Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry's first removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard*, for use in high-resolution mobile shooting devices such as DSLRs, 3D VR cameras, action cams and drones. Coming in a wide range of storage capacities including 256, 128, 64 and 32 gigabyte (GB), Samsung's UFS cards are expected to bring a significant performance boost to the external memory storage market, allowing much more satisfying multimedia experiences.

"Our new 256GB UFS card will provide an ideal user experience for digitally-minded consumers and lead the industry in establishing the most competitive memory card solution," said Jung-bae Lee, senior vice president, Memory Product Planning & Application Engineering, Samsung Electronics "By launching our new high-capacity, high-performance UFS card line-up, we are changing the growth paradigm of the memory card market to prioritize performance and user convenience above all."

Micron Technology, Inc., (Nasdaq:MU) today introduced the company's first 3D NAND memory technology optimized for mobile devices and its first products based on the Universal Flash Storage (UFS) 2.1 standard. Micron's initial mobile 3D NAND-based 32GB solution is targeted specifically for the high and mid-end smartphone segments which make up approximately 50 percent of worldwide smartphone volume[1]. As mobile devices bypass personal computers as consumers' primary computing device, user behaviors heavily impact the device's mobile memory and storage requirements. Micron's mobile 3D NAND addresses these concerns, enabling an unparalleled user experience that includes seamless high definition video streaming, higher bandwidth gameplay, faster boot up times, camera performance and file loading.

"Micron continues to advance NAND technology with our introduction of 3D NAND and UFS products for the mobile segment," said Mike Rayfield, vice president of Micron's mobile business unit. "The improved performance, higher capacity and enhanced reliability of 3D NAND will help our customers meet the ever-growing demand for mobile storage and will enable much more exciting end user experiences."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of several key updates to the Universal Flash Storage (UFS) family of standards. These include JESD220C UFS version 2.1, JESD223C UFSHCI version 2.1, JESD220-1A UFS UME version 1.1 and JESD223-1A UFSHCI UME version 1.1.

Developed for mobile applications and computing systems requiring high performance with low power consumption, the new UFS updates offer key improvements over earlier versions which will provide data security through the use of inline cryptography between the SoC and UFS Storage device. All four updated standards are available for free download from the JEDEC website.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220-2 Universal Flash Storage (UFS) Card Extension Standard. The new removable memory card standard standardizes functionality that aligns with the popular UFS embedded device standard. JESD220-2 is available for free download from the JEDEC website.

UFS is a high performance interface designed for use in computing and mobile systems such as smart phones and tablets where power consumption needs to be minimized. Its high speed serial interface and optimized protocol enable significant improvements in throughput and mobile system performance. The new UFS card standard provides a leading-edge removable storage solution while maintaining sequential and random IOPS performance that is critical for future mobile markets. Even using a single lane the UFS 1.0 card offers 600 MB/s interface speed in both directions and a state-of-the-art queuing mechanism to further increase system throughput.

SK Hynix Inc. announced it has developed UFS (Universal Flash Storage) 2.0 64 GB (Gigabytes) solution based on its own 16 nm NAND Flash and in-house firmware and controller. This UFS 2.0 represents a groundbreaking leap in performance by enabling High-Speed Gear 3 interface with dual data lanes.

UFS 2.0 is the next generation of embedded flash memory to eMMC for mobile IT gadgets which drives a remarkable boost in reading/writing speed at low power and supports high density. The Company's UFS 2.0 operates at 780 MB/s(Megabytes per second) and 160 MB/s of sequential read/write speed and runs random read/write speed at 32,000 IOPS and 17,000 IOPS. As a result, it works three times faster in read speed than eMMC 5.1.

In addition, this UFS 2.0 utilizes 'Command Queue' technology used in SSD solutions to handle read and write commands simultaneously to achieve data operation efficiency by preventing buffering load in multi-tasking and ordering priorities of data works. To maximize prioritized command processing feature of UFS standard, the device employs 'Multi-Thread' read processing internally to ensure that high priority command is serviced first irrespective of other outstanding tasks, delivering fast response to time-critical host requests for best user experience. In consequence, it realizes even better performance in speed and power consumption over eMMC.