Now, take that title with the customary grain of salt, and remember: most mobile configurations aren't directly comparable due to different components, speed of the memory subsystem, and so on. Putting that salt aside, though, one thing remains: Intel beats AMD in the latest purported 3DMark benchmarks - and on the red team's home-field, so to speak: graphics performance. A benchmark posted by renowned leaker and benchmark scavenger rogame on twitter has turned up an Intel Tiger Lake-U (i7-1165G7) scoring 11879 (99.68%) in the Physics and 6912 (112.92%) in the Graphics score compared to AMD's R7 4800U 11917 Physics score and 6121 Graphics score.

For context, this pits a 4-core, 8-thread Intel Willow Cove design paired with Gen12 Xe graphics tech (2.8 GHz base, 4.4 GHz boost) against 8 of AMD's Zen 2 cores and Vega graphics. Also for context, it's expected that Intel's i7-1165G7 runs with a 28 W TDP, compared to AMD's R7 4800U 15 W envelope. Also of note is that 3D Mark isn't exactly the poster-child for CPU parallelization performance, as the benchmark scales up rather poorly as more cores are added. Perhaps more interesting as a comparison, these scores from Intel's Tiger Lake are comparable to the company's current i5-10300H (4C/8T 2.5 GHz base 4.5 GHz boost), which scores 10817 on the Physics side (making the i7-1165G7 9.8% faster with a 200 MHz slower base clock, 100 MHz higher boost & 17 W less TDP (28 W for the Tier Lake and 45 W for the i5-10300H).

Intel today updated the public data-sheet of its 10th Gen Core "Comet Lake-S" desktop processor to reveal precise power limit and tau values of each specific SKU. PL 1 or power level 1 is interchangeable with the processor's TDP as a power value. PL 1 is sufficient for a processor to sustain its base frequency (nominal clocks). For example, a processor with 65 W TDP has PL 1 at 65 W. PL 2 is what affords the processor the power to seek out boost frequencies. This value varies with between model to model, with the unlocked K/KF SKUs getting higher PL 2 values than the locked ones. The company also disclosed Tau. This is a timing variable that tells the processor how long (in seconds) can it stay within PL 2, before having to retreat to PL 1.

Intel has recently released 4 new Atom C3000 chips now sporting "R" and "L" suffixes, these chips join the lineup as it enters its third year of service. The dual-core C3338R chip comes in at 38 USD and gains a 300 MHz base clock boost along with QAT support for just a $1 premium over the C3338. The quad-core C3436 comes in at 64 USD and features the lowest per-core pricing of the entire lineup at just 16 USD per core and with a 10.75 W TDP. The 96 USD quad-core C3558R gains a 200 MHz base clock boost and DDR4-2400 support for a 10 USD and 1 W TDP premium over the C3558. Finally, the 209 USD octa-core C3758R gains a 200 MHz base clock boost for a 16 USD and 1 W TDP increase over the Intel Atom C3758.

Intel's next-generation Atom processor is codenamed "Elkhart Lake." Built on the 10 nm silicon fabrication process, the chip combines up to four CPU cores based on the "Tremont" microarchitecture, with an iGPU based on the Gen11 architecture, and a single-channel memory interface that supports DDR4 and LPDDR4. Differentiation of the processor include 2-core and 4-core CPU variants, and TDP variants spanning 6 W, 9 W, and 12 W. "Tremont" is a lightweight CPU core by Intel that lacks AVX capabilities. Besides "Elkhart Lake," the core is featured in the "Lakefield" Core heterogenous processors as the their low-power cores.

Chinese electronics B2B marketplace CogoBuy.com has the processor listed, although without listing out any processor model numbers. The marketplace is accepting RFQs (requests for quotations) for bulk purchase of these BGA chips on trays, without listing prices. Also listed is an "industrial variant" of the chip, which has an increased TJmax of 110 °C (compared to 105 °C of the standard variant). The Gen11 iGPU wasn't detailed, but it's likely to have a lower execution unit count than the variant found on "Ice Lake" processors, while retaining its display- and media-engines (ability to pull 8K60 displays).

The idea of an ARK is to preserve that which enters it; however, the legend on the basis of arks and their concept must've slipped Intel's internal memos. The company has de-listed a previously detailed Ice Lake mobile CPU from its database - the Core i7-1068G7 - which was a 28 W part available for system integrators to build machines around. That part was special, because it was - then - the only 28 W part listed for mobile Ice Lake, with the rest of the CPU lineup having configurable TDPs between 12 W and 25 W - thus having a lesser maximum theoretical performance due to reduced TDP.

In its stead, Intel has entered a new, Core i7-1068NG7 (yes, the same naming with an extra N), which places this as an Apple-exclusive CPU, according to the folks over at Notebookcheck. Besides this entry, Intel has also listed the i5-1038NG7, which also features a 28 W TDP that's higher than the other available CPUs for other system integrators. If this is true, then Intel is reserving its cream-of-the-crop CPUs for Apple. Since the California-based company wouldn't be using parts with worse thermal and power consumption figures than what's available for others, the only answer to how these products came to being is that they are binned CPUs with better than average characteristics. Intel could be doing this to keep Apple happy even as the California-based company is well on its way to eschew its dependence on x86 with a fully internally-developed ARM CPU.

Historically, Intel has separated its processors and chipsets that accompany them to overclockable and non-overclockable ones. That means that only the "K" CPUs can be overclocked. With the latest generation, only some parts of the lineup are K CPUs, like the Core i9-10900K, i7-10700K, i5-10600K, etc. Those processors could only be overclocked one put in motherboards based on "Z" chipset, like Z390 and Z490. However, it seems like ASRock has developed a new technology that will overclock non-K CPUs on non-Z motherboards, which is quite impressive.

Called the Base Frequency Boost (BFB) technology, it will allow for overclocking the non-K processors on chipsets like B460 and H470. How will that work you might wonder? Well, ASRock will take the TDP of the CPUs and make it run in the PL1 mode, which increases the processor TDP form 65 W and turns it into a 125 W TDP beast. This will, of course, be user selective and case dependent, meaning that if your cooling system can not handle that much heat coming out from the overclocked processors, it is unlikely that they will reach the peak clocks ASRock can target. You can check out the slide below:

AMD is readying a new line of Ryzen 3 socket AM4 desktop processors to bolster its competitiveness against the upcoming 10th generation Core i3 processor family, according to OPN details unearthed by @momomo_us. The new line of processors are expected to be based on the "Matisse" MCM, configured with one "Zen 2" chiplet that has a quad-core CPU configuration. Within the chiplet, AMD appears to be achieving 4 cores by disabling one of the two CCXs completely, instead of taking the 2+2 core CCX configuration route. A single CCX with its 16 MB L3 cache, and 2 MB of L2 cache (4x 512 KB) add up to the processor's 18 MB "total cache."

Among the two SKUs existing are the Ryzen 3 3100 (OPN: 100-000000284) and the Ryzen 3 3300X (OPN: 100-000000159). Both are 4-core/8-thread parts with 18 MB total cache, and 65 W TDP. The 3100 is clocked up to 3.90 GHz, and the 3300X up to 4.30 GHz. It remains to be seen if AMD enables features like PCI-Express gen 4.0, and whether the 3100 has an unlocked multiplier. AMD's move to introduce Ryzen 3 "Matisse" parts appears to be necessitated by Intel's 10th gen Core i3. Intel is configuring its next value-segment chips to be 4-core/8-thread at price-points under $160. AMD has older generation Ryzen 5 and Ryzen 3 series parts at these prices, but is lacking on any current-gen product. One area where the 10th gen Core i3 one-ups Ryzen 3 "Matisse" is integrated graphics. Then again, Intel is likely to have "F" SKUs of Core i3 parts with disabled iGPUs, meant for gaming PCs. That's what AMD appears to be going after, to establish the next low-cost gaming PC king.

Reviews of AMD's flagship mobile processor, the Ryzen 9 4900HS went live today, and the verdict is clear. Intel has lost both performance and battery-efficiency leadership over its most lucrative computing segment: mobile client computing. In a Hardware Unboxed review comparing the 4900H to Intel's current Core i9 flagship, the i9-9880H, the AMD chip at its stock 45 W TDP beats the Intel one even with the Intel chip configured to 90 W cTDP.

The 4900HS posts 11.9% higher CineBench R20 score (both chips are 8-core/16-thread) when the Intel chip is bolstered with 90 W cTDP, and a whopping 33% faster when the i9-9980H is at its stock settings, and 54% faster when its capped at 35 W cTDP. It also ends up over 150% faster than AMD's last fastest mobile processor, the 12 nm "Picasso" based Ryzen 7 3750H. The story repeats with CineBench R15 (4900H being 34% faster than stock i9-9880H), 18% faster at Handbrake HEVC, 25% faster at Blender "Classroom," and 35% faster at 7-Zip benchmark. The AMD chip lags behind by 12% in the less-parallelized Photoshop. On creativity apps that do scale with cores, such as Premiere "Warp Stabilizer 4K," the 4900HS is 12.6% faster. Gaming performance remains an even split between the two chips. Find several more interesting test results and commentary in the Hardware Unboxed presentation here. Intel has already announced a response to the 4900HS in the form of the i9-10980HK.

Here are two of the first pictures of Intel's upcoming Core i5-10400 processor, based on the company's 10th generation, 14 nm "Comet Lake-S" silicon. With its 10th generation, Intel is looking to bolster its Core i5 desktop processor series by introducing HyperThreading and increased L3 cache to existing price-points. The i5-10400 is hence a 6-core/12-thread processor with 12 MB of shared L3 cache at its disposal, compared to 9th and 8th generation Core i5 desktop chips being 6-core/6-thread with 9 MB of L3 cache.

The Core i5-10400 succeeds the popular Core i5-9400/F and its equally popular predecessor, the i5-8400. The iGPU-devoid i5-9400F in particular owed its popularity to Intel pricing it $15-20 less than the standard i5-9400. The upcoming i5-10400 is expected to be priced under the $200 mark, with the i5-10400F being similarly discounted. Both chips feature identical CPU specs: 2.90 GHz nominal clock speeds, up to 4.30 GHz maximum Turbo Boost, and 4.00 GHz all-core Turbo Boost. As the chip lacks an unlocked multiplier, its TDP is reportedly rated at 65 W. The chip will compete with AMD's Ryzen 5 3600 for sub-$200 supremacy. The 10th generation Core desktop processor family is built in the new LGA1200 package, and launches alongside the new Intel 400-series chipset, in April.

Ampere Computing, a startup focusing on making HPC and processors from cloud applications based on Arm Instruction Set Architecture, today announced the release of a first 80 core "cloud-native" processor based on the Arm ISA. The new Ampere Altra CPU is the company's first 80 core CPU meant for hyper scalers like Amazon AWS, Microsoft Azure, and Google Cloud. Being built on TSMC's 7 nm semiconductor manufacturing process, the Altra is a CPU that is utilizing a monolithic die to achieve maximum performance. Using Arm's v8.2+ instruction set, the CPU is using the Neoverse N1 platform as its core, to be ready for any data center workload needed. It also borrows a few security features from v8.3 and v8.5, namely the hardware mitigations of speculative attacks.

When it comes to the core itself, the CPU is running at 3.0 GHz frequency and has some very interesting specifications. The design of the core is such that it is 4-wide superscalar Out of Order Execution (OoOE), which Ampere refers to as "aggressive" meaning that there is a lot of data throughput going on. The cache levels are structured in a way that there is 64 KB of L1D and L1I cache per core, along with 1 MB of L2 cache per core as well. For system-level cache, there is 32 MB of L3 available to the SoC. All of the caches have Error-correcting code (ECC) built-in, giving the CPU a much-needed feature. There are two 128-bit wide Single Instruction Multiple Data (SIMD) units, which are there to do parallel processing if needed. There is no mention if they implement Arm's Scalable Vector Extensions (SVE) or not.

SAPPHIRE Technology builds on the reputation and strength of its embedded systems business division by announcing a new series of embedded motherboards with a compact footprint that deliver improved levels of performance, features and stability to customers. Powered by the latest AMD Ryzen Embedded Processor which feature the AMD Radeon "Vega" graphics combined with the high-performance "Zen" CPU, the BP-FP5 and NP-FP5 embedded platforms provide a stable balance of low power consumption and optimized performance for the embedded markets.

According to Paul Smith, Director of SAPPHIRE's Embedded Business Division, "the versatile and effective design of these boards with low power compute and high-resolution multimedia display capability make them perfect for a wide variety of industry applications in the Embedded space such as industrial PC, interactive digital signage, thin clients and POS terminals".

be quiet!, the market leader in PC power supplies in Germany since 2007, announces Shadow Rock 3. This addition to the mid-range CPU cooler lineup of be quiet! features a redesigned heat sink and heat pipe layout and a Shadow Rock 2 fan to increase the rated cooling capacity to 190 W TDP while its asymmetrical design improves compatibility with tall RAM modules.

Compared to its predecessor, Shadow Rock 3 has undergone a substantial redesign. The previous model relied on four 8 mm heat pipes to cool the CPU, while Shadow Rock 3 now implements five 6 mm heat pipes with heat pipe direct touch (HDT) technology. The heat pipes are in direct contact with the processor surface, which results in fast heat transfer from the CPU to the heat sink. The fan has been upgraded to a Shadow Wings 2 120 mm PWM high-speed, which is decoupled from the heatsink and offers a silent operation at no higher than 24.4 dB(A), even at maximum speed. Users who are looking for even higher cooling performance have the option to attach a second fan to the heatsink.

PowerColor today issued a press release where they present the world their new Red Devil and Red Dragon models of AMD's RX 5600 XT graphics cards. This comes after reports on AMD's move towards increasing TDP, memory and core clockspeeds on their new graphics card so as to better compete with NVIDIA's recently price-cut RTX 2060, which would make it a much better performer than AMD's RX 5600 XT at a slightly higher price ($279 vs $299).

Hence a reported strike back from AMD in increasing performance for their RX 5600 XT with increased power envelope (160 W over 150 W), faster memory (at 14 Gbps instead of the original 12 Gbps) and increased core clocks (1615 MHz gaming and 1750 MHz boost, versus 1375 MHz gaming and 1560 MHz on AMD's CES press-event slides). The change in configuration brought about changes in the card design, with the higher-powered Red Devil coming in with 1x 8-pin and 1x 6-pin power delivery inputs, instead of the firstly developed 8-pin only. The changes have been brought about by a BIOS change, and not all cards will ship with the new specifications. However, PowerColor said that a BIOS update will be made available for customers to get their RX 5600 XT on steroids. Of course, whether or not it should be the onus of users to do such an update (which may risk in bricking their graphics card) is another matter entirely. The press release follows.

Intel's upcoming Core i9-10900K desktop processor is up to 30 percent faster than the Core i9-9900K according to the company, which put out a performance guidance slide that got leaked to the web. Based on the 14 nm "Comet Lake-S" silicon and built for the new LGA1200 platform (Intel 400-series chipset motherboards); the i9-10900K is a 10-core/20-thread processor that leverages increased TDP headroom of 125 W to sustain higher clock-speeds than 9th generation "Coffee Lake Refresh," while also offering a 25% increase in processing muscle over the i9-9900K, thanks to the two additional CPU cores.

In its performance guidance slide, Intel shows the i9-10900K scoring 30% more than the i9-9900K in SPECint_rate_base2006_IC16.0. There's also a 25% boost in floating-point performance, in SPECfp_rate_base2006_IC16.0, which roughly aligns with the additional core count, as both these tests are multi-threaded. Other noteworthy results include a 26% gain in Cinebench R15, and 10% in SYSMark 2014 SE. In tests that don't scale with cores, Intel appears to rely entirely on the increased clock-speeds and improved boosting algorithm to eke out performance gains in the low-to-mid single-digit percentages. Intel is introducing a new clock-speed boosting technology called Thermal Velocity Boost, which can dial up clock-speeds of the i9-10900K up to 5.30 GHz.

This piece of news shouldn't surprise anyone, except for the fact that Intel is apparently signing on a TDP of 125 W for even its K-series unlocked processors for their next-generation Comet Lake-S family. Intel's current Comet Lake 9900K CPU features a TDP of "only" 95 W - when compared to the rumored 125 W of the 10900K), whilst their current top offering, the i9-9900KS, features a 127 W TDP. Remember that Intel's 10900K should feature 10 cores and 20 threads, two extra cores than their current 9900K - this should explain the increased TDP, a mathematical necessity given that Intel can only count on marginal improvements to its 14 nm fabrication process to frequencies and power consumption of its CPUs.

A leaked slide from momomo on Twitter shows, if real, that Intel's future enthusiast-grade CPUs (likely i5-10600K, i7-10700K and i9-10900K) will feature this 125 W TDP, while other launches in that family will make do with the more traditional 65 W TDP (interesting to see that Intel has some 10-core CPUs with 65 W TDP, the same as their current 9900, despite two more cores). A footnote on the leaked slide shows that these K processors can be configured for a 95 W TDP, but this would likely come at a significant cost to operating frequency. Intel seems to be bringing a knife to a gunfight (in terms of core counts and TDP) with AMD's Ryzen 3000 and perhaps Ryzen 4000 CPUs, should those and Intel's future offerings actually coexist in the market.

Intel's upcoming LGA1200 mainstream desktop socket (aka socket H5), appears to be cooler-compatible with older LGA115x sockets. This would mean any CPU cooler compatible with sockets LGA1156, LGA1155, LGA1150, and LGA1151, should be mechanically compatible with LGA1200. You'd still need to ensure the cooler has enough thermal capacity to cool some of the higher TDP SKUs such as the range-topping Core i9-10900K.

Comparative mechanical drawings of LGA1200 and LGA1151 were posted by momomo_us and eUUUK50, which show the LGA1200 package to have the same dimensions as the older socket. A picture of the land-grid of an LGA1200 package also leaked to the web, showing how Intel utilized empty bits of the fiberglass substrate to cram in the additional 49 pins, without changing the size of the contacts. The LGA1200 socket debuts with Intel's 10th generation Core "Comet Lake" desktop processors and motherboards based on the company's 400-series chipsets. Intel is expected to launch these processors by Q2-2020.

Following the previous report about AMD's upcoming "Renoir" APU lineup of processors for notebook and desktop, we have new information about the new processor models and their configurations. Supposed to launch in early 2020, the Renoir lineup is supposed to feature up to 8 cores and 16 threads in high-end models. Dubbed Ryzen 4000 series, the new APU lineup will be available in four configurations determined by its TDP: 15 W and 45 W chips for notebooks, and 35 W and 65 W variants meant for desktop.

According to WCCFTech, AMD will launch high-performance Ryzen 9 4900H and Ryzen 7 4800H APUs soon in the first notebooks. Supposed to be part of the "H" series of mobile APUs, these models will feature high core count, that can reach up to 8 cores, SMT support as well, all within TPD of 45 Watts. A power-optimized Ryzen 7 4800HS has also appeared in the listings as a lower clocked alternative to Ryzen 7 4800H, which is supposed to feature lower TDP as well. All of the former processors appear listed as the base of ASUSes upcoming GA401 and GA502 laptops, featuring 16 GB of RAM, Windows 10, and a 14-inch display. While configurations of the laptop will affect its price, Ryzen 7 4800HS powered model is currently listed at 1904 EUR, featuring 16 GB of RAM and 1 TB of storage, so we now have a ballpark price estimate to speculate upon.

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from customers and distributors. The boxed SKU of the E-2274G, which includes a stock cooling solution, has been marked as "discontinued" and "end of life." Intel is offering an E-2274G tray processor (chip-only) as replacement for the returned inventory. The cause for the recall is the cooling solution included in the boxed SKU, which has been found to be insufficient to cool the E-2274G, a 4-core/8-thread processor based on the 14 nm++ "Coffee Lake" microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is supplied by Foxconn, and has been known to be bundled with Intel's entry-level client-segment processors, such as the Pentium Gold series and Core i3 series (chips with TDP typically rated 65 W or less). It features a thin, circular, all-aluminium heatsink, which lacks a copper core that certain other LGA115x-compatible stock coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium surface, with spirally-projecting fins dissipating heat under the fan's airflow. It could be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that's designed for the rigors of mission-critical use-cases such as workstations and small-business servers.Heatsink images courtesy: AndyKingParts (Amazon seller)

Brainbox, a Korean media outlet, has gathered information on Intel's newest Ice Lake and Cooper Lake server processors from a presentation ASUS held for its server lineup. With Cooper Lake-SP paving the way for the first server CPU model to be released on the new "Whitley" platform, it is supposed to launch in Q2 of 2020. Cooper Lake-SP comes with TDP of 300 W and will be available with configurations of up to 48 cores, but there also should be a 56 core model like the Xeon Platinum 9282, that has a TDP of 400 W. Cooper Lake-SP supports up to 64 PCIe 3.0 lanes, 8 channel memory (16 DIMMs in total) that goes up to 3200 MHz and four Ultra Path Interconnect (UPI) links.

Ice Lake-SP, built on the new 10 nm+ manufacturing process, is coming in soon after Cooper Lake-SP release, with a launch window in Q3 of 2020. That is just few months apart from previous CPU launch, so it will be a bit hard to integrate the launches of two rather distinct products. As far as the specifications of Ice Lake-SP goes, it will have up to 38 core for the top end model, within 270 W TDP. It supports 64 PCIe 4.0 lanes with three UPI links. There is also 8 channel memory support, however this time there is an option to use 2nd generation Optane DC Persistent Memory. Both CPU uArches will run on the new LGA 4189 on the P+ socket.

AMD's latest Product Master guide (since taken down but immortalized in the interweb) has a surprise in store for AMD's Ryzen 7 desktop CPU lineup. Sandwiched in-between the Ryzen 7 3700X and the Ryzen 7 3800X, a new entry has reared its head, in the form of the Ryzen 7 3750X. The new CPU is specified to keep the same 105 W TDP of its elder sibling Ryzen 7 3800X, instead of keeping the Ryzen 7 3700X's 65 W TDP. Technically, this is possible to achieve in both pricing and performance: the Ryzen 7 3750X, if it ever is launched (it could be a specific release for system integrators or other interested parties outside the usual mainstream desktop suspects) could sport increased base clocks compared to the Ryzen 7 3700X's 3.6 GHz base / 4.4 GHz boost clocks... But not easily, considering the Ryzen 7 3800X starts at 3.9 GHz base / 4.5 GHz boost. It's possible to release the 3750X with a 200 MHz boost on base clocks and the same 4.4 GHz boost, but does it make any sense to do so?

It could - even if with some forced optimism - should AMD price it closer to the Ryzen 7 3700X than to the Ryzen 7 3800X. The $329 and $399 prices for those CPUs, respectively, leave a gap that could be filled by the Ryzen 7 3750X at around the $349 mark, for example. It's likely most users would be making the jump from the 65 W CPU than dropping less cash compared to the 3800X, so AMD's margins per sale would definitely improve. At the same time, this could be a way for AMD to cope with TSMC's 7 nm increase in lead-times and lower availability of CPUs by moving stock from the 65 W CPU to the pricier 3750X in parts that can actually run at those frequencies. Driving their lineup's ASP up ensures AMD can keep a steady stream of income should availability decline - less parts sold at a greater price can shore up some of the lost cash influx.

The AMD Embedded business provides SoCs and discrete GPUs that enable casino gaming companies to create immersive and beautiful graphics for the latest in casino gaming platforms, which are adopting the same high-quality motion graphics and experiences seen in modern consumer gaming devices. AMD Embedded provides casino and gaming customers a breadth of solutions to drive virtually any gaming system. The AMD Ryzen Embedded V1000 SoC brings CPU and GPU technology together in one package, providing the capability to run up to four 4K displays from one system. The AMD Ryzen Embedded R1000 SoC is a power efficient option while providing up to 4X better CPU and graphics performance per dollar than the competition.

Beyond SoCs, AMD also offers embedded GPUs to enable stunning, immersive visual experiences while supporting efficient thermal design power (TDP) profiles. AMD delivers three discrete GPU classes to customers with the AMD Embedded Radeon ultra-high-performance embedded GPUs, the AMD Embedded Radeon high-performance embedded GPUs and the AMD Embedded Radeon power-efficient embedded GPUs. These three classes enable a wide range of performance and power consumption, but most importantly offer features that the embedded industry demands including planned longevity, enhanced support and support for embedded operating systems.

AMD Tuesday expanded its 3rd generation Ryzen desktop processor lineup with two new product additions, the 12-core/24-thread Ryzen 9 3900, and the 6-core/12-thread Ryzen 5 3500X. Both chips are particularly interesting given their naming. The 3900 is a slightly subdued twin of the company's current flagship, the 3900X, with a small amount of clock speed traded off for a huge drop in TDP. This chip ticks at 3.10 GHz with 4.30 GHz boost, compared to 3.80/4.60 GHz frequencies of the 3900X. Its TDP, however, is rated at just 65 W, compared to 105 W of the 3900X. You get 512 KB of dedicated L2 cache per core, and 64 MB of L3 cache.

The Ryzen 5 3500X is another interesting part, in which the "X" makes a world of difference from the Ryzen 5 3500. Whilst the 3500 is a 6-core/6-thread part devoid of SMT, the 3500X is 6-core/12-thread (features SMT), has the same exact 3.60 GHz nominal clocks as the popular Ryzen 5 3600, but a slightly lower 4.10 GHz boost frequency, compared to 4.20 GHz of the 3600. The Ryzen 5 3500X is expected to be marginally cheaper than the 3600, at around $189, and is currently only being offered to OEMs and system integrators in China. The company hasn't finalized pricing for the 3900, yet.

Intel's upcoming 5 GHz-on-all-cores Core i9-9900KS will certainly be a beast of a processor for the company - in more ways than one. The 8-core, 16-thread 5 5 GHz all-core turbo CPU will be Intel's best-performing consumer CPU for a while. The steps taken to ensure that have been the only ones Intel could do with their current CPU design and fabrication process - increase the TDP and improve all-core boost frequency, which should allow the CPU to perform incredibly well in peak performance.

The question that remains, of course, is how long the CPU will actually be able to keep its 5.0 GHz all-core frequency when it's engaged. The 127 W TDP as outed by an ASUS BIOS is a monstrous amount for an 8-core CPU, and I don't envy the heatsinks that will have to keep it in check. All in all, this seems to be nothing more than a CPU binned for Intel's purposes of becoming the best CPU for gaming and "home user relevant applications".

We originally covered Intel's work on the (more) energy-efficient version of their Core i9-9900 processor back in January. However, it seems that the company has improved the i9-9900T's performance before final release. Initial specifications for the processor were expected to deliver a 1.70 GHz base clock (down from 3.60 GHz of the original i9-9900K), with 1~2 core Turbo Boost frequency down to 3.80 GHz. However, the Geekbench benchmarks show a different story, one that's much more appealing to users: Intel managed to keep the 35 W TDP target, but base clocks stand at a much more interesting 2.1 GHz and much improved Boost clocks of 4.4 GHz.

This is good news, as performance is sure to be better than initially expected. However, this seems like a necessary move from Intel - AMD's Ryzen 3000 processors would be staring hungrily to Intel's 9900T otherwise (and likely still are). The eight cores, 16 threads, 16 MB of cache and Intel UHD Graphics 630 are kept from the original part. The test scores pitting it against an Intel i9-9900KS show an expected drop in performance compared to the faster processor. The Core i9-9900T has an Intel-set pricing of $439.

When AMD launched its Ryzen 9 3900X 12-core/24-thread processor at its Computex 2019 keynote, our readers commented on the notable absence of a 16-core SKU, given that a "Matisse" multi-chip module with two 8-core "Zen 2" chiplets adds up to that core-count. Some readers noted this could be a case of AMD holding back its top performing part in the absence of competition in the segment from Intel. It turns out, the company was saving this part up for an E3 2019 unveiling.

The Ryzen 9 3950X maxes out "Matisse" MCM with 16 cores, 32 threads via SMT, a staggering 64 MB of L3 cache (72 MB including the 8 MB of total L2 cache), and a stunning 105-Watt TDP figure that's unchanged from the company's TDP for the 3900X. The Ryzen 9 3950X is clocked at 3.50 GHz, with a maximum boost frequency of 4.70 GHz. The company is yet to reveal its price, but given that the $499 price-tag has already been taken by the 3900X, one could expect an even higher price. It remains to be seen if the 3950X will launch alongside the rest of the series on 7/7.