According to the South China Morning Post (SCMP) sources, Yangtze Memory Technologies Corp (YMTC) has been plotting to manufacture its advanced 3D NAND flash using locally sourced equipment. As the source notes, YMTC has placed big orders from local equipment makers in a secret project codenamed Wudangshan, named after the Taoist mountain in the company's home province of Hubei. Last year, YTMC announced significant progress towards creating 200+ layer 3D NAND flash before other 3D NAND makers like Micron and SK Hynix. Called X3-9070, the chip is a 232-layer 3D NAND based on the company's advanced Xtacking 3.0 architecture.

As the SCMP finds, YTMC has placed big orders at Beijing-based Naura Technology Group, maker of etching tools and competitor to Lam Research, to manufacture its advanced flash memory. Additionally, YTMC has reportedly asked all its tool suppliers to remove all logos and other marks from equipment to avoid additional US sanctions holding the development back. This significant order block comes after the state invested 7 billion US Dollars into YTMC to boost its production capacity, and we see the company utilizing those resources right away. However, few industry analysts have identified a few "choke points" in YTMC's path to independent manufacturing, as there are still no viable domestic alternatives to US-based tool makers in areas such as metrology tools, where KLA is the dominant player, and lithography tools, where ASML, Nikon, and Canon, are noteworthy. The Wuhan-based Wudangshan project remains secret about dealing with those choke points in the future.

Netlist Inc. an enterprise solid state storage drive specialist has been awarded over $303 million in damages by a federal jury in Texas on April 21, over apparent patent infringement on Samsung's part. Netlist has alleged that the South Korean multinational electronics corporation had knowingly infringed on five patents, all relating to improvements in data processing within the design makeup of memory modules intended for high performance computing (HPC) purposes. The Irvine, CA-based computer-memory specialist has sued Samsung in the past - with a legal suit filed at the Federal District Court for the Central District of California.

Netlist was seemingly pleased by the verdict reached at the time (2021) when the court: "granted summary judgements in favor of Netlist and against Samsung for material breach of various obligations under the Joint Development and License Agreement (JDLA), which the parties executed in November 2015. A summary judgment is a final determination rendered by the judge and has the same force and effect as a final ruling after a jury trial in litigation."

SK hynix announced today it has become the industry's first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers' performance evaluation of samples is underway. HBM (High Bandwidth Memory): A high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products. HBM3 is the 4th generation product, succeeding the previous generations HBM, HBM2 and HBM2E

"The company succeeded in developing the 24 GB package product that increased the memory capacity by 50% from the previous product, following the mass production of the world's first HBM3 in June last year," SK hynix said. "We will be able to supply the new products to the market from the second half of the year, in line with growing demand for premium memory products driven by the AI-powered chatbot industry." SK hynix engineers improved process efficiency and performance stability by applying Advanced Mass Reflow Molded Underfill (MR-MUF)# technology to the latest product, while Through Silicon Via (TSV)## technology reduced the thickness of a single DRAM chip by 40%, achieving the same stack height level as the 16 GB product.

Kingston FURY, the high-performance division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million overclockable modules. In 2002, Kingston entered the enthusiast market with a line of high-performance memory modules under the Kingston HyperX name. Over the next 19 years Kingston grew the HyperX name within the enthusiast and gaming space until its sale of the peripheral line to HP in 2021. Continuing the incredible success of the HyperX memory products, Kingston rebranded its high-performance component lines into Kingston FURY, investing resources and knowledge from its core business to create the next generation of enthusiast products. Today, the engineering expertise behind the numerous overclocking records and awards continues into a new era of leading-edge, high-performance, enthusiast and gaming solutions.

Since its inception, Kingston has taken pride in its testing innovations and industry-leading product reliability. Back in 2005, Kingston was granted a U.S patent on a proprietary, first of its kind, dynamic burn-in tester. This ensured the utmost reliability in server memory modules used in the world's largest data centres. Earlier this year, Kingston broadened its portfolio by adding the Kingston FURY Renegade Pro DDR5 RDIMM which provides overclockable server-class DDR5 memory for creators, engineers, and data science professionals to meet the requirements of the latest applications. Its award-winning line of Kingston FURY Beast DDR5 and Renegade DDR5 memory modules also received a makeover with the introduction of white heat spreaders to empower users to choose the colour that best fits their individual style.

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

It looks like 12 GB will be the standard memory size for the NVIDIA GeForce RTX 4070 graphics card the company plans to launch in mid-April 2023. It is very likely that the card has 12 GB of memory across the 192-bit memory bus width of the "AD104" silicon the SKU is based on. The RTX 4070 is already heavily cut down from the RTX 4070 Ti that maxes out the "AD104," with the upcoming SKU featuring just 5,888 CUDA cores, compared to the 7,680 of the RTX 4070 Ti. The memory sub-system, however, could see NVIDIA use the same 21 Gbps-rated GDDR6X memory chips, which across the 192-bit memory interface, produce 504 GB/s of memory bandwidth. Confirmation of the memory size came from regulatory filings of several upcoming custom-design RTX 4070 board models by MSI and GIGABYTE, with the Eurasian Economic Commission (EEC), and Korean NRRA.

Gigabyte is also apparently testing the new BIOS update that should bring non-binary memory support to AMD's 600-series chipset motherboards. With the official AGESA update for AMD X670 and B650 apparently just around the corner, it does not come as a surprise that all motherboard makers are implementing it and testing it on their motherboards.

The latest comes from Gigabyte over at Coolaler forums, showing the AORUS X670E Master motherboard running 192 GB of DDR5 memory. This time around, the memory was running at 6000 MT/s, so the official support is certainly around the corner, even for overclocked kits. Both Corsair and G.SKILL have already announced their own 24 GB and 48 GB modules running at up to DDR5-8000. The official AGESA update is rumored to come in April, but there is no official word from either AMD or various motherboard makers.

T-FORCE, the gaming sub-brand of Team Group, has launched the blazing-fast VULCAN SO-DIMM DDR5 Memory for laptop gamers looking to upgrade to next-generation DDR5 memory. The VULCAN Memory delivers incredible performance with a simple installation and comes in a range of large capacities, making it the perfect choice for boosting one's gaming experience as well as productivity. Thanks to its ultra-thin graphene heatspreader that enhances cooling; it keeps laptops stable during intensive gaming and allows players to seize victory at the most critical moments.

Following the release of DDR5 desktop memory, the new generation of extremely-fast RAM from T-FORCE has swept the PC hardware world. Today, T-FORCE is launching its first VULCAN SO-DIMM DDR5 Memory designed specifically for gaming laptops. Offering a max clock rate of DDR5-5200 and featuring an ultra-thin graphene heatspreader, gamers will experience shorter load times and faster boot-up speeds while still maintaining low laptop temperatures. With up to 64 GB of capacity, players will enjoy unimpeded gaming and use work applications simultaneously. The new release of VULCAN SO-DIMM brings a whole new level of performance and user experience.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the Battle-Ax Redline Series gaming memory. Available in DDR4 and DDR5 memory kits, the Battle-Ax Redline Series are designed for the latest generation Intel and AMD platforms.

The Battle-Ax Redline Series sports a new look - a low-profile heatspreader with an aggressive styling that fits its beastly performance specifications. The Battle-Ax Redline DDR5 sports a white/red heatspreader while the Battle-Ax Redline DDR4 comes in black/red color.

Kingston today unveiled the FURY Renegade Pro DDR5 RDIMM memory for workstations based on the Intel W790 platform (Xeon W-3400 and W-2400 series "Sapphire Rapids" processors). The company is marking these as "overclockable" registered ECC DIMMs, as they come with Intel XMP 3.0 profiles that enable their advertised speeds on Intel platforms. The FURY Renegade Pro series comes in DDR5-6000 (32-38-38 1.35 V), DDR5-5600 (36-38-38 1.25 V), and DDR5-4800 (36-38-38 1.1 V) speed; with module densities of 16 GB and 32 GB (per DIMM); making up single-module kits, 4-module kits (for W-2400 platforms), and 8-module kits (for W-3400 platforms). The modules themselves are bare—lacking in heatspreaders, with a thin decal covering the DRAM chips. These are standard-height DIMMs.

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

It has been reported by multiple users across several online communities that their Wii U consoles are no longer functioning properly. The error codes 160-0103 and 160-2155 are the dreaded indicators of memory corruption. It has been discovered that the NAND Flash within the Wii U's internal eMMC is prone to failure. According to details gleaned from teardowns of the console's hardware, Nintendo has implemented either Toshiba or Samsung flash storage boards for the various revisions of the console. There has been an uptick in the rate of bricked Wii U consoles across recent months, but the problems seem to have occurred as far back as 2015, according to archived posts on the GBA Temp forum. It is speculated that leaving the Wii U inactive for long periods of time can lead to the memory corruption issues.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing an extreme performance DDR5 memory kit based on the latest 24 GB module capacity, with a specification of DDR5-8000 CL38-48-48 at 48 GB (24 GB x2) under the flagship Trident Z5 RGB series, and setting a new bar for extreme overclocked memory with 24 GB capacity modules.

With Samsung Electronics announcing that the next-generation GDDR7 memory standard is in development, and Cadence, a vital IP provider for DRAM PHY, EDA software, and validation tools announcing its latest validation solution, the decks are clear for the new memory standard to debut with the next-generation of GPUs. GDDR7 would succeed GDDR6, which had debuted in 2018, and has been around for nearly 5 years now. GDDR6 launched with speeds of 14 Gbps, and its derivatives are now in production with speeds as high as 24 Gbps. It provided a generational doubling in speeds from the preceding GDDR5.

The new GDDR7 promises the same, with its starting speeds said to be as high as 36 Gbps, going beyond the 50 Gbps mark in its lifecycle. A MyDrivers report says that NVIDIA's next-generation GeForce RTX 50-series, probably slated for a late-2024 debut, as well as AMD's competing RDNA4 graphics architecture, could introduce GDDR7 at its starting speeds of 36 Gbps. A GPU with a 256-bit wide GDDR7 interface would enjoy 1.15 TB/s of bandwidth, and one with 384-bit would have a cool 1.7 TB/s to play with. We still don't know what is the codename of NVIDIA's next graphics architecture, it could be any of the ones NVIDIA hasn't used from the image below.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new high-speed 7000MT/s 48 GB (2x 24 GB) VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, as well as the general availability of its massive 192 GB (4x 48 GB) DDR5-5200 kits. CORSAIR has worked closely with motherboard manufacturer ASUS to ensure that these new kits work flawlessly across its full range of 700 series motherboards, making them an ideal high-speed companion for the latest 13th Gen Intel Core processors.

These new memory kits are compatible with all Intel 700 series motherboards, but the close working relationship between ASUS and CORSAIR demonstrates both company's commitment to delivering optimal performance and compatibility for customers. Rigorous testing of these new VENGEANCE DDR5 memory kits ensures they work across the full range of ASUS motherboards, including at the new higher DDR5-7000 speeds.

Netac on Wednesday launched the Hurricane Z RGB line of premium DDR5 memory kits. These are characterized by their chunky aluminium heatspreaders that have a clear chrome finish (claimed to be silver-plated), and crowned by silicone addressable-RGB LED diffusers. The company released dual-channel (two module) kits with densities of 32 GB (2x 16 GB), across six speed-based variants.

At the very top is a DDR5-8000 variant with 38-48-48-128 timings and 1.5 V module voltage; followed by a DDR5-7600 variant that offers 36-46-46-122 timings at 1.4 V. A notch below is the DDR5-7200 variant with 34-45-45-115 timings and 1.4 V; followed by a DDR5-6600 variant with slightly tighter 34-40-40-105 timings at the same 1.4 V. The DDR5-6200 variant offers a tighter 32-38-38-96 timings at 1.35 V, while the series begins with a DDR5-6000 variant with 36-36-36-96 timings at 1.35 V. All six variants rely on XMP 3.0 profiles to enable their advertised speeds and timings. Under the hood, these modules are using SK hynix-sourced DRAM chips. Netac released the Hurricane Z RGB series in China first, where its prices range between the equivalent of $203 and $335, depending on the model.

Lexar, a leading global brand of flash memory solutions, is excited to announce Lexar ARES RGB DDR5 Desktop Memory. Specifically designed for gaming, this next-gen DDR5 memory delivers superior performance with speeds starting at DDR5-5600 and up to DDR5-6000, and with quick CL32-36-36-68 / CL34-38-38-76 timings (XMP 3.0 & EXPO). A premium aluminium heatspreader keeps the gaming system cool for ultra-fast performance.

Lexar ARES RGB DDR5 Desktop Memory features on-board Power Management IC (PMIC) to provide better power control and power delivery and it also includes Lexar RGB Sync which lets gamers customize the RGB LED to their own style. "Lexar ARES RGB DDR5 Desktop Memory provides the performance that gamers need to master the latest games—and the upcoming titles that will require the speed and capacity of DDR5," said Joey Lopez, Director Brand Marketing. "And in addition to the performance, this memory also features Lexar RGB Sync so gamers can play in style."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the return of the 7th Annual OC World Cup 2023, after a 3-year hiatus. The G.SKILL OC World Cup extreme overclocking competition will begin with the Online Qualifier stage, held from March 1, 2023 until April 5, 2023 on hwbot.org. Then the top 9 overclockers of the online qualifier will become finalists, who are qualified to join the live competition at the G.SKILL booth during Computex 2023 week from May 30, 2023 to June 2, 2023 and compete for a portion of the $40,000 USD total cash prize pool, with the OC Champion title taking home $10,000 USD!

With the participation of top extreme overclockers from around the world and carefully crafted rules designed to test the ability of each overclocker, the G.SKILL OC World Cup is considered to be one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 overclockers of the Online Qualifier will be eligible to enter the Live Qualifier stage during the week of Computex 2023 at the G.SKILL booth, and the top 3 overclockers from the Live Qualifier stage will compete for the title of OC Champion in the Grand Final.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

According to SkatterBench, a website known for incredible overclocking attempts, we get to see AMD's Ryzen 7000 series integrated GPU get up to 42% performance improvement from overclocking. Specifically, the SKU used in the attempt was the Ryzen 9 7900 non-X model with 12 cores and 24 threads, clocked at 3.7 GHz base frequency and 5.4 GHz boost speed. The SKU contains a basic AMD GPU integrated into the package; however, not meant for any serious gaming tasks. Nonetheless, it is interesting to see what a two-core RDNA2 GPU clocked at 2.2 GHz managed to achieve once overclocked. The memory clock of the GPU is set to 2.4 GHz at stock.

Running at the base voltage of 0.997 volts under Furmark workload, the iGPU consumes around 38.5 Watts. However, the overclocking attempt pushed the voltage to 1.395 Volts, resulting in a 3.1 GHz iGPU frequency. The GPU Memory clock is now set to 3200 MHz, and the GPU+SOC power is 60.689 Watts, almost double compared to the stock settings. The overclocker used a GFX curve optimizer with various system tweaks to achieve these numbers. While the OC attempt was successful, the most significant performance improvement was a 42% increase, with some game titles averaging less. Below, the blue bar indicates stock, while the green bar indicates OC'd performance. You can check out the YouTube video as well to see more details.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced massive new capacities for its DDR5 memory kits, thanks to new 24 GB and 48 GB UDIMM modules. For the first time from CORSAIR, PC builders can choose from 192 GB (4x 48 GB), 96 GB (2x 48 GB), or 48 GB (2x 24 GB) memory kits. Available in either VENGEANCE RGB DDR5 or VENGEANCE DDR5 kits, these new high capacities are ideal for the most demanding, high-capacity applications such as 8K video editing, as well as DRAM-heavy AI and deep learning workloads. Motherboards with just two memory slots, including Micro ATX and Mini-ITX builds, where space is tight but large capacities are needed also benefit.

CORSAIR VENGEANCE RGB DDR5 and VENGEANCE DDR5, already top choices for performance enthusiasts, are optimized for the latest gaming PCs and workstations and at these new capacities give custom PC enthusiasts the option to build with memory configurations that weren't possible until now. Both 96 GB and 48 GB kits are available immediately in both RGB and non-RGB flavors, running at 5,600MT/s and 5,200MT/s and support Intel XMP 3.0 memory overclocking to ensure owners can easily run their memory at the intended speeds.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Neo Forza today unveiled the Trinity DDR5-7200 32 GB (2x 16 GB) dual-channel memory kit. Based on SK hynix A-dies, the modules pack an Intel XMP 3.0 profile that runs the kit at its advertised speed of DDR5-7200. It also includes an AMD EXPO profile, although this enables a slightly lower speed of DDR5-6400. The DDR5-7200 XMP 3.0 profile ticks at timings of 36-46-46-82; while the DDR5-6400 EXPO profile offers 40-40-40-77. Both these profiles run the modules at 1.4 V. Neo Forza claims that the module comes with good overclocking headroom, and they've achieved DDR5-8000 on an Intel Core i9-13900K machine with minimal effort. The company didn't reveal pricing or availability information.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.