The Korea Intellectual Property Rights Information Service (KIPRIS) has been processing a bunch of trademark applications in recent weeks, submitted by Samsung Electronics Corporation. News outlets pointed out, earlier on this month, that the South Korean multinational manufacturing conglomerate was attempting to secure the term "Snowbolt" as a moniker for an unreleased HBM3P DRAM-based product. Industry insiders and Samsung representatives have indicated that high bandwidth memory (5 TB/s bandwidth speeds per stack) will be featured in upcoming cloud servers, high-performance and AI computing - slated for release later on in 2023.

A Samsung-focused news outlet, SamMobile, has reported (on May 15) of further trademark applications for next generation DRAM (Dynamic Random Access Memory) products. Samsung has filed for two additional monikers - "Shinebolt" and "Flamebolt" - details published online show that these products share the same "designated goods" descriptors with the preceding "Snowbolt" registration: "DRAM modules with high bandwidth for use in high-performance computing equipment, artificial intelligence, and supercomputing equipment" and "DRAM with high bandwidth for use in graphic cards." Kye Hyun Kyung, CEO of Samsung Semiconductor, has been talking up his company's ambitions of competing with rival TSMC in providing cutting edge component technology, especially in the field of AI computing. It is too early to determine whether these "-bolt" DRAM products will be part of that competitive move, but it is good to know that speedier memory is on the way - future generation GPUs are set to benefit.