Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

Intel introduced the Z790 platform to the market last year and impressed enthusiastic gamers. This year, we expect the introduction of the latest B760 platform. MSI's new B760 motherboards lineup will spring a surprise for mainstream users, attracting interest and sparking widespread discussion. Targeting the mainstream market, MSI B760 motherboards have unique designs and loaded specifications. Let's explore more about the B760 platform.

The B760 platform has lots of amazing features accompanied by MSI's MPG, MAG, and PRO Series. The mainstream users' choice - MAG Series includes black TOMAHAWK and white MORTAR motherboards. The MSI MAG Series motherboards adopted 12 Duet Rail Power System with 75 A DrMOS and 6 layer PCB with 2oz thickened copper, which provides stable currents delivered to the CPU. For expansion, the MSI MAG Series supports Lightning Gen 5 PCIe and owns up to 3 onboard M.2 Gen4 slots. To deal with the heat generated in high-loading operation, the MAG Series features premium thermal solutions including All Aluminium Design and Extended Heatsink. The M.2 slots are covered with M.2 Shield Frozr as well.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

Intel today debuted its 2023 N-series entry-level mobile processors targeting a range of low-cost notebook applications, such as educational notebooks for bulk purchase and distribution by public schools. These processors are built on the same Intel 7 (10 nm Enhanced SuperFin) node as the 13th Gen Core processors, but come with just "Gracemont" E-cores, and no P-cores.

The silicon physically features two "Gracemont" E-core clusters amounting to 8 E-cores, 6 MB of shared L3 cache, and an iGPU based on the Xe-LP graphics architecture, with 32 EUs (execution units). The silicon also features a GNI 3.0 for basic AI acceleration using a truncated version of the DLBoost instruction set, and an IPU (as in image processing unit), which can improve web-camera experience (on the fly background noise suppression). The iGPU also offers hardware-accelerated AV1 decoding. On the platform-side, the processor features a single-channel DDR5 memory interface that's backwards-compatible with DDR4, and also supports LPDDR5. Storage interfaces include eMMC, UFS 2.1, and NVMe SSD. Wireless networking options available with the platform include fast WiFi 6E and Bluetooth 5.2.

MSI is announcing the launch of our new Gen4 PCIe NVMe models to its SSD category - SPATIUM M461, M452 & M453 in M.2 2280 form factors that can be easily installed into compatible desktop motherboards and laptops. These new products allow MSI to continue to refine its identity as a high-performance PC brand and grow its product ecosystem by expanding SPATIUM, our high-performance storage category. Our SSDs are built with high-quality, high-density 3D NAND flash that delivers astonishing performance and endurance for professionals, content creators, and gamers.

SPATIUM M461, The Competitive PCIe 4.0 SSD for Mainstream Segment.
SPATIUM M461 was developed to meet the expectations of mainstream SSD consumers. Blazing fast speeds up to 5000 MB/sec sequential read and 4200 MB/sec sequential write speeds allow users using the latest generation of PCs to enjoy the capabilities of the PCIe Gen4 interface. Available storage capacities are 500 GB, 1 TB, 2 TB, and 4 TB.

Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing an expanded product line with exciting new ARM-based series of servers as part of the MegaDC family. Using Ampere Altra and Ampere Altra Max processors, the Mt. Hamilton platform leverages a single unified motherboard design, targeting cloud-native applications, such as Cloud Gaming, Video-on-Demand, CDN, IaaS, Database, Object-Storage, dense VDI, and Telco Edge (Distributed Unit and Centralized Unit) solutions. In addition, the new servers address several objectives for cloud-native workloads, specifically delivering high performance per watt while executing scalable workloads and those that require very low latency responses.

"Supermicro continues to bolster our product line by introducing ARM-based servers, using the Ampere Altra and Altra Max CPUs," said Ivan Tay, SVP of Product Management, Supermicro. "Expanding our already broad server product line gives customers even more choices for their specific workloads. We can quickly offer optimized application servers for customers worldwide using our Building Block Solutions approach."

TECNO, a global innovative technology brand with operations in over 70 markets, recently announced the latest MEGABOOK S1 at TECNO Flagship Product Launch 2022 in Dubai, delivering its first flagship laptop to users.

In 2019, TECNO announced new efforts in building a digital product ecosystem by launching its AIoT business strategy, aiming to deliver digital to every person, home, and organization and help them create a fully- connected smart digital lifestyle. Following this vision, as the upgraded line of MEGABOOK T1, the flagship MEGABOOK S1 highlights the concept of ideas that create wonders, targeting users in professional fields like business and the creative industries, helping them work with ease while still achieving a higher efficiency.

For those looking at upgrading—or adding an SSD—to their Steam Deck, there's now a new option from Sabrent. The company has launched an M.2 2230 sized version of its Rocket SSD that will be available in sizes of 256 GB, 512 GB and 1 TB. As one would expect, due to the form factor, we're looking at DRAM-less drives. Sabrent has gone with Phison's E21T controller and it has been paired with Micron's B47R, 176-layer NAND.

In other words, we're not talking about a high-performance drive here, but that might be a good thing as well, since it'll produce less heat, which should prevent drive throttling in the tiny space available inside the Steam Deck. Sabrent rates the drives as having a sequential read speed of up to 5,000 MB/s and a sequential write speed of up to 4,300 MB/s. The read IOPS are rated at up to 450K, with the write IOPS at up to 920K, which once again varies between the drive sizes. The 512 GB drive appears to have the overall best performance. The drives are rated for 200, 300 and 600 TBW and come with a five year warranty. No pricing has been revealed so far.

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

Here's one of the first pictures of a mechanical HDD with NVMe interface. Seagate is apparently in production of an Exos-series Enterprise HDD featuring U.2 NVMe interface where one would expect SAS 12 Gbps. We seriously doubt if the HDD is fast enough to take advantage of U.2 NVMe (at least 32 Gbps per direction), but the move to NVMe probably has to do with the decline of older interface standards such as SAS 12 Gbps and SATA 6 Gbps in the enterprise space for cold-storage, and that future generations of rackmount DAS and NAS enclosures could increasingly feature U.2 backplanes, phasing out SAS and SATA. This is like when optical drives switched over to SATA despite not needing the bandwidth SATA had to offer (optical discs barely move a few dozen MB/s, for which even ATA33 IDE was sufficient). We don't know how the Seagate Exos drive handles NVMe internally—whether there is a new native NVMe controller, or whether this is really just a SAS 12 Gbps drive with a PCIe-to-SAS bridge chip.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products, announces that it is now offering a new class of high performance, power efficient, data center solid state disk drives (SSDs) beginning with the DC4800 PCIe Gen 4 family. SMART's DC4800 devices are designed with a specialized hardware-accelerated SSD controller that draws less power without compromising storage input/output (I/O) performance. Zero-induced throttling allows these SSDs to perform better under continued duress, even when they are pushed to their performance limit. This translates to significant power consumption improvement per server, as well as consistent latency performance of up to 7-nines or 99.99999% of the time.

"Today's leading-edge servers are not only expected to manage a significant mass of transactions to enable processes like machine learning, artificial intelligence, and the internet of things, but they are also expected to be more power efficient," said Andy Mills, data center architect for SMART. "Data centers are increasingly challenged by performance and energy demands as they expand to address these new workloads that process data from an ever-growing array of intelligent devices at the edge."

Team Group, the global leader in industrial memory modules, launches the brand's first industrial grade PCIe Gen4x4 M.2 2280 SSD, P845-M80. With the adoption of the ultra-fast Gen 4 x4 interface, it delivers an exceptional reading/writing performance for a large data amount. Equipped with BiCS 5 112-layer 3D NAND flash memory, it is a highly cost-competitive solution that accelerates the development of biomedical innovation and digital medicine applications. P845-M80 comes in a maximum capacity of 2 TB and meets the NVMe 2.0 standards. Its bandwidth and data transmission speed are twice that of its predecessor PCIe Gen3, making it even more ideal for the transmission of large amounts of data. Meanwhile, its 3K P/E cycles make it the best memory solution in both performance and durability.

In the wake of the global pandemic, science and digital medicine is rapidly on the rise in innovative biomedical fields. In response to the significant increase in the demand for high-performance image processing and stable storage, Team Group introduces the PCIe Gen 4 x4 industrial grade SSD with the adoption of an 8-channel controller and optional patented graphene and aluminium fin heat dissipation technologies. It effectively reduces the thermal energy generated from high-speed reading and writing and maintains system stability. The patented graphene heat dissipation technology (US invention patent number: US 110,513,92 B2 / Taiwan invention patent number: I703921) features a small volume and agility in application, suitable for machines of smaller sizes. Whereas, the patented aluminium fin heat dissipation technology (Taiwan utility model patent number: M541645) enables maximum heat dissipation and prolongs product service life. Both technologies are novel options for biomedical innovators, offering stability, high speed, and low latency.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products announces that it is now offering a new class of high performance, power efficient, data center solid state disk drives (SSDs) beginning with the DC4800 PCIe Gen 4 family.

SMART's DC4800 devices are designed with a specialized hardware-accelerated SSD controller that draws less power without compromising storage input/output (I/O) performance. Zero-induced throttling allows these SSDs to perform better under continued duress, even when they are pushed to their performance limit. This translates to significant power consumption improvement per server, as well as consistent latency performance of up to 7-nines or 99.99999% of the time.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance products, providing the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.

It can be widely used in harsh industrial environments, and provide stable computing performance, which can be deployed in industries ranging from the most edge computing to various Embedded platforms such as machine control and multimedia retail and the high-performance edge computing application products are the core of digital transformation, and how to continuously strengthen their capabilities has become more and more important. Power consumption is intended to realize energy-saving and carbon-reducing applications of various edge high-performance computing, and actively deploy in multiple application fields such as autonomous mobile robots (AMR).

Synology today announced the new 4-bay Synology DiskStation DS923+, the latest in its Plus line of all-in-one storage devices for home office and small business users. Powered by the versatile Synology DiskStation Manager (DSM) operating system, the DS923+ delivers comprehensive solutions to protect and manage business data, easily collaborate on documents, access files remotely, and monitor physical assets, all within a compact desktop format. It offers consistent performance out of the box, with the option to easily upgrade networking and further boost data transfer speeds through network cards.

"The DS923+ provides users with impressive performance and capability for its size," said Michael Wang, Product Manager at Synology. "With the ability to easily scale the storage and networking, it adapts as your needs grow."

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, introduced new QM2 PCIe Gen 3 expansion cards: the QM2-2P-344A and QM2-2P-384A. QM2 cards can be installed in compatible QNAP NAS or Windows /Linux PCs/workstations to add M.2 NVMe SSD slots (M.2 SSD sold separately) for boosting system performance and increasing storage capacity.

"The QM2-2P-344A and QM2-2P-384A are a budget-friendly expansion solution for both QNAP NAS and PC/workstations, providing flexible M.2 NVMe SSD configuration with easy-to-use tool-free installation," said Andy Chuang, Product Manager of QNAP, adding "Compared with SATA-based SSDs, the QM2's PCIe interface provides higher bandwidth to deliver faster transfer speed and data access."

KLEVV, an emerging memory brand introduced by Essencore, is excited to announce three new consumer-grade M.2 NVMe SSDs, the CRAS C930, C910, and C730. The new CRAS M.2 NVMe SSD lineup aims to serve a wide range of users, enabling entry-level to top-tier enthusiasts with industry-leading storage technology. Both CRAS 930 and C910 come with an optional add-on heatsink for users to maximize their freedom in the setup.

With an impressive 1500 TBW endurance lifecycle and a significant emphasis on DRAM cache buffer, the CRAS C930 is built to withstand harsh workloads. Utilizing the latest PCIe Gen4 x4 interface supported by NVMe 1.4, it delivers break-neck sequential read/write speed of up to 7400/6800 MB/s at 2 TB max capacity and 4K random read/write up to 1000K IOPS. Exceptional engineering and design elements make the CRAS C930 the crown jewel of KLEVV's new M.2 NVMe SSD lineup, capable of running on PCs, Laptops, and even PS5 consoles. Additionally, the flat fin heatsink addon is a great inclusion with up to 20% temperature reduction, giving users complete flexibility in their choice.

Netac over the weekend released the NV5000-t, an M.2 NVMe SSD that takes advantage of the PCI-Express 4.0 x4 host interface, offering mid-range performance. Available in 500 GB and 1 TB capacities, the drive uses an unspecified type of 3D NAND flash memory, and a DRAMless controller design. On offer, are sequential transfer rates of up to 4800 MB/s reads, with up to 4600 MB/s writes for the 1 TB variant. The 500 GB variant writes sequentially at speeds of up to 2700 MB/s, but with the same up to 4800 MB/s reads. The 1 TB variant offers endurance of 640 TBW, while the 500 GB variant does 320 TBW. Both models are backed by 5-year warranties. The company didn't reveal pricing.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of Kingston FURY Renegade SSD with Heatsink, its second-generation PCIe 4.0 NVMe M.2 drive for console and PC gamers. Kingston FURY Renegade SSD with Heatsink maintains speed and temperature while delivering cutting-edge performance in high capacities using the latest Gen 4x4 controller.

By maximizing the available bandwidth of PCIe 4.0, Kingston FURY Renegade SSDs achieve speeds up to 7,300/7,000 MB/s read/write and up to 1,000,000 IOPS to deliver amazing consistency for an exceptional gaming experience. The drives are optimized to reduce game and application load times, stream and capture with ease and give your system an overall boost in responsiveness. Available in high capacities up to 4 TB, users can store an extensive library of their favorite games and media and still have space for the latest titles. Kingston FURY Renegade SSD offer two options for users both with formidable speeds and massive capacities:

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced significant milestones in 2022 that were highlighted by key partnerships, product innovations and advancements, and overall technology leadership.

"Despite market challenges, Phison is proud to have successfully navigated 2022 with strong innovation and technology leadership, two hallmarks of our company," said K.S. Pua, Phison CEO. "As a forward-thinking company, we cannot wait to bring more SSD customizations, innovations, and solutions to our partners, and customers next year."

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its portfolio of products ready to support the new AMD EPYC 9004 Series Processors in the first wave of GIGABYTE solutions that will target a wide range of demanding workloads that include GPU-centric, high-density, edge, and general computing. A new x86 platform, a new socket, and a wealth of highly performant technologies provided new opportunities for GIGABYTE to tailor products for leading data centers. So far, GIGABYTE has released twenty-two new servers and motherboards to support the new AMD "Zen 4" architecture. Both single-socket and dual-socket options are available to handle big data and digital transformation. The ongoing collaboration between GIGABYTE and AMD has allowed for a comprehensive portfolio of computing solutions that are ready for the market.

The new 4th Gen AMD EPYC processors feature substantial compute performance and scalability by combing high core counts with impressive PCIe and memory throughput. In terms of out of the box performance, AMD estimates found that 4th Gen AMD EPYC CPUs are the highest performing server processors in the worldi. With the advancement to 5 nm technology and other performant innovations, the new AMD EPYC 9004 series processors move to a new SP5 socket. The new architecture leads the way to faster data insights with high performance and built-in security features, and this platform targets HPC, AI, cloud, big data, and general enterprise IT.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.