We've all taken a look at AMD's March 2019 product roadmap, which showed us the upcoming 2019 tech the company would be bringing to the table in its "non-stop product momentum". However, it seems that this non-stop product momentum might be coming to an unexpected twist of fate that might delay it from entering the last station - the Zen 2-based Threadripper. In the company's latest May earnings call roadmap, the company silently removed the Zen 2 Threadripper from its product roadmap - where it used to sit right after the launch of Zen 2-based Ryzen products for consumers, is now just a big crop of the space it occupied.

This might mean many things, and a mistake on someone's part while cropping the PowerPoint slide could be the only thing going on here. However, the best and most plausible speculation that can be entertained when one considers this is simple - a supply problem. With the 7 nm node being the newest, most dense fabrication process possible, and with AMD having to share TSMC's 7 nm wafer production with a number of high profile companies - such as Qualcomm, for instance - may mean that supply is simply too tight to support Zen 2-based products across so many product stacks - Ryzen and Epyc - at the same time.

While Fallout 76 may have (read: has) come out of the gates to generally poor rception, Bethesda Softworks has been hard at work trying to bring the game up to speed to the potential of the Fallout series - at least, as much potential as there is to scrounge for in this shared/world rendition of it. This has worked, according to Bethesda, through a dedication to "(...) improve performance, detect new exploits, and make the experience smoother for everyone. There's still work to do, but we're happy to report that game and server stability has increased over 300% since launch." To celebrate a perceived new state of the nation, Bethesda has just revealed their plans for the game thorugh a roadmap that spans the entirety of 2019.

It seems the game will be following a Seasonal content delivery, as there is a Spring, Summer, Fall, and Winter separation for content - free content, that is. The first content update, dubbed "Wild Appalachia", will be coming out throughout Spring 2019, featuring a series of new quests, features, events, crafting systems and more starting on March 12 and appearing over several weeks. Summer will see the arrival of of the "Nuclear Winter" content update, which seems like a tongue-in-cheek proposition. "Wastelanders", dropping this Fall, will be the single most comprehensive amount of content, according to Bethesda, with "a new main questline, new factions, new events, new features and even more surprises." Check out after the break for the full announced features for the Spring Update, "Wild Appalachia".

Intel's Next Unit of Computing (NUC) systems have always offered a great deal of performance in a tiny form factor. Their current lineup which consists of Hades Canyon features Intel's 8th generation of processors and depending on model can also feature an AMD Radeon RX VEGA M graphics processor, that said, the vast majority of units utilize Intel's integrated graphics. The most potent these configuration is Intel's 100W 4c/8t i7-8809G with Radeon RX Vega M GH graphics. It delivers exceptional performance for the size, allowing users to play AAA games at high settings with stable frame rates.

Thanks to a member of the PC EVA forums we now have access to what appears to be a leaked Intel roadmap showcasing their Ghost Canyon X NUC systems. Set to debut in 2019/2020 Intel will be pushing multiple new CPUs for these systems including a 45W 8c/16t i9-9xxxH, 45W 6c/12t i7-9xxxH, and 45W 4c/8t i5-9xxxH. All three feature UHD graphics by Intel, however, what is most interesting there provisions for a single PCIe X16 slot. Now, in reality, the inclusion of a proper PCIe slot is unlikely, I would speculate due to the size that it is, in fact, an MXM slot which limits options to discrete mobile graphics processors which tend to be far more expensive for consumers. Still, more information is required before making any serious judgments one way or the other at this time.

At the XFastest Network event in Japan, ASRock shared some slides detailing its overall graphics card strategy up to February 2019. There are some interesting bits of information that can be gleaned/extrapolated from it. One bit of information that seems to be set in stone is the introduction, come August, of revised versions of some graphics cards (namely, the RX 570 and RX 580 models) under the MK2 marketing - likely revised in their cooling apparatus. That the RX Vega versions of ASRock graphics cards won't be receiving such a revision seems clear as well: there's no reason for the company to withhold information on that. The others, however, are more prone to speculation.

First of, the fact that ASRock still only lists AMD graphics cards likely means the company will remain an exclusively AMD-aligned AIB. Secondly, the absence of any new AMD graphics cards in the ASRock lineup, while noteworthy and prone to speculation, doesn't really say much. AMD certainly wouldn't look lovingly towards ASRock should they out information on a new RX600 series or other AMD products ahead of time. Likewise, ASRock wouldn't want publicity on a new deal with NVIDIA to hit the roads ahead of time. As such, let's just stay with the MK2 graphics cards and ASRock's lineup - and codification for its products, which they kindly shared during the event.

Bluechip computer, a German IT distribution company, has inadvertently spilled the beans on AMD and Intel's plans for the remainder of this year, shedding some more light on a number of products whose existence was still somewhat marred in fog. The information comes straight from a webinar Bluechip presented to its industry partners - a 30-minute presentation which made its way to YouTube.

The information gleaned is a confirmation, of sorts, of AMD's planned launch of their Z490 platform in June; the B450 chipset coming a little bit later, in July (an expected product, in every sense); and AMD's second-gen Threadripper, a known-quantity already, which should accompany a X399 platform refresh.

Continuing with its trend of leaking AMD slides, Spanish website Informatica Cero has now published some purported company slides leading up to AMD's 2020 strategy. New information concerns the appearance of a new, value-oriented mobile APU in the form of "Dali" - let's hope performance on that is slightly more predictable than the particular style of the artist whose name it follows. Dali therefore joins AMD's "Renoir" APU and "Vermeer" CPUs (both expected in the 7 nm process) for AMD's 2020 roadmap. This is an interesting product, which AMD is likely positioning for tablets and ultraportables.

Another interesting tidbit is AMD's outlook for their Threadripper line of HEDT CPUs. The company is looking towards its 7 nm rendition of these powerhouse chips, codenamed "Castle Peak", to bring them, in a literal way, to that figurative peak. AMD compares Threadripper to a Monster Truck of computing, and is apparently hoping to introduce Castle Peak as early as 2019. AMD then plans to further refine these "process inflection point" products in a new generation to come right after, in 2020 (much like the company has done now with Zen and Zen+).

AMD at CES shed some light on its 2018 roadmap, while taking the opportunity to further shed some light on its graphics and CPU projects up to 2020. Part of their 2018 roadmap was the company's already announced, across the board price-cuts for their first generation Ryzen processors. This move aims to increase competitiveness of its CPU offerings against rival Intel - thus taking advantage of the blue giant's currently weakened position due to the exploit saga we've been covering. This move should also enable inventory clearings of first-gen Ryzen processors - soon to be supplanted by the new Zen+ 12 nm offerings, which are expected to receive a 10% boost to power efficiency from the process shrink alone, while also including some specific improvements in optimizing their performance per watt profile. These are further bound to see their market introduction in March, and are already in the process of sampling.

On the CPU side, AMD's 2018 roadmap further points towards a Threadripper and Ryzen Pro refresh in the 2H 2018, likely in the same vein as their consumer CPUs that we just talked about. On the graphics side of their 2018 roadmap, AMD focused user's attention in the introduction of premium Vega offerings in the mobile space (with HBM2 memory integration on interposer, as well), which should enable the company to compete against NVIDIA in the discrete graphics space for mobile computers. Another very interesting tidbit announced by AMD is that they would be skipping the 12 nm process for their graphics products entirely; the company announced that it will begin sampling of 7 nm Vega products to its partners, but only on the Instinct product line of machine learning accelerators. We consumers will likely have to wait a little while longer until we see some 7 nm graphics cards from AMD.

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

Samsung stands as a technology giant in the industry, with tendrils stretching out towards almost every conceivable area of consumer, prosumer, and professional markets. It is also one of the companies which can actually bring up the fight to Intel when it comes to semiconductor manufacturing, with some analysts predicting the South Korean will dethrone Intel as the top chipmaker in Q2 of this year. Samsung scales from hyper-scale data centers to the internet-of-things, and is set to lead the industry with 8nm, 7nm, 6nm, 5nm, 4nm and 18nm FD-SOI in its newest process technology roadmap. The new Samsung roadmap shows how committed the company is (and the industry with it) towards enabling the highest performance possible from the depleting potential of the silicon medium. The 4 nm "post FinFET" structure process is set to be in risk production by 2020.

This announcement also marks Samsung's reiteration on the usage of EUV (Extreme Ultra Violet) tech towards wafer manufacturing, a technology that has long been hailed as the savior of denser processes, but has been ultimately pushed out of market adoption due to its complexity. Kelvin Low, senior director of foundry marketing at Samsung, said that the "magic number" for productivity (as in, with a sustainable investment/return ratio) with EUV is 1,500 wafers per day. Samsung has already exceeded 1,000 wafers per day and has a high degree of confidence that 1,500 wafers per day is achievable.

AMD finalized the GPU architecture roadmap running between 2016 and 2018. The company first detailed this at its Capsaicin Event in mid-March 2016. It sees the company's upcoming "Polaris" architecture, while making major architectural leaps over the current-generation, such as a 2.5-times performance/Watt uplift and driving the company's first 14 nanometer GPUs; being limited in its high-end graphics space presence. Polaris is rumored to drive graphics for Sony's upcoming 4K Ultra HD PlayStation, and as discrete GPUs, it will feature in only two chips - Polaris 10 "Ellesmere" and Polaris 11 "Baffin."

"Polaris" introduces several new features, such as HVEC (h.265) decode and encode hardware-acceleration, new display output standards such as DisplayPort 1.3 and HDMI 2.0; however, since neither Polaris 10 nor Polaris 11 are really "big" enthusiast chips that succeed the current "Fiji" silicon, will likely make do with current GDDR5/GDDR5X memory standards. That's not to say that Polaris 10 won't disrupt current performance-thru-enthusiast lineups, or even have the chops to take on NVIDIA's GP104. First-generation HBM limits the total memory amount to 4 GB over a 4096-bit path. Enthusiasts will have to wait until early-2017 for the introduction of the big-chip that succeeds "Fiji," which will not only leverage HBM2 to serve up vast amounts of super-fast memory; but also feature a slight architectural uplift. 2018 will see the introduction of its successor, codenamed "Navi," which features an even faster memory interface.

Alongside an updated desktop CPU roadmap, Intel posted an updated consumer SSD roadmap at its 3D Revolution 2014 presentation in Rome. It reveals the company's next-generation consumer SSD series, codenamed "August Ridge," and branded SSD 750 series. Targeting both the "consumer" and "professional" (≠ enterprise) market segments, the SSD 750 series comes in three form-factors, 2.5-inch SATA 6 Gb/s, mSATA 6 Gb/s, and M.2 (likely PCIe 2.0 x2 link layer). The series will sell in most popular sub-terabyte capacities, and will be based on the company's 20 nm MLC NAND flash. We have no reason to believe Intel will discontinue using SandForce-made processors in its consumer SSDs. Intel's SSD 750 series "August Ridge" is slated for Q4-2014.

Intel's presentation for Italian technology conference 3D Revolution 2014 was leaked to the web, revealing the company's most up-to-date desktop CPU roadmap, which looks deep into 2015. It reveals a wealth of new information. To begin with the HEDT (high-end desktop) segment, Intel plans to drag Core i7 "Ivy Bridge-E" through Q3-2014, and launch its succeeding Core i7 "Haswell-E" processor close to Q4-2014, or late into Q3, which would pin its launch some time in September 2014. "Haswell-E" is built in the new socket LGA2011-3 package, and is supported exclusively by Intel X99 Express chipset. It also heralds DDR4 memory to the consumer space. "Haswell-E" will have its reign till late-Q3 2015, when Intel plans to launch Core i7 "Broadwell-E," which is built in the same package, and supported by the same X99 platform, but based on a swanky new 14 nm silicon.

Things get interesting with the company's mainline desktop processors. Intel recently launched its "Haswell" Refresh silicon, and is bound to launch their unlocked variants, codenamed "Devil's Canyon," on the 25th of June. Built in the LGA1150 package, "Haswell" Refresh runs on both 8-series and 9-series chipset. Intel's 9-series chipset was originally designed to launch alongside the company's first processors built on the 14 nm silicon fab process, codenamed "Broadwell," which is an optical shrink of "Haswell," with a few minor tweaks and speed bumps, just as "Ivy Bridge" was to "Sandy Bridge." Intel's "Broadwell" chips are now expected to debut in Q1-2015, probably along the sidelines of the 2015 International CES. These chips will be supported by existing LGA1150 motherboards, some with BIOS updates.

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

AMD (NYSE: AMD) today disclosed its roadmap for the fast-growing embedded computing market, as it becomes the first company to offer both ARM and x86 processor solutions for low-power and high-performance embedded compute designs. The new lineup includes two best-in-class x86 accelerated processing units (APUs) and central processing units (CPUs), a first look at a high-performance ARM system-on-chip (SoC) and a new family of discrete AMD Embedded Radeon graphics processing units (GPUs) expected to launch in 2014. These additions provide the embedded industry's engineering community with more choices to match their exact design needs, and are designed to offer improvements in performance-per-watt and performance-per-dollar. Together with the recent launch of the award-winning AMD Embedded G-Series SoC family that set a superior bar for performance-per-watt low-power multicore APUs, these latest additions to the embedded product roadmap further signify a strategic push by AMD to focus on the high-growth embedded market.

AMD reportedly updated its consumer products roadmap for 2014 thru 2015 to account for changes in the industry. The company is expected to unveil its next-generation "Volcanic Islands" GPU family by late-September, 2013. In the first quarter of 2014, the company is expected to unveil its 4th generation entry-level APUs, codenamed "Kabini." Built in ST3 socket for notebooks, and FS1B for desktops, this product family will include dual- and quad-core parts, with TDPs under 25W. Among the quad-core parts are the A4-5350 and A4-5150, and among the dual-core ones is the E1-2650.

"Kabini" will enter mass-production in February 2014, and will be formally announced in the following month. Kabini's early-2014 launch, delayed from late-2013, will have a cascading effect on its successor's launch. "Beema," its successor, will now launch in either late-2014, or early-2015. "Beema" will be based on the same socket types as "Kabini," but will incorporate more HSA technologies.

As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

Intel's first processors in the BGA (ball-grid array) package, arrive by the end of 2013, according to a leaked roadmap slide. Some of the first of these processors will span across entry-level market segments, covering the Celeron and Pentium brands. The term system-on-chip (SoC) better defines these chips than processors, as they completely integrate the processor as we know it, with the motherboard chipset. Motherboards with BGA processors come with the processors non-replaceable, and hard-wired to the board, with a stock fan-heatsink.

Intel's first SoCs for the desktop are based on the "BayTrail-D" silicon. These include the Celeron J1750, Celeron J1850, and Pentium J2850. Celeron J1750 is a dual-core part, with the CPU cores clocked at 2.41 GHz, GPU at 792 MHz, and a TDP rated at just 10W. Celeron J1850, on the other hand, is a quad-core part, with its CPU cores clocked at 2.00 GHz, and the same 792 MHz GPU. Pentium J2850 tops the series, being a quad-core part with CPU cores running at 2.41 GHz, and GPU at 792 MHz. Both these quad-core parts stick to 10W TDP. Being SoCs, these chips integrate connectivity otherwise handled by a PCH, into the processor package. According to an Intel roadmap slide, the three parts will spearhead Intel's BGA CPU lineup deep into 2014, at least as far as late-June.

According to CPU World staff, who, by appealing to an unnamed secondary source, managed to confirm the validity of an earlier leak, we are now looking at Intel's desktop roadmap for the following twelve months. The slides reveal the Q3 launch of Intel's Ivy Bridge-E chips, the Core i7-4820K, i7-4930K and i7-4960X comprising the lineup. The new Extreme chips will make use of the existing X79 platform. Also in Q3 the Premium line will receive a new product, the Core i7-4771, which we do not know in what way differs from the currently available Core i7-4770, but a judicious appeal to wild speculation could point out an upgraded IGP.

The mid segments will get a platform upgrade in the form of a new H81 chipset, and six new processors, the Core i3-4130, i3-4330, i3-4340, as well as three new Ivy Bridge based Pentium chips, the G3220, G3420 and G3430. Celeron processors are in the pipelines for Q1 2014, while Q2 will follow with the Haswell refresh and the accompanying new platform based on the Z97 and H97 chipsets.

Keeping up with an updated launch roadmap for Q1 2013 posted last November, Intel rolled out entry-level Celeron and Pentium dual-core processors based on its 22 nm "Ivy Bridge" silicon. All of the seven desktop and four mobile chips announced occupy price-points under $100. The desktop lineup begins with the Celeron G1610 (2.60 GHz, dual-core, 55W TDP), priced at US $42; Celeron G1610T (2.30 GHz, dual-core, 35W TDP) at $42; followed by Celeron G1620 (2.70 GHz), priced significantly higher at $52; Pentium G2010 (2.80 GHz, dual-core, 55W TDP) and G2020 (2.90 GHz), and G2020T (2.50 GHz, 35W TDP) at $64; and Pentium G2130 (3.20 GHz, dual-core, 55W TDP) at $86.

Intel has two kinds of Celeron mobile processors, targeting the mainstream and Ultrabook-like notebook form-factors. Among the mainstream notebook processors are the Celeron 1000M (1.80 GHz, dual-core, 35W TDP) and Celeron 1020M (2.10 GHz, dual-core, 35W TDP). Among the Ultrabook-like form-factor models are the Celeron 1007U (1.50 GHz, dual-core, 17W TDP), and Celeron 1037U (1.80 GHz, dual-core, 17W TDP). Interestingly, all four mobile Celeron "Ivy Bridge" CPU models are priced at $86, in 1000-unit tray quantities.

The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today announced Chairman, John D'Ambrosia of Dell, and Marketing Committee Chair, Chauncey Schwartz of QLogic, will be featured speakers at the upcoming Large Installation System Administration Conference (LISA '12). A technical educational conference and networking event for system administrators of all levels of expertise, LISA '12 is scheduled for December 9 - 14, 2012 at San Diego, CA's Sheraton San Diego Hotel & Marina.

Ethernet is at the next critical junction in its lifecycle, particularly with the emergence of new applications like cloud computing and server virtualization, that could profoundly impact this essential technology," said John D'Ambrosia, chairman, Ethernet Alliance, and chief Ethernet evangelist, CTO office, Dell. "Therefore, it's important to understand the current conditions within the Ethernet ecosystem, as well as taking a forward-facing view of where we'll be six months, a year, or even five years down the road."

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.

Production of AMD's next-generation FX processor family, which are based on its "Piledriver" microarchitecture, will commence in Q3 2012, according to industry sources. Some of the first client processor models based on the "Vishera" silicon, will be the eight-core FX-8350, six-core FX-6300, and quad-core FX-4320. The three model names were earlier misinterpreted with an "x" prefix from a roadmap slide.

A few more details are known about these chips. For starters, the chips will be built on the existing AM3+ package, retaining compatibility with current AM3+ platforms. The chips will also retain dual-channel DDR3-1866 MHz integrated memory controllers, and Turbo Core 2.0. The main differences here, are increases in IPC (performance to clock-speed ratio), and the implementation of resonant clock mesh technology, which increases energy efficiency.

Details of desktop Core i7 and Core i5 "Ivy Bridge" processors in the LGA1155 package have been detailed at lengths, in the past. Core i3 parts based on the same 22 nm Ivy Bridge silicon, however, were relatively known. Tables listing out updated information about the lineup points out that Intel has as many as five Core i3 "Ivy Bridge" desktop processors in the works, all dual-core, and among which two are low-power parts.

The table also suggests that these Core i3 chips will have reduced features, importantly, the lack of PCI-Express 3.0 bus. When connected to these chips, PCI-E 3.0 add-on cards (such as graphics cards) will function in PCI-Express 2.0 mode. Further, these chips will lack support for AES-NI (accelerates encryption), VT-d (enhanced virtualization), and TXT (security). Certain models in the lineup have faster integrated graphics, denoted by a "5" in the end of the model number. These chips also lack Turbo Boost for the x86 cores, but feature HyperThreading.

In the second quarter of this year, AMD will launch its next-generation accelerated processing unit, codenamed "Trinity", starting with quad-core A10 and A8 parts in the quarter, followed by dual-core A6 and A4 parts in the third-quarter of 2012 (more here). DonanimHaber scored a specifications-sheet that details all the models AMD has in store for this year, also giving us an insight to what constitute each of these model numbers.

An interesting revelation here is that AMD does not have triple-core APUs anywhere in its lineup. The A10 lineup consists of quad-core APUs that come with Radeon HD 7660D graphics, while the A8 lineup also consists of quad-core APUs, but with slower Radeon HD 7560D graphics. The A6 lineup consists of dual-core APUs with Radeon HD 7540D graphics, while the A4 lineup has dual-core APUs with Radeon HD 7480D graphics.

AMD is pushing on with a desktop product lineup that's leveraging its Piledriver CPU and Graphics CoreNext GPU architectures in 2012. Apparently, the company will have a faster product development cycle to catch up with Intel's "Tick-Tock", as revealed in a roadmap slide scored by DonanimHaber. The current product lineup will remain unchanged in the first quarter of 2012. Then in the second quarter, AMD will launch a few more socket AM3+ FX-8000, FX-6000, and FX-4000 series eight, six, and four-core processors; along with the much talked about "Trinity" accelerated processing unit.

The fastest "Trinity" APUs will get a new brand identifier, the A10-5000 series. These APUs will pack next-generation "Piledriver" modular cores and Radeon HD 7600D series graphics. Around this time, AMD will also launch the Brazos 2.0 low-power APU for netbooks, nettops, and embedded computing devices. Brazos 2.0 will get the E2-1000 series branding. The big change is reserved for the third quarter of 2012, when AMD launches the successor of its less-than-lucky AMD FX "Bulldozer" processor family.