At the annual Hot Chips conference, IBM (NYSE: IBM) today unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time. Telum is IBM's first processor that contains on-chip acceleration for AI inferencing while a transaction is taking place. Three years in development, the breakthrough of this new on-chip hardware acceleration is designed to help customers achieve business insights at scale across banking, finance, trading, insurance applications and customer interactions. A Telum-based system is planned for the first half of 2022.

Today, businesses typically apply detection techniques to catch fraud after it occurs, a process that can be time consuming and compute-intensive due to the limitations of today's technology, particularly when fraud analysis and detection is conducted far away from mission critical transactions and data. Due to latency requirements, complex fraud detection often cannot be completed in real-time - meaning a bad actor could have already successfully purchased goods with a stolen credit card before the retailer is aware fraud has taken place.

The first desktop processors to implement AMD's "Zen 4" microarchitecture will feature integrated graphics as standard across the lineup, according to a Chips and Cheese report citing leaked AMD design documents. Currently, most of the Socket AM4 desktop processor lineup lacks integrated graphics, and specialized "G" SKUs with integrated graphics dot it. These SKUs almost always come with compromises in CPU performance or PCIe I/O. With its 5 nm "Raphael" Socket AM5 desktop processor, AMD is planning to change this, in a bid to match up to Intel on the universality of integrated graphics.

Built in the 5 nm silicon fabrication process, the "Raphael" silicon combines "Zen 4" CPU cores along with an iGPU based on the RDNA2 graphics architecture. This would be the first time AMD updated the SIMD architecture of its Ryzen iGPUs since 2017. The RDNA2-based iGPU will come with a more advanced DCN (Display CoreNext) component than current RDNA2-based discrete GPUs, with some SKUs even featuring DisplayPort 2.0 support, besides HDMI 2.1. By the time "Raphael" is out (2022-23), it is expected that USB4 type-C would gain popularity, and mainstream motherboards as well as pre-built desktops could ship with USB4 with DisplayPort 2.0 passthrough. AMD relies on a discrete USB4 controller with PCI-Express 4.0 x4 wiring, for its first Socket AM5 platform.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, has released the latest BIOS that support AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics and AMD Ryzen 5000 Series Desktop Processors with PRO Technologies.

AMD Ryzen 5000 G-Series Desktop Processors with Radeon Graphics are the newest generation processors come with industry-leading 7nm technology, elevating processing performance to the next level. And now, ASRock 500-Series, B450 AMD Ryzen motherboards and X300 Mini PC are able to support both of them by updating the latest BIOS.

AMD is slowly preparing to launch its next-generation processors based on the new AM5 socket. The new lineup of processors will be based on the upgraded Zen 4 architecture that is said to bring multiple microarchitecture improvements and enhancements, equaling to a possible high-performance increase. Today, according to ExecutableFix, the person who provided us with renders of AMD's upcoming AM5 socket designed for next-generation Raphael processors. As we previously reported, AM5 is doing away from PGA and switching to LGA type instead, where pins are delivered on the socket, not the CPU like we used to see with AMD processors.

The LGA-1718 socket, pictured in the renders below, looks like a simple retention mechanism, where there is one metal arm to hold the lid down under pressure. If it turns out to be true, this implementation will be a very positive upgrade over the past PGA socket found on AM4 and before. We can look forward to seeing what AMD will deliver once the launch of Raphael processors gets closer.

Qualcomm is trying to get into the PC space with their mobile Snapdragon chips, which offer great battery and decent performance. However, so far only Apple managed to get the right formula for developing custom low-power, high-performance chips. It is exactly Apple's M1 processor in question that Qualcomm intends to mimic. According to the recent interview with Qualcomm's new CEO Cristiano Amon, we are informed that Qualcomm plans to produce laptop chips that would directly compete with Apple's. That means that, despite the ecosystem differences of Apple M1 (macOS) and Qualcomm Snapdragon (Windows-on-Arm), the company wants to deliver equal if not better performance and great battery life.

With the recent acquisition of Nuvia, Qualcomm has a team of very talented engineers to back up its claims. The company also recently hired some of the developers behind Apple's M1 chip. The company notes that it will be using only the best solutions for its upcoming SoC, which will include a 5G modem. Mr. Amon has also noted the following:

We needed to have the leading performance for a battery-powered device. If Arm, which we've had a relationship with for years, eventually develops a CPU that's better than what we can build ourselves, then we always have the option to license from Arm.

Armed with up to 8 "Golden Cove" high-performance CPU cores and up to 8 "Gracemont" low-power cores in a hybrid x86 processor setup, the "Alder Lake" silicon enables Intel to carve out some interesting SKUs in the mobile space, by creating numerous combinations of the big and small CPU core counts, and more importantly, by adjusting the ratio of big cores to small ones. The two core types operate at significantly different performance/Watt bands, which allows Intel to target the various TDP-defined mobile processor SKU categories with just the right big:small core ratios, as revealed by a leaked "Alder Lake" mobile SKU roadmap, leaked to the web by HXL.

Intel is looking to spread the silicon across six mobile segments defined by TDP—the 5 W tablet/handheld; the 9 W ultra-thin, the 15 W mainstream tablet/laptop, the 28 W performance tablet/laptop, the 35-45 W thin enthusiast laptop, and the 45-55 W "muscle" laptop. With Intel recently announcing the discontinuation of its 1+4 (big+small) core "Lakefield" hybrid processor, its mantle in the 5 W segment will be picked up by "Alder Lake-M5," with 1 "Golden Cove" and 4 "Gracemont" cores. There will be two product tiers segmented by iGPU execution units (EUs), one with 48 EU, and the other with 64.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready, which can pass the upgraded Windows 11 OS. verification.

Windows 11 is the latest operating system from Microsoft, and features dozens of exciting new functions and Android APP support to effectively improve productivity, system security, and gaming performance. However, most of the users might be confusing that Windows 11 requires TPM 2.0 support means they need a TPM module on board for Windows 11 upgrade.

EVGA Corporation, or simply EVGA as it is known in the community, is the maker of various PC components and peripherals. As many of you are aware, EVGA has historically been focused on making products based on silicon coming from NVIDIA and Intel. The company has used NVIDIA products exclusively for its GPU portfolio and used Intel chipsets for its motherboard solutions. In the past, EVGA made motherboards for AMD processors, however, these boards used NVIDIA's chipset so they weren't technically full AMD motherboards. Starting today, that is about to change as we got some very juicy teasers from EVGA. In the nine-second video teaser on YouTube titled "A new Darkness is coming...", EVGA showcased a simple animation showing the AMD Ryzen logo surrounding EVGA's.

And of course, that only means one thing. EVGA will officially be joining the ecosystem of AMD and offering motherboards for their Ryzen processors. While the company is "one of the top NVIDIA authorized partners" in GPUs, on the CPU front it is officially joining Team Red and marking an important milestone for everyone. It is still not clear what kind of motherboard we will be getting, however, we can expect to see EVGA's best engineering applied in the form of a possible X570 Dark motherboard.Below, you can see the video teaser.

At the 2021 International Supercomputing Conference (ISC) Intel is showcasing how the company is extending its lead in high performance computing (HPC) with a range of technology disclosures, partnerships and customer adoptions. Intel processors are the most widely deployed compute architecture in the world's supercomputers, enabling global medical discoveries and scientific breakthroughs. Intel is announcing advances in its Xeon processor for HPC and AI as well as innovations in memory, software, exascale-class storage, and networking technologies for a range of HPC use cases.

"To maximize HPC performance we must leverage all the computer resources and technology advancements available to us," said Trish Damkroger, vice president and general manager of High Performance Computing at Intel. "Intel is the driving force behind the industry's move toward exascale computing, and the advancements we're delivering with our CPUs, XPUs, oneAPI Toolkits, exascale-class DAOS storage, and high-speed networking are pushing us closer toward that realization."

SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced launched the new SiFive Performance family of processors. The SiFive Performance family debuts with two new processor cores, the P270, SiFive's first Linux capable processor with full support for the RISC-V vector extension v1.0 rc, and the SiFive Performance P550 core, SiFive's highest performance processor to date. The new SiFive Performance P550 delivers a SPECInt 2006 score of 8.65/GHz, making it the highest performance RISC-V processor available today, and comparable to existing proprietary solutions in the application processor space.

"SiFive Performance is a significant milestone in our commitment to deliver a complete, scalable portfolio of RISC-V cores to customers in all markets who are at the vanguard of SOC design and are dissatisfied with the status quo," said Dr. Yunsup Lee, Co-Founder and CTO of SiFive. "These two new products cover new performance points and a wide range of application areas, from efficient vector processors that easily displace yesterday's SIMD architectures, to the bleeding edge that the P550 represents. SiFive is proud to set the standard for RISC-V processing and is ready to deliver these products to customers today."

Thanks to the information coming from Yuuki_Ans, a person which has been leaking information about Intel's upcoming 4th generation Xeon Scalable processors codenamed Sapphire Rapids, we have the first die shots of the Sapphire Rapids processor and its delidded internals to look at. After performing the delidding process and sanding down the metal layers of the dies, the leaker has been able to take a few pictures of the dies present on the processor. As the Sapphire Rapids processor uses multi-chip modules (MCM) approach to building CPUs, the design is supposed to provide better yields for Intel and give the 10 nm dies better usability if defects happen.

In the die shots, we see that there are four dies side by side, with each die featuring 15 cores. That would amount to 60 cores present in the system, however, not all of the 60 cores are enabled. The top SKU is supposed to feature 56 cores, meaning that there would be at least four cores disabled across the configuration. This gives Intel flexibility to deliver plenty of processors, whatever the yields look like. The leaked CPU is an early engineering sample design with a low frequency of 1.3 GHz, which should improve in the final design. Notably, as Sapphire Rapids has SKUs that use in-package HBM2E memory, we don't know if the die configuration will look different from the one pictured down below.

AMD is innovating its own x86 hybrid processor technology formulated along the Arm big.LITTLE hybrid CPU core topology that inspired Hybrid processors by Intel. Under this, the processor has two kinds of CPU cores with very different performance/Watt bands—one kind focuses on performance and remains dormant under mild processing loads; while the other hand handles most lightweight processing loads that don't require powerful cores. This is easier said than done, as the two kinds of cores feature significantly different CPU core microarchitectures, and instruction sets.

AMD has filed a patent describing a method for processing workloads to be switched between the two CPU core types, on the fly. Unlike homogenous CPU core designs where workload from one core is seamlessly picked up by another over a victim cache like the L3, there is some logic involved in handover between the two core types. According to the patent application, in an AMD hybrid processor, the two CPU core types are interfaced over the processor's main switching fabric, and not a victim cache, much in the same way as the CPU cores and integrated GPU are separated in current-gen AMD APUs.

Today, we have talked about AMD's upcoming Raphael lineup of processors in the article you can find here. However, it seems like the number of leaks on AMD's plans just keeps getting greater. Thanks to the "itacg" on Weibo, we have learned that AMD's Ryzen 8000 desktop series of processors are reportedly codenamed as Granite Ridge. This new codename denotes the Zen 5 based processors, manufactured on TSMC's 3 nm (N3) node. Another piece of information is that AMD's Ryzen 8000 series APUs are allegedly called Strix Point, and they also use the 3 nm technology, along with a combination of Zen 5 and Zen 4 core design IPs. We are not sure how this exactly works out, so we have to wait to find out more.

Intel is preparing its 12th Gen Core "Alder Lake" processors to target not just desktop, but also notebook. The "Alder Lake-P" mobile processor will be Intel's second to implement a hybrid CPU core design (after "Lakefield"). Coelacanth Dream revealed the power level (PL) values of the three key variants of the "Alder Lake-P" silicon. Intel will create broadly three categories of mobile chips targeting specific notebook form-factors—15 W, 28 W, and 45 W. The "Alder Lake-U" 15 W chips are expected to have a PL1 value (interchangeable with the TDP marked on the tin), of 15 W, but its PL2 value, which enables the highest Turbo frequency, can be as high as 55 W.

The next category, the "Alder Lake-U" 28 W chips, have a PL2 value of 64 W. Lastly, the "Alder Lake-H" 45 W chip, which will go into notebooks of conventional thickness, is expected to have a PL2 value of a scorching 115 W. Unless we're mistaken, "Alder Lake-P" is a hybrid processor with up to 6 "Golden Cove" performance CPU cores, and up to 8 "Gracemont" low-power cores. The performance cores feature HyperThreading, and are AVX-512 capable. Unlike the desktop "Alder Lake-S," Intel is investing in a larger iGPU. Based on the Gen12 Xe LP graphics architecture, the iGPU of the "Alder Lake-P" could feature 96 execution units, compared to just 48 on the "Alder Lake-S."

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

AMD is reportedly preparing to launch a B2 stepping of their Ryzen 5000 series of processors, codenamed Vermeer. Thanks to the findings of Patrick Schur, who was lucky to get ahold of AMD's processor codes, we have information that AMD is slowly preparing a B2 stepping of Vermeer processors, to come as a refresh. First off is the alleged Ryzen 9 5950XT 16 core, 32 threaded models which are supposed to feature a base speed of 3.4 GHz, and a boost frequency of 5.0 GHz, entering the 5 GHz world. Another B2 stepping that we know about is an alleged Ryzen 5 5600XT 6 core, 12 threaded design. This one features the same frequencies as its Ryzen 5 5600X variant, meaning 3.7 GHz base, and 4.6 GHz boost frequencies.

Of course, all this information should be taken with a big grain of salt, as we don't know what AMD is planning to do, or how the company plans to manifest any new product launch.

AMD processors have been very good at the field of security, on par with its main competitor, Intel. However, from time to time, researchers find new ways of exploiting a security layer and making it vulnerable to all kinds of attacks. Today, we have information that two new research papers are being published at this year's 15th IEEE Workshop on Offensive Technologies (WOOT'21) happening on May 27th. Both papers are impacting AMD processor security, specifically, they show how AMD's Secure Encrypted Virtualization (SEV) is compromised. Researchers from the Technical University of Munich and the University of Lübeck are going to present their papers on CVE-2020-12967 and CVE-2021-26311, respectfully.

While we do not know exact details of these vulnerabilities until papers are presented, we know exactly which processors are affected. As SEV is an enterprise feature, AMD's EPYC lineup is the main target of these two new exploits. AMD says that affected processors are all of the EPYC embedded CPUs and the first, second, and third generation of regular EPYC processors. For third-generation EPYC CPUs, AMD has provided mitigation in SEV-SNP, which can be enabled. For prior generations, the solution is to follow best security practices and try to avoid an exploit.

Apple's M1 custom processor has been widely adopted among the developer community. However, it is exactly this part of the M1 customer base that wants something different. For months, various developers have been helping with the adoption of the M1 processor for the Linux Kernel, which has today received preliminary support for the processor. The latest 5.13-RC1 release of the Linux Kernel is out, and it adds some basic functionality for the M1 processor. For now, it is some basic stuff like a simple bring up, however, much more has to be added. For example, the GPU support is still not done. Not even half-done. The M1 SoC is now able to boot, however, it takes a lot more work to get the full SoC working correctly.

Mr. Linus Torvalds, the Linux kernel developer, and its creator highlights that "This was - as expected - a fairly big merge window, but things seem to have proceeded fairly smoothly. Famous last words." According to one of the main activists for Linux on M1, Mr. Hector Martin, "This is just basic bring-up, but it lays a solid foundation and is probably the most challenging up-streaming step we'll have to do, at least until the GPU stuff is done." So it is still a long way before the M1 processor takes a full Linux kernel for a spin and the software becomes usable.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

AAEON, an industry leader of AI and IOT solutions, is excited to celebrate the launch of Intel's latest scalable platform, the 3rd Generation Intel Xeon Scalable Processors (formerly Ice Lake-SP). As an associate member of the Intel IoT Solutions Alliance, AAEON is excited to bring this new technology to market with the ARES-WHI0 industrial ATX server board and other future products.

The 3rd Generation Intel Xeon Scalable Processors deliver the next generation of high-end computing performance and support for vital data integrity and security technologies. This new generation of Xeon SP brings higher processing speeds and Intel's Deep Learning Boost technology, allowing for greater acceleration and more efficient processing for AI server applications.

Apple's M1 processors are a big success. When Apple introduced the M1 processors in the MacBook lineup, everyone was impressed by the processor performance and the power efficiency it offered. Just a few days ago, Apple updated its Mac lineup to feature these M1 processors and made it obvious that custom silicon is the way to go in the future. Today, we have information coming from Nikkei Asia, that Apple's next-generation M2 chip has entered mass production and that it could be on the way for as early as July when Apple will reportedly refresh its products. The M2 chip is made inside TSMC's facilities on a 5 nm+ N5P node. While there is no more information coming from the report about the SoC, we can expect it to be a good generational improvement.