Russia Unveils Domestic 350 nm Lithography System Amid Sanctions
Russian and Belarusian semiconductor manufacturers have achieved a significant milestone in domestic chip production capabilities. In collaboration with Belarus-based Planar, the Zelenograd Nanotechnology Center (ZNTC) has developed a new lithography system supporting 350 nm process technology for 8-inch (200 mm) silicon wafers. This development represents a strategic response to Western sanctions severely restricting Russia's access to advanced semiconductor manufacturing equipment. The system employs solid-state laser technology to project circuit patterns onto photoresist-coated wafers through a photomask that defines the circuitry. After selective exposure, the photoresist undergoes chemical processing to build circuit structures. While the 350 nm node marks a critical capability for domestic semiconductor production, it sits almost three decades behind leading-edge fabrication processes in high-performance computing applications.
This technology is comparable to what powered Intel's Pentium II processors in the late 1990s. Despite this technological gap, the equipment will enable the production of various electronic components suitable for consumer electronics and certain specialized military applications where bleeding-edge performance isn't required. ZNTC has already outlined plans to develop a more advanced 130 nm lithography system by 2026 as part of a government-backed initiative to incrementally enhance domestic semiconductor capabilities. While unable to match the 3-5 nm processes currently deployed by global semiconductor leaders, this lithography system establishes a foundation for domestic chip manufacturing infrastructure, especially in the category of mature nodes. The success of this intermediate solution will likely influence government funding priorities as the country attempts to narrow the technological gap with Western semiconductor capabilities in the coming years.
This technology is comparable to what powered Intel's Pentium II processors in the late 1990s. Despite this technological gap, the equipment will enable the production of various electronic components suitable for consumer electronics and certain specialized military applications where bleeding-edge performance isn't required. ZNTC has already outlined plans to develop a more advanced 130 nm lithography system by 2026 as part of a government-backed initiative to incrementally enhance domestic semiconductor capabilities. While unable to match the 3-5 nm processes currently deployed by global semiconductor leaders, this lithography system establishes a foundation for domestic chip manufacturing infrastructure, especially in the category of mature nodes. The success of this intermediate solution will likely influence government funding priorities as the country attempts to narrow the technological gap with Western semiconductor capabilities in the coming years.