Phoronix head honcho, Michael Larabel, has noticed another set of interesting updates for AMD Graphics on Linux—albeit in preparation for next generation solutions: "engineers on Monday (February 5) posted a few new patch series for enabling some updated IP (intellectual property) blocks within their open-source AMDGPU Linux kernel graphics driver. This new IP is presumably part of the ongoing hardware enablement work for their next-gen RDNA 4 graphics." Team Red GitHub patches for "GFX12" targets appeared online last November, again highlighted by Larabel's investigative work—AMD engineers appear to be quite determined with their open-source software endeavors, as seen in LLVM-Project notes regarding GFX1200's enablement.

The new "IP block" updates included patches for the enabling ATHUB 4.1, LSDMA 7.0, IH 7.0, and HDP 7.0—presumably for next generation Radeon graphics solutions. Larabel provided a quick breakdown of these components: "ATHUB 4.1 is needed for clock-gating / power management features, LSDMA 7.0 is the latest IP for Light SDMA for general purpose System DMA (SDMA) on the GPU, IH 7.0 for the Interrupt Handler on the GPU, and HDP 7.0 for the Host Data Path support for CPU accessing the GPU device memory via the PCI BAR. As far as code changes, the big chunks of the work are from the auto-generated header files." He believes that AMD's engineers have largely moved on from current generation tasks: "The big version bumps for these IP blocks all the more are likely indicative of these bits being for next-gen RDNA 4 as opposed to further iterating on RDNA3 or similar." The patches could be merged into the upcoming Linux 6.9 release, possibly coinciding with a Radeon RX 8000 series rollout.

According to Financial Times, a regional court in Düsseldorf, Germany, created a significant setback for Intel on Wednesday, issuing an injunction prohibiting sales of some of its processors due to allegations they infringe on a patent held by R2 Semiconductor. R2, a technology firm based in Palo Alto, California, accused Intel of violating its patent related to processor voltage regulation. The ruling applies to Intel's 10th, 11th, and 12th generation Core processors, known as Ice Lake, Tiger Lake, and Alder Lake, as well as its Ice Lake Xeon server SKUs. Newer processors generations (13th, 14th, etc.) don't infringe the patent. Even though Intel noted that it plans to appeal the decision, the ramifications could extend beyond the company itself. Industry experts warn the court order could lead to a sweeping ban on products containing the disputed Intel chips, including laptops and pre-built PCs from major manufacturers like HP and Dell. R2 has waged an ongoing legal fight across multiple jurisdictions to defend its intellectual property.

After initially filing suit against Intel in the United States, R2 shifted its efforts to Germany and other European countries after its patent was invalidated stateside. Intel strongly denied R2's patent infringement claims, alleging the company's entire business model relies on extracting legal settlements through serial litigation. Intel believes the injunction serves only R2's financial interests while harming consumers, businesses, and the economy. The two firms traded barbs in official statements about the case. R2's CEO, David Fisher, rebuffed Intel's characterization of his company, saying it has only targeted Intel for infringement of its clear IP rights. As the war of words continues, the practical impact of the German court's decision remains uncertain, pending Intel's appeal. However, the preliminary injunction demonstrates the massive financial consequences at stake in battles over technological patents.

Faraday Technology Corporation, a Taiwanese silicon IP designer, has announced plans to develop a new 64-core system-on-chip (SoC) utilizing Intel's most advanced 18A process technology. The Arm-based SoC will integrate Arm Neoverse compute subsystems (CSS) to deliver high performance and efficiency for data centers, infrastructure edge, and 5G networks. This collaboration brings together Faraday, Arm, and Intel Foundry Services. Faraday will leverage its ASIC design and IP solutions expertise to build the SoC. Arm will provide the Neoverse compute subsystem IP to enable scalable computing. Intel Foundry Services will manufacture the chip using its cutting-edge 18A process, which delivers one of the best-in-class transistor performance.

The new 64-core SoC will be a key component of Faraday's upcoming SoC evaluation platform. This platform aims to accelerate customer development of data center servers, high-performance computing ASICs, and custom SoCs. The platform will also incorporate interface IPs from the Arm Total Design ecosystem for complete implementation and verification. Both Arm and Intel Foundry Services expressed excitement about working with Faraday on this advanced Arm-based custom silicon project. "We're thrilled to see industry leaders like Faraday and Intel on the cutting edge of Arm-based custom silicon development," said an Arm spokesperson. Intel SVP Stuart Pann said, "We are pleased to work with Faraday in the development of the SoC based on Arm Neoverse CSS utilizing our most competitive Intel 18A process technology." The collaboration represents Faraday's strategic focus on leading-edge technologies to meet evolving application requirements. With its extensive silicon IP portfolio and design capabilities, Faraday wants to deliver innovative solutions and break into next-generation computing design.

The nonprofit organisation that is in charge of coordinating and managing the namespaces and numerical spaces on the internet—ICANN or Internet Corporation for Assigned Names and Number—has proposed a rather big change on how consumers and businesses could be accessing networked devices on their private networks in the future. ICANN has put forward a new top-level domain for private use, much like the 192.168.x.x IP address range is allocated to private networks (alongside two other ranges), we might end up with a similar top-level domain. The proposed domain will be .internal, although we already have .localhost and .local today, but neither is really usable in a private network.

As such .internal has been suggested—in favour of.private due to concerns about it sounding like something privacy related—as a means for less computer savvy users to connect to devices on a private network. We've already seen solutions from several router manufacturers that use various domain names or subdomains to enable easier connectivity to routers. However, the goal here is to avoid clashes with top-level domains on the internet and.internal is said to resolve this problem. That said, it's not clear how this will be implemented as yet, but the ICANN is set to release more details in the near future. Even though it might not be the perfect solution, it should hopefully allow people to remember what they called their devices when they need to access them, rather than trying to remember the correct IP address.

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, today announced successful collaboration with Keysight Technologies, a market-leading design, emulation, and test solutions provider, demonstrating interoperability between Alphawave Semi's PCIe 6.0 64 GT/s Subsystem (PHY and Controller) Device and Keysight PCIe 6.0 64 GT/s Protocol Exerciser, negotiating a link to the maximum PCIe 6.0 data rate. Alphawave Semi, already on the PCI-SIG 5.0 Integrators list, is accelerating next-generation PCIe 6.0 Compliance Testing through this collaboration.

Alphawave Semi's leading-edge silicon implementation of the new PCIe 6.0 64 GT/s Flow Control Unit (FLIT)-based protocol enables higher data rates for hyperscale and data infrastructure applications. Keysight and Alphawave Semi achieved another milestone by successfully establishing a CXL 2.0 link setting the stage for future cache coherency in the datacenter.

MemryX Inc. is announcing the availability of production level silicon of its cutting-edge AI Accelerator (MX3). MemryX is a pioneering startup specializing in accelerating artificial intelligence (AI) processing for edge devices. In less than 30 days after receiving production silicon from TSMC, MemryX will publicly showcase the ability to efficiently run hundreds of unaltered AI models at the 2024 Consumer Electronics Show (CES) in Las Vegas from Jan 9 through Jan 12.

Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

Rapidus Corporation, a company involved in the research, development, design, manufacture, and sales of advanced logic semiconductors, today announced an agreement with Tenstorrent Inc., a next-generation computing company building computers for AI, to jointly develop semiconductor IP (design assets) in the field of AI edge devices based on 2 nm logic semiconductors.

In addition to its AI processors and servers, Tenstorrent built and owns the world's most performant RISC-V CPU IP and licenses that technology to its customers around the world. Through this technological partnership with Rapidus, Tenstorrent will accelerate the development of cutting-edge devices to meet the needs of the ever-evolving digital society.

Synopsys, Inc. (Nasdaq: SNPS) today announced it has extended its ARC Processor IP portfolio to include new RISC-V ARC-V Processor IP, enabling customers to choose from a broad range of flexible, extensible processor options that deliver optimal power-performance efficiency for their target applications. Synopsys leveraged decades of processor IP and software development toolkit experience to develop the new ARC-V Processor IP that is built on the proven microarchitecture of Synopsys' existing ARC Processors, with the added benefit of the expanding RISC-V software ecosystem.

Synopsys ARC-V Processor IP includes high-performance, mid-range, and ultra-low power options, as well as functional safety versions, to address a broad range of application workloads. To accelerate software development, the Synopsys ARC-V Processor IP is supported by the robust and proven Synopsys MetaWare Development Toolkit that generates highly efficient code. In addition, the Synopsys.ai full-stack AI-driven EDA suite is co-optimized with ARC-V Processor IP to provide an out-of-the-box development and verification environment that helps boost productivity and quality-of-results for ARC-V-based SoCs.

Ventana Micro Systems Inc. today announced the second generation of its Veyron family of RISC-V processors. The new Veyron V2 is the highest performance RISC-V processor available today and is offered in the form of chiplets and IP. Ventana Founder and CEO Balaji Baktha will share the details of Veyron V2 today during his keynote speech at the RISC-V Summit North America 2023 in Santa Clara, California.

"Veyron V2 represents a leap forward in our quest to lead the industry in high-performance RISC-V CPUs that are ready for rapid customer adoption," said Balaji Baktha, Founder and CEO of Ventana. "It substantiates our commitment to customer innovation, workload acceleration, and overall optimization to achieve best in class performance per Watt per dollar. V2 enhancements unleash innovation across data center, automotive, 5G, AI, and client applications."

SiFive is a team of one of the pioneering engineers that helped create RISC-V instruction set architecture (ISA) and helped the ecosystem grow. The company has been an active member of the RISC-V community and contributed its guidance on various RISC-V extensions. However, according to sources close to More Than Moore, the company is reportedly downsizing its team, and layoffs are imminent. The impact of the downsizing is about 20% of the workforce, which equals around 120-130 staff. However, that is only part of the story. SiFive is reportedly also canceling its pre-designed core portfolio and shifting focus on custom-design core IP that it would sell to customers. This is in line with the slowing demand for their pre-designed offerings and the growing demand for AI-enhanced custom silicon. The company issued a statement for Moore Than Moore.

SiFive PR for Moore Than MooreAs we adjust to the rapidly changing semiconductor end markets, SiFive is realigning across all of our teams and geographies to better take advantage of the opportunities ahead, reduce operational complexities and increase our ability to respond quickly to customer product requirements. Unfortunately, as a result some positions were eliminated last week. The employees are being offered severance and outplacement assistance. SiFive continues to be excited about the momentum and long-term outlook for our business and RISC-V.

Additionally, there was another statement for More Than Moore, which you can see entirely below.

Synopsys today announced it has expanded its collaboration with Arm to provide optimized IP and EDA solutions for the newest Arm technology, including the Arm Neoverse V2 platform and Arm Neoverse Compute Subsystem (CSS). Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai full-stack AI-driven EDA suite, and Synopsys Interface, Security, and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions. The expanded partnership builds on three decades of collaboration to enable mutual customers to quickly develop specialized silicon at lower cost, with less risk and faster time to market.

"With Arm Total Design, our aim is to enable rapid innovation on Arm Neoverse CSS and engage critical ecosystem expertise at every stage of SoC development," said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business at Arm. "Our deep technical collaboration with Synopsys to deliver pre-integrated and validated IP and EDA tools will help our mutual customers address the industry's most complex computing challenges with specialized compute."

Phison Electronics, a global leader in NAND controllers and storage solutions, announced today that the company has expanded its portfolio of PCIe 5.0 high-speed transmission solutions with PCIe 5.0, CXL 2.0 compatible redriver and retimer data signal conditioning IC products. Leveraging the company's deep expertise in PCIe engineering, Phison is the only signal conditioners provider that offers the widest portfolio of multi-channel PCIe 5.0 redriver and retimer solutions and PCIe 5.0 storage solutions designed specifically to meet the data infrastructure demands of artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and other data-intensive, next-gen applications. At the 2023 Open Compute Project Global Summit, the Phison team is showcasing its expansive PCIe 5.0 portfolio, demonstrating the redriver and retimer technologies alongside other enterprise NAND flash, illustrating a holistic vision for a PCIe 5.0 data ecosystem to address the most demanding applications of the AI-everywhere era.

"Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase," said Michael Wu, President & General Manager, Phison US. "Phison's accumulated experience in high-speed signaling enables our team to deliver retimer and redriver design solutions that are optimized for top signal integration, low power usage, and high temperature endurance, to deliver interface speeds for the most challenging compute environments."

Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced today that it selected Samsung Foundry to bring Tenstorrent's next generation of AI chiplets to market. Tenstorrent builds powerful RISC-V CPU and AI acceleration chiplets, aiming to push the boundaries of compute in multiple industries such as data center, automotive and robotics. These chiplets are designed to deliver scalable power from milliwatts to megawatts, catering to a wide range of applications from edge devices to data centers.

To ensure the highest quality and cutting-edge manufacturing capabilities for its chiplet, Tenstorrent has selected Samsung's Foundry Design Service team, known for their expertise in silicon manufacturing. The chiplets will be manufactured using Samsung's state-of-the-art SF4X process, which boasts an impressive 4 nm architecture.

Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC's 3DFabric technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process for seamless die-to-die connectivity.

"TSMC has been working closely with Synopsys to deliver differentiated solutions that address designers' most complex challenges from early architecture to manufacturing," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our long history of collaboration with Synopsys benefits our mutual customers with optimized solutions for performance and power efficiency to help them address multi-die system design requirements for high-performance computing, data center, and automotive applications."

Phanteks put out its first statement in response to reports about Lian Li filing a patent infringement lawsuit against it. Lian Li alleges that Phanteks D30 RGB line of compound fans for radiators infringe upon a design patent held by the company, and that Lian Li Uni Fan series implement the original design defined in the patent. In particular, the controversy is around the design of the mechanism that lets you daisy-chain individual fans without cables. In its defense, Phanteks says that during the development of the D30 RGB series, its lawyers were duly consulted to look for IP conflicts. The company stated that it will face the legal challenge and is confident to prove that its product is not in infringement of Lian Li IP. The statement by Phanteks follows.

We at Phanteks can confirm the filing of the patent infringement suit filed by a fellow PC enthusiast brand. We want to inform the community that our legal team is and has always properly handled any legal issue or communication that has arose.

From the start of the Phanteks D30 fan development, we set out to design an original product that innovates to provide new solutions to PC enthusiasts. We have consulted with patent lawyers during the development and prior to the announcement of the D30 fans and the fans were not found to infringe on the claims in the patent. Phanteks D30 fans are an original idea and have been issued patents in multiple countries to date.

We value and respect valid and enforceable IP rights and are confident that the result of this legal matter will confirm there is no infringement. We will continue our mission to serve the PC community by creating unique and innovative solutions.

MIPS, a leading developer of high- performance RISC-V compute IP, has announced embedded systems industry veteran Sameer Wasson as the company's new CEO. Before joining MIPS, Wasson spent 18 years at Texas Instruments (TI), most recently as Vice President, Business Unit (BU) Manager, Processors, where he was responsible for the company's Processor businesses. In that role, Wasson re-established TI as a mainstream microprocessor (MPU) and microcontroller (MCU) supplier for high growth automotive and industrial markets, and established the company's footprint in embedded AI, software defined vehicles, and electrification.

As the new CEO of MIPS, Wasson will further accelerate the company's leadership in the High-Performance RISC-V market as it continues to expand its footprint in Automotive and Enterprise markets.

Today, AMD released the findings from a new survey of global IT leaders which found that 3 in 4 IT leaders are optimistic about the potential benefits of AI—from increased employee efficiency to automated cybersecurity solutions—and more than 2 in 3 are increasing investments in AI technologies. However, while AI presents clear opportunities for organizations to become more productive, efficient, and secure, IT leaders expressed uncertainty on their AI adoption timeliness due to their lack of implementation roadmaps and the overall readiness of their existing hardware and technology stack.

AMD commissioned the survey of 2,500 IT leaders across the United States, United Kingdom, Germany, France, and Japan to understand how AI technologies are re-shaping the workplace, how IT leaders are planning their AI technology and related Client hardware roadmaps, and what their biggest challenges are for adoption. Despite some hesitations around security and a perception that training the workforce would be burdensome, it became clear that organizations that have already implemented AI solutions are seeing a positive impact and organizations that delay risk being left behind. Of the organizations prioritizing AI deployments, 90% report already seeing increased workplace efficiency.

Tachyum today announced that new EDA tools, utilized during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools - including an increase in the number of Prodigy cores to 192.

After RTL design coding, Tachyum began work on completing the physical design (the actual placement of transistors and wires) for Prodigy. After the Prodigy design team had to replace IPs, it also had to replace RTL simulation and physical design tools. Armed with a new set of EDA tools, Tachyum was able to optimize settings and options that increased the number of cores by 50 percent, and SERDES from 64 to 96 on each chip. Die size grew minimally, from 500mm2 to 600mm2 to accommodate improved physical capabilities. While Tachyum could add more of its very efficient cores and still fit into the 858mm2 reticle limit, these cores would be memory bandwidth limited, even with 16 DDR5 controllers running in excess of 7200MT/s. Tachyum cores have much higher performance than any other processor cores.

Intel and Synopsys announced that they have entered into a definitive agreement to expand the companies' long-standing IP (intellectual property) and EDA (electronic design automation) strategic partnership with the development of a portfolio of IP on Intel 3 and Intel 18A for Intel's foundry customers. The availability of key IP on Intel advanced process nodes will create a more robust offering for new and existing Intel Foundry Services (IFS) customers.

"Marking another important step in our IDM 2.0 strategy, this transaction will foster a vibrant foundry ecosystem by allowing designers to fully realize the advantages of Intel 3 and Intel 18A process technologies and quickly bring differentiated products to market," said Stuart Pann, senior vice president and general manager of IFS. "Synopsys brings a strong track record of delivering high-quality IP to a broad customer base, and this agreement will help accelerate the availability of IP on advanced IFS nodes for mutual customers."

Cadence Design Systems, Inc. and Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. The expected technology asset purchase also brings Cadence proven and experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence's domain-rich talent base.

"Memory and SerDes IP design and integration continues to be integral to the design of AI, data center and hyperscale applications, CPU architectures and networking devices, and the addition of the Rambus IP and seasoned team further accelerates Cadence's Intelligent System Design strategy, which drives design excellence," said Boyd Phelps, senior vice president and general manager of the IP Group at Cadence. "The acquisition of the Rambus PHY IP broadens Cadence's well-established enterprise IP portfolio and expands its reach across geographies and vertical markets, such as the aerospace and defense market, providing complete subsystem solutions that meet the demands of our worldwide customers."

Intel's integrated device manufacturing (IDM) has been experiencing a lot of trouble in recent years, and the company is not a leading-edge semiconductor manufacturer, with TSMC taking the pole position. However, the new restructuring hopes to change some of the business operations to increase its efficiency and establish Intel as the go-to foundry for customers. David Zinsner, Executive Vice President and the Chief Financial Officer, alongside Jason Grebe, Corporate Vice President & GM of the Corporate Planning Group at Intel, joined investors to explain how IDM will transform into a next-generation business. Intel IDM, including Intel Foundry Services (IFS), will get a new operation model, which will put IDM as an almost separate business unit with its own profit and loss (P&L) statement published in the quarterly/yearly financial report.

According to Intel, the company's IDM 1.0 strategy has been serving it well, but IDM 2.0 is needed to build next-generation nodes as the capital required for them is massive. Intel hopes to regain node leadership with the Intel 18A node in 2025. The company's strategy is still to have IFS as the second biggest external foundry business, presumably just behind TSMC. Putting IDM into its own P&L will result in $8-10 billion in "cost reduction opportunities, " including ramp rates, test time, and sort times based on the market pricing, not Intel's pricing. At the start, IDM is expected o start with a negative operating margin. Intel also states that keeping IFS as a business unit allows the company to simultaneously develop products on it and de-risk it for customers who want to build on IFS. The company is developing five different products (assuming packaging) on Intel 18A, all of which will be available for customers to use as well.

The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK's National Semiconductor Strategy. Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at the Industrial Technology Research Institute (ITRI) of Taiwan had an initial exchange with DSIT. During the exchange, Dr. Chang suggested that Taiwan can become a trustable partner for the UK and that the partnership can leverage collective strengths to create mutually beneficial developments. According to the Strategy, the British government plans to invest 1 billion pounds over the next decade to support the semiconductor industry. This funding will improve access to infrastructure, power more research and development and facilitate greater international cooperation.

Dr. Chang stressed that ITRI looks forward to more collaboration with the UK on semiconductors to enhance the resilience of the supply chain. While the UK possesses cutting-edge capabilities in semiconductor IP design and compound semiconductor technology, ITRI has extensive expertise in semiconductor technology R&D and trial production. As a result, ITRI is well-positioned to offer consultation services for advanced packaging pilot lines, facilitate pre-production evaluation, and link British semiconductor IP design companies with Taiwan's semiconductor industry chain. "The expansion of British manufacturers' service capacity in Taiwan would create a mutually beneficial outcome for both Taiwan and the UK," said Dr. Chang.

A legal dispute between Realtek and MediaTek has kicked off over Realtek claiming that MediaTek has gotten a third party company to sue Realtek over some unspecified patents involving technology used in smart TVs and set-top boxes. The third party involved goes under the name of IPValue Management Inc and appears to be what is generally known as a patent troll, i.e. a company that buys up patents and uses them to take legal actions against other companies, without actually producing anything related to the patents in question. Realtek claims that MediaTek is conspiring with IPValue to drive Realtek out of the market, leaving Mediatek in a close to monopoly situation in the market.

According to Reuters, Realtek told the publication that it filed the lawsuit against MediaTek to "protect free and fair competition in the industry" and "prevent further harm to the public." Neither MediaTek or IPValue have commented on the lawsuit to the publication. What makes this entire mess even more peculiar, is that MediaTek is said to have a licensing agreement in place with a subsidiary of IPValue called Future Link System LLC, which was signed in 2019. This agreement was brought up by the U.S. International Trade Commission (ITC) in a separate lawsuit last year, with the ITC calling it alarming and the court calling it improper. After the ITC criticism last year, Future Link apparently settled with several other companies such as Amlogic, but not with Realtek, which is why the company is now taking things to court. Realtek claims that MediaTek is trying to force any allegedly infringing chips out of the market and trying to make Realtek look like an unreliable partner and supplier to its customers. As such, Realtek wants the court to end the alleged conspiracy and is also asking for damages. Time will tell if Realtek is successful or not, but it seems strange that a patent troll would agree to licence its patents to some parties, but not all, since the only reason for a patent troll to exist is to make money from its patents.

During the ISC High Performance 2023 international conference, Intel announced interesting roadmap updates to its high-performance computing (HPC) and artificial intelligence (AI). With the scrapping of Rialto Bridge and Lancaster Sound, Intel merged these accelerator lines into Falcon Shores processor for HPC and AI, initially claiming to be a CPU+GPU solution on a single package. However, during the ISC 2023 talk, the company forced a change of plans, and now, Falcon Shores is GPU only solution destined for a 2025 launch. Originally, Intel wanted to combine x86-64 cores with Xe GPU to form an "XPU" module that powers HPC and AI workloads. However, Intel did not see a point in forcing customers to choose between specific CPU-to-GPU core ratios that would need to be in an XPU accelerator. Instead, a regular GPU solution paired with a separate CPU is the choice of Intel for now. In the future, as workloads get more defined, XPU solutions are still a possibility, just delayed from what was originally intended.

Regarding Intel's Gaudi accelerators, the story is about to end. The company originally paid two billion US Dollars for Habana Labs and its Gaudi hardware. However, Intel now plans to stop the Gaudi development as a standalone accelerator and instead use the IP to integrate it into its Falcon Shores GPU. Using modular, tile-based architecture, the Falcon Shores GPU features standard ethernet switching, up to 288 GB of HBM3 running at 9.8 TB/s throughput, I/O optimized for scaling, and support for FP8 and FP16 floating point precision needed for AI and other workloads. As noted, the creation of XPU was premature, and now, the initial Falcon Shores GPU will become an accelerator for HPC, AI, and a mix of both, depending on a specific application. You can see the roadmap below for more information.