On July 1st, Reuters reported that the French antitrust authority plans to file charges against NVIDIA for alleged anti-competitive practices, marking France as the first country to take such action against the tech giant. This follows a raid on NVIDIA's local offices in September 2023, as we reported here, which was part of a broader investigation into the graphics card and cloud computing sectors. A recent report released by French authorities regarding competition in generative AI highlighted concerns about potential abuses of power by chip suppliers, specifically noting the industry reliance on NVIDIA. If NVIDIA is to be found guilty of charges made by French authorities it can be facing fines of up to 10% of its global annual revenue. However, NVIDIA may have the option to make concessions to avoid such penalties.

As the world's largest manufacturer of AI chips and computer graphics cards, NVIDIA is under intense scrutiny from antitrust authorities in Europe and the United States. The European Commission is gathering informal feedback to assess whether NVIDIA had breached its antitrust rules, though it has not yet launched a formal investigation. The Department of Justice and Federal Trade Commission are reportedly conducting joint investigations into NVIDIA, Microsoft, and OpenAI, reflecting growing regulatory concern in the United States over these tech giants' market influence.

A recent report from Taiwan TV News has revealed that TSMC's overseas expansion plans will only contribute around 10% of the company's total silicon production capacity. TSMC's overseas expansion strategy has been a topic of significant interest in the tech industry as the company seeks to diversify its manufacturing capabilities beyond its home base in Taiwan. The company has announced plans to build new fabrication plants in the United States, Japan, and potentially other regions in an effort to mitigate supply chain risks and better serve its global customer base. However, according to the report, these overseas facilities will only account for a small fraction of 10% of TSMC's overall production capacity.

The majority of the company's manufacturing will continue to be centered in Taiwan, where it maintains its most advanced and high-volume fabs. There are also significant challenges and investments required to establish new semiconductor manufacturing facilities overseas. Building a state-of-the-art fab can cost billions of dollars and take several years to complete, making it a complex and capital-intensive undertaking. Despite the relatively small contribution of its overseas facilities, TSMC's global expansion is still seen as a crucial step in diversifying its supply chain and mitigating geopolitical risks. The company's ability to maintain its technological leadership and meet the growing demand for advanced chips will be crucial in the years to come.

Micron has announced more precise timeframes for the commencement of operations at its two new memory facilities in the United States during its Q3 FY2024 results presentation. The company expects these fabs, located in Idaho and New York, to begin production between late 2026 and 2029. The Idaho fab, currently under construction near Boise, is slated to start operations between September 2026 and September 2027. Meanwhile, the New York facility is projected to come online in the calendar year 2028 or later, pending the completion of regulatory and permitting processes. These timelines align with Micron's original plans announced in 2022 despite recent spending optimizations. The company emphasizes that these investments are crucial to support supply growth in the latter half of this decade.

Micron's capital expenditure for FY2024 is set at approximately $8 billion, with a planned increase to around $12 billion in FY2025. This substantial rise in spending, targeting a mid-30s percentage of revenue, will support various technological advancements and facility expansions. A substantial portion of this increased investment - over $2 billion - will be dedicated to constructing the new fabs in Idaho and New York. Additional funds will support high-bandwidth memory assembly and testing, as well as the development of other fabrication and back-end facilities. Sanjay Mehrotra, Micron's CEO, underscored the importance of these investments, stating that the new capacity is essential to meet long-term demand and maintain the company's market position. He added that these expansions, combined with ongoing technology transitions in Asian facilities, will enable Micron to grow its memory bit supply in line with industry demand.

PC (excluding tablets) shipments to the United States grew 5% year-on-year to 14.8 million units in Q1 2024. The consumer and SMB segments were the key growth drivers, both witnessing shipment increases above 9% year-on-year in the first quarter. With a strong start to the year, the market is now poised for a healthy recovery trajectory amid the ongoing Windows refresh cycle. Total PC shipments to the US are expected to hit 69 million units in 2024 before growing another 8% to 75 million units in 2025.

For the third consecutive quarter, the consumer segment showed the best performance in the US market. "Continued discounting after the holiday season boosted consumer demand for PCs into the start of 2024," said Greg Davis, Analyst at Canalys. "However, the first quarter also saw an uptick in commercial sector performance. Shipment growth in small and medium businesses indicates that the anticipated refresh brought by the Windows 10 end-of-life is underway. With enterprise customers set to follow suit, the near-term outlook for the market remains highly positive."

The United States Federal Trade Commission (FTC) has taken legal action against software giant Adobe and two of its top executives for allegedly deceiving consumers about the actual costs of its popular subscription services and deliberately obstructing cancellations. In a federal court complaint filed by the Department of Justice at the FTC's request, the commission accuses Adobe of obscuring hefty early termination fees and making it excessively difficult for customers to cancel their subscriptions. The complaint alleges that when signing up for subscriptions on Adobe's website, the company steers consumers toward the "annual paid monthly" option, pre-selecting it as the default while burying details about the 50% early termination fee for canceling within the first year. Customers have lodged numerous complaints, saying they were unaware the plan committed them for a full year.

According to the FTC, even when customers did attempt to cancel, Adobe forced them to navigate a bureaucratic maze of web pages, unhelpful customer service reps, dropped calls, and transfers. Some customers who thought they had successfully canceled continued to be charged. Samuel Levine, Director of the FTC's Bureau of Consumer Protection, noted, "Adobe trapped customers into year-long subscriptions through hidden early termination fees and numerous cancellation hurdles." The complaint charges that these deceptive "dark patterns" violate the Restore Online Shoppers' Confidence Act. It names Adobe's President of Digital Media, David Wadhwani, and Vice President Maninder Sawhney as co-defendants for their oversight roles in these shady business practices.

XFX has prepared its newest "Magnetic Air" series of Radeon RX 7000 series GPUs with hot-swappable fans for the US market, where they were only exclusive to the Chinese region. The company has informed us that the series will be called "Magnetic Air," instead of the previously believed "MagAir." Comprising the XFX Qicksilver Radeon RX 7800 XT Magnetic Air and the XFX Mercury Radeon RX 7900 XTX Magnetic Air, these GPUs are now available for purchase in the US, with an official launch date set for June 18. What sets the Magnetic Air series apart is its unique cooling design, featuring Honeywell PTM 7950 phase-changing thermal pads that offer superior thermal conductivity. The cooling system boasts 216 ultra-thin matrix fins strategically arranged in a high and low structure to optimize airflow, while the heatsink is attached to a vapor chamber for efficient heat dissipation. Additionally, the backplate is crafted from durable aluminium die-cast, ensuring long-lasting performance.

The XFX Qicksilver Radeon RX 7800 XT Magnetic Air is available in both white and black variants, priced at $529.99, while the XFX Mercury Radeon RX 7900 XTX Magnetic Air carries a price tag of $979.99. The most innovative feature of the Magnetic Air series is its swappable fan design, allowing users to customize their cooling setup to suit their specific needs. This level of flexibility is sure to appeal to enthusiasts and overclockers seeking optimal performance from their rigs. Currently, only the black variants of the 7900XTX and 7800XT are in stock, but all Magnetic Air models are expected to be available on the official launch date of June 18 for PC enthusiasts in the United States.

[Editor's note: Our in-depth review of the RX 7900 XTX Magnetic Air is now live]

The 63rd edition of the TOP500 reveals that Frontier has once again claimed the top spot, despite no longer being the only exascale machine on the list. Additionally, a new system has found its way into the Top 10.

The Frontier system at Oak Ridge National Laboratory in Tennessee, USA remains the most powerful system on the list with an HPL score of 1.206 EFlop/s. The system has a total of 8,699,904 combined CPU and GPU cores, an HPE Cray EX architecture that combines 3rd Gen AMD EPYC CPUs optimized for HPC and AI with AMD Instinct MI250X accelerators, and it relies on Cray's Slingshot 11 network for data transfer. On top of that, this machine has an impressive power efficiency rating of 52.93 GFlops/Watt - putting Frontier at the No. 13 spot on the GREEN500.

The US government is investigating the potential national security risks associated with China's involvement in the development of open-source RISC-V chip technology. According to a letter obtained by Reuters, the Department of Commerce has informed US lawmakers that it is actively reviewing the implications of China's work in this area. RISC-V, an open instruction set architecture (ISA) created in 2014 at the University of California, Berkeley, offers an alternative to proprietary and licensed ISAs like those developed by Arm. This open-source ISA can be utilized in a wide range of applications, from AI chips and general-purpose CPUs to high-performance computing applications. Major Chinese tech giants, including Alibaba and Huawei, have already embraced RISC-V, positioning it as a new battleground in the ongoing technological rivalry between the United States and China over cutting-edge semiconductor capabilities.

In November, a group of 18 US lawmakers from both chambers of Congress urged the Biden administration to outline its strategy for preventing China from gaining a dominant position in RISC-V technology, expressing concerns about the potential impact on US national and economic security. While acknowledging the need to address potential risks, the Commerce Department noted in its letter that it must proceed cautiously to avoid unintentionally harming American companies actively participating in international RISC-V development groups. Previous attempts to restrict the transfer of 5G technology to China have created obstacles for US firms involved in global standards bodies where China is also a participant, potentially jeopardizing American leadership in the field. As the review process continues, the Commerce Department faces the delicate task of balancing national security interests with the need to maintain the competitiveness of US companies in the rapidly evolving landscape of open-source chip technologies.

Last month, we covered ASML's plans to leave the Netherlands after a crisis with the Dutch government that prevented skilled immigrants from entering and working inside ASML's facilities. However, it appears that ASML has managed to strike a potential deal with the Netherlands Prime Minister Mark Rutte and his office about the company's plans to stay in the country. In an effort dubbed "Operation Beethoven," the Dutch government aimed to keep the tech giant in the country, with a deal now seemingly in place. AMSL's roadblocks and reasons for potentially leaving the Netherlands were difficulty in obtaining building permits, constraints on the electrical grid, transportation bottlenecks, and a need for supporting infrastructure like hospitals, schools, and housing. The most prominent of them was importing foreign labor in the form of highly skilled engineers and scientists needed to develop next-generation lithography machines.

According to the NLTimes, ASML now plans to potentially expand in the Brainport Industries Campus (BIC) in Eindhoven, with a creation of 20,000 new jobs in a 2.5 billion Euro investment from the Dutch government. "BIC is an interesting option for us, which we are now exploring together with the municipality of Eindhoven," noted ASML CFO Roger Dassen. Given that ASML needs to double its operations in the following decade to meet soaring demand, the company has many uncertainties. Questions of finding skilled immigrants and building infrastructure to support their needs remain the company's priority. In the Summer, the plan to support ASML's expansion will be voted in the Eindhoven City Council, which will decide the fate of ASML's stay in the Netherlands. An interesting comment from January from AMSL CEO Peter Wennik is, "Ultimately, we can only grow this company if there are enough qualified people. We prefer to do that here, but if we cannot get those people here, we will get those people in Eastern Europe or in Asia or in the United States. Then we will have to go there." The final decision still awaits.

As a part of its Q1 earnings call discussion, one of the largest semiconductor manufacturers, TSMC, has unveiled a strategic move to charge a premium for chips manufactured at its newly established overseas fabrication plants. During an earnings call, TSMC's CEO, C.C. Wei, announced that the company will impose higher pricing for chips produced outside Taiwan to offset the higher operational costs associated with these international locations. This move aims to maintain TSMC's target gross margin of 53% amidst rising expenses such as inflation and elevated electricity costs. This decision comes as TSMC expands its global footprint with new facilities in the United States, Germany, and Japan (JAMS) to meet the increasing demand for semiconductor chips worldwide. The company's new US-based Arizona facility, known as Fab 21, has faced delays due to equipment installation issues and labor negotiations.

Chips produced at this site, utilizing TSMC's advanced N5 and N4 nodes, could cost between 20% to 30% more than those manufactured in Taiwan. TSMC's strategy to manage the cost disparities across different geographic locations involves strategic pricing, securing government support, and leveraging its manufacturing technology leadership. This approach reflects the company's commitment to maintaining its competitive edge while navigating the complexities of global semiconductor manufacturing in today's fragmented market. Introducing a location premium is expected to impact American semiconductor designers, who may need to pass these costs on to specific market segments, particularly those with lower price sensitivity, such as government-related projects. Despite these challenges, TSMC's overseas expansion underscores its adaptive strategies in the face of global economic pressures and industry demands, ensuring its continued position as a leading player in the semiconductor industry.

On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

SK hynix Inc., the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation's AI supply chain, while bringing more than a thousand new jobs to the region.

The company held an investment agreement ceremony with officials from Indiana State, Purdue University, and the U.S. government at Purdue University in West Lafayette on the 3rd and officially announced the plan. At the event, officials from each party including Governor of Indiana Eric Holcomb, Senator Todd Young, Director of the White House Office of Science and Technology Policy Arati Prabhakar, Assistant Secretary of Commerce Arun Venkataraman, Secretary of Commerce State of Indiana David Rosenberg, Purdue University President Mung Chiang, Chairman of Purdue Research Foundation Mitch Daniels, Mayor of city of West Lafayette Erin Easter, Ambassador of the Republic of Korea to the United States Hyundong Cho, Consul General of the Republic of Korea in Chicago Junghan Kim, SK vice chairman Jeong Joon Yu, SK hynix CEO Kwak Noh-Jung and SK hynix Head of Package & Test Choi Woojin, participated.

The Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. CHIPS Act funding aims to increase U.S. semiconductor manufacturing and research and development capabilities, especially in leading-edge semiconductors. Intel is the only American company that both designs and manufactures leading-edge logic chips. The proposed funding would help advance Intel's critical semiconductor manufacturing and research and development projects at its sites in Arizona, New Mexico, Ohio and Oregon, where the company develops and produces many of the world's most advanced chips and semiconductor packaging technologies.

"Today is a defining moment for the U.S. and Intel as we work to power the next great chapter of American semiconductor innovation," said Intel CEO Pat Gelsinger. "AI is supercharging the digital revolution and everything digital needs semiconductors. CHIPS Act support will help to ensure that Intel and the U.S. stay at the forefront of the AI era as we build a resilient and sustainable semiconductor supply chain to power our nation's future."

Soon, you'll be able to play your favorite games from GOG, like the Witcher series or Cyberpunk 2077, on multiple devices of your choice. We're teaming up with Amazon Luna cloud gaming service to give you even more ways of enjoying your titles, while still keeping our mission of DRM-free gaming. Let's dive into it and take a look at how it works!

What exactly is Amazon Luna?
It is a cloud gaming service developed and operated by Amazon. The service first launched in March 2022 in the United States, and then spread its reach to other countries last year, with availability in the USA, Canada, UK, Germany, France, Italy, and Spain. Luna works by streaming games from cloud servers and runs on Amazon's powerful cloud computing service Amazon Web Services (AWS). And what it means is that it allows its customers to enjoy gaming on the go, on the couch, or anywhere else you have an internet connection. No lengthy downloads or updates, no need for an expensive gaming PC, complicated setup, or heavy computer processing - just pure joy of running your games on a device of your choice in high-quality.

According to the latest report by Reuters, the US government is preparing to announce a multi-billion dollar grant for Intel's chip manufacturing operations in Arizona next week, possibly worth more than $10 billion. US President Joe Biden and Commerce Secretary Gina Raimondo will make the announcement, which is part of the 2022 CHIPS and Science Act aimed at expanding US chip production and reducing dependence on China and Taiwan manufacturing. The exact amount of the grant has yet to be confirmed, but rumors suggest it could exceed $10 billion, making it the most significant award yet under the CHIPS Act. The funding will include grants and loans to bolster Intel's competitive position and support the company's US semiconductor manufacturing expansion plans. This comes as a surprise just a day after the Pentagon reportedly refused to invest $2.5 billion in Intel as a part of a secret defense grant.

Intel has been investing significantly in its US expansion, recently opening a $3.5 billion advanced packaging facility in New Mexico, supposed to create extravagant packaging technology like Foveros and EMIB. The chipmaker is also expanding its semiconductor manufacturing capacity in Arizona, with plans to build new fabs in the state. Arizona is quickly becoming a significant hub for semiconductor manufacturing in the United States. In addition to Intel's expansion, Taiwan Semiconductor Manufacturing Company (TSMC) is also building new fabs in the state, attracting supply partners to the region. CHIPS Act has a total funding capacity of $39 billion allocated for semiconductor production and $11 billion for research and development. The Intel grant will likely cover the production part, as Team Blue has been reshaping its business units with the Intel Product and Intel Foundry segments.

Game File reporter, Stephen Totilo, has discovered a new Nintendo-filed legal document—the Japanese multinational video game company's North American office is ready to do battle (in court) with Tropic Haze. The latter's Yuzu Switch Emulator is the focus of Nintendo's legal case—initiated on February 26, at the United States District Court for the District of Rhode Island. Totilo's social media summary of goings-on stated: "Nintendo is suing the creators of popular Switch emulator Yuzu, saying their tech illegally circumvents Nintendo's software encryption and facilitates piracy. Seeks damages for alleged violations and a shutdown of the emulator." The Dolphin Emulator—a Gamecube and Wii emulation platform—was removed from Valve's Steam store last year, following the sending of a Digital Millennium Copyright Act (DMCA) takedown order, but its development team was not pursued in US courts. The House of Mario is reportedly fiercely protective of its intellectual properties and technologies—gaining a hard-nosed reputation for engaging in plenty of legal action over decades past.

Nintendo's federal-level lawsuit alleges that Tropic Haze's Yuzu Switch Emulator played a large part in widespread illegal distribution of a 2023 flagship game title. They believe that "The Legend of Zelda: Tears of the Kingdom" was pirated over one million times in a time period prior to its official launch on Switch consoles, while Yuzu's Patreon funding almost doubled within the same cycle. Nintendo stated (through filed documentation): "With Yuzu in hand, nothing stops a user from obtaining and playing unlawful copies of virtually any game made for the Nintendo Switch, all without paying a dime to Nintendo or to any of the hundreds of other game developers and publishers making and selling games for the Nintendo Switch...In effect, Yuzu turns general computing devices into tools for massive intellectual property infringement of Nintendo and others' copyrighted works." They argue that Yuzu is capable of circumventing the Switch console's many layers of encryption—Tropic Haze's software, in their opinion, is "primarily designed" to break Switch software protections.

Dylan Patel, of SemiAnalysis, has highlighted worrying industry trends from an October 2021 published report—the Center for Security and Emerging Technology (CSET) document explored and "(outlined) infrastructure investments and regulatory reforms that could make the United States a more attractive place to build new chipmaking capacity and ensure continued U.S. access to key inputs for semiconductor manufacturing." Citing CSET/World Fab Forecast findings, Patel expressed his dissatisfaction with the apparent lack of progress in the region: "The United States is the slowest relevant country in the world to build a fab thanks to NIMBY assholes and the garbage regulatory/permitting system." The SemiAnalysis staffer likely believes that unsuitable conditions remain in place, and continue to hinder any forward momentum—for greenfield fabrications projects, at least.

The CSET 2021 report posited that the proposed $52 billion CHIPS Act fund would not solve all USA chip industry problems—throwing a large sum of money into the pot is not always a surefire solution: "The United States' ability to expeditiously construct fabs has declined at the same time as the total number of fab projects in the United States has declined. Some of this is due to changes in the global semiconductor value chain, which has concentrated resources in Asia as foundries have risen in prominence, and countries like Taiwan, South Korea, and China have established significant market share in the industry from 1990 to 2020. However, during this same 30-year period, the time required to build a new fab in the United States increased 38 percent, rising from an average of 665 days (1.8 years) during the 1990 to 2000 time period to 918 days (2.5 years) during the 2010-2020 time period (Figure 2). At the same time, the total number of new fab projects in the United States was halved, decreasing from 55 greenfield fab projects in the 1990-2000 time period to 22 greenfield fab projects between 2010 and 2020." Intel's work-in-progress Ohio fabrication site has suffered numerous setbacks (including delayed CHIPS Act payments)—the latest news articles suggest that an opening ceremony could occur in late 2026 or early 2027. Reportedly, TSMC's Arizona facility is a frequently runs into bureaucratic and logistical headaches—putting pressure on company leadership at their Hsinchu (Taiwan) headquarters.

In a major stride toward building a shared national research infrastructure, the U.S. National Science Foundation has launched the National Artificial Intelligence Research Resource pilot program with significant support from NVIDIA. The initiative aims to broaden access to the tools needed to power responsible AI discovery and innovation. It was announced Wednesday in partnership with 10 other federal agencies as well as private-sector, nonprofit and philanthropic organizations. "The breadth of partners that have come together for this pilot underscores the urgency of developing a National AI Research Resource for the future of AI in America," said NSF Director Sethuraman Panchanathan. "By investing in AI research through the NAIRR pilot, the United States unleashes discovery and impact and bolsters its global competitiveness."

NVIDIA's commitment of $30 million in technology contributions over two years is a key factor in enlarging the scale of the pilot, fueling the potential for broader achievements and accelerating the momentum toward full-scale implementation. "The NAIRR is a vision of a national research infrastructure that will provide access to computing, data, models and software to empower researchers and communities," said Katie Antypas, director of the Office of Advanced Cyberinfrastructure at the NSF. "Our primary goals for the NAIRR pilot are to support fundamental AI research and domain-specific research applying AI, reach broader communities, particularly those currently unable to participate in the AI innovation ecosystem, and refine the design for the future full NAIRR," Antypas added.

The artificial intelligence boom is driving a sharp rise in electricity use across the United States, catching utilities and regulators off guard. In northern Virginia's "data center alley," demand is so high that the local utility temporarily halted new data center connections in 2022. Nation-wide, electricity consumption at data centers alone could triple by 2030 to 390 TeraWatt Hours. Add in new electric vehicle battery factories, chip plants, and other clean tech manufacturing spurred by federal incentives, and demand over the next five years is forecast to rise at 1.5%—the fastest rate since the 1990s. Unable to keep pace, some utilities are scrambling to revise projections and reconsider previous plans of closing fossil fuel plants even as the Biden administration pushes for more renewable energy. Some older coal power plans will stay online, until the grid adds more power production capacity. The result could be increased emissions in the near term and risks of rolling blackouts if infrastructure continues lagging behind demand.

The situation is especially dire in Virginia, the world's largest data center hub. The state's largest utility, Dominion Energy, was forced to pause new data center connections for three months last year due to surging demand in Loudoun County. Though connections have resumed, Dominion expects load growth to almost double over the next 15 years. With data centers, EV factories, and other power-hungry tech continuing rapid expansion, experts warn the US national electricity grid is poorly equipped to handle the spike. Substantial investments in new transmission lines and generation are urgently needed to avoid businesses being turned away or blackouts in some regions. Though many tech companies aim to power operations with clean energy, factories are increasingly open to any available power source.

Forza Motorsport Update 4 introduces the prestigious Daytona International Speedway—a truly iconic racetrack renowned for its marvels in engineering. Meanwhile, a new Italian Challengers Featured Tour invites you to build four staples of Italy's automotive heritage! Let's dive into the details. Update 4 will be available to download on Xbox Series X|S, Windows PCs and Steam beginning on Tuesday, January 16. New events across the Career, Featured Multiplayer and Rivals will start on Thursday, January 18.

Get ready for race weekend with Daytona, new Spotlight cars and the Italian Challengers Tour
On Tuesday we'll share details about the fixes contained in Update 4. This version is focused on new content and events, and contains only minor fixes for car and track content compared to our previous updates. Work on game fixes to address top community issues is ongoing—look out for additional improvements in Update 5 and beyond.

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.

The United States is softening restrictions on the significant GPU maker NVIDIA, selling artificial intelligence chips to China. While still limiting advanced chip exports deemed strategically threatening, Commerce Secretary Gina Raimondo clarified this week that NVIDIA could supply some AI processors to Chinese commercial companies. Previously, Raimondo had sharply criticized NVIDIA for attempting to sidestep regulations on selling powerful GPUs abroad. Her comments followed rumors that NVIDIA tweaked chip designs to avoid newly imposed export controls narrowly. However, after discussions between Raimondo and NVIDIA CEO Jensen Huang, the Commerce Department says NVIDIA and other US firms will be permitted to export AI chips to China for general commercial use cases. Exports are still banned on the very highest-end GPUs that could enable China to train advanced AI models rivaling American developments.

Raimondo said NVIDIA will collaborate with the US to comply with the export rules. Huang reaffirmed the company's commitment to adherence. The clarification may ease pressures on NVIDIA, as China accounts for up to 25% of its revenue. While optimistic about recent Chinese approvals for US joint ventures, Raimondo noted frustrations linger around technology controls integral to national security. The nuanced recalibration of restrictions illustrates the balances the administration must strike between economic and security interests. As one of the first big US technology exporters impacted by tightened restrictions, NVIDIA's ability to still partly supply the valuable Chinese chip market points to a selective enforcement approach from regulators in the future.

Lenovo (United States) Inc., part of the global technology corporation, Lenovo Group, filed a patent infringement action on November 15th with the United States International Trade Commission (ITC) against ASUSTeK Computer Inc. and ASUS Computer International (ASUS) for infringement of a variety of Lenovo's patents related to software, hardware, and connectivity across multiple ASUS products. The action is in response to ASUS's August 2023 filings in the Regional Court of Munich related to cellular technologies, where Lenovo had offered a cross-licensing deal as a solution.

Lenovo is a strong proponent of cross-licensing agreements, open and transparent negotiations, and licensing within the industry on fair, reasonable, and non-discriminatory (FRAND) terms. This is evidenced by the Group's ongoing litigation with InterDigital, where it advocated for greater transparency and less discrimination in licensing negotiations and was proven by the UK Court to be a willing licensee. The action against ASUSTeK reflects the Group's commitment to protecting its significant contributions to technology innovation and industry "firsts" over the past 39 years, building a portfolio of over 28,000 patents with a further 14,000 applications pending.

The 62nd edition of the TOP500 reveals that the Frontier system retains its top spot and is still the only exascale machine on the list. However, five new or upgraded systems have shaken up the Top 10.

Housed at the Oak Ridge National Laboratory (ORNL) in Tennessee, USA, Frontier leads the pack with an HPL score of 1.194 EFlop/s - unchanged from the June 2023 list. Frontier utilizes AMD EPYC 64C 2GHz processors and is based on the latest HPE Cray EX235a architecture. The system has a total of 8,699,904 combined CPU and GPU cores. Additionally, Frontier has an impressive power efficiency rating of 52.59 GFlops/watt and relies on HPE's Slingshot 11 network for data transfer.

According to Kyodo News, Japanese chip manufacturer Kioxia and its U.S. counterpart Western Digital are reportedly on the verge of finalizing a merger agreement, aiming to create the world's largest producer of memory chips. The merger plan involves establishing a holding company to consolidate their operations for producing NAND flash memory chips, with the announcement reportedly coming this month. The merged entity is expected to be listed on the Nasdaq stock exchange in the United States. As the global semiconductor market contends with competitive pressures and fluctuating demand, the merger is seen as a strategic move to enhance the combined market position of both companies.

Western Digital shareholders are anticipated to hold a majority stake in the new entity, with Kioxia's shareholders, including Toshiba Corporation, owning the remaining stake. The move is poised to give the newly formed company a combined market share of 35.4 percent in NAND memory chips as of March, surpassing South Korea's Samsung, the current leader, with 34.3 percent. However, the merger's ultimate approval hinges on regulators' decisions, including those in China, as semiconductors have become increasingly integral to global economic security. Major Japanese banks, including MUFG Bank and the state-backed Development Bank of Japan, are contemplating loans of up to approximately 1.9 trillion yen (about $12.7 billion) to facilitate the merger.