LG Electronics has announced its 2025 Gram laptop lineup at CES 2025, featuring Intel's latest processors and a new AI system that combines on-device EXAONE language processing with cloud-based GPT-4o capabilities. The flagship Gram Pro (17Z90TR) features a 17-inch WQXGA LCD display with 2,560 x 1,600 resolution and a 31-144 Hz variable refresh rate. Powered by Intel Core Ultra 9 or Ultra 7 processors and an NVIDIA RTX 4050 with 6 GB GDDR6 memory, it supports up to 32 GB of LPDDR5X RAM at 8,533 MHz. The device includes dual SSD slots supporting up to 2 TB Gen 4 NVMe storage and a 90Wh battery, all within a 3.26-pound chassis.

The Gram Pro 2-in-1 (16T90TP) employs a 16-inch WQXGA+ OLED panel with 2,880 x 1,800 resolution and a 48-120 Hz refresh rate. Running on Intel Core Ultra 7 or Ultra 5 processors with Intel Arc graphics, it features up to 32 GB of LPDDR5X memory at 8,400 MHz. The convertible weighs 3.08 pounds and includes a 77Wh battery and a mega dual cooling system. At 2.73 pounds, the Gram Pro 16Z90TS combines Intel Core Ultra 7 processors with Intel Arc graphics, featuring a 16-inch WQXGA LCD display and 77Wh battery. All Pro models include dual USB4 Gen3x2 Type-C ports with Thunderbolt 4 support and HDMI 2.1 outputs capable of 4K@60 Hz.

Micron at the 2025 International CES showed us product that hint at the company planning a strong comeback to the client and PC-DIY market segments. The company's Crucial brand is already a high-volume player in the client segment, but the company never really approached the enthusiast segment. Products like the company's new T705 Pro and P510 NVMe SSDs, and DDR5 Pro Overclocking memory, seek to change this. We begin our tour with PC memory, and the DDR5 Pro OC CUDIMMs. Crucial has jumped onto the CKD bandwagon, introducing memory modules and kits that come with DDR5-6400 out of the box, but which are geared for manual overclocking to take advantage of the 1β DRAM chips underneath (hence the name).

The company also showed us their first DDR5 CSODIMM suitable for the next generation of notebooks with HX-segment processors. This module comes with a CKD and a DDR5-6400 JEDEC-standard SPD profile out of the box. Lastly, there's the Micron-branded LPCAMM2, which comes in speeds of up to LPDDR5X-8533, and is suitable for the next generation of ultraportables.

ADATA at the 2025 International CES brought several of its latest memory products. The technology dominating memory products this year is CKD, or client clock driver. But there's more, ADATA also introduced memory modules with RCD, or registered clock driver, or a clock driver for RDIMMs. We begin our tour with the XPG Lancer CUDIMM RGB series, the company's flagship PC overclocking memory product. The top-spec module shown here comes with speeds as high as DDR5-9733, a step above even the DDR5-9600 that most other brands brought. The module comes in densities of 16 GB and 24 GB; and speeds of DDR5-8400, DDR5-8800, DDR5-9200, DDR5-9600, besides the top DDR5-9733. When paired with a Core Ultra "Arrow Lake-S" processor in Gear 4 mode, these kits should easily cross 10,000 MT/s using manual overclocking.

Next up, the company showed us its AICore line of DDR5 RDIMMs for workstations and servers. The module packs an RCD, a registered clock driver, which is essentially a CKD for RDIMMs. It is a component that clears out and amplifies the DDR5 physical layer signal, letting the machine operate at higher memory frequencies. The AICore series comes in speeds of up to DDR5-8000, and densities of up to 16 GB per module. Other speed variants in the series include DDR5-6400 and DDR5-7200. The recommended platforms for these modules include Intel's Xeon W-3500/W-2500 series "Sapphire Rapids," and AMD Ryzen Threadripper 7000-series "Storm Peak."

ASUS at the 2025 International CES showed off some of the first NUC desktops that meet Microsoft Copilot+ AI PC logo requirements. The new ASUS NUC 14 Pro AI measures 130 mm x 130 mm x 34 mm. It runs an Intel Core Ultra 200V series "Lunar Lake" processor. Depending on the processor model, you get 16 GB or 32 GB of hardwired LPDDR5X memory. You also get the processor's Xe2 "Battlemage" iGPU. Its NPU provides up to 45 AI TOPS of performance, meeting Copilot+ requirements. Storage is care of an M.2-2280 slot with NVMe Gen 4 x4 wiring. I/O options include two 40 Gbps Thunderbolt 4 ports including DisplayPort passthrough, and networking that includes Bluetooth 5.4 and Wi-Fi 7.

ASUS won't (or probably can't use the "NUC" moniker with AMD processors), and so there's the ExpertCenter PN54 for those who want essentially the same device, but with an AMD Ryzen AI 300 series processor. This mini PC has the same exact dimensions as the NUC 14 Pro AI, and is powered by a Ryzen AI 300 "Strix Point" processor, with options going all the way up to the Ryzen AI 9 HX 370. This chip includes the XDNA 2 NPU with 50 AI TOPS on tap, which means it meets Microsoft Copilot+ AI PC logo requirements. It also features the Radeon 870M RDNA 3.5 graphics with 16 CU. The chip uses standard dual-channel DDR5-5600 using SODIMMs. Storage includes an M.2-2280 slot with Gen 4 x4 wiring. In place of Thunderbolt 4, you get a couple of USB4 ports with 40 Gbps bandwidth and DP passthrough. Comms include Bluetooth 5.4 and Wi-Fi 7, just like on its Intel-powered sibling.

Lenovo announced the latest additions to its Lenovo Legion ecosystem of gaming devices, accessories, and software today at CES 2025, delivering a deep bench of devices across a wide range of form-factors that give gamers of all levels powerful options to game their way in pursuit of 'reaching their impossible'. These new devices include:

• The Lenovo Legion Go S (8", 1) and Lenovo Legion Go S (8", 1) - Powered by SteamOS, gaming handheld devices featuring an 8-inch screen with VRR support, a chassis sporting fused TrueStrike controllers with adjustable trigger switches and hall-effect joysticks, and the world's first officially licensed handheld powered by SteamOS.
• The Lenovo Legion Go (8.8", 2), a gaming handheld prototype device planned to feature a native landscape OLED display, up to double the RAM compared to previous generation, and a bigger battery.
• The redesigned Lenovo Legion Pro 7i (16", 10), Lenovo Legion Pro 5i (16", 10) and Lenovo Legion Pro 5 (16", 10) laptops, with new aggressive design language, more performance, and new Lenovo PureSight OLED display options.
• A fully redesigned Legion Space gaming software solution that unifies all Lenovo Legion device settings, syncs with all Lenovo Legion ecosystem devices, provides access to all games in one library, and features a suite of new AI-powered features that help gamers up their game, their streams, and their enjoyment.
• The Lenovo Legion Pro 34WD-10 monitor, a PureSight OLED display with gaming-specific features to give competitive gamers an edge on the map.
• Lenovo also announced other new additions to its Legion and LOQ laptops and desktops, the latest Legion Tab, and a selection of Legion accessories to complement the gaming devices.

Acer today launched the new Nitro Blaze 8 and Nitro Blaze 11 handheld gaming devices, designed to elevate mobile gaming experiences with cutting-edge performance and versatile features. Powered by AMD Ryzen 7 8840HS processors, 16 GB of LPDDR5X memory, and up to 2 TB of storage, the Nitro Blaze series boasts lightning-fast performance and responsiveness. Their WQXGA touch panels (8.8-inch or 10.95-inch) featuring Radeon Super Resolution and AMD FidelityFX Super Resolution technology, ensure fluid image quality. The dedicated Acer Game Space application simplifies managing and accessing popular games and applications on handheld gaming PCs.

The new Nitro Mobile Gaming Controller enhances the mobile gaming experience by enabling users to game anywhere and anytime with its foldable design. It supports fast charging to allow uninterrupted gaming sessions while powering mobile devices quickly.

AMD at the 2025 International CES debuted the Ryzen AI Max 300 series of mobile processors. These chips are designed to go up against the Apple M4 Pro, or the chip that powers the Apple MacBook Pro. The idea behind it is to provide leadership CPU and graphics performance from a single package, minimizing the PCB footprint from having a discrete GPU. In stark contrast, the Intel Core Ultra 200V "Lunar Lake," is designed more to go against the Apple M4, or the chips that power the latest MacBook Air but not quite the MacBook Pro. What sets "Strix Halo" functionally apart from "Lunar Lake" or even the M4 Pro, is that the AMD chip doesn't have memory-on-package (MoP), it relies on discrete LPDDR5X memory chips.

The "Strix Halo" processor is "Fire Range" on steroids. There are one or two "Zen 5" CCDs, for up to a 16-core/32-thread core configuration. Each of these "Zen 5" cores are unlike the ones on "Strix Point," in that they feature a fully unlocked AVX512 hardware pipeline (512-bit FP). The CCD shares a lavish 32 MB of L3 cache among 8 "Zen 5" cores. This is hardly the star attraction. Unlike "Fire Range," which features the small 6 nm client I/O die from "Granite Ridge," The new "Strix Halo" features a massive SoC die built on the 5 nm EUV foundry node. This packs the star attraction of the processor, it's oversized iGPU that has a massive 40 compute units (2,560 stream processors).

Samsung Electronics Co., Ltd. today announced the global launch of the Galaxy Book5 Pro and Galaxy Book5 360, expanding the Galaxy Book5 lineup to meet a wider range of AI needs for all users. Powered by Intel Core Ultra processors (Series 2) featuring NPUs up to 47 TOPs, these latest PCs come directly integrated with Galaxy AI capabilities like the innovative AI Select as well as cutting-edge features that deliver personalized experiences across the Galaxy ecosystem. With the addition of AI Select, PC users can easily search anything, anytime with a simple click, just like on their phone except on a much larger, immersive display.

"We are thrilled to make Galaxy AI and cutting-edge innovation accessible to more people than ever before, addressing their unique productivity needs on PC and other Galaxy devices," said Changtae Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "Alongside our trusted industry partners, we are delivering an AI experience on Galaxy Book that empowers users to work, create and connect in more intelligent ways through our growing ecosystem."

Nintendo Switch 2 promises to be this year's big (well small) gaming platform launch. It goes up against a growing ecosystem of handhelds based on x86-64 mobile processors running Windows, its main play would have to be offering a similar or better gameplay experience, but with better battery life, given that all of its hardware is purpose-built for a handheld console, and runs a highly optimized software stack; and the SoC forms a big part of this. Nintendo turned to NVIDIA for the job, given its graphics IP leadership, and its ability to integrate it with Arm CPU IP in a semi-custom chip. Someone with access to a Switch 2 prototype, likely an ISV, took the device apart, revealing the chip, a die-shrunk version of the Tegra T239 from 2023.

It's important to note that prototype consoles physically appear nothing like the final product, they're just designed so ISVs and game developers can validate them, and together with PC-based "official" emulation, set up the ability to develop or port games to the new platform. The Switch 2 looks very similar to the original Switch, it is a large tablet-like device, with detachable controllers. The largest chip on the mainboard is the NVIDIA Tegra T239. Nintendo Prime shared more details about the chip.

TrendForce's latest investigations reveal that the DRAM market is expected to face downward pricing pressure in 1Q25 as seasonal weakness aligns with sluggish consumer demand for products like smartphones. Additionally, early stockpiling by notebook manufacturers—over potential import tariffs under the Trump administration—has further exacerbated the pricing decline.

Conventional DRAM prices are projected to drop by 8% to 13%. However, if HBM products are included, the anticipated price decline will range from 0% to 5%.

AMD's recently announced Strix Point APU lineup has received favorable reviews from critics and consumers alike. Especially for SFF/Mini PC enthusiasts, Strix Point brings commendable efficiency and performance to the table - both of which are absolutely essential for a high-end mini PC. The GMK EVO-X1 is surely among those, and the system is now available for purchase from GMKTec's official online store.

The EVO X1 sports a 110.19 x 107.3 x 63.2 mm chassis, which is decently compact for its class. As mentioned previously, the system is powered by the 12-core (4x Zen 5 + 8x Zen 5c) Ryzen AI 9 HX 370 APU with the shockingly potent RDNA 3.5-based Radeon 890M iGPU with 16 CUs. For most CPU-centric workloads, the EVO X1 should easily suffice. The iGPU, as mentioned, is potent enough to handle most graphically demanding tasks, including some lightweight gaming, but expecting anything more from it would be futile. Thankfully, an OCuLink port is present, which should allow for extremely fast eGPU connections courtesy of its 64 Gbps bandwidth.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

A new ultraportable notebook model powered by the AMD Ryzen AI 300 series "Strix Point" processor coming this December, will feature LPDDR5X-8000 memory, a memory speed above the LPDDR5-7500 that was standard for the processor. Hoang Anh Phu did some digging, and found that AMD has quietly updated the product pages of these processors on its website, now showing support for LPDDR5X-8000. Older versions of these pages accessed by The Wayback Machine showed them to mention 7500 MT/s as the top speed for LPDDR5X.

While regular DDR5 SO-DIMM speeds remain unchanged at dual-channel DDR5-5600, it's pertinent to note that mainstream and enthusiast-segment gaming notebooks tend to use faster DDR5 SO-DIMMs than spec using OEM-level memory overclocking, however, LPDDR5X speeds do not tend to be higher than what the processor is capable of. An OEM would only use LPDDR5X-8000 chips if the processor officially supports it, which it now does with this stealthy specs update. The notebook in question is an HP EliteBook X G1a, a 14-inch premium ultraportable that not just uses LPDDR5X-8000 with "Strix Point" processors, but also seems to have overclocked its NPU. By AMD's specs, the XDNA 2 NPU should be capable of 50 TOPS, but HP has stepped its performance up by 10%.

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

AMD's answer to Intel's "Lunar Lake" is here. According to Olrak29, who discovered a strange entry on the OpenBenchmark benchmarking suite made by Phoronix, we have preliminary information on AMD's "Krackan / Kraken Point" APU. Spotted in the benchmark trials is the "100-000000713" model, which corresponds to an eight-core, sixteen-threaded CPU with four regular Zen 5 and four smaller (but not less potent) Zen 5c cores clocked at 3.95 GHz. Do note that this is just an engineering sample in the wild, so final clock speeds will depend mainly on AMD and its OEMs, given by TDP they plan to support with Kraken Point.

Accompanying the 8C/16T CPU configuration is the 32 GB of LPDDR5X memory from SK Hynix. According to the benchmark reading, four 8 GB modules were present, so we expect it to be on the system board, unlike on-chip like Intel does with Lunar Lake. The memory is running at 8000 MT/s, which is a 500 MT/s improvement over Strix Point and slower than its competitor, Lunar Lake, which has LPDDR5X running at 8533 MT/s. Lastly, the Krackan / Kraken Point APU has been spotted with eight RDNA 3.5 Compute Units. Where this exactly lands in AMD's product stack is still unclear. We expect to hear more about it as we enter 2025, so by then, remain patient until the next leak.

Details of what is claimed to be Google's upcoming Tensor G5 and G6 SoCs have popped up over on Notebookcheck.net and the site claims to have found the specs on a public platform, without going into any further details. Those that were betting on the Tensor G5—codenamed Laguna—delivering vastly improved performance over the Tensor G4, are likely to be disappointed, at least on the CPU side of things. As previous rumours have suggested, the chip is expected to be manufactured by TSMC, using its N3E process node, but the Tensor G5 will retain the single Arm Cortex-X4 core, although it will see a slight upgrade to five Cortex-A725 cores vs. the three Cortex-A720 cores of the Tensor G4. The G5 loses two Cortex-A520 cores in favour of the extra Cortex-A725 cores. The Cortex-X4 will also remain clocked at the same peak 3.1 GHz as that of the Tensor G4.

Interestingly it looks like Google will drop the Arm Mali GPU in favour of an Imagination Technologies DXT GPU, although the specs listed by Notebookcheck doesn't add up with any of the specs listed by Imagination Technologies. The G5 will continue to support 4x 16-bit LPDDR5 or LPDDR5X memory chips, but Google has added support for UFS 4.0 memory, something that's been a point of complaint for the Tensor G4. Other new additions is support for 10 Gbps USB 3.2 Gen 2 and PCI Express 4.0. Some improvements to the camera logic has also been made, with support for up to 200 Megapixel sensors or 108 Megapixels with zero shutter lag, but if Google will use such a camera or not is anyone's guess at this point in time.

Micron Technology, Inc., today announced that its 9550 PCIe Gen 5 E1.S data center SSDs have been added to the NVIDIA recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and its derivatives. The GB200 NVL72 uses the GB200 Grace Blackwell Superchip to deliver rack-scale, energy-efficient AI infrastructure. The enablement of PCIe Gen 5 storage in the system makes the Micron 9550 SSD an ideal fit for optimizing performance and power efficiency in AI workloads like large-scale training of AI models, real-time trillion-parameter language model inference and high-performance computing (HPC) tasks.

Micron 9550 delivers world-class AI workload performance and power efficiency:
Compared with other industry offerings, the 9550 SSD delivers up to 34% higher throughput for NVIDIA Magnum IO GPUDirect (GDS) and up to 33% faster workload completion times in graph neural network (GNN) training with Big Accelerator Memory (BaM). The Micron 9550 SSD saves energy and sets new sustainability benchmarks by consuming 81% less SSD energy per 1 TB transferred than other SSD offerings with NVIDIA Magnum IO GDS and up to 43% lower SSD power in GNN training with BaM.

TrendForce's latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

Smartphone brands continue to remain cautious despite some server OEMs continuing to show purchasing momentum. Consequently, TrendForce forecasts that Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0-5%. However, benefiting from the rising share of HBM, the average price of overall DRAM is projected to rise 8-13%—a marked deceleration compared to the previous quarter.

Some of the first die-shots and annotations of the Intel Core Ultra 200V "Lunar Lake" processor surfaced on the web, thanks to die-shots by GeenWens and Kurnalsalts on Twitter. Be sure to check out our Lunar Lake Technical Deep-dive article to learn the basics of how Lunar Lake is different from "Meteor Lake." Both are disaggregated chiplet-based processors, but Lunar Lake remodels things a bit. All the logic engines of the processor—the CPU, the iGPU, and the NPU, are located in a centralized Compute tile that's built on the TSMC 3 nm process, while all the I/O controllers are spun out to the Platform Controller tile built on TSMC 6 nm, which sit on a Foveros base tile that acts as an interposer, facilitating high-density microscopic connections between the two tiles. The base tile sits on the fiberglass substrate, which also has stacked LPDDR5X memory for either 16 GB or 32 GB of on-package system memory.

The Kurnalsalts annotation provides a good lay of the land for the Compute tile. The most striking aspect of it is the CPU. "Lunar Lake" comes with a 4P+4E core hybrid CPU, but the two kinds of cores do not share a last-level cache or sit in a ringbus, unlike in case of the Compute tile of "Meteor Lake." The four "Lion Cove" P-cores each come with 2.5 MB of dedicated L2 caches, and share a 12 MB L3 cache. The four "Skymont" E-cores are not part of the ringbus connecting the four P-cores, rather they are physically separated, much like the low-power island E-cores on "Meteor Lake." The E-core cluster shares a 4 MB L2 cache among the four E-cores. This E-core cluster is directly connected to the switching fabric of the Compute tile.

NVIDIA has reportedly discontinued its dual-rack GB200 NVL36x2 GPU model, opting to focus on the single-rack GB200 NVL72 and NVL36 models. This shift, revealed by industry analyst Ming-Chi Kuo, aims to simplify NVIDIA's offerings in the AI and HPC markets. The decision was influenced by major clients like Microsoft, who prefer the NVL72's improved space efficiency and potential for enhanced inference performance. While both models perform similarly in AI large language model (LLM) training, the NVL72 is expected to excel in non-parallelizable inference tasks. As a reminder, the NVL72 features 36 Grace CPUs, delivering 2,592 Arm Neoverse V2 cores with 17 TB LPDDR5X memory with 18.4 TB/s aggregate bandwidth. Additionally, it includes 72 Blackwell GB200 SXM GPUs that have a massive 13.5 TB of HBM3e combined, running at 576 TB/s aggregate bandwidth.

However, this shift presents significant challenges. The NVL72's power consumption of around 120kW far exceeds typical data center capabilities, potentially limiting its immediate widespread adoption. The discontinuation of the NVL36x2 has also sparked concerns about NVIDIA's execution capabilities and may disrupt the supply chain for assembly and cooling solutions. Despite these hurdles, industry experts view this as a pragmatic approach to product planning in the dynamic AI landscape. While some customers may be disappointed by the dual-rack model's cancellation, NVIDIA's long-term outlook in the AI technology market remains strong. The company continues to work with clients and listen to their needs, to position itself as a leader in high-performance computing solutions.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Today, Lenovo announced its newest additions to its Lenovo Yoga and Lenovo IdeaPad portfolios at Lenovo Innovation World 2024, designed to enhance user productivity and creativity through the power of AI. Models include additions to the Lenovo Copilot+ PC portfolio. These new products promise to revolutionize the way consumers create, ideate, and produce, offering a seamless blend of performance and user-centric features. The products—announced at Lenovo's special event in Berlin—include:

• The all-new Lenovo Yoga Slim 7i Aura Edition (15", 9), an Intel Evo Edition Copilot+ PC1 powered by Intel Core Ultra processors (Series 2), the product of a multi-year collaboration with Intel.
• The Lenovo Yoga Pro 7 (14", 9), Lenovo IdeaPad Slim 5 (15", 10) and Lenovo IdeaPad Slim 5 (13", 10), Copilot+ PCs powered by AMD Ryzen processors.
• The Lenovo IdeaPad Slim 5x (14", 9) and Lenovo IdeaPad 5x 2-in-1 (14", 9), powered by Snapdragon X Plus 8-core processors.
• Lenovo Creator Zone, a software suite that allows creators to use natural language to ideate and generate images locally with the power of AI.

These products are the latest examples of Lenovo's commitment to leading the industry in providing cutting-edge technology, exceptional user experiences, and enhanced creativity and productivity to consumers around the globe.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Acer today expanded its Copilot+ PC lineup with the new Swift Go 14 AI and Swift 14 AI laptops, delivering versatile performance and elevated productivity with incredible battery life.

The Swift Go 14 AI features the latest Snapdragon X Plus 8-core processor in an ultra-portable design. Acer also announced the Swift 14 AI featuring the new AMD Ryzen AI 300 Series processors which leverage the advanced AMD XDNA 2 architecture to utilize greater AI processing power and performance without compromise. Whether creating, working, or streaming on-the-go, these Copilot+ PCs streamline daily tasks and workloads more efficiently and enable Acer's on-device AI applications to help elevate users' digital experiences.

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.