5 memory that will have a frequency of over 10,000 MHz. While the JEDEC specification notes that the DDR5 frequency range is between 4800-8400 MHz, manufacturers are always welcome to go over the official specifications. Being that Netac is a relatively new player in the PC memory space, we are wondering how the company plans to execute its plans.

A 10 GHz DDR5 memory would require a very high voltage to run, meaning high heat output. We know that DDR5 chips can run at 2.6 V, according to T-FORCE, who tested such a configuration earlier. The next potential problem would be a platform that could handle 10 GHz DDR5 memory, however, by the time we get this memory in our hands, platforms will mature enough to handle high-speed RAM. The first batch of new DDR5 memory that was sent to Netac was Micron's Z9ZSB modules, which are 2Gx8, CL40 memory modules. They are manufactured in the 1znm memory manufacturing node Micron uses. It is left to be seen what we end up with and if Netac delivers on its promise.

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.Download CPU-Z Version 1.96 Here.

NVIDIA today announced its first data center CPU, an Arm-based processor that will deliver 10x the performance of today's fastest servers on the most complex AI and high performance computing workloads.

The result of more than 10,000 engineering years of work, the NVIDIA Grace CPU is designed to address the computing requirements for the world's most advanced applications—including natural language processing, recommender systems and AI supercomputing—that analyze enormous datasets requiring both ultra-fast compute performance and massive memory. It combines energy-efficient Arm CPU cores with an innovative low-power memory subsystem to deliver high performance with great efficiency.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest BIOS of B560 AORUS motherboards. Enhanced by the 12+1 phases DrMOS power stage with 60 Amps for each and full coverage VRM thermal design, B560 AORUS motherboards can support Intel Core i9 11900K (F) series processors overclocking to all cores 5.1 GHz. The exclusive anti-interference design of memory circuit enables DDR4 speed raising up to XMP 4800 MHz, and overclocking performance boost to DDR4 5300 MHz. which demonstrates GIGABYTE's strong R&D strength and persistence in quality. Users can enjoy the performance boost of time-limited overclocking by simply updating to the latest BIOS to meet their special needs.1

Intel B series chipset motherboards have been always excluded from overclocking due to the product positioning. Although the memory XMP overclocking is unlocked on 500 series, the processor frequency can only reach up to 4.8 GHz by Turbo Boost. Thanks to the efforts of Gigabyte's R&D team, the processor can be overclocked to 5.1 GHz and maintain low temperature under the Prime95 no AVX burn-in test. This powerful performance benefits from the top-quality materials of GIGABYTE AORUS motherboards and product design capabilities, which include 12+1 phases/ 60Apms DrMOS power stage, 6 layers 2Oz ultra-cool PCB, full-covered VRM thermal design, and the latest Smart Fan 6 technology for temperature control. These features allow processors to have a stable and pure power supply under ultra-high frequency operation, providing the most solid backing for the CPU limited-time overclocking.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

AMD is slowly preparing to launch its next-generation client-oriented accelerated processing unit (APU), which is AMD's way of denoting a CPU+GPU combination. The future design is codenamed after Van Gogh, showing AMD's continuous use of historic names for their products. The APU is believed to be a design similar to the one found in the SoC of the latest PlayStation 5 and Xbox Series X/S consoles. That means that there are Zen 2 cores present along with the latest RDNA 2 graphics, side by side in the same processor. Today, one of AMD's engineers posted a boot log of the quad-core Van Gogh APU engineering sample, showing some very interesting information.

The boot log contains information about the memory type used in the APU. In the logs, we see a part that says "[drm] RAM width 256bits DDR5", which means that the APU has an interface for the DDR5 memory and it is 256-bit wide, which represents a quad-channel memory configuration. Such a wide memory bus is typically used for applications that need lots of bandwidth. Given that Van Gogh uses RDNA 2 graphics, the company needs a sufficient memory bandwidth to keep the GPU from starving for data. While we don't have much more information about it, we can expect to hear greater details soon.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

Yes, you are reading that title correctly. Today we got ahold of information that DDR3 prices are going to skyrocket by as much as 40-50% this year! Despite DDR4 being present for seven years (since 2014), which is a lot in the world of tech, DDR3 is still thriving. Used in a wide range of devices like IoT, older servers, and long time running machines that need maintenance for decades. The DDR3 has been manufactured by SK Hynix, Samsung, and Micron, however, as technology moved on, these companies began the migration to the newer DDR4 standard. Even DDR5 exists today and it is currently manufactured.

So why is DDR3 soaring in value? It is because of the increased scarcity of this memory. SK Hynix has stopped the production of 2 Gb modules, leaving only the 4 Gb modules in production. Samsung has cut down the capacity from 60,000 wafers of DDR3 memory modules per month to just 20,000. This has caused the price of 2 Gb and 4 Gb modules to rise already as much as 30%. Despite the age of 14 years, DDR3 is still widely used in many systems. And because of that, the scarcity is making the price of the current memory increase. The price is expected to rise through the whole year and it could reach a 50% increase.

Intel has just released its "Architecture Instruction Set Extensions and Future Features Programming Reference" manual, which serves the purpose of providing the developers' information about Intel's upcoming hardware additions which developers can utilize later on. Today, thanks to the @InstLatX64 on Twitter we have information that Intel is bringing on-package High Bandwidth Memory (HBM) solution to its next-generation Sapphire Rapids Xeon processors. Specifically, there are two instructions mentioned: 0220H - HBM command/address parity error and 0221H - HBM data parity error. Both instructions are there to address data errors in HBM so the CPU operates with correct data.

The addition of HBM is just one of the many new technologies Sapphire Rapids brings. The platform is supposedly going to bring many new technologies like an eight-channel DDR5 memory controller enriched with Intel's Data Streaming Accelerator (DSA). To connect to all of the external accelerators, the platform uses PCIe 5.0 protocol paired with CXL 1.1 standard to enable cache coherency in the system. And as a reminder, this would not be the first time we see a server CPU use HBM. Fujitsu has developed an A64FX processor with 48 cores and HBM memory, and it is powering today's most powerful supercomputer - Fugaku. That is showing how much can a processor get improved by adding a faster memory on-board. We are waiting to see how Intel manages to play it out and what we end up seeing on the market when Sapphire Rapids is delivered.

The DRAM market exhibits a healthier and more balanced supply/demand relationship compared with the NAND Flash market because of its oligopolistic structure, according to TrendForce's latest investigations. The percentage distribution of DRAM supply bits by application currently shows that PC DRAM accounts for 13%, server DRAM 34%, mobile DRAM 40%, graphics DRAM 5%, and consumer DRAM (or specialty DRAM) 8%. Looking ahead to 1Q21, the DRAM market by then will have gone through an inventory adjustment period of slightly more than two quarters. Memory buyers will also be more willing to stock up because they want to reduce the risk of future price hikes. Therefore, DRAM prices on the whole will be constrained from falling further. The overall ASP of DRAM products is now forecasted to stay generally flat or slightly up for 1Q21.

Colorful, a Chinese manufacturer of PC components known for its graphics cards, is apparently preparing a special RAM version for AMD's Ryzen 5000 series CPUs. The new arrival is part of the iGame series that Colorful offers. Thanks to SMZDM forums, we have specifications of the upcoming iGame RAM tuned specifically for Ryzen 5000 series processors. Coming in with all white PCB without a heat spreader, the new Colorful iGame memory features Samsung's B-dies designed for maximum speed and performance. The dies are running at 4000 MT/s with some very strict timings. The memory features C14 (14-14-14-35) timings that are supposed to bring the system latency down and improve performance even further. It is estimated that such a configuration will require 1.5 Volts to power it. While the exact name, launch date, and pricing is unknown, we can only wait and see how Colorful plays it out.

RISC-V architecture is a relatively new Instruction Set Architecture (ISA) developed at the University of California Berkeley. Starting as a "short, three-month project" the RISC-V ISA is a fifth generation of the Reduced Instruction Set Computing (RISC) ideology. A company working on this technology and helping to grow the ecosystem is SiFive. Today, they announced a big step forward for the ecosystem that will enable developers to make and optimize even more software for this architecture and platform. Called the HiFive Unmatched, the development board represents the first entry of RISC-V ISA to the world of personal computing, with its Mini-ITX form factor and PC-like connectors of power supply and I/O.

The board is home to SiFive's FU740 SoC, a five-core heterogeneous, coherent processor with four SiFive U74 cores, and one SiFive S7 core. This SoC is capable of smooth Linux OS operation, giving the developers a good platform to do their optimizations for. There is 8 GB of onboard DDR4 RAM (unknown frequencies and timing), a MicroSD card slot, and one PCIe 3.0 x4 M.2 slot for system storage. To connect the board to the outside world, you get one Gigabit Ethernet port. For user I/O there are four USB 3.2 Gen 1 Type-A ports (1 Charging port) and one MicroUSB Console port. To power the board, you need a proper power supply with a 24-pin power connector. If you plan to build a PC based on the Unmatched board, you would need a standard ITX case, as it comes in the standard Mini-ITX (170x170 mm) form factor. For more information, please check out SiFive's website.

Intel has been preparing the launch of its 10 nm processors for desktop users for some time now, and today we are getting the first pictures of the Alder Lake-S CPU backside. Featuring a package with a size of 37.5×45 mm, the Alder Lake CPU uses more of its area for a pin count increase. Going up from 1200 pins in the LGA1200 socket, the new Alder Lake-S CPU uses 1700 CPU pins, which slots in the LGA1700 socket. In the picture below, there is an engineering sample of the Alder Lake-S CPU, which we see for the first time. While there is no much information about the processor, we know that it will use Intel's 10 nm SuperFin design, paired with hybrid core technology. That means that there will be big (Golden Cove) and little (Gracemont) cores in the design. Other features such as PCIe 5.0 and DDR5 should be present as well. The new CPU generation and LGA1700 motherboards are scheduled to arrive in second half of 2021.

Fujitsu has today officially completed the delivery of the Fugaku supercomputer to the Riken scientific research institute of Japan. This is a big accomplishment as the current COVID-19 pandemic has delayed many happenings in the industry. However, Fujitsu managed to play around that and deliver the supercomputer on time. The last of 400 racks needed for the Fugaku supercomputer was delivered today, on May 13th, as it was originally planned. The supercomputer is supposed to be fully operational starting on the physical year of 2021, where the installation and setup will be done before.

As a reminder, the Fugaku is an Arm-based supercomputer consisting out of 150 thousand A64FX CPUs. These CPUs are custom made processors by Fujitsu based on Arm v8.2 ISA, and they feature 48 cores built on TSMC 7 nm node and running above 2 GHz. Packing 8.786 billion transistors, this monster chips use HBM2 memory instead of a regular DDR memory interface. Recently, a prototype of the Fugaku supercomputer was submitted to the Top500 supercomputer list and it came on top for being the most energy-efficient of all, meaning that it will be as energy efficient as it will be fast. Speculations are that it will have around 400 PetaFlops of general compute power for Dual-Precision workloads, however, for the specific artificial intelligence applications, it should achieve ExaFLOP performance target.

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, today is proud to announce the launch of their 32 GB memory module kits as part of the VIPER 4 BLACKOUT DDR4 PERFORMANCE MEMORY, offering gamers and video content creators the ability to equip their systems with more memory and further extending the potential performance. The VIPER 4 BLACKOUT series modules have long been an excellent choice for enthusiastic builders who are looking for high-speed memory with headroom for performance tweaking and overclocking.

The series was created to be performance-oriented,and with outstanding compatibility across the latest Intel and AMD platforms, the VIPER 4 BLACKOUT series 64 GB kit are available in speeds from 3000 MHz up to 3600 MHz and built from strictly tested memory chips and components on a 10-layer PCB. Each of the 32 GB modules is wrapped by a military-grade aluminium heatspreader with an advanced pin array to maximize efficiency and thermal performance."The VIPER 4 BLACKOUT DRAM is an award-winning series and has been highly recommended by mainstream PC hardware media last year.Influencefrompositive customer feedback from our 16 GB kits encouraged us to expand the VIPER 4 BLACKOUT series to include a much larger 64 GB kit," said Roger Shinmoto, the Vice President of VIPER GAMING by PATRIOT.

Have you ever wondered how a laptop with a desktop CPU that has 16 cores and 32 threads would look like on a laptop? Well, today is your lucky day as XMG, a German laptop maker, has decided to launch a laptop that has AMD's latest and greatest desktop CPU - the Ryzen 3950X 16C/32T monster. The 3950X CPU, while featuring a regular TDP of 105 W, has been configured to 65 W in Eco Mode, and it runs anywhere from 2.6 to 4.2 GHz. The CPU also isn't soldered to the motherboard and there is a full AM4 socket, that is capable of housing any 3000 series desktop CPU.

Besides a powerful CPU, there are options for NVIDIA GeForce RTX 2060 or RTX 2070 graphics cards, which drive a 15.6-inch Full HD 144 Hz IPS panel equipped with anti-glare technology. The GPUs are a "Max-P incarnation" as XMG calls it, which presumably means that they are designed for maximum performance i.e. possibly higher boost speeds. Additionally, you can configure the laptop with up to 64 GB of DDR4 2666 MHz RAM. This configuration, containing Ryzen 9 3950X, RTX 2070, 32 GB of RAM and 1 TB NVM, costs around 2631 EUR. For more configuration options, you can check out this website. Availability is supposed to be in 6-8 weeks.

Cadence, a fabless semiconductor company focusing on the development of IP solutions and IC design and verification tools, today posted an update regarding their development efforts for the 5th generation of DDR memory which is giving us some insights into the development of a new standard. The new DDR5 standard is supposed to bring better speeds and lower voltages while being more power-efficient. In the Cadence's blog called Breakfast Bytes, one of Cadence's memory experts talked about developments of the new standards and how they are developing the IP for the upcoming SoC solutions. Even though JEDEC, a company developing memory standards, hasn't officially published DDR5 standard specifications, Cadence is working closely with them to ensure that they stay on track and be the first on the market to deliver IP for the new standard.

Marc Greenberg, a Cadence expert for memory solutions was sharing his thoughts in the blog about the DDR5 and how it is progressing. Firstly, he notes that DDR5 is going to feature 4800 MT/s speeds at first. The initial speeds will improve throughout the 12 months when the data transfer rate will increase in the same fashion we have seen with previous generation DDR standards. Mr. Greenberg also shared that the goals of DDR5 are to have larger memory dies while managing latency challenges, same speed DRAM core as DDR4 with a higher speed I/O. He also noted that the goal of the new standard is not the bandwidth, but rather capacity - there should be 24Gb of memory per die initially, while later it should go up to 32Gb. That will allow for 256 GB DIMMs, where each byte can be accessed under 100 ns, making for a very responsive system. Mr. Greenberg also added that this is the year of DDR5, as Cadence is receiving a lot of orders for their 7 nm IP which should go in production systems this year.

Micron Technologies, in the latest earnings report, announced that they will start shipping High-Bandwidth Memory 2 (HBM2) DRAM. Used for high-performance graphics cards, server processors and all kinds of processors, HBM2 memory is wanted and relatively expensive solution, however, when Micron enters the market of its manufacturing, prices, and the market should adjust for the new player. Previously, only SK-Hynix and Samsung were manufacturing the HBM2 DRAM, however, Micron will join them and they will again form a "big-three" pact that dominates the memory market.

Up until now, Micron used to lay all hopes on its proprietary Hybrid Memory Cube (HMC) DRAM type, which didn't gain much traction from customers and it never really took off. Only a few rare products used it, as Fujitsu SPARC64 XIfx CPU used in Fujitsu PRIMEHPC FX100 supercomputer introduced in 2015. Micron announced to suspend works on HMC in 2018 and decided to devote their efforts to GDDR6 and HBM development. So, as a result, we are seeing that they will launch HBM2 DRAM products sometime this year.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10 nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers," said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."