SK hynix Inc. (or "the company", www.skhynix.com) announced today that its DDR5 product for servers using 1anm, the fourth generation of the 10 nm process technology, has been validated on the 4th Gen Intel Xeon Scalable processor (formerly codenamed Sapphire Rapids) for the first time in the industry. "The validation of the 1anm DDR5 compatibility by Intel for its newest processor that supports DDR5 for the first time is monumental," SK hynix said. "We will seek a fast turnaround in the semiconductor memory industry by actively responding to the growing server market through DDR5, which is already in mass production."

The validation of the company's 1anm DDR5 product, which adopts 1anm technology using the EUV lithography process, is for 4th Gen Intel Xeon Scalable processors, Intel's latest server CPU launched on January 10th. The 4th Gen Intel Xeon Scalable processor has been cited as a key to a turnaround in the industry, given that the launch of a next-generation server CPU requires server replacement and thus, results in a rapid increase in demand for high-performance memory chips. Experts predict that DDR5, expected to meet customers' such needs, will soon become the flagship product in the server DRAM market.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

Micron Technology, Inc., today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over previous generations, which is essential to fueling the rapid growth of cores in today's data center processors. Transitioning to DDR5 will help alleviate a potential bottleneck for years to come by providing higher bandwidth to unlock more computer power per processor. Micron DDR5, in combination with 4th Gen Intel Xeon Scalable processors, benefits a wide range of workloads including SPECjbb, which delivers up to 49% performance improvement on benchmarking for Critical-jOPS (Java operations per second) compared to previous generations. In addition to increased memory bandwidth and performance, Micron DDR5 memory is also designed to improve reliability across the data center with features such as on-die Error Correction Code (ODECC) and bounded faults. On-die ECC corrects single-bit errors and detects multi-bit errors.

"The deep collaboration we have established with Intel as a highly valued ecosystem partner, has allowed Micron to remain at the forefront of the industry transition to DDR5," said Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit. "This work has been pivotal in developing solutions that meet the complex needs and challenges of our data center customers as they convert massive amounts of data into insights."

Giga Computing is an industry leader in high-performance servers and workstations, today announced the next-generation of GIGABYTE servers and server motherboards for the new 4th Gen Intel Xeon Scalable processor to achieve efficient performance gains with built-in accelerators. The new processors have the most built-in accelerators of any processor on the market to help maximize performance efficiency for emerging workloads; and do so while boosting virtualization and AI performance. Generational improvements make this platform ideal for AI, cloud computing, advanced analytics, HPC, networking, and storage applications. For these markets, Giga Computing has announced fourteen new series that constitute seventy-eight configurations for customers to choose from. And all these new GIGABYTE products support the full portfolio of 4th Gen Intel Xeon Scalable processors, including those with high bandwidth memory (HBM) in the Intel Xeon Max Series.

Patriot Memory is, well, a PC memory company first, and it acts like one, by bring to CES its fastest DDR5 memory offerings. The new Patriot Viper Venom RGB/non-RGB is the company's new high-end enthusiast memory product, and comes with speeds ranging between DDR5-5200 to DDR5-7400, and capacities up to 64 GB. The Viper Xtreme 5 rules the pack with capacity ranging up to 32 GB, but speeds between DDR5-7600 and the top DDR5-8000. The Viper Elite 5 is a notch below the two, and comes in speed ranges between DDR5-5600 to DDR5-6000. Intel XMP 3.0 profiles enable the advertised speeds and the click of a button.

The Signature and Signature Premium lines of DDR5 memory come in speeds of up to DDR5-5600, and cover the company's mainstream lineup. The Signature Premium includes a heatspreader, the Signature doesn't. It's good to see Patriot continue to ship DDR4 kits to the crowd that's transitioning between the two memory standards. The new Viper 4 Blackout series features a retro-Patriot style that's reminiscent of the company's DDR2 days, comes in densities of up to 64 GB, and speeds of up to DDR4-4400.

Thermaltake's CES booth was lit up with a vibrant mix of illuminated enthusiast PC memory modules, from its ToughRAM D5 RGB series. The company is going beyond boring black and white heatspreader color options, and now has die-cast aluminium heatspreader in a number of colors, including gold, red, and turquoise. Even the usual black and white ones come with new printed patterns, under the ToughRAM D5 RGB XG series. The ToughRAM D5 RGB XG comes in speeds of up to DDR5-6600, and per-module capacity of up to 32 GB along with 16-diode RGB LED setup; whereas the regular ToughRAM D5 RGB ticks at speeds of up to DDR5-5600, up to 32 GB density, and a 6-diode LED setup diffused through a silicone band.

Last year it felt like DDR5-6000 to DDR5-6400 was the top of the PC memory food-chain, and in a year, this has been pushed up to DDR5-8000. Platforms such as the 13th Gen Core "Raptor Lake" can already handle such high memory speeds, and ADATA has designed such a memory module that includes an Intel XMP 3.0 profile that enables the advertised DDR5-8000 speed at the click of a button. The new ADATA XPG Caster RGB DDR5-8000 features a chunky aluminium heatspreader that's crowned by a silicone addressable RGB LED diffuser. It's been tested for compatibility with both Intel and AMD platforms, however only an XMP 3.0 profile is included.

Elsewhere across the ADATA booth, we also came across the company's latest SD 8.0 memory card that uses PCI-Express 3.0 x2 physical layer and NVMe 1.3 protocol layer, to offer sequential speeds of up to 1600 MB/s reads, with up to 1300 MB/s writes, including LDPC ECC. The card comes in 256 GB and 512 GB capacities, and is backwards-compatible with UHS-I devices. Back at the memory section, we found an XPG + ASUS ROG co-branded Lancer ROG DDR5 memory that comes at speeds of up to DDR5-6600. Lastly, there's the ACE-6400, a mid-range DDR5-6400 memory module targeting creators, that runs at DDR5-5600 native (JEDEC), and its advertised DDR5-6400 using an XMP 3.0 profile.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

SK hynix Inc. announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan. 5th through Jan. 8th. The products, introduced under the theme of the "Green Digital Solution," as part of the SK Group's "Carbon-Free Future" campaign, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt and performance. The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe interface.

KINGMAX, a world-renowned professional supplier of memory products, has introduced the latest "Horizon" series of DDR5-5200, DDR5-5600, and DDR5-6000 memory that fully supports both Intel's 13th Gen Raptor Lake and Z790 platform and AMD's Ryzen 7000 processors and 600-series motherboards. DDR5 Horizon also promises to make the most of the overclocking capacities of Intel XMP 3.0 and AMD EXPO, thereby bringing speed-hungry gamers, overclocking enthusiasts, and creators an utterly satisfying performance.

Made from choice chips and fully conforming to JEDEC criteria, KINGMAX's DDR5 Horizon comes in three frequencies: 5200 MHz, 5600 MHz, and 6000 MHz. With a CL36 latency and running at 1.25 V, it is available in single- or dual-channel versions with 8 GB/16 GB/32 GB capacities to cater to different consumer needs. Moreover, the QVL certification of a good number of leading motherboard manufacturers attests to its superior compatibility with brand-new PC platforms.

One of the world's leading PC components & peripheral manufacturers is proud to announce the grand launch of the DDR5-8000 16 GB x 2 CL38-48-48-90 1.45 V ultra-speed modules will be available in Q1, 2023. GeIL DDR5 lineup includes EVO V and Polaris RGB are tailor-made for hardcore gamers and hardware enthusiasts to deliver unparalleled performance and stability. In addition, GeIL Dyna 5 has created a comprehensive and efficient automated testing process for grading and sorting every DDR5 IC. As a result, GeIL ensures the bandwidth data transmission, compatibility, reliability, and integrity to meet all the demands of gamers and overclockers using Intel's latest platforms.

GeIL DDR5-8000 MHz series has passed the required burn-in tests using the latest ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots indicate those test results. GeIL is a brand committed to offering memory products with a wider range of overclocking potential to PC enthusiasts and gamers. The latest GeIL DDR5-8000 memory modules are built with the advanced PMIC (Power Management IC), which can effectively obtain and control a wider range of localized voltage adjustments. The PMIC is used to enhance the overall stability and performance of the memory module and can effectively unlock additional overclocking headroom.

As we're nearing the end of 2022, there is more news about layoffs and this time around it's Micron that is looking at laying off some 10 percent of its workforce. The company announced its FQ1 '23 earnings today, or fiscal quarter one 2023, since not all companies follow the standard year when it comes to financial reporting. Micron saw revenues of US$4,085 billion for the quarter, down from US$6,643 billion in the previous quarter and down from US$7,687 billion the same quarter a year ago. However, the company made a net loss of US$195 million.

Micron's CEO Sanjay Mehrotra stated "Micron's strong technology, manufacturing and financial position put us on solid footing to navigate the near-term environment, and we are taking decisive actions to cut our supply and expenses. We expect improving customer inventories to enable higher revenue in the fiscal second half, and to deliver strong profitability once we get past this downturn." These decisive actions include cutting 10 percent of its workforce according to Reuters, although this won't take place until sometime in 2023. Micron is also planning a cut in its CAPEX plans for its fiscal 2024, i.e. the company won't be investing as heavily as planned in new fabs, despite being granted money to do so by the US government.

ADATA, the world's leading memory module brand and XPG, their performance and gaming arm, today announced that they will be attending the CES 2023, where they will showcase a number of new products with the theme "Make it Fusion, Make it Xtreme!" The feature product to be displayed will be the XPG FUSION 1600 W Titanium power supply developed in collaboration with Delta Electronics. Other impressive power supplies also equipped with the latest ATX 3.0 and PCIe 5.0, such as the XPG CYBERCORE II and CORE REACTOR II series will be shown as well.

ADATA will also present impressive offerings in other categories, such as the XPG PCIe Gen5 SSD which offers a patented heat dissipation design, up to 8 TB of storage space, and read/write speed of up to 14,000 MB/s. Additionally, ADATA will present other award-winning memory and storage products, as well as gaming focused products in system, chassis, special themed pc build and peripherals categories.

Netac, a Chinese maker of memory and storage devices, has developed DDR5 memory modules with impressive speeds. The company has used SK Hynix A-type dies to create DDR5 memory with up to 8000 MT/s rates. With incredible speeds comes significant latency, whereas the DDR5-8000 memory kit comes with a CAS latency of 38-48-48-128. Netac has determined that these DRAM modules require as much as 1.5 Volts to power it. The base kit starts at 6000 MT/s, with 6200/6600/7200/7600 and 8000 MT/s variations mentioned above. Available in silver and black, these memory modules are equipped with an ARGB strip at the top that works with every RGB control software of motherboard makers.

You can check out the images and specification table below.

Team Group's creator series T-CREATE launches three DDR5 memory products: T-CREATE EXPERT DDR5 Desktop Memory, T-CREATE CLASSIC DDR5 Desktop Memory, and T-CREATE CLASSIC DDR5 Laptop Memory, comprehensively tailored for creators' demands. Equipped with a variety of frequency specifications from 5,200 to 6,400 MHz and a maximum storage capacity of 32 GB per module, the newly launched products offer a smooth experience for creators working on 4K/8K ultra-high-resolution video editing, professional 3D illustration software and system, as well as multitasking on their desktop computers and laptops.

Specifically built for heavy and complicated processing needs, T-CREATE EXPERT DDR5 Desktop Memory comes in ultra-high frequency options of 6,400 MHz and 6,000 MHz. Paired with low latency specifications, it features unprecedentedly exceptional performance and robust stability to fully support the complex operations and computing demands in professional 3D rendering and long-form super-high resolution video editing. Creators can ensure authenticity and optimal quality in each frame.

Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

The next-generation GDDR7 memory standard is shaping up nicely, to double bandwidth and density over the current GDDR6. In a company presentation detailing upcoming memory technologies, Samsung revealed that GDDR7 uses PAM3 signalling. While ones and zeroes are stored in DRAM memory cells, it is transmitted between devices (such as the DRAM chip and the GPU) in electrical waveforms known as "signals." Ones and zeroes are interpreted by patterns in the signal waveform.

Conventional GDDR6 memory uses NRZ (non-return to zero) or PAM2 signalling to achieve data-rates starting from 14 Gbps, with 24 Gbps expected to be the fastest production GDDR6 memory speed on offer, however some of the faster GDDR6 speeds such as 18 Gbps, 20 Gbps, and 22 Gbps couldn't hit production soon enough for the development phase of the GeForce RTX 30-series "Ampere" GPU, and so NVIDIA and Micron Technology co-developed the GDDR6X standard leveraging PAM4 signalling, to offer speeds ranging between 18 Gbps to 23 Gbps (or higher) several quarters ahead of this faster JEDEC-standard GDDR6.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

Eliyan's NuLink PHY and NuGear technologies address the critical need for a commercially viable approach to enabling high performance and cost-effectiveness in the connection of homogeneous and heterogenous architectures on a standard, organic chip substrate. It has proven to achieve similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the other drawbacks of specialized approaches.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

Kioxia Corporation, the world leader in memory solutions, has developed an image classification system based on Memory-Centric AI, an AI technology that utilizes high-capacity storage. The system classifies images using a neural network that refers to knowledge stored in external high-capacity storage; this avoids "catastrophic forgetting," one of the major challenges of neural networks, and allows knowledge to be added or updated without the loss of current knowledge. This technology was presented on October 25 at the oral session of European Conference on Computer Vision 2022 (ECCV 2022) in Tel Aviv, one of the top conferences in the field of computer vision.

In conventional AI techniques, neural networks are trained to acquire knowledge by updating parameters called "weights." Once fully trained, in order to acquire new knowledge a neural network must be either re-trained from the beginning or fine-tuned with new data. The former requires huge amounts of time and consumes significant energy costs, while the latter requires parameters to be updated and faces the catastrophic forgetting problem of losing the knowledge acquired in the past which leads to deterioration of classification accuracy.