AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

A new ultraportable notebook model powered by the AMD Ryzen AI 300 series "Strix Point" processor coming this December, will feature LPDDR5X-8000 memory, a memory speed above the LPDDR5-7500 that was standard for the processor. Hoang Anh Phu did some digging, and found that AMD has quietly updated the product pages of these processors on its website, now showing support for LPDDR5X-8000. Older versions of these pages accessed by The Wayback Machine showed them to mention 7500 MT/s as the top speed for LPDDR5X.

While regular DDR5 SO-DIMM speeds remain unchanged at dual-channel DDR5-5600, it's pertinent to note that mainstream and enthusiast-segment gaming notebooks tend to use faster DDR5 SO-DIMMs than spec using OEM-level memory overclocking, however, LPDDR5X speeds do not tend to be higher than what the processor is capable of. An OEM would only use LPDDR5X-8000 chips if the processor officially supports it, which it now does with this stealthy specs update. The notebook in question is an HP EliteBook X G1a, a 14-inch premium ultraportable that not just uses LPDDR5X-8000 with "Strix Point" processors, but also seems to have overclocked its NPU. By AMD's specs, the XDNA 2 NPU should be capable of 50 TOPS, but HP has stepped its performance up by 10%.

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

AMD's answer to Intel's "Lunar Lake" is here. According to Olrak29, who discovered a strange entry on the OpenBenchmark benchmarking suite made by Phoronix, we have preliminary information on AMD's "Krackan / Kraken Point" APU. Spotted in the benchmark trials is the "100-000000713" model, which corresponds to an eight-core, sixteen-threaded CPU with four regular Zen 5 and four smaller (but not less potent) Zen 5c cores clocked at 3.95 GHz. Do note that this is just an engineering sample in the wild, so final clock speeds will depend mainly on AMD and its OEMs, given by TDP they plan to support with Kraken Point.

Accompanying the 8C/16T CPU configuration is the 32 GB of LPDDR5X memory from SK Hynix. According to the benchmark reading, four 8 GB modules were present, so we expect it to be on the system board, unlike on-chip like Intel does with Lunar Lake. The memory is running at 8000 MT/s, which is a 500 MT/s improvement over Strix Point and slower than its competitor, Lunar Lake, which has LPDDR5X running at 8533 MT/s. Lastly, the Krackan / Kraken Point APU has been spotted with eight RDNA 3.5 Compute Units. Where this exactly lands in AMD's product stack is still unclear. We expect to hear more about it as we enter 2025, so by then, remain patient until the next leak.

Details of what is claimed to be Google's upcoming Tensor G5 and G6 SoCs have popped up over on Notebookcheck.net and the site claims to have found the specs on a public platform, without going into any further details. Those that were betting on the Tensor G5—codenamed Laguna—delivering vastly improved performance over the Tensor G4, are likely to be disappointed, at least on the CPU side of things. As previous rumours have suggested, the chip is expected to be manufactured by TSMC, using its N3E process node, but the Tensor G5 will retain the single Arm Cortex-X4 core, although it will see a slight upgrade to five Cortex-A725 cores vs. the three Cortex-A720 cores of the Tensor G4. The G5 loses two Cortex-A520 cores in favour of the extra Cortex-A725 cores. The Cortex-X4 will also remain clocked at the same peak 3.1 GHz as that of the Tensor G4.

Interestingly it looks like Google will drop the Arm Mali GPU in favour of an Imagination Technologies DXT GPU, although the specs listed by Notebookcheck doesn't add up with any of the specs listed by Imagination Technologies. The G5 will continue to support 4x 16-bit LPDDR5 or LPDDR5X memory chips, but Google has added support for UFS 4.0 memory, something that's been a point of complaint for the Tensor G4. Other new additions is support for 10 Gbps USB 3.2 Gen 2 and PCI Express 4.0. Some improvements to the camera logic has also been made, with support for up to 200 Megapixel sensors or 108 Megapixels with zero shutter lag, but if Google will use such a camera or not is anyone's guess at this point in time.

Micron Technology, Inc., today announced that its 9550 PCIe Gen 5 E1.S data center SSDs have been added to the NVIDIA recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and its derivatives. The GB200 NVL72 uses the GB200 Grace Blackwell Superchip to deliver rack-scale, energy-efficient AI infrastructure. The enablement of PCIe Gen 5 storage in the system makes the Micron 9550 SSD an ideal fit for optimizing performance and power efficiency in AI workloads like large-scale training of AI models, real-time trillion-parameter language model inference and high-performance computing (HPC) tasks.

Micron 9550 delivers world-class AI workload performance and power efficiency:
Compared with other industry offerings, the 9550 SSD delivers up to 34% higher throughput for NVIDIA Magnum IO GPUDirect (GDS) and up to 33% faster workload completion times in graph neural network (GNN) training with Big Accelerator Memory (BaM). The Micron 9550 SSD saves energy and sets new sustainability benchmarks by consuming 81% less SSD energy per 1 TB transferred than other SSD offerings with NVIDIA Magnum IO GDS and up to 43% lower SSD power in GNN training with BaM.

TrendForce's latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

Smartphone brands continue to remain cautious despite some server OEMs continuing to show purchasing momentum. Consequently, TrendForce forecasts that Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0-5%. However, benefiting from the rising share of HBM, the average price of overall DRAM is projected to rise 8-13%—a marked deceleration compared to the previous quarter.

Some of the first die-shots and annotations of the Intel Core Ultra 200V "Lunar Lake" processor surfaced on the web, thanks to die-shots by GeenWens and Kurnalsalts on Twitter. Be sure to check out our Lunar Lake Technical Deep-dive article to learn the basics of how Lunar Lake is different from "Meteor Lake." Both are disaggregated chiplet-based processors, but Lunar Lake remodels things a bit. All the logic engines of the processor—the CPU, the iGPU, and the NPU, are located in a centralized Compute tile that's built on the TSMC 3 nm process, while all the I/O controllers are spun out to the Platform Controller tile built on TSMC 6 nm, which sit on a Foveros base tile that acts as an interposer, facilitating high-density microscopic connections between the two tiles. The base tile sits on the fiberglass substrate, which also has stacked LPDDR5X memory for either 16 GB or 32 GB of on-package system memory.

The Kurnalsalts annotation provides a good lay of the land for the Compute tile. The most striking aspect of it is the CPU. "Lunar Lake" comes with a 4P+4E core hybrid CPU, but the two kinds of cores do not share a last-level cache or sit in a ringbus, unlike in case of the Compute tile of "Meteor Lake." The four "Lion Cove" P-cores each come with 2.5 MB of dedicated L2 caches, and share a 12 MB L3 cache. The four "Skymont" E-cores are not part of the ringbus connecting the four P-cores, rather they are physically separated, much like the low-power island E-cores on "Meteor Lake." The E-core cluster shares a 4 MB L2 cache among the four E-cores. This E-core cluster is directly connected to the switching fabric of the Compute tile.

NVIDIA has reportedly discontinued its dual-rack GB200 NVL36x2 GPU model, opting to focus on the single-rack GB200 NVL72 and NVL36 models. This shift, revealed by industry analyst Ming-Chi Kuo, aims to simplify NVIDIA's offerings in the AI and HPC markets. The decision was influenced by major clients like Microsoft, who prefer the NVL72's improved space efficiency and potential for enhanced inference performance. While both models perform similarly in AI large language model (LLM) training, the NVL72 is expected to excel in non-parallelizable inference tasks. As a reminder, the NVL72 features 36 Grace CPUs, delivering 2,592 Arm Neoverse V2 cores with 17 TB LPDDR5X memory with 18.4 TB/s aggregate bandwidth. Additionally, it includes 72 Blackwell GB200 SXM GPUs that have a massive 13.5 TB of HBM3e combined, running at 576 TB/s aggregate bandwidth.

However, this shift presents significant challenges. The NVL72's power consumption of around 120kW far exceeds typical data center capabilities, potentially limiting its immediate widespread adoption. The discontinuation of the NVL36x2 has also sparked concerns about NVIDIA's execution capabilities and may disrupt the supply chain for assembly and cooling solutions. Despite these hurdles, industry experts view this as a pragmatic approach to product planning in the dynamic AI landscape. While some customers may be disappointed by the dual-rack model's cancellation, NVIDIA's long-term outlook in the AI technology market remains strong. The company continues to work with clients and listen to their needs, to position itself as a leader in high-performance computing solutions.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Today, Lenovo announced its newest additions to its Lenovo Yoga and Lenovo IdeaPad portfolios at Lenovo Innovation World 2024, designed to enhance user productivity and creativity through the power of AI. Models include additions to the Lenovo Copilot+ PC portfolio. These new products promise to revolutionize the way consumers create, ideate, and produce, offering a seamless blend of performance and user-centric features. The products—announced at Lenovo's special event in Berlin—include:

• The all-new Lenovo Yoga Slim 7i Aura Edition (15", 9), an Intel Evo Edition Copilot+ PC1 powered by Intel Core Ultra processors (Series 2), the product of a multi-year collaboration with Intel.
• The Lenovo Yoga Pro 7 (14", 9), Lenovo IdeaPad Slim 5 (15", 10) and Lenovo IdeaPad Slim 5 (13", 10), Copilot+ PCs powered by AMD Ryzen processors.
• The Lenovo IdeaPad Slim 5x (14", 9) and Lenovo IdeaPad 5x 2-in-1 (14", 9), powered by Snapdragon X Plus 8-core processors.
• Lenovo Creator Zone, a software suite that allows creators to use natural language to ideate and generate images locally with the power of AI.

These products are the latest examples of Lenovo's commitment to leading the industry in providing cutting-edge technology, exceptional user experiences, and enhanced creativity and productivity to consumers around the globe.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

Acer today expanded its Copilot+ PC lineup with the new Swift Go 14 AI and Swift 14 AI laptops, delivering versatile performance and elevated productivity with incredible battery life.

The Swift Go 14 AI features the latest Snapdragon X Plus 8-core processor in an ultra-portable design. Acer also announced the Swift 14 AI featuring the new AMD Ryzen AI 300 Series processors which leverage the advanced AMD XDNA 2 architecture to utilize greater AI processing power and performance without compromise. Whether creating, working, or streaming on-the-go, these Copilot+ PCs streamline daily tasks and workloads more efficiently and enable Acer's on-device AI applications to help elevate users' digital experiences.

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.

ZOTAC GAMING proudly announces the much-anticipated premium gaming handheld, the ZOTAC GAMING ZONE, is ready to begin accepting preorders in select regions and e-tailer platforms. The ZONE, which emphasizes premium hardware and elite controls, was announced COMPUTEX 2024 with great anticipation. Visitors arriving at GAMESCOM 2024, one of the largest video game trade fairs held annually in Cologne, Germany, will be the first to experience the thrills of gaming on the ZONE. The ZOTAC GAMING ZONE is the first handheld gaming PC on the market to incorporate premium hardware and elite control features that players will not find on other handheld PCs, offering gamers more immersion and advantages in PC games like non-other.

The ZOTAC GAMING ZONE is powered by AMD's Ryzen 7 8840U, an efficient powerhouse with bleeding edge Zen 4 architecture and RDNA 3 graphics that enables even AAA gaming at native 1080p resolution. Along with the 16 GB of LPDDR5X-7500 Memory on board, the ZONE makes the full spectrum of experiences that PC gaming can offer through stunning visuals and performance, and take advantage of AMD's driver-level Fluid Motion Frames (FMF) and FidelityFX Super Resolution technology to enhance gameplay performance and immersion further. Also featured are a full-sized 2280 512 GB M.2 NVMe PCIe 4.0 x4 SSD and a UHS-II microSD card reader to cover every gamer's storage needs.

Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry's thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16 GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.

"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully completed verification of the industry's fastest 10.7 gigabit-per-second (Gbps) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on MediaTek's next-generation Dimensity platform.

The 10.7 Gbps operation speed verification was carried out using Samsung's LPDDR5X 16-gigabyte (GB) package on MediaTek's upcoming flagship Dimensity 9400 System on Chip (SoC), scheduled to be released in the second half of this year. The two companies have closely collaborated to complete the verification within just three months.

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

The first reviews of a notebook with Qualcomm's Snapdragon X Elite SoC have appeared today, and it looks like the promised performance isn't quite there. And yes, all the reviews that went live today are all based on Asus' Vivobook S 15 OLED, so it might be a bit too early to state that Qualcomm isn't delivering on its claimed performance, as other manufacturers might deliver better performance. Let's start with the battery life. The Vivobook S 15 OLED comes with a 70 Wh battery pack which enables it to deliver better battery life than many AMD or Intel notebooks, but Apple's MacBook Air 15 M3 delivers on average a 40 percent better battery life, with a smaller 66.5 Wh battery pack. Browsing the web or watching movies aren't really too taxing for the Snapdragon X Elite, but under heavier loads the battery life drops off a cliff.

When it comes to application performance, the Snapdragon X Elite offers good multicore performance in benchmarks like Cinebench 2024 and PCMark 10, but it falls way behind in most other tests, ranging from video encoding to file extraction and document conversion, with Intel Core Ultra 7 155H based notebooks often pulling ahead by 50 percent or more. Despite being equipped with LPDDR5X-8448 memory, the Snapdragon X Elite falls behind in both the memory copy and write tests in AIDA64 compared to the Intel powered laptops. However, it's not all doom and gloom, as the Qualcomm chip delivers an impressive memory latency of a mere 8.1 ns, compared to 100+ for the Intel based laptops. It also outclasses the Intel laptops when it comes to memory read performance.

Handheld gaming devices are a dime a dozen these days and more and more companies are joining the fray on almost a weekly basis. At Computex, XPG was showing its upcoming handheld gaming device—currently known as the NIA—and it has several interesting features that most of their competitors haven't mentioned so far. The potentially most interesting feature that XPG has implemented is an LPCAMM2 module with support for up to 64 GB of LPDDR5x memory. XPG didn't list how much RAM the NIA will ship with, but 16 or 32 GB seems like the logical choices.

The device will be powered by AMD's Phoenix APU, but no details were given. XPG has implemented support for foveated rendering, which the company claims is an exclusive feature. This is courtesy of a front-facing camera with eye tracking, but it's unclear how exactly it'll work, since it won't be exactly the same as in a VR headset. The NIA will ship with an XPG Gammix S55 SSD, which is an M.2 2230 PCIe 4.0 NVMe drive with sizes of up to 2 TB. XPG also claims that the NIA is built for a "circular computing product lifecycle" whatever that means, but we're guessing it has something to do with using recycled materials and being recyclable. The screen size of the 1080p, 120 Hz display wasn't mentioned, but the screen can be tilted for better ergonomics and is supposed to deliver up to 500 nits brightness. The NIA also has a built-in kickstand.

Zotac took the plunge into the emerging market of Windows-based gaming handhelds that a lot of PC hardware brands are getting into off late. The device has a 7-inch 1080p AMOLED multi-touch display, but you can connect an external display using over DisplayPort. At the heart of the Zotac ZONE is the AMD Ryzen 7 8840U "Hawk Point" processor, with its Radeon 780M graphics. This chip is wired to 16 GB of LPDDR5X-7500, and a 512 GB M.2 NVMe SSD. The device features an M.2-2280 Gen 4 slot, so you are spoiled for choice with SSD upgrades.

The Zotac ZONE handheld console uses Windows 11 Home, but with its first-party One Launcher UI that organizes your games across DRM platforms, lets you configure input, tweak performance or battery life, and much more. The star attraction with this device's connectivity is its two USB4 type-C ports, one of which has DisplayPort passthrough), and PD 3.0. There's also a microSD UHS-II reader. A 4-pole 3.5 mm headset jack handles analog audio. Wireless connectivity includes Wi-Fi 6E and Bluetooth 5.2. Powering it all is a 48.5 Wh battery. The device measures 310 mm x 135 mm x 40 mm, and is expected to weigh under 700 g.

ASUS Republic of Gamers (ROG) today announced the latest version of its critically acclaimed Zephyrus G16 gaming laptop, now featuring an AMD Ryzen AI 9 HX 370 processor. With a built-in NPU for AI-accelerated tasks and a dedicated NVIDIA GPU, the latest Zephyrus G16 stands ready for any scenario, from gaming to productivity and more—all in an ultra-sleek thin-and-light package.

Zephyrus enters the era of AI computing
We're entering a new era of computing, with artificial intelligence at its center—and ROG is charging ahead with the new Zephyrus G16, now a true AI PC thanks to its AMD Ryzen AI 9 HX 370 processor. With 12 cores, 24 threads, a built-in AMD Ryzen AI XDNA 2 NPU capable of 50 TOPS of AI performance, along with 31 TOPS from the CPU and its integrated Radeon 890M graphics, the new Zephyrus G16 stands ready for enhancing productivity in AI-enabled applications, including powerful Windows Copilot tools.