Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry's thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16 GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.

"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."

AMD's upcoming "Strix Halo" mobile processor that features up to 16 "Zen 5" CPU cores and a powerful iGPU with 40 compute units, is beginning to surface in online benchmark databases. We've gone into the juicy technical bits about the processor in our older articles, but put simply, it is a powerful mobile processor meant to square off against the likes of the Apple M3 Pro and M3 Max. A chiplet-based processor, much like the upcoming "Granite Ridge" desktop processor and "Fire Range" mobile processor, "Strix Halo" features up to 16 full-sized "Zen 5" cores, as it uses up to two of the same "Eldora" CCDs as them; but wired to a large I/O die that contains the oversized iGPU, and an NPU, besides the memory controllers. The iGPU has 40 compute units (2,560 stream processors), and is based on the RDNA 3.5 graphics architecture, while the NPU is the same 50 TOPS-class unit carried over from "Strix Point."

A prototype HP laptop powered by a "Strix Halo" processor that uses a single 8-core "Zen 5" CCD, was spied on the web. This chip has eight full-sized "Zen 5" cores that share a 32 MB L3 cache. The iGPU on the I/O die has its own 32 MB Infinity Cache memory that cushions memory transfers. In our older reports, we speculated as to what the memory interface of "Strix Halo" would be. It turns out that the chip exclusively features a 256-bit wide LPDDR5X memory interface, which is double the bus width of "Strix Point." This is essentially what a "quad-channel DDR5" memory interface would be, and AMD is using a memory speed standard of at least LPDDR5X-8000. From the machine's point of view, this would be just a couple of hardwired LPDDR5X chips, or a pair of LPCAMM 2 modules. Back to the benchmarks, and we are shown a single-thread CPU score of 2099 to 2177 points, and a multithreaded score ranging between 5477 points to 13993 points. The laptop was tested with an unknown version and distribution of Linux. The CPU cores are shown boosting up to 5.35 GHz.

Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully completed verification of the industry's fastest 10.7 gigabit-per-second (Gbps) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on MediaTek's next-generation Dimensity platform.

The 10.7 Gbps operation speed verification was carried out using Samsung's LPDDR5X 16-gigabyte (GB) package on MediaTek's upcoming flagship Dimensity 9400 System on Chip (SoC), scheduled to be released in the second half of this year. The two companies have closely collaborated to complete the verification within just three months.

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

The first reviews of a notebook with Qualcomm's Snapdragon X Elite SoC have appeared today, and it looks like the promised performance isn't quite there. And yes, all the reviews that went live today are all based on Asus' Vivobook S 15 OLED, so it might be a bit too early to state that Qualcomm isn't delivering on its claimed performance, as other manufacturers might deliver better performance. Let's start with the battery life. The Vivobook S 15 OLED comes with a 70 Wh battery pack which enables it to deliver better battery life than many AMD or Intel notebooks, but Apple's MacBook Air 15 M3 delivers on average a 40 percent better battery life, with a smaller 66.5 Wh battery pack. Browsing the web or watching movies aren't really too taxing for the Snapdragon X Elite, but under heavier loads the battery life drops off a cliff.

When it comes to application performance, the Snapdragon X Elite offers good multicore performance in benchmarks like Cinebench 2024 and PCMark 10, but it falls way behind in most other tests, ranging from video encoding to file extraction and document conversion, with Intel Core Ultra 7 155H based notebooks often pulling ahead by 50 percent or more. Despite being equipped with LPDDR5X-8448 memory, the Snapdragon X Elite falls behind in both the memory copy and write tests in AIDA64 compared to the Intel powered laptops. However, it's not all doom and gloom, as the Qualcomm chip delivers an impressive memory latency of a mere 8.1 ns, compared to 100+ for the Intel based laptops. It also outclasses the Intel laptops when it comes to memory read performance.

Handheld gaming devices are a dime a dozen these days and more and more companies are joining the fray on almost a weekly basis. At Computex, XPG was showing its upcoming handheld gaming device—currently known as the NIA—and it has several interesting features that most of their competitors haven't mentioned so far. The potentially most interesting feature that XPG has implemented is an LPCAMM2 module with support for up to 64 GB of LPDDR5x memory. XPG didn't list how much RAM the NIA will ship with, but 16 or 32 GB seems like the logical choices.

The device will be powered by AMD's Phoenix APU, but no details were given. XPG has implemented support for foveated rendering, which the company claims is an exclusive feature. This is courtesy of a front-facing camera with eye tracking, but it's unclear how exactly it'll work, since it won't be exactly the same as in a VR headset. The NIA will ship with an XPG Gammix S55 SSD, which is an M.2 2230 PCIe 4.0 NVMe drive with sizes of up to 2 TB. XPG also claims that the NIA is built for a "circular computing product lifecycle" whatever that means, but we're guessing it has something to do with using recycled materials and being recyclable. The screen size of the 1080p, 120 Hz display wasn't mentioned, but the screen can be tilted for better ergonomics and is supposed to deliver up to 500 nits brightness. The NIA also has a built-in kickstand.

Zotac took the plunge into the emerging market of Windows-based gaming handhelds that a lot of PC hardware brands are getting into off late. The device has a 7-inch 1080p AMOLED multi-touch display, but you can connect an external display using over DisplayPort. At the heart of the Zotac ZONE is the AMD Ryzen 7 8840U "Hawk Point" processor, with its Radeon 780M graphics. This chip is wired to 16 GB of LPDDR5X-7500, and a 512 GB M.2 NVMe SSD. The device features an M.2-2280 Gen 4 slot, so you are spoiled for choice with SSD upgrades.

The Zotac ZONE handheld console uses Windows 11 Home, but with its first-party One Launcher UI that organizes your games across DRM platforms, lets you configure input, tweak performance or battery life, and much more. The star attraction with this device's connectivity is its two USB4 type-C ports, one of which has DisplayPort passthrough), and PD 3.0. There's also a microSD UHS-II reader. A 4-pole 3.5 mm headset jack handles analog audio. Wireless connectivity includes Wi-Fi 6E and Bluetooth 5.2. Powering it all is a 48.5 Wh battery. The device measures 310 mm x 135 mm x 40 mm, and is expected to weigh under 700 g.

ASUS Republic of Gamers (ROG) today announced the latest version of its critically acclaimed Zephyrus G16 gaming laptop, now featuring an AMD Ryzen AI 9 HX 370 processor. With a built-in NPU for AI-accelerated tasks and a dedicated NVIDIA GPU, the latest Zephyrus G16 stands ready for any scenario, from gaming to productivity and more—all in an ultra-sleek thin-and-light package.

Zephyrus enters the era of AI computing
We're entering a new era of computing, with artificial intelligence at its center—and ROG is charging ahead with the new Zephyrus G16, now a true AI PC thanks to its AMD Ryzen AI 9 HX 370 processor. With 12 cores, 24 threads, a built-in AMD Ryzen AI XDNA 2 NPU capable of 50 TOPS of AI performance, along with 31 TOPS from the CPU and its integrated Radeon 890M graphics, the new Zephyrus G16 stands ready for enhancing productivity in AI-enabled applications, including powerful Windows Copilot tools.

Two new ASUS TUF series laptop models (TUF A14 and TUF A16) come out of the dark at Computex, making use of AMD Ryzen AI 9 CPUs and NVIDIA RTX 4000 GPUs. The ultraslim chassis of ASUS TUF Gaming A14 weighs merely 1.46 kg with a thickness of 1.69 cm, and features a 14" 16:10 up to 2.5K 165 Hz @ 3 ms 400 nits display with NVIDIA G-Sync support. Powered by the latest AMD Ryzen AI 9 HX 370 processor with 50 TOPS NPU, and with another hefty helping hand from NVIDIA GeForce RTX 4060 GPU with 233 TOP of AI performance, dual-channel LPDDR5X RAM, a 73 Whr battery, and 2x M2.2280 SSD slots makes it an interesting option for gamers looking after a light and thin laptop.

The bigger brother, TUF A16 have the same AMD Ryzen 9 CPU but comes with NVIDIA GeForce RTX 4070 GPU with 321 TOPS, a 16" 100% sRGB display with 90% screen-to-body ratio, dual-channel LPDDR5X 7500 MHz memory, USB 4.0 ports, and dual 2nd Gen Arc Flow Fans with full-width heatsink (170 W combined max wattage).

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.Update 07:03 UTC: We have some pricing and availability details from Schenker.

ASUS today announced the ROG Ally X, its ambitious new handheld game console that's a step up from the ROG Ally that the company launched last year. The ROG Ally X is powered by the same AMD Ryzen Z1 Extreme processor as the ROG Ally, but with 50% more unified memory—now up to 24 GB of LPDDR5X-7500, which runs at an 18% higher speed than the 16 GB LPDDR5-6400 of the original. The designers also implemented an M.2-2280 NVMe SSD slot, which opens the console up to the widest possible selection of NVMe SSDs. The console includes a 1 TB drive, which is double that of the 500 GB that the ROG Ally comes with. The company has also significantly upgraded the thermal solution of the console with a larger fan, and better thermal venting, which offers 6°C lower gaming temperatures.

Perhaps the biggest feature upgrade is the battery, which is 80 Wh, a 100% increase from the 40 Wh of the original ROG Ally. This may not be a linear 100% increase in battery life from the ROG Ally (due to the various hardware upgrades), but should still pose significant improvements to it. Other hardware updates include USB4, which includes DisplayPort passthrough from the iGPU; besides a separate USB 3.2 Gen 2 type-C. The console supports USB-PD with 140 W fast-charging, and is paired with a first-party GaN-based 140 W fast-charger. Dimensions are similar to those of the ROG Ally, except for 4 mm added thickness, and 70 g added weight (608 g vs. 678 g). Available from July, the ROG Ally X is priced at $799, and includes a 3-month Xbox Game Pass. We went hands on with the console at ASUS's pre-Computex event. Stay tuned for several more announcements form the company in the coming days.

Acer today introduces two new Acer Chromebook Plus Enterprise laptops, both designed with powerful technology and Google AI capabilities that ensure businesses, their workforces and frontline employees are equipped with the latest technology to work in the cloud more efficiently and securely.

Both new Chromebook Plus Enterprise models - the Acer Chromebook Plus Enterprise 515 and Acer Chromebook Plus Enterprise Spin 514 - come with the business capabilities of ChromeOS unlocked, ensuring best-in-class security, simple management, flexible access, and enhanced administrative support, all coupled with double the speed, memory and storage. The Acer Chromebook Plus Spin 514 (CP514-4HN) is also available for consumers or individuals.

ZOTAC, best known for its graphics cards and to some extent its Mini-PCs, is going to present a new handheld gaming device - ZOTAC ZONE. Videocardz somehow managed to get their hands on an almost complete spec sheet just to find out that it will be powered by an 8-core AMD Ryzen 7 8840U processor. From this we can also get to know that it will use Radeon 780M integrated graphics with 12 RDNA3 Compute Units (15 W Default, 28 W Max). ZOTAC ZONE will feature a 7-inch 120 Hz AMOLED, 1080p, 120 Hz display with up to 800 nits maximum brightness.

The device specs include 16 GB of LPDDR5X memory, 512 GB dedicated storage and support for M2.2 2280 SSDs. The 48.5 Wh battery with an estimated 1.25 hours of runtime seems a bit weak, thus the lower 700 g weight, but that could change since the display/demo unit that will be available during Computex next week is a non-final prototype model. As confirmed by ZOTAC, ZONE is expected to be launched in the next quarter, with no details about the price.

Acer today debuted two new premium Chromebook Plus laptops - the Acer Chromebook Plus Spin 714 and Acer Chromebook Plus 516 GE - that combine versatile designs with a 2x faster Intel Core processor and up to double the memory and storage, giving people the power to do even more all at once.

As Chromebook Plus devices, the two new models support enhanced generative AI features for connectivity, creativity, and collaboration, such as a "help me write" feature available with just a right click, Google Photos' Magic Editor, Gemini, and more. The Acer Chromebook Plus Spin 714 is a slim convertible optimized for on-the-go productivity and connectivity with a 360-degree hinge that allows it to be used in myriad ways and places, and the Acer Chromebook Plus 516 GE is a next-generation cloud-gaming Chromebook with the latest gaming-centric hardware to stream and play AAA games with NVIDIA GeForce NOW, Xbox Cloud Gaming, Boosteroid, Amazon Luna and more.

Yesterday we reported on DDR6 memory hitting new heights of performance and it looks like LPDDR6 will follow suit, at least based on details in a JEDEC presentation. LPDDR6 will just like LPDDR5 be available as solder down memory, but it will also be available in a new LPCAMM2 module. The bus speed of LPDDR5 on LPCAMM2 modules is expected to peak at 9.2 GT/s based on JEDEC specifications, but LPDDR6 will extend this to 14.4 GT/s or roughly a 50 percent increase. However, today the fastest and only LPCAMM2 modules on the retail market which are using LPDDR5X, comes in at 7.5 GT/s, which suggests that launch speeds of LPDDR6 will end up being quite far from the peak speeds.

There will be some other interesting changes to LPDDR6 CAMM2 modules as there will be a move from 128-bit per module to 192-bit per module and each channel will go from 32-bits to 48-bits. Part of the reason for this is that LPDDR6 is moving to a 24-bit channel width, consisting of two 12-bit sub channels, as mentioned in yesterday's news post. This might seem odd at first, but in reality is fairly simple, LPDDR6 will have native ECC (Error Correction Code) or EDC (Error Detection Code) support, but it's currently not entirely clear how this will be implemented on a system level. JEDEC is also looking at developing a screwless solution for the CAMM2 and LPCAMM2 memory modules, but at the moment there's no clear solution in sight. We might also get to see LPDDR6 via LPCAMM2 modules on the desktop, although the presentation only mentions CAMM2 for the desktop, something we've already seen that MSI is working on.

ASUS today announced a new generation of AI-powered computing at its online-only Next Level. AI Incredible. launch event, dedicated to the launch of the ASUS Vivobook S 15 (S5507). Powered by the Snapdragon X Elite, the device is the company's first Copilot+ PC, with Windows AI features and a collection of exclusive ASUS AI apps that aim to improve the user's work and play.

"As ASUS embarks on this journey, marked by the launch of our first AI PC, we stand at the beginning of a new era of personal computing." ASUS Co-CEO S.Y. Hsu said, speaking at the event, "The launch of our first Copilot+ PC powered by Snapdragon X Elite is an important milestone for us, and we believe that these devices are the future of consumer PCs and will drastically change the way we will work, study, create, and play."

Today, Lenovo launched the Lenovo Yoga Slim 7x and Lenovo ThinkPad T14s Gen 6, its first next generation Copilot+ PCs powered by Snapdragon X Elite. As the PC industry enters a new phase of the artificial intelligence era, Lenovo is poised to offer new levels of personalization in personal computing across its PC portfolio. Intelligent software-powered local processing of tasks, and increased productivity, creativity, and security, these Copilot+ PC's combine to deliver a whole new experience in PC interaction. Lenovo is expanding its already comprehensive portfolio of AI-ready devices, software, and optimized services with two new laptops for consumers and business users—the Lenovo Yoga Slim 7x and the Lenovo ThinkPad T14s Gen 6.

Powered by Qualcomm Technologies' new Snapdragon X Elite processor featuring the 12-core Qualcomm Oryon CPU, Qualcomm Adreno GPU and a dedicated Qualcomm Hexagon NPU (neural processing unit), the new laptops deliver leading PC performance per watt with the fastest to date AI NPU processing up to 45 trillion operations per second (TOPS). With the latest enhancements from Microsoft and Copilot+, users can now access Large Language Model (LLM) capabilities even when offline, offering seamless productivity and creativity. The latest Lenovo laptops allow users to tap into the extensive Copilot+ knowledge base, empowering them to explore endless creative possibilities. By leveraging generative AI and machine learning, Copilot+ assists in composing compelling text, crafting engaging visuals, and streamlining common productivity tasks. With the ability to work offline with the same fluidity as online, the Yoga Slim 7x and the ThinkPad T14s Gen 6 set new standards in AI PC innovation, promising a futuristic and streamlined user experience for end users.

Acer today launched its first Copilot+ PC with the Swift 14 AI laptop, in collaboration with Microsoft and Qualcomm Technologies, Inc., ushering in a new AI era with brand new user experiences and AI capabilities on Windows 11. The Swift 14 AI has multiple device models, powered by Snapdragon X Elite and Snapdragon X Plus platforms, and both feature one of the world's fastest NPUs for laptops to enable on-device AI processing. Users can streamline everyday tasks with smarter PC functions and tackle complex workloads more effectively.

"Engineered for AI from the inside out, the Swift 14 AI is the first among many Acer Copilot+ PCs to come," said Jerry Kao, COO, Acer Inc. "These next-generation AI PCs see significant leaps in AI processing power, unlocking brand new experiences that we know users will love."

TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50-60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.

Courtesy of ASUS Vietnam (via @rquandt on X/Twitter), we now have an idea of what ASUS' first Qualcomm Snapdragon X Elite notebook will look like, but also what the main specifications are. It will share the Vivobook S 15 OLED branding with other notebooks from ASUS, although the leaked model carries the model number S5507QA-MA089WS. At its core is a Qualcomm Snapdragon X Elite X1E-78-100 SoC which is the base model from Qualcomm. The SoC consists of 12 Oryon cores, of which eight are performance cores and four are energy efficient cores. A peak, multi-threaded clock speed of 3.4 GHz and 42 MB of cache, as well as a 75 TOPs AI engine rounds off the SoC specs. The SoC is also home to a Qualcomm Adreno GPU, but so far Qualcomm hasn't released any useful specs about the GPU in the Snapdragon X Elite series of chips.

ASUS has paired the SoC with 32 GB of LPDDR5X memory of an unknown clock speed, although Qualcomm officially supports speed of up to 8,448 MT/s in a to PC users unusual configuration of eight channels at 16-bit wide, for a bandwidth of up to 135 GB/s. For comparison, Intel's latest Core Ultra processors max out at LPDDR5X 7,467 MT/s and up to 120 GB/s memory bandwidth. Other features include a 1 TB PCIe 4.0 NVMe SSD, a glossy 15.6-inch 2,880 x 1,620 resolution, 120 Hz OLED display with 600 nits peak brightness and a 70 WHr battery. It's unclear what connectivity options will be on offer, but judging by the screenshot below, we can at least expect an HDMI out as well as a pair of USB Type-C ports, a micro SD card slot and a headphone jack. As far as pricing goes, Roland Quandt is suggesting a €1,500 base price on X/Twitter, but we'll have to wait for the official launch to find out what these Arm based laptops will retail for. ASUS Vietnam has already removed the page from its website.

The ROG Ally X handheld gaming console ASUS plans to unveil on June 2, has not just a fixed microSD card slot, and a 40% larger battery, but also an upgraded main memory, MysteryLupin, a reliable source with ASUS leaks, reports. The console features 24 GB of LPDDR5X memory, compared to 16 GB on the regular ROG Ally with the Ryzen Z1 Extreme. The larger battery should give it usage of up to 8 hours on a full charge, while the larger memory should definitely improve performance, given that the SoC is the same Z1 Extreme ASUS uses in the regular ROG Ally. Besides the larger memory and battery, the console features an industry standard M.2-2280 NVMe SSD drive bay, with a pre-installed 1 TB SSD. This should open users up to the widest possible range of SSD upgrades. ASUS is reportedly pricing the ROG Ally X at $799, a $100 increase over the original ROG Ally with the Z1 Extreme—a premium that's actually shaping up to be good value.

Intel has prepared the Core Ultra 5-238V, a Lunar Lake-MX CPU that integrates 32 GB of LPDDR5X memory into the CPU package. This new design represents a significant departure from the traditional approach of using separate memory modules, promising enhanced performance and efficiency, similar to what Apple is doing with its M series of processors. The Core Ultra 5-238V is the first of its kind for Intel to hit mass consumers. Previous attempt was with Lakefield, which didn't take off, but had advanced 3D stacked Foveros packaging. With 32 GB of high-bandwidth, low-power LPDDR5X memory directly integrated into the CPU package, the Core Ultra 5-238V eliminates the need for separate memory modules, reducing latency and improving overall system responsiveness. This seamless integration results in faster data transfer rates and lower power consumption with LPDDR5X memory running at 8533 MT.

Applications that demand intensive memory usage, such as video editing, 3D rendering, and high-end gaming, will be the first to experience performance gains. Users can expect smoother multitasking, quicker load times, and more efficient handling of memory-intensive tasks. The Core Ultra 5-238V is equipped with four big Lion Cove and four little Skymont cores, in combination with seven Xe2-LPG cores based on Battlemage GPU microarchitecture. The bigger siblings to Core Ultra 5, the Core Ultra 7 series, will feature eight Xe2-LPG cores instead of seven, with the same CPU core count, while all of them will run the fourth generation NPU.

Micron Technology, Inc., today announced the availability of Crucial LPCAMM2, the disruptive next-generation laptop memory form factor that features LPDDR5X mobile memory to level up laptop performance for professionals and creators. Consuming up to 58% less active power and with a 64% space savings compared to DDR5 SODIMMs, LPCAMM2 delivers higher bandwidth and dual-channel support with a single module. LPCAMM2 is an ideal high-performance memory solution for handling AI PC and complex workloads and is compatible with the powerful and versatile Lenovo ThinkPad P1 Gen 7 mobile workstations.

"LPCAMM2 is a game-changer for mobile workstation users who want to enjoy the benefits of the latest mobile high performance memory technology without sacrificing superior performance, upgradeability, power efficiency or space," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "With LPCAMM2, we are delivering a future-proof memory solution, enabling faster speeds and longer battery life to support demanding creative and AI workloads."