Apple is planning to launch its own high-performance processors designed for Macs at the 2020 WWDC, held in the week of 22 June, 2020. This would be the the first step among many toward the replacement of Intel processors and the x86 machine architecture from the Apple Mac ecosystem, in the same fashion as the company replaced PowerPC with x86 last decade. Apple has codenamed the process of graduating to the new machine architecture "Kalamata," and besides detailing the new processor and its architecture, the company could announce a large-scale developer support initiative to help Mac software vendors to transition to the new architecture in time for the first Macs with the new processors to roll out in 2021.

A Bloomberg report on the new processors states that the chips will be based on the "same technology" as the company's A-series SoCs for iOS devices, meaning that Apple will leverage the Arm machine architecture, and has probably developed a high performance CPU core that can match Intel's x64 cores in IPC and efficiency. Macs based on the new processors, will however run MacOS and not iOS, which means much of the clean-break transition woes between PPC and x86 Macs are bound to return, but probably better managed by software vendors. It also remains to be seen how Apple handles graphics. The company could scale up the Metal-optimized iGPU found in its A-series SoCs on its new Mac processor, while also giving them the platform I/O capability to support discrete graphics from companies such as AMD.

Intel is preparing to launch its next-generation Tiger Lake lineup of processors for the middle of 2020. The processors are based on the new "Willow Cove" CPU core, which supposedly brings even more IPC gains compared to previous "Golden Cove" CPU cores found in Ice Lake processors. The Tiger Lake lineup will use Intel's advanced 10 nm+ manufacturing process. This alone should bring some gains in frequency compared to the 10 nm Ice Lake processor generation, which was spotting a maximum of 4.1 GHz boost frequency on 28 W TDP model named Core i7-1068NG7. This processor is labeled as the highest-performing Ice Lake parts available today and the best 10 nm products available so far from Intel.

Thanks to the popular hardware leaker Rogame, we have evidence that the gains from 10 nm+ manufacturing process are real and that Tiger Lake will show us an amazing boost frequency of 5 GHz. In the benchmark, an unknown OEM laptop was spotted running the benchmark with a Tiger Lake CPU. This CPU is a 4 core, 8 threaded model with a base frequency of 2.3 GHz and a surprising boost frequency of 5 GHz. This information should, of course, be taken with a grain of salt until we get more information about the Tiger Lake lineup and their specifications.

TSMC is working hard to bring a new 5 nm (N5 and N5+) despite all the hiccups the company may have had due to the COVID-19 pandemic happening. However, it seems like nothing can stop TSMC, and plenty of companies have already reserved some capacity for their chips. With mass production supposed to start in Q3 of this year, 5 nm node should become one of the major nodes over time for TSMC, with predictions that it will account for 10% of all capacity for 2020. Thanks to the report of ChinaTimes, we have a list of new clients for the TSMC 5 nm node, with some very interesting names like Intel appearing on the list.

Apple and Huawei/HiSilicon will be the biggest customers for the node this year with A14 and Kirin 1000 chips being made for N5 node, with Apple ordering the A15 chips and Huawei readying the Kirin 1100 5G chip for the next generation N5+. From there, AMD will join the 5 nm party for Zen 4 processors and RDNA 3 graphics cards. NVIDIA has also reserved some capacity for its Hopper architecture, which is expected to be a consumer-oriented option, unlike Ampere. And perhaps the most interesting entry to the list is Intel Xe graphics cards. The list shows that Intel might use the N5 process form TSMC so it can ensure the best possible performance for its future cards, in case it has some issues manufacturing its own nodes, just like it did with 10 nm.

Silicon Valley startup Tachyum, founded in 2016, is ready with its crowning product, the Tachyum Prodigy. The startup recently received an investment from the Slovak government in hopes of job-creation in the country. The Prodigy is what its makers call "a universal processor," which "outperforms the fastest Xeon at 10X lower power." The company won't mention what machine architecture it uses (whether it's Arm or MIPS, or its own architecture). Its data-sheet is otherwise full of specs that scream at you.

To begin with, its top trim, the Prodigy T16128, packs 128 cores on a single package, complete with 64-bit address space, 512-bit vector extensions, matrix multiplication fixed-function hardware that accelerate AI/ML, and 4 IPC at up to 4.00 GHz core clock. Tachyum began the processor's software-side support, with an FPGA emulator in December 2019 (so you can emulate the processor on an FPGA and begin developing for it), C/C++ and Fortran compilers; debuggers and profilers, tensorflow compilers, and a Linux distribution that's optimized it. The I/O capabilities of this chip are something else.

Today, AMD announced that 2nd Gen AMD EPYC processors are powering the Oracle Cloud Infrastructure Compute E3 platform, bringing a new level of high-performance computing to Oracle Cloud. Using the AMD EPYC 7742 processor, the Oracle Cloud "E3 standard" and the bare metal compute instances are available today and leverage key features of the Gen AMD EPYC processors including class-leading memory bandwidth and the highest core count for an x86 data center processor. These features enable the Oracle Cloud E3 platform to be well suited for both general purpose and high bandwidth workloads such as big data analytics, memory intense workloads and Oracle business applications.

SiPearl, the company that is designing the high-performance, low-power microprocessor for the European exascale supercomputer, has signed a major technological licensing agreement with Arm, the global semiconductor IP provider. The agreement will enable SiPearl to benefit from the high-performance, secure, and scalable next-generation Arm Neoverse platform, codenamed ''Zeusʺ, as well as leverage the robust software and hardware Arm ecosystem.

Taking advantage of the Arm "Zeus" platform, including Arm's POP IP, on advanced FinFET technologyenables SiPearl to accelerate its design and ensure outstanding reliability for a very high-end offering,in terms of both computing power and energy efficiency, and be ready to launch its first generation of microprocessors in 2022.

MATLAB received an update that no longer cripples users of AMD processors. Back in November 2019, there was quite some controversy when it emerged that MATLAB, a popular computing platform popular with engineering firms, universities, and research institutes, wasn't working optimally with AMD processors. Specifically, the suite's Intel MKL (math kernel library) component was designed such that if it didn't recognize the "GenuineIntel" CPUID string, it would disable fast AVX2 code-paths and fall back to SSE. This would inflict anywhere between 20-300 percent performance penalties on "AuthenticAMD" processors.

Reddit user Nedflanders1976 developed a tweak back in November, which spoofs MKL into thinking AMD processors are "GenuineIntel," enabling it to leverage modern instruction sets such as SSE4, AVX, and AVX2. AMD processors have been supporting SSE4 and AVX since its 2011 FX-series, and AVX2 since 2017 Ryzen. With the latest R2020a version, MATLAB automatically enables AVX2 execution on AMD processors that support the instruction set. A quick set of tests by ExtremeTech confirms that the update does indeed leverage the faster code-path by default, with Ryzen Threadripper 3960X and 3970X gaining over 200% performance and beating the Core i9-10980XE (something that needed the Nedflanders1976 tweak earlier).

Ampere Computing, a startup focusing on making HPC and processors from cloud applications based on Arm Instruction Set Architecture, today announced the release of a first 80 core "cloud-native" processor based on the Arm ISA. The new Ampere Altra CPU is the company's first 80 core CPU meant for hyper scalers like Amazon AWS, Microsoft Azure, and Google Cloud. Being built on TSMC's 7 nm semiconductor manufacturing process, the Altra is a CPU that is utilizing a monolithic die to achieve maximum performance. Using Arm's v8.2+ instruction set, the CPU is using the Neoverse N1 platform as its core, to be ready for any data center workload needed. It also borrows a few security features from v8.3 and v8.5, namely the hardware mitigations of speculative attacks.

When it comes to the core itself, the CPU is running at 3.0 GHz frequency and has some very interesting specifications. The design of the core is such that it is 4-wide superscalar Out of Order Execution (OoOE), which Ampere refers to as "aggressive" meaning that there is a lot of data throughput going on. The cache levels are structured in a way that there is 64 KB of L1D and L1I cache per core, along with 1 MB of L2 cache per core as well. For system-level cache, there is 32 MB of L3 available to the SoC. All of the caches have Error-correcting code (ECC) built-in, giving the CPU a much-needed feature. There are two 128-bit wide Single Instruction Multiple Data (SIMD) units, which are there to do parallel processing if needed. There is no mention if they implement Arm's Scalable Vector Extensions (SVE) or not.

Ahead of their rumored April 2020 availability product codes of Intel's upcoming 10th generation Core "Comet Lake-S" desktop processors leaked to the web, courtesy momomo_us. The lineup includes 22 individual SKUs, although it's unknown if all of these will be available in April. There are four 10-core/20-thread SKUs: the i9-10900K, the i9-10900KF, the i9-10900, and the i9-10900F. The "K" extension denotes unlocked multiplier, while the "F" extension indicates lack of integrated graphics. "KF" indicates a SKU that's both unlocked and lacking an iGPU. Similarly, there are four 8-core/16-thread Core i7 SKUs, the i7-10700K, the i7-10700KF, the i7-10700, and the i7-10700F.

The 6-core/12-thread Core i5 family has several SKUs besides the range-topping i5-10600K and its siblings, i5-10600KF and i5-10600. These include the i5-10500, i5-10400, and i5-10400F. The quad-core Core i3 lineup includes the i3-10320, i3-10300, and i3-10100. The former two have 8 MB L3 cache, while the i3-10100 has 6 MB. Among the entry-level Pentium SKUs are the G6600, G6500, G6400, G5920, and G5900.

Today, Arm announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm Cortex -M55 processor and Arm Ethos -U55 NPU, the industry's first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers. The new IP and supporting unified toolchain enable AI hardware and software developers with more ways to innovate as a result of unprecedented levels of on-device ML processing for billions of small, power-constrained IoT and embedded devices.

Zhaoxin is a brand that makes multi-core 64-bit x86 processors primarily for use in Chinese state IT infrastructure. It's part of the Chinese Government's ambitious plan to make its IT hardware completely indigenous. Zhaoxin's x86-64 CPU cores are co-developed by licensee VIA, specifically its CenTaur subsidiary that's making NCORE AI-enabled x86 processors. The company's KaiXian KX-6780A processor is now commercially available in China to the DIY market in the form of motherboards with embedded processors.

The KaiXian KX-6780A features an 8-core/8-thread x86-64 CPU clocked up to 2.70 GHz, 8 MB of last-level cache, a dual-channel DDR4-3200 integrated memory controller, a PCI-Express gen 3.0 root-complex, and an iGPU possibly designed by VIA's S3 Graphics division, which supports basic display and DirectX 11.1 readiness. The CPU features modern ISA, with instruction sets that include AVX, AES-NI, SHA-NI, and VT-x comparable virtualization extensions. The chip has been fabricated on TSMC 16 nm FinFET process.

European Processor Initiative (EPI) is a Europe's project to kickstart a homegrown development of custom processors tailored towards different usage models that the European Union might need. The first task of EPI is to create a custom processor for high-performance computing applications like machine learning, and the chip prototypes are already on their way. The EPI chairman of the board Jean-Marc Denis recently spoke to the Next Platform and confirmed some information regarding the processor design goals and the timeframe of launch.

Supposed to be manufactured on TSMC's 6 nm EUV (TSMC N6 EUV) technology, the EPI processor will tape-out at the end of 2020 or the beginning of 2021, and it is going to be heterogeneous. That means that on its 2.5D die, many different IPs will be present. The processor will use a custom ARM CPU, based on a "Zeus" iteration of Neoverese server core, meant for general-purpose computation tasks like running the OS. When it comes to the special-purpose chips, EPI will incorporate a chip named Titan - a RISC-V based processor that uses vector and tensor processing units to compute AI tasks. The Titan will use every new standard for AI processing, including FP32, FP64, INT8, and bfloat16. The system will use HBM memory allocated to the Titan processor, have DDR5 links for the CPU, and feature PCIe 5.0 for the inner connection.

Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.

The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.

Intel has today launched a new product called Data Streaming Accelerator known as Intel DSA shortly. The new device is going to be present inside every future Intel processor with a goal of "optimizing streaming data movement and transformation operations common with applications for high-performance storage, networking, persistent memory, and various data processing applications."

The DSA processor will replace an existing solution that is Intel QuickData Technology, which was previously used for data movement. This new dedicated processor has a much-needed purpose to free up CPU cycles from doing IO work like moving data to/from volatile memory, persistent memory, memory-mapped I/O, and through a Non-Transparent Bridge (NTB) device to/from remote volatile and persistent memory inside a chip. In addition to the usual data movement operations, the DSA processor can create and test CRC checksums for any errors in storage and networking applications.

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

Cerebras has introduced the world to its CS-1 system, which will house the company's (and simultaneously, the industry's) most powerful monolithic accelerator.The CS-1 is an integrated solution the size of 15 industry-standard rack units, and packs everything from the Wafer Scale Engine to cooling systems. The CS-1 consumes 20 kW of power, with a full 4 kW dedicated solely to the cooling subsystem, like fans, pumps, and the heat exchanger, 15 kW dedicated to the chip, and 1 kW is totally lost to power supply inefficiencies. Obviously, power supply modules and other cooling subsystems are redundant, and hot-swappable if need be - you can imagine the computational value lost with each millisecond of downtime that were to occur in such a system.

In today's world, computer security is becoming very important due the exponential increase in malware and ransomware attacks. Various studies have shown that a single malicious attack can cost companies millions of dollars and can require significant recovery time. With the growth of employees working remotely and connected to a network considered less secure than traditional corporate network, employee's computer systems can be perceived as a weak security link and a risk to overall security of the company. Operating System (OS) and independent hardware vendors (IHV) are investing in security technologies which will make computers more resilient to cyberattacks.

Intel's Omni-Path technology has been used primarily in high performance computing market, in order to provide high speed interconnect between Intel Xeon CPUs, with speeds reaching around 100 Gbps. Accompanied by different design and system integration that Omni-Path uses, it was a bit difficult to integrate into server system, while not adding much value that other technologies couldn't match or beat.

Because of these reasons, Intel is now discontinuing its last product capable of utilizing Omni-Path - the first generation Xeon Scalable CPUs. Carrying the suffix "F", these CPUs had an extra connector sticking out of CPU's PCB to enable the Omni-Path functionality (see images bellow). There were eight CPUs manufactured in total that had this extra feature, consisting out of two Xeon Platinum and six Xeon Gold CPUs, which have now reached end of life. Intel states that focus from these CPUs has shifted to other technologies like silicon photonics, which provides much greater speed reaching 100s of gigabits per second. Intel already demonstrated transceivers capable of reaching 400 Gb/s speeds with the magic of light, which will become available in 1H 2020.

Intel's upcoming 5 GHz-on-all-cores Core i9-9900KS will certainly be a beast of a processor for the company - in more ways than one. The 8-core, 16-thread 5 5 GHz all-core turbo CPU will be Intel's best-performing consumer CPU for a while. The steps taken to ensure that have been the only ones Intel could do with their current CPU design and fabrication process - increase the TDP and improve all-core boost frequency, which should allow the CPU to perform incredibly well in peak performance.

The question that remains, of course, is how long the CPU will actually be able to keep its 5.0 GHz all-core frequency when it's engaged. The 127 W TDP as outed by an ASUS BIOS is a monstrous amount for an 8-core CPU, and I don't envy the heatsinks that will have to keep it in check. All in all, this seems to be nothing more than a CPU binned for Intel's purposes of becoming the best CPU for gaming and "home user relevant applications".

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.AMD's full statement is quoted below.

Top-of-the-line gaming brand AORUS, reveals itself at the 2019 GAMESCOM trade show in Germany Cologne, in which the spotlight shines at the all-new 17 inch flagship gaming laptop, the AORUS 17. AORUS takes the lead yet again through the co-op with world renowned switch manufacture OMRON to innovate and develop a set of unique mechanical switches that is tailored for the AORUS 17, not only does the keys offer exceptional durability, it also offers one of the best feeling keys that gamers can find on a laptop. The AORUS greatness continues through the combination of the brand new Intel 8-core CPU, NVIDIA RTX graphics chip with Ray Tracing technology and an exclusive WINDFORCE INFINITY cooling system, the AORUS 17 steadily sits on the high-end gaming thrown with these specs.

AORUS leads the industry again by working with world renowned mechanical switch manufacture, OMRON in order to create a unique set of mechanical keys for the AORUS laptop, with gamer oriented design details, including an optimal 2.5 mm key travel and an actuation point of 1.6 mm, giving gamers both the sensational touch and sound of a crisp blue switch, which gamers can now enjoy the qualities of a full mechanical keyboard right on their AORUS laptop. AORUS pursues further by redesigning the key caps to produce stunning backlit keys with unique "concentric" keycaps, letting the LED underneath the keycap shine though evenly, increasing the overall lighting intensity by 27%, in addition to the AORUS exclusive FUSION 2.0 keyboard customization software, gamers can truly create a unique personal style.

GIGABYTE, a leading server systems builder which recently released a total of 17 new AMD EPYC 7002 Series "Rome" server platforms simultaneously with AMD's own official launch of their next generation CPU, is proud to announce that our new systems have already broken 11 different SPEC benchmark world records. These new world records have not only been achieved against results from all alternative processor based systems but even against competing vendor solutions using the same 2nd Generation AMD EPYC 7002 Series "Rome" processor platform, illustrating that GIGABYTE's system design and engineering is perfectly optimized to deliver the maximum performance possible from the 2nd Generation AMD EPYC.

Intel today announced its future Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in a standard, socketed CPU as part of its mainline Intel Xeon Scalable platforms, with availability in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series, which today is gaining momentum among the world's most demanding HPC customers, including HLRN, Advania, 4Paradigm, and others.

"The Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family generated a lot of excitement among our customers who are deploying the technology to run their high-performance computing (HPC), advanced analytics, artificial intelligence and high-density infrastructure. Extended 56-core processor offerings into our mainline Intel Xeon Scalable platforms enables us to serve a much broader range of customers who hunger for more processor performance and memory bandwidth."
-Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

Today, Intel officially launched 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics for stunning entertainment and enable the best connectivity with Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season.

"These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 - all integrated onto the SoC, thanks to Intel's 10nm process technology and architecture design - we're opening the door to an entirely new range of experiences and innovations for the laptop."
-Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.

For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.