Advantech, a leading provider of AIoT platforms and services, proudly unveils its latest AI acceleration modules: the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules deliver AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparable AI modules and GPU cards. Designed in standard M.2 and PCIe form factors, the EAI-1200 and EAI-3300 can be seamlessly integrated with diverse x86 and Arm-based platforms, enabling quick upgrades of existing systems and boards to incorporate AI capabilities. With these AI acceleration modules, developers can run inference efficiently on the Hailo-8 NPU while handling application processing primarily on the CPU, optimizing resource allocation. The modules are paired with user-friendly software toolkits, including the Edge AI SDK for seamless integration with HailoRT, the Dataflow Compiler for converting existing models, and TAPPAS, which offers pre-trained application examples. These features accelerate the development of edge-based vision AI applications.

EAI-1200 M.2 AI Module: Accelerating Development for Vision AI Security
The EAI-1200 is an M.2 AI module powered by a single Hailo-8 VPU, delivering up to 26 TOPS of computing performance while consuming approximately 5 watts of power. An optional heatsink supports operation in temperatures ranging from -40 to 65°C, ensuring easy integration. This cost-effective module is especially designed to bundle with Advantech's systems and boards, such as the ARK-1221L, AIR-150, and AFE-R770, enhancing AI applications including baggage screening, workforce safety, and autonomous mobile robots (AMR).

Jetway JPIC-ADN1 is a compact 2.5" Pico-ITX motherboard powered by the Intel Processor N97. It supports up to 32 GB of DDR5-4800 MHz memory, making it capable of handling demanding workloads. With its versatile I/O options, including 6x USB ports, 2x Serial ports, 1x B+M-Key M.2 slot, 1x E-Key M.2 slot, and 1x SATA3 port, the JPIC-ADN1 is ideal for a variety of applications, it's ready to handle even the most demanding tasks.

The JPIC-ADN1's compact design and efficient Alder Lake-N processor make it perfect for edge computing and IoT gateway applications. Its powerful processing and expansion capabilities enable seamless data processing, communication, and remote management in industrial IoT solutions.

ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new AmITX Mini-ITX motherboards, a range of compact form factor motherboards sporting the latest Intel technology for high-performance computing. The new AmITX series supports processor options ranging from low power consumption Intel N97 to high-performance 14/13/12th generation Intel Core i9/i7/i5/i3 and includes features such as PCIe 5.0 x16, 2.5 Gbe, DDR5, USB 3.2 Gen 2, and M.2 B/E/M Key to suit applications in smart city, smart manufacturing, and smart medicine.

The Mini-ITX motherboards in the AmITX series boast 2.5GbE LAN for ultra-fast data connectivity, USB 3.2 Gen 2 to connect with other devices, M.2 B/E/M Key slots for SSD, and wireless cards, and RS-232/422/485 to connect with machine components. The high-performance computing AmITX-RL-I supports 14/13/12th Gen Intel Core i9/i7/i5/i3 processors up to 65 W TDP, up to 64 GB of DDR5 4800 MHz memory, and has a PCIe 5.0 x16 slot for a GPU card. The low power consumption AmITX-ALN has an Intel N97 processor with 12 W ultra-low power, supports up to 32 GB of DDR4 3200 MHz memory, and has a PCIe 3.0 x1 slot.

The MS-CF16 Pico-ITX SBC is powered by Intel Alder Lake-N/Amston Lake series processors, offering up to 16 GB of LPDDR5X memory for efficient, high-performance computing. It supports dual independent displays via HDMI and LVDS/eDP interfaces, and features multiple I/O options including 2.5 GbE/1GbE, USB 10 Gbps/5 Gbps and two M.2 slots for flexible connectivity. The board's ultra-compact 2.5" Pico-ITX form factor ensures easy integration into space-constrained environments.

At an industry event in Austin today, Thundercomm announces RUBIK Pi, the first Pi built on Qualcomm SoC platforms for developers. RUBIK Pi is an innovative tool that aims to lower the barriers application development with AI inference, allowing developers to access high-performance, easy-to-deploy AI R&D tools.

The Pi product is a must-have for electronics enthusiasts and developers. It can be seen as a microcomputer, integrating a processor, memory, storage, and various interfaces on a credit card-sized board. Thundercomm, a world-leading IoT product and solution provider, building on its expertise in ICT technologies and developer workflows, launched RUBIK Pi, aiming to create the most user-friendly AI R&D tools.

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.

NETGEAR, Inc., a leading provider of innovative and secure solutions for people to connect and manage their digital lives, today expanded its Nighthawk WiFi 7 standalone router line to include the new RS600, RS500, and RS200. The lineup of Nighthawk routers is built on the company's promise to deliver the latest WiFi 7 technology combined with powerful WiFi performance and secure connectivity for homes of any size.

Powerful, Secure WiFi 7 for Everyone
Since the launch of NETGEAR's first WiFi 7 offering - Nighthawk RS700S - multi-gig internet speeds have become more accessible and affordable, and IoT devices that require extreme low latency and higher throughput continue to be adopted at high rates. WiFi 7, which is 2.4x faster than WiFi 6, offers enhanced performance to address the ever-growing demands of modern connectivity. This next-generation technology supports increased capacity across multiple connected smart home devices, providing faster speeds, near-zero latency and the ability to handle the demands of high-quality video streaming as well as advanced computing, including AI-driven applications and AR/VR experiences.

IBASE Technology Inc., a leading innovator of embedded computing solutions, announces the launch of the MI1002 Mini-ITX motherboard powered by the latest Intel Core Ultra processors Series 1 (Meteor Lake-PS platform) with an LGA1851 socket. The new platform provides advanced AI capabilities, enhanced graphics, and remarkable energy efficiency, enabling the MI1002 to handle complex tasks effortlessly, whether deploying AI applications, managing edge computing, or driving IoT solutions.

The MI1002 is available in two variants, MI1002AF and MI1002AF-1, both equipped with two DDR5 memory sockets, multiple M.2 slots for ultra-fast storage and 5G connectivity, and dual 2.5G LAN ports for high-speed networking. The MI1002AF includes support for Intel iAMT 18.0 and dTPM 2.0, which are essential for enhanced security and remote management capabilities. The MI1002AF-1, on the other hand, is equipped with fTPM 2.0, providing a more cost-effective solution for applications where Intel iAMT is not required.

Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1 GB 1.8 V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby power, small-form-factor package, and continuous read for fast boot and instant-on support.

The W25N01KW flash memory stands out for its high-speed read capabilities, achieving speeds up to 52 MB/sec in both Continuous Read and Sequential Read modes. The fast boot and instant-on support enhance energy efficiency and extend the devices' operational lifespan. It also offers an advanced deep power-down mode that reduces power consumption to as low as 1µA. The W25N01KW comes in a small form factor and is available in compact WSON8 (8 mm x 6 mm) and WSON8 (6 mm x 5 mm) packages. These exceptional features ensure ultra-fast code/data access, longer battery life, and compact design, contributing to an optimized user experience across various applications.

Industry leader AAEON has expanded its RISC computing product portfolio with the release of the SRG-IMX8PL and PICO-IMX8PL, a Mini PC and 2.5" PICO-ITX board, respectively. Both products are powered by the NXP i.MX 8M Plus platform, featuring a quad-core Arm Cortex -A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.

Built to provide cost-efficient IoT Gateway solutions in rugged environments, the SRG-IMX8PL and PICO-IMX8PL both offer wide temperature ranges of -40°C to 80°C with the use of a fanless heatsink, a 9 V to 36 V power input range. The SRG-IMX8PL Mini PC also features enhanced shock, drop, and vibration resistance. Dual LAN ports with IEEE 1588 and TSN capabilities, alongside Wi-Fi and 4G module support via M.2 2230 E-Key and full-size mini card, provide each device with broad connectivity options for industrial IoT use. Additionally, both the PICO-IMX8PL and SRG-IMX8PL support a wide range of operating systems, including Debian 11, Android 13, Windows 10 IoT, and Yocto, as well as data communication protocols such as Modbus, MQTT, and OPC Unified Architecture (OPC UA).

MSI is excited to introduce the MS-C907, a robust and versatile embedded Box IPC designed to meet the demanding requirements of various industries. Beyond its suitability for the chemical industry, the MS-C907 is ideal for applications in factory automation, transportation, digital signage and retail.

Meeting the Needs of Multiple Industries
The MS-C907 offers robust performance, extensive connectivity, and durable design, making it an ideal solution for a wide range of industrial applications. Whether it's automating factory processes, powering digital signage, or managing smart building systems, the MS-C907 provides the reliability and efficiency needed for continuous operation.

AAEON, a leading provider of compact embedded solutions, has announced two new additions to its RISC computing line: the PICO-AM62, a single board built on the PICO-ITX form factor, and the SRG-AM62, its RISC Gateway system counterpart. Both the PICO-AM62 and SRG-AM62 represent a new approach from AAEON's RISC Computing Division, powered by Texas Instruments AM62x Sitara Processors. These processors consist of a quad-core Arm Cortex -A53 CPU, single-core Arm Cortex -M4F MCU, and integrated GPU support.

The new product line stands out for its cost-efficiency and reliability. Both the PICO-AM62 single-board and the compact SRG-AM62 Gateway System are available in SKUs with a wide temperature tolerance of -40°C to 85°C and a power input range of 9 V to 36 V. The products are based on Texas Instruments processors, which are highly scalable and have a 20-year lifespan. This influenced AAEON's vendor choice and should attract customers looking for cost-effective, durable IoT solutions. The environmental ruggedness of both the PICO-AM62 and SRG-AM62 makes them well-suited for deployment in challenging environments, such as in-vehicle digital clusters or industrial applications.

NETGEAR, Inc., the leading provider of innovative and secure solutions for people to connect and manage their digital lives, today expanded its WiFi 7 mesh and standalone router lines with the new Orbi 770 Tri-band Mesh System and Nighthawk RS300 Router. NETGEAR's most affordable WiFi 7 products to date build on the company's promise to provide powerful WiFi performance and secure connectivity.

WiFi 7 Changes the Game
WiFi 7 unlocks 2.4 times faster speeds than WiFi 6, delivers low latency and better handles WiFi interference for families to seamlessly enjoy next gen 4K/8K streaming, video conferencing, gaming, and more. Since the launch of NETGEAR's first WiFi 7 offerings - Nighthawk RS700 and Orbi 970 - multi-gig internet speeds have become more affordable, work from home demands have remained steady, and more devices such as AR/VR headsets or AI-focused platforms like CoPilot+ have been introduced that require extreme low latency and higher throughput.

MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm Neoverse Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems, telecommunications, and beyond.

"Together with Arm, we're enabling our customers' designs to meet the most challenging workloads for AI applications, maximizing performance per watt," said Vince Hu, Corporate Vice President at MediaTek. "We will be working closely with Arm as we expand our footprint into data centers, utilizing our expertise in hybrid computing, AI, SerDes and chiplets, and advance packaging technologies to accelerate AI innovation from the edge to the cloud."

Following the success of the de next form factor, which included the world's smallest single board computers to host Intel Core and AMD Ryzen V2000 Series processors, AAEON has announced de next brand's first edge system, the de next-TGU8-EZBOX. Mirroring its record-breaking SBC counterparts, the de next-TGU8-EZBOX is the world's smallest edge PC with an embedded Intel Core processor, measuring just 95.5 mm x 69.5 mm x 42.5 mm with a heatsink, and 95.5 mm x 69.5 mm x 45.4 mm with an active cooler. The system is suitable for edge computing and IoT gateway solutions, especially in scenarios with there is limited space. Furthermore, the benefits that come with fanless heat dissipation, such as low noise and protection against dust, will appeal to customers in both the digital signage and industrial markets.

The system retains many of the I/O features of its board counterparts, including multiple high-speed interfaces for industrial-grade performance. Two LAN ports, operating at both 2.5GbE and GbE speeds, are conveniently grouped together with two USB 3.2 Gen 2 ports and one HDMI 1.4b port for easy interface access during operation.

The PICO-ITX, a compact embedded single-board computer (SBC) based on a 100 mm x 72 mm form factor, serves as a more space-efficient alternative motherboard, ensuring a broad range of interfaces on a more readily deployable board.

GIGAIPC's PICO-G350A (Yocto OS) / PICO-G350B (Android OS) are the first Pico-ITX boards to feature an ARM SoC, powered by MediaTek MT8365 Arm Quad-Core Cortex -A53, to provide incredible energy efficiency and outstanding low power consumption that demonstrates impressive performance. Featuring a ruggedized design, it operates reliably across a wide temperature range from 0 to 60°C. Designed with flexibility and rich on-board interfaces, including USB 2.0 (hot and USB OTG), Micro SD expansion slots, and M.2 2230 E-Key for AW-CB451NF-D wifi module support, this solution is tailored to accommodate various application scenarios, such as smart retail, self-service terminals, industrial automation, intelligent medical health, and digital media.

ASUS IoT, the global AIoT solution provider, today announced PE8000G at Embedded World 2024, a powerful edge AI computer that supports multiple GPU cards for high performance—and is expertly engineered to handle rugged conditions with resistance to extreme temperatures, vibration and variable voltage. PE8000G is powered by formidable Intel Core processors (13th and 12th gen) and the Intel R680E chipset to deliver high-octane processing power and efficiency.

With its advanced architecture, PE8000G excels at running multiple neural network modules simultaneously in real-time—and represents a significant leap forward in edge AI computing. With its robust design, exceptional performance and wide range of features, PE8000G series is poised to revolutionize AI-driven applications across multiple industries, elevating edge AI computing to new heights and enabling organizations to tackle mission-critical tasks with confidence and to achieve unprecedented levels of productivity and innovation.

While we are all used to having a system with a CPU, GPU, and, recently, NPU—X-Silicon Inc. (XSi), a startup founded by former Silicon Valley veterans—has unveiled an interesting RISC-V processor that can simultaneously handle CPU, GPU, and NPU workloads in a chip. This innovative chip architecture, which will be open-source, aims to provide a flexible and efficient solution for a wide range of applications, including artificial intelligence, virtual reality, automotive systems, and IoT devices. The new microprocessor combines a RISC-V CPU core with vector capabilities and GPU acceleration into a single chip, creating a versatile all-in-one processor. By integrating the functionality of a CPU and GPU into a single core, X-Silicon's design offers several advantages over traditional architectures. The chip utilizes the open-source RISC-V instruction set architecture (ISA) for both CPU and GPU operations, running a single instruction stream. This approach promises lower memory footprint execution and improved efficiency, as there is no need to copy data between separate CPU and GPU memory spaces.

Called the C-GPU architecture, X-Silicon uses RISC-V Vector Core, which has 16 32-bit FPUs and a Scaler ALU for processing regular integers as well as floating point instructions. A unified instruction decoder feeds the cores, which are connected to a thread scheduler, texture unit, rasterizer, clipping engine, neural engine, and pixel processors. All is fed into a frame buffer, which feeds the video engine for video output. The setup of the cores allows the users to program each core individually for HPC, AI, video, or graphics workloads. Without software, there is no usable chip, which prompts X-Silicon to work on OpenGL ES, Vulkan, Mesa, and OpenCL APIs. Additionally, the company plans to release a hardware abstraction layer (HAL) for direct chip programming. According to Jon Peddie Research (JPR), the industry has been seeking an open-standard GPU that is flexible and scalable enough to support various markets. X-Silicon's CPU/GPU hybrid chip aims to address this need by providing manufacturers with a single, open-chip design that can handle any desired workload. The XSi gave no timeline, but it has plans to distribute the IP to OEMs and hyperscalers, so the first silicon is still away.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

Qualcomm Technologies, Inc. unveiled its latest advancements in artificial intelligence (AI) at Mobile World Congress (MWC) Barcelona. From the new Qualcomm AI Hub, to cutting-edge research breakthroughs and a display of commercial AI-enabled devices, Qualcomm Technologies is empowering developers and revolutionizing user experiences across a wide range of devices powered by Snapdragon and Qualcomm platforms.

"With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialization of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences."

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6 nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20 MHz, thus ensuring the peak data rate of up to 227 Mbps downlink and 122 Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

At MWC 2024, Intel announced its new Edge Platform, a modular, open software platform enabling enterprises to develop, deploy, run, secure, and manage edge and AI applications at scale with cloud-like simplicity. Together, these capabilities will accelerate time-to-scale deployment for enterprises, contributing to improved total cost of ownership (TCO).

"The edge is the next frontier of digital transformation, being further fueled by AI. We are building on our strong customer base in the market and consolidating our years of software initiatives to the next level in delivering a complete edge-native platform, which is needed to enable infrastructure, applications and efficient AI deployments at scale. Our modular platform is exactly that, driving optimal edge infrastructure performance and streamlining application management for enterprises, giving them both improved competitiveness and improved total cost of ownership," said Pallavi Mahajan, Intel corporate vice president and general manager of Network and Edge Group Software.

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

Samsung Electronics foundry has reportedly bagged a mass production order for its cutting edge 2 nm EUV foundry node from Japanese AI chip startup PFN (Preferred Networks). This is reportedly the first major third party order for the 2 nm node. Founded in 2014, PFN specializes in AI and IoT chips, and spun off from Preferred Infrastructure. Samsung's 2 nm node, called the SF2, is on track for delivery of mass produced chips in 2025, which means much of 2024 will be spent on testing, validation, and risk production, with the node expected to go live toward the end of the year. Samsung SF2 is being designed to offer 25% higher power efficiency (at iso-clocks), and 12% increase in performance, over SF3 (3 nm EUV FinFET). In the semiconductor fabrication market, Samsung SF2 competes against TSMC N2 and Intel 20A.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the BIH61-AHA industrial motherboard, designed for smooth, seamless industrial application from AIOT machines, Edge computing, HMI machine, Digital Signage and more. Built based on the Intel H610 chipset, the BIOSTAR BIH61-AHA motherboard is engineered to support the latest Intel Core i7/i5/i3 processors (LGA1700). Featuring the latest DDR5 technology with support for 2x DDR5-4800 MHz LONG-DIMM up to 96 GB max, it offers extensive customization to meet the intricate needs of various industries.

Targeting a diverse audience, from system integrators looking to build sophisticated AIoT machines to enthusiasts aiming to construct powerful automation or edge computing systems, the BIH61-AHA provides unparalleled connectivity and expansion options. With 10 COM ports, 5 PCI slots, dual Intel GbE LAN ports for reliable and high-speed network communication, extensive USB connectivity with 6x USB2.0 & 4x USB 3.2 Gen 1 ports, and multiple storage interfaces, including 4x SATA 6 Gb/s and 1x M.2 M-KEY socket. Its support for a wide operating temperature range (0 ~ 60 degrees C) and ATX power input also ensures the motherboard's adaptability in challenging environments.