Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, will today celebrate the start of construction on the nation's first new memory manufacturing fab in 20 years. Company executives will join Idaho Governor Brad Little, Boise Mayor Lauren McLean, other community partners and team members to mark the milestone with a ceremonial concrete pour at Micron's Boise headquarters on the 45th anniversary of the company's founding.

Just over a year ago, Micron announced its plans to invest approximately $15 billion through the end of the decade to construct a new fab for leading-edge memory manufacturing, to be co-located with the company's R&D epicenter in its hometown of Boise. Through the lifespan of the project, Micron will directly infuse $15.3 billion into the Idaho economy and directly spend $13.0 billion with Idaho businesses. The project will create over 17,000 new Idaho jobs, including 2,000 Micron direct jobs, furthering the need for a diverse, highly skilled workforce.

v-color Technology Inc, is thrilled to introduce a memory kit that redefines extreme performance. This release unveils an unparalleled DDR5 memory specification designed to push the boundaries of low-latency performance, with module capacity of 16GBx2 and 32GBx2 CL of 26 and speeds ranging from 5600 MHz up to 5800 MHz. These new kits will open a new era of gaming and overclocking, delivering speed and stability to the most demanding users

v-color announced its latest achievement in the form of an Ultra-Low-Timing XSky series DDR5 memory kit. This module operates at 32 GB (2x16GB) DDR5 5600 MHz CL26-36-36-76 1.4 V, 32 GB (2x 16 GB) DDR5 5800 MHz CL26-36-36-76 1.4 V and 64 GB (2x32GB) DDR5 5600 MHz CL26-36-36-76 1.4 V.

During the China Chip Storage Future 2023 Storage Industry Trend Summit, Yingren Technology, widely recognized as InnoGrit outside of China, announced the initiation of mass production of its enterprise-level YR S900 PCIe 5.0 SSD controller. Marking a significant breakthrough, the YR S900 stands as China's first domestic PCIe 5.0 SSD controller. Operating on an open-source RISC-V architecture, the YR S900 is engineered to align with U.S. export restrictions, ensuring a seamless design and manufacturing process of the SSD controller. While Yingren Technology remains discreet about the specific process node to produce the YR S900, it's known that the controller embodies a versatile design, with compatibility extending to mainstream NAND from eminent manufacturers, and exhibits an impressive synergy with NAND from Yangtze Memory Technologies Corp (YMTC).

The YR S900 is a quad-channel controller, offering sequential read and write speeds peaking at 14 GB/s and 12 GB/s, respectively, and is equipped with InnoGrit's third-generation ECC engine to optimize 4K LDPC encoding and decoding. This collaboration with Kioxia's XL-Flash results in a low 4K random read latency of 10us, highlighting its potential to deliver higher data throughput, increased stability, and extended service life. The YR S900 encompasses a comprehensive feature set, including FDP, SR-IOV hardware virtualization, CMB, and a range of data encryption algorithms. While the mass production of the YR S900 underscores a monumental stride in SSD solutions within China, it remains to be seen whether adopting this new Chinese technology will enter markets beyond China.

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM market for PCs and laptops - and potentially even data centers. Samsung's groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel's platform. Historically, PCs and laptops have conventionally used LPDDR DRAM or DDR-based So-DIMMs. While LPDDR is compact, it's permanently attached to the motherboard, making it challenging to replace during repairs or upgrades. On the other hand, So-DIMMs can be attached or detached easily but have limitations with performance and other physical features.

LPCAMM overcomes the shortcomings of both LPDDR and So-DIMMs, addressing the increased demand for more efficient yet compact devices. Being a detachable module, LPCAMM offers enhanced flexibility for PC and laptop manufacturers during the production process. Compared to So-DIMM, LPCAMM occupies up to 60% less space on the motherboard. This allows more efficient use of devices' internal space while also improving performance by up to 50% and power efficiency by up to 70%. LPDDR's power-saving features have made it an attractive option for servers, since it could potentially improve total cost of operation (TCO) efficiency. However, using LPDDR can create operational difficulties such as the need to replace the entire motherboard when upgrading a server's DRAM specifications. LPCAMM offers a solution to these challenges, creating significant potential for it to become the solution of choice for future data centers and servers.

SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

KIOXIA America, Inc. today announced that it has donated a command set specification to the Linux Foundation vendor-neutral Software-Enabled FlashTM Project. Built to deliver on the promise of software-defined flash, Software-Enabled Flash technology gives storage developers control over their data placement, latency outcomes, and workload isolation requirements. Through its open API and SDKs, hyperscale environments may optimize their own flash protocols, such as flexible direct placement (FDP) or zoned namespace (ZNS), while accelerating adoption of new flash technologies. This unique combination of open source software and purpose-built hardware can help data centers maximize the value of flash memory. KIOXIA has developed working samples of hardware modules for hyperscalers, storage developers and application developers.

"We are delighted to provide command set specifications to the Software-Enabled Flash Project," said Eric Ries, senior vice president and general manager of the Memory and Storage Strategy Division for KIOXIA America, Inc. "This is an important step that allows the ecosystem to bring products to market, and enables customers to extract the maximum value from flash memory."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

UPMEM, a fabless semiconductor startup has raised €4.1 M equity from the European Innovation Council (EIC) Fund and Venture Capitalists (Partech, Western Digital Capital, C4 Ventures…), and a €2.5M grant from the EIC. Founded by Fabrice Devaux and Gilles Hamou, the company is pioneering ultra-efficient Processing In Memory (PIM) accelerators to tackle the significant challenge of compute efficiency for AI and big data applications.

UPMEM's PIM solution, integrating UPMEM's first commercial-grade PIM chip on the market, is now available to cloud markets across the globe (US, Asia...) to provide the most cost-effective and energy-efficient solutions for AI and analytics applications in data centers and at the edge, such as large language models (LLM e.g. GPT), genomics, large analytics.

Patriot Memory has announced a full expansion of its latest DDR5 performance memory series, the Viper Xtreme 5 DDR5. This expansion will include new non-RGB models available in 7,600 MT/s and 8,200 MT/s kits, with kit capacities from 32 GB (16 GB x2) to 48 GB (24 GB x2). Previously unveiled at CES 2023, the Viper Xtreme 5 aims to take system performance to a new level with performance memory built for extreme overclockers, serious gamers and enthusiast tinkerers alike. With speeds reaching up to 8,200 MT/s, the Viper Xtreme 5 is Patriot Memory and Viper Gaming's fastest DRAM produced to date.

Since its debut, the Viper Xtreme 5 has received strong praise from gamers, tech enthusiasts and media alike, including a nomination for "Best System Memory Series" at the 2023 European Hardware Awards, FunkyKit Editor's Choice Award, Techpowerup Editor's Choice Award, TweakTown Editor's Choice Award and Overclockers.com's "Approved" Top Rating. The Viper Xtreme 5 was also featured in multiple record-breaking overclock competitions by overclockers Chewonthis and Fugger.

Lexar, a leading global brand of flash memory solutions, joined Gamescom 2023 for the first time. Lexar also unveiled some of the new products that are estimated to be launched in Q4 2023 for the first time at the show. Designed for PC enthusiasts to accelerate their workflow, the new portfolio includes internal SSDs, DRAM.

The performance of Lexar ARES RGB DDR5 Desktop Memory reaches a new height of 8000MT/s and 8400MT/s, allowing hardcore gamers and PC enthusiasts to experience superior performance with next-gen DDR5. And, in addition to the performance, this memory also features Lexar RGB Sync so gamers can customize the RGB LED to their own style, and its sleek premium aluminium heat spreader keeps the system cool. It is built with on-die ECC, which leverages real-time data error correction for increased data stability and reliability. With on-board Power Management IC (PMIC), it provides better power control and power delivery.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new DDR5 memory kit specifications at DDR5-6400 CL32-39-39 in kit capacities of 32 GB (16 GB x2) and 48 GB (24 GB x2) under the Trident Z5 Neo RGB series, which also now comes in a new white version. Designed for AMD Ryzen 7000 series processors and AMD X670 chipset motherboards with AGESA 1.0.0.7c BIOS updates, and programmed with AMD EXPO overclock profile technology, these new specifications enable PC enthusiasts, overclockers, and DIY builders to build an ideal AMD system.

Overclocked Memory Speed Up to DDR5-6400
With the introduction of the AGESA 1.0.0.7c update, G.SKILL is updating the Trident Z5 Neo RGB series with DDR5-6400 memory kits, designed for use on compatible AMD platforms. Refer to the screenshot below to see the DDR5-6400 CL32-39-39 32 GB (16 GB x2) memory kit validated on the AMD Ryzen 9 7950X desktop processor and the ASUS ROG CROSSHAIR X670E HERO motherboard with the 1602 BIOS update. Memory performance and results may vary depending on the motherboard model, CPU model, and BIOS version used.

SK hynix Inc. announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available, and said a customer's evaluation of samples is underway. The company said that the successful development of HBM3E, the extended version of HBM3 which delivers the world's best specifications, comes on top of its experience as the industry's sole mass provider of HBM3. With its experience as the supplier of the industry's largest volume of HBM products and the mass-production readiness level, SK hynix plans to mass produce HBM3E from the first half of next year and solidify its unrivaled leadership in AI memory market.

According to the company, the latest product not only meets the industry's highest standards of speed, the key specification for AI memory products, but all categories including capacity, heat dissipation and user-friendliness. In terms of speed, the HBM3E can process data up to 1.15 terabytes a second, which is equivalent to processing more than 230 Full-HD movies of 5 GB-size each in a second.

AMD appears set to enhance the core count for its renowned Threadripper series. After a prolonged wait, the high-end desktop (HEDT) platform boasting a significant CPU count returns with the Ryzen Threadripper PRO 7995WX, which features an impressive 96 cores and 192 threads. This marks the series' first core count upgrade since the Threadripper 3000 series. The 7995WX CPU was spotted in the HP Z6 G5 Workstation system, potentially one of the inaugural prebuilt systems from AMD's OEM partners. The Threadripper PRO series seems poised to dominate AMD's HEDT offerings, with no indications of non-PRO consumer models emerging for now.

The latest Geekbench listing unveiled the 7995WX CPU's 96-core configuration. Although the base frequency appears misrepresented, benchmark data hints at the 96-core CPU potentially reaching a boost clock of 5.14 GHz, a detail further confirmed by Geekbench's output. Another notable enhancement in the Threadripper series is introducing the DDR5 memory standard. While the benchmarking tool doesn't explicitly mention this, it does highlight a memory configuration of 503.27 GB (512 GB) in use. The CPU managed to score 2095 points for single-core score and 81408 points for multi-core score on Geekbench v5.5 for Linux (Ubuntu 22.04 LTS), making it one of the fastest CPUs in the database.

Courtesy of an SK Hynix keynote speech at the Flash Memory Summit, we now have a few more details about its upcoming 321-layer NAND Flash. PC Watch Japan who attended the industry event shared some pictures from the keynote which adds some crucial details that were missing from last week's press release. SK Hynix's officially shared performance figures tell us that we should expect up to 12 percent faster program performance, which should be the write performance and up to 13 percent improved read latency. Both of these performance metrics will obviously depend on the SSD controller the NAND is paired with, the related firmware on said controller and so forth.

PC Watch Japan also quotes a program throughput of 194 MB/s, which is 26 MB/s improvement over SK Hynix 176-layer NAND and currently the highest known program throughput of any announced NAND Flash. That said, Kioxia is expecting to hit 205 MB/s with its next generation of 300 layer NAND. SK Hynix also claims 10 percent better read power efficiency, which is really neither here nor there when it comes to modern SSDs, unless we're talking server level SSDs with a dozen of these NAND chips or more. Rather than going with two stacks of 150 plus layers each, SK Hynix went with three times 107 layer stacks, which should be compared to their current 238 layer product which has two stacks of 119 layers. This made the new NAND package easier to produce and should in the long term result in higher yields. Each NAND package is expected to deliver a memory density of 20 Gbit per square millimetre or more, which is almost twice that of its 176-layer NAND.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

AMD Radeon RX 7700 XT is confirmed to feature 12 GB as its standard memory size, and feature a 192-bit wide GDDR6 memory interface, according to a leaked regulatory filing by ASRock for its upcoming graphics cards. We already know from last week's mega leak of the PowerColor RX 7800 XT Red Devil that the card maxes out the "Navi 32" silicon, enabling all 60 RDNA3 CU, and comes with 16 GB of memory across the chip's full 256-bit memory bus. This filing suggests how AMD will carve the RX 7700 XT out.

Probably designed to compete with the GeForce RTX 4070, the RX 7700 XT is based on the same "Navi 32" silicon as the RX 7800 XT, but cut down. AMD is expected to disable some of the 60 CU physically present on the 5 nm GCD, while one of the four 6 nm MCDs will be disabled, giving the chip a 192-bit memory bus to drive its 12 GB of memory. We know from the PowerColor leak that the RX 7800 XT gets 18 Gbps memory speed. It remains to be seen if AMD sticks with this speed for even the RX 7700 XT, in which case, it gets 432 GB/s of memory bandwidth at its disposal. AMD is expected to launch the RX 7800 XT and RX 7700 XT within this quarter (before October).

Micron Technology, Inc. (Nasdaq: MU), today announced sample availability of the Micron CZ120 memory expansion modules to customers and partners. The Micron CZ120 modules come in 128 GB and 256 GB capacities in the E3.S 2T form factor, which uses PCIe Gen 5 x8 interface. Additionally, the CZ120 modules are capable of running up to 36 GB/s memory read/write bandwidth and augment standard server systems when incremental memory capacity and bandwidth is required. The CZ120 modules use Compute Express Link (CXL) standards and fully support the CXL 2.0 Type 3 standard. By leveraging a unique dual-channel memory architecture and Micron's high-volume production DRAM process, the Micron CZ120 delivers higher module capacity and increased bandwidth. Workloads that benefit from more memory capacity include AI training and inference models, SaaS applications, in-memory databases, high-performance computing and general-purpose compute workloads that run on a hypervisor on premise or in the cloud.

"Micron is advancing the adoption of CXL memory with this CZ120 sampling milestone to key customers," commented Siva Makineni, vice president of the Micron Advanced Memory Systems Group. "We have been developing and testing our CZ120 memory expansion modules utilizing both Intel and AMD platforms capable of supporting the CXL standard. Our product innovation coupled with our collaborative efforts with the CXL ecosystem will enable faster acceptance of this new standard, as we work collectively to meet the ever-growing demands of data centers and their memory-intensive workloads."

V-COLOR Technology Inc, a leading memory manufacturer, is proud to present a new speed reached for DDR5 96 GB (2x 48 GB) kit of 7800 CL38.
Aiming to break barriers and elevate performance, with this new high-speed of overclocked 96 GB (2x 48 GB) capacity kit at DDR5-7800 CL38-48-48-126

Testing the limits of DDR5 memory speed, v-color reached DDR5-7800 CL38-48-48-126 at 96 GB (2x48GB) kit configuration, with the ASUS ROG MAXIMUS Z790 APEX and Intel Core i9-13900KF processor. Seamlessly compatible with Intel XMP 3.0, the Manta XPrism RGB DDR5 96 GB (2x 48 GB) ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

MSI, today, released a new AMD AGESA PI 1.0.0.7c BIOS update for all MSI's motherboard X670E, X670, B650, A620 product line. For this new BIOS release, MSI focus on and prioritize mainly for higher DDR5 memory module support and also stability bug fixes. The latest update has huge significant increase for supported memory frequency on AMD Ryzen CPUs. Below is a list of models that will be ready at the time of the release while other models will have come support in the following week.

In the screenshots below, demonstrates running a Memory Stress Test, on an AMD Ryzen R7 7700X CPU with a paired of dual-channel DDR5-7200 MHz "EXPO" certified kit on MSI's PRO B650-P WIFI Motherboard will run without any stability issues. Moreover, it also demonstrates running a Memory Stress Test on an AMD Ryzen R9 7900X CPU with MSI's MEG X670E ACE Motherboard can even achieve 8000 MHz (CL36) high frequency. A few more updates specifically on the AGESA 1.0.0.7c added extra for protection for reliability than before and also patched a few potential vulnerabilities and security loopholes.

KIOXIA America, Inc. today announced the availability of the first hardware samples that support the Linux Foundation's vendor-neutral Software-Enabled Flash Community Project, which is making flash software-defined. The company is expecting to deliver customer samples in August 2023. Built for the demanding needs of hyperscale environments, Software-Enabled Flash technology helps hyperscale cloud providers and storage developers maximize the value of flash memory. The hardware from KIOXIA is the first step to putting this working technology in the hands of developers.

The first running units will be showcased in live demonstrations in the KIOXIA booth (#307) next week at Flash Memory Summit 2023 (FMS 2023). This new class of drive consists of purpose-built, media-centric flash hardware focused on hyperscale requirements that work with an open source API and libraries to provide the needed functionality. By unlocking the power of flash, this technology breaks free from legacy hard disk drive (HDD) protocols and creates a platform specific to flash media in a hyperscale environment.

TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.

The distinctions between HBM generations primarily lie in their speed. The industry experienced a proliferation of confusing names when transitioning to the HBM3 generation. TrendForce clarifies that the so-called HBM3 in the current market should be subdivided into two categories based on speed. One category includes HBM3 running at speeds between 5.6 to 6.4 Gbps, while the other features the 8 Gbps HBM3e, which also goes by several names including HBM3P, HBM3A, HBM3+, and HBM3 Gen2.

Lexar, a leading global brand of flash memory solutions, is excited to announce three additions to its gaming product lineup - the new Lexar NM790 M.2 2280 PCIe Gen 4×4 NVMe SSD, Lexar ARES DDR5 Desktop Memory in 6400MT/s, and Lexar ARES RGB DDR4 Desktop Memory in 3600MT/s.

The NM790 M.2 NVMe SSD is perfect for gamers and content creators, delivering incredible speeds of 7400 MB/s read, 6500 MB/s write thanks to its PCIe Gen 4 tech, which includes HMB 3.0 and Dynamic SLC Cache. So whether users are looking to vanquish foes in their gaming battles or conquer their latest creative pursuits, the NM790 SSD is ready to take on the challenge.