The rumour mill has kicked into high gear this week about TSMC planning a second fab in Japan. The original source is the Nikkan Kogyo newspaper (via Reuters), based in Tokyo, although it's unclear where the actual fab would be located, if it's indeed even happening. According to the paper, the new fab would be focusing on 5 and 10 nanometer chips, but production isn't expected to start until sometime in the second half of this decade. This suggests that these would be mainstream nodes by then, which points to yet another fab for either the vehicle industry or something similar.

The fab is said to cost more than a trillion yen, or over US$7.4 billion to build. TSMC's CEO C.C. Wei was asked about the potential fab during TSMC's latest earnings call, but simply said that the company had nothing further to add. TSMC is of course busy building a fab in Japan on Kyushu island, but as it'll have a node capacity for 12 to 16 nm parts, it makes sense that TSMC would already be planning for an extension of said fab that can produce on more advanced nodes as its customers will be moving to more advanced nodes over time.

AMD and Arm have been gaining up on Intel in the server CPU market in the past few years, and the margins of the share that AMD had won over were especially large in 2022 as datacenter operators and server brands began finding that solutions from the number-2 maker growing superior to those of the long-time leader, according to Frank Kung, DIGITIMES Research analyst focusing primarily on the server industry, who anticipates that AMD's share will well stand above 20% in 2023, while Arm will get 8%.

Prices are one of the three major drivers that resulted in datacenter operators and server brands switching to AMD. Comparing server CPUs from AMD and Intel with similar numbers of cores, clockspeed, and hardware specifications, the price tags of most of the former's products are at least 30% cheaper than the latter's, and the differences could go as high as over 40%, Kung said.

Thanks to the attribution of Puget Systems, we have a preview of Intel's latest Xeon W-3400 and Xeon W-2400 workstation processors based on Sapphire Rapids core technology. Delivering up to 56 cores and 112 threads, these CPUs are paired with up to eight TeraBytes of eight-channel DDR5-4800 memory. For expansion, they offer up to 112 PCIe 5.0 lanes come with up to 350 Watt TDP; some models are unlocked for overclocking. This interesting HEDT family for workstation usage comes at a premium with an MSRP of $5,889 for the top-end SKU, and motherboard prices are also on the pricey side. However, all of this should come as no surprise given the expected performance professionals expect from these chips. Puget Systems has published test results that include: Photoshop, After Effects, Premiere Pro, DaVinci Resolve, Unreal Engine, Cinebench R23.2, Blender, and V-Ray. Note that Puget Systems said that: "While this post has been an interesting preview of the new Xeon processors, there is still a TON of testing we want to do. The optimizations Intel is working on is of course at the top, but there are several other topics we are highly interested in." So we expect better numbers in the future.Below, you can see the comparison with AMD's competing Threadripper Pro HEDT SKUs, along with power usage using different Windows OS power profiles:

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced today that it has selected Amazon Web Services, Inc. (AWS) as its cloud provider for electronic design automation (EDA). A cloud-first approach helps Marvell to rapidly and securely scale its service on the world's leading cloud, rise to the challenges brought by increasingly complex chip design processes, and deliver continuous innovation for the expanding needs across the automotive, carrier, data center, and enterprise infrastructure markets it serves. The work extends the longstanding relationship between the two companies—Marvell is also a key semiconductor supplier for AWS, helping the company support the design and rapid delivery of cloud services that best meet customers' demanding requirements.

EDA refers to the specialized and compute-intensive processes used in chip making and is a critical piece of Marvell's R&D. Over the years, the number of transistors on an integrated chip has increased exponentially. Each advance in chip design calls for a calculated application of software modules overseeing logic design, debugging, component placement, wire routing, optimization of time and power consumption, and verification. Due to the computationally intensive nature of EDA workloads, it is no longer cost-effective or timely to run EDA on premises. By powering its EDA with AWS, Marvell leverages an unmatched portfolio of services including secure, elastic, high-performance compute capacity in the cloud to solve challenges around speed, latency, security of IP, and data transfer.

GlobalFoundries Inc. (GF) (Nasdaq: GFS) today announced preliminary financial results for the fourth quarter and fiscal year ended December 31, 2022.

Key Fourth Quarter Financial Highlights
Revenue of $2,101 million, up 14% year-over-year.
Gross margin of 29.6% and adjusted gross margin of 30.1%.
Net income of $668 million.
Adjusted EBITDA of $821 million.
Cash, cash equivalents and marketable securities of $3,346 million.

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology. This open industry standard defines interconnect between chiplets within a package, enabling an open chiplet ecosystem and facilitating the development of advanced 2.5D/3D devices.

A leader in high-performance memory ICs, Winbond is an established supplier of known good die (KGD) needed to assure end-of-line yield in 2.5D/3D assembly. 2.5D/3D multichip devices are needed to realize the exponential improvements in performance, power efficiency, and miniaturization, demanded by the explosion of technologies such as 5G, Automotive, and Artificial Intelligence (AI).

To date, Intel has been promised almost €6.8 billion in subsidies from the federal German government, but apparently this isn't enough for Intel, as the company is now asking for an additional €3.2 billion, for a total of €10 billion is subsidies for its Magdeburg fab. The total investment in the fab in Magdeburg—which was announced back in March 2022—is said to be around €33 billion. In other words, Intel is asking Germany to pitch in almost a third of the cost for its shiny new fab. According to an Intel spokesperson quoted by the Register, Intel is worried about the current geopolitical situation and that the demand for semiconductors has declined, plus the fact that inflation has made everything much more expensive. Intel's Arizona fabs ended up costing an extra US$5 billion, which is about a third extra compared to the original cost estimate, so it's not hard to see why Intel is asking for more money here.

At the same time, the Vietnamese government jumped the gun and announced that Intel is looking at investing US$3.3 billion in the country, as part of an announcement of investments of a total of US$7.4 billion in Ho Chi Minh, by foreign companies. The additional US$4.1 billion investments apparently hinges on Intel's investment in the country, more specifically in the Saigon Hi-Tech Park. The official stance from Intel is that "Vietnam is an important part of our global manufacturing network, but we have not announced any new investments." It's unclear what the exact plans are, but Intel is said to have met up with government officials in Vietnam, according to Bloomberg. It's likely that it would be some kind of chip packaging facility, much like what Intel and AMD already has in Malaysia and China, among other places.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

NVIDIA has reportedly begun shipping NVIDIA GeForce RTX 4080 graphics cards with a newer GPU SKU that changes the requirement for PCB design and is set to lower manufacturing costs. Previously, the company shipped its AD103-300-A1 SKU to power the GeForce RTX 4080 graphics cards. However, the new AD103-301 SKU will power the upcoming RTX 4080 cards that the company plans to ship to its AIBs and possibly use in the reference design. With the new 301 version, the GPU performance and power envelope should not change. What does change is the PCB design requirements, as the new SKU revision possesses a different chip pinout that doesn't correspond to the old design.

HKEPC has reported that GPUs with AD103-301 SKU are shipping, while VideoCardz confirms the AIB update with Gainward also offering updated cards. GALAX offers RTX 4080 models with either AD103-300/301 as well. Additionally, the GeForce RTX 4070 Ti will also see an SKU update, with AD104-250 being replaced by AD104-251. With these new silicon revisions, customers will not see any difference. However, the AIBs and NVIDIA could see a cost reduction to improve margins. HKEPC estimates around $1 BOM cost reduction with the new SKU, which will make a difference in thousands of cards shipped.

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

Montage Technology, a leading data processing and interconnect IC design company, announced today that its PCIe 5.0/CXL 2.0 Retimer has successfully achieved mass production. This chip is a key upgrade based on Montage's PCIe 4.0 Retimer, providing a stable and reliable PCIe 5.0 and CXL 2.0 interconnect solution with high bandwidth and low latency for the cloud and high-performance computing market.

Montage's PCIe 5.0/CXL 2.0 Retimer employs advanced signal conditioning technologies to improve signal integrity and increase the effective transmission distance of high-speed signals. Compliant with relevant PCI-SIG and CXL specifications, the chip meets mainstream package requirements, supports transfer rate up to 32 GT/s, and takes the lead in supporting ultra-low transmission latency of less than 5 ns. The chip supports various complex system topologies such as SRIS and Retimer cascading, offering an ideal solution to address the PCIe/CXL signal integrity challenges in next-generation servers, enterprise storage, and AI acceleration systems. The PCIe 5.0/CXL 2.0 Retimer has passed extensive interoperability testing with a variety of compute, storage and networking products, such as CPU, PCIe switches, SSDs, GPUs and NICs, thus laying a solid foundation for the large-scale deployment of cloud computing and data centers.

Powercast Corporation, the leader in radio-frequency (RF)-based over-the-air wireless power technology, has unveiled its Ubiquity transmitter, an ultra-low-cost RF power transmitter which was selected as a CES 2023 Innovation Award Honoree in three categories: Smart Home, Embedded Technologies and Sustainability, Eco-Design & Smart Energy.

Designed to be the industry's most economical RF wireless transmitter, Powercast has lowered the barrier to entry where RF wireless power can actually become ubiquitous with multiple RF transmitters covering every home. Ubiquity will be on display in Powercast's booth #52311 at the Venetian Expo in the Smart Home Marketplace during CES 2023 in Las Vegas, January 5 - 8, 2023.

MediaTek, one of the first adopters of Wi-Fi 7 technology, will be demonstrating a full ecosystem of production-ready devices featuring the next generation of wireless connectivity for the first time at CES 2023. These products are the culmination of MediaTek's investment in Wi-Fi 7 technology, focusing on reliable and always-on connected experiences on a wide variety of devices in several product categories, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

As the most current and powerful Wi-Fi standard, Wi-Fi 7 utilizes record-breaking 320 MHz channel bandwidth and 4096-QAM modulation to greatly improve overall user experience. Multi-Link Operation (MLO) also enables the Wi-Fi connection to aggregate channel speeds and alleviate link interruption in congested environment for time-demanding applications.

It's not just TSMC and the other Taiwanese chip makers that are seeing a dip in demand, the Korean chip makers have seen a slump of 15 percent in the past four months, compared to 2021. This is said to be the biggest drop in chip demand since 2009 according to data from Statistics Korea. There's a combination of factors behind the slump in demand, especially when it comes to memory related products, where inventories already are high, combined with inflation and a low demand.

According to the Financial Times, an analyst at JPMorgan in Korea isn't expecting things to improve until 2024 at the earliest. Just like Micron and Kioxia, SK hynix is looking at cutting spending on new fabs and production lines, although as TPU reported earlier this week, Samsung is going its own way, by continuing to invest in new fabs and production lines. Samsung is expected to have a capex of US$37.5 billion this year back in October, although based on the increase in costs, the capex would have increased in the fourth quarter of the year. On the plus side, it seems like the shortage of semiconductors should ease in 2023 and hopefully return to more normal levels.

According to news out of Taiwan, TSMC will hold a ceremony to mark the official mass production start of its 3 nm node on the 29th of December. This is said to help "shatter doubts about de-Taiwanization" or in simpler terms, that Taiwan will lose its golden goose as TSMC invests abroad. The 3 nm fab—known as fab 18—is based in southern Taiwan's Tainan and the ceremony also marks the start of an expansion of TSMC's most advanced fab. TSMC is said to be kicking off its N3E node production sometime in the second half of 2023, followed by its N3P node in 2024, all of which should take place at fab 18, which also produces 5 nm wafers.

In related news, according to Reuters, a Japanese lawmaker from the ruling party has said that TSMC is considering a second plant in Japan, in addition to its current joint venture that is already under construction. TSMC's response to Reuters was that the company isn't ruling out Japan for future fabs, but that the company doesn't have any current plans. At the same time, TSMC is said to be sending executives to Dresden, Germany in early 2023, for a second round of talks about building a fab to help support the European auto industry, although this would be a 28/22 nm fab, which is far from cutting edge these days, although a lot more advanced than most fabs making chips for the auto industry.

Big things are afoot at Intel's graphics chip division once again, as the company has just broken up its Accelerated Computing Systems and Graphics (AXG) business unit which will result in some big changes. For starters, Raja Koduri has been—what we can only refer to as—demoted, given he's back to being chief architect rather than being in charge of the AXG business unit. Some of his staff will be moved to other business units inside Intel as the AXG business unit will cease to exist. This doesn't mean Intel will stop making discrete consumer GPUs, with at least the Battlemage/Arc B-series launch still being planned to take place sometime in 2023.

At the same time, it looks like Raja Koduri will be out of action for what is likely to be at least a month since he posted on Twitter that he's had emergency back surgery while on a business trip. How this will affect his transition back to his role as chief architect is anyone's guess at this point in time. However, he will not be focusing solely on GPUs in the future, but the broader range of products that Intel offers—particularly the integration of GPU, CPU and AI architectures at Intel. We've posted an official statement from Intel after the break, which Intel provided to Tom's Hardware. We also wish Raja a speedy recovery!

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

The United States has recently imposed several sanctions on technology exports to China. These sanctions are designed to restrict the transfer of specific technologies and sensitive information to Chinese entities, particularly those with ties to the Chinese military or government. The primary motivation behind these sanctions is to protect American national security interests, as well as to protect American companies from unfair competition. According to Financial Times, we have information that Chinese tech Giant, Alibaba, can not access Arm licenses for Neoverse V1 technology. Generally, the technology group where Neoverse V-series falls in is called Wassenaar -- multilateral export control regime (MECR) with 42 participating states. This agreement prohibits the sale of technology that could be used for military purposes.

The US argues that Arm's Neoverse V1 IP is not only a product from UK's Arm but a design made in the US as well, meaning that it is a US technology. Since Alibaba's T-Head group responsible for designing processors that go into Alibaba's cloud services can not use Neoverse V1, it has to look for alternative solutions. The Neoverse V1 and V2 can not be sold in China, while Neoverse N1 and N2 can. Alibaba's T-Head engineer argued, "We feel that the western world sees us as second-class people. They won't sell good products to us even if we have money."

Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today. It will be offered in the form of high performance chiplets and IP. Ventana Founder and CEO Balaji Baktha will make the public announcement during his RISC-V Summit keynote today.

The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for Data Center, Automotive, 5G, AI, and Client applications. The Veyron V1 efficient microarchitecture also enables the highest single socket performance among competing architectures.

The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking facilities starting construction from 2021 to 2023, with segments including automotive and high-performance computing fueling the spending increases, SEMI announced today in its latest quarterly World Fab Forecast report. The projected growth in global factory count includes a record high 33 new semiconductor manufacturing facilities starting construction this year and 28 more in 2023.

"The latest SEMI World Fab Forecast update reflects the increasing strategic importance of semiconductors to countries and a wide array of industries worldwide," said Ajit Manocha, SEMI president and CEO. "The report underscores the significant impact of government incentives in expanding production capacity and strengthening supply chains. With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications."

According to TrendForce's research, the total revenue of the global top 10 foundries rose by 6% QoQ to US$35.21 billion for 3Q22 as the release of the new iPhone series during the second half of the year generated significant stock-up activities across Apple's supply chain. However, the global economy shows weak performances, and factors such as China's policy on containing COVID-19 outbreaks and high inflation continue to impact consumer confidence. As a result, peak-season demand in the second half of the year has been underwhelming, and inventory consumption is proceeding slower than anticipated. This situation has led to substantial downward corrections to foundry orders as well. For 4Q22, TrendForce forecasts that the total revenue of the global top 10 foundries will register a QoQ decline, thereby terminating the boom of the past two years—when there was an uninterrupted trend of QoQ revenue growth.

Regarding individual foundries' performances in 3Q22, the group of the top five was led by TSMC, followed by Samsung, UMC, GlobalFoundries, and SMIC. Their collective global market share (in revenue terms) came to 89.6%. Most foundries were directly impacted by clients slowing down their stock-up activities or significantly correcting down their orders. Only TSMC was able to make a notable gain due to Apple's strong stock-up demand for the SoCs deployed in this year's new iPhone models. TSMC saw its revenue rise by 11.1% QoQ to US$20.16 billion, and the corresponding market share expanded to 56.1%. The growth was mainly attributed to the ≤7 nm nodes, whose share in the foundry's revenue had kept climbing and reached 54% in the third quarter. Conversely, Samsung actually experienced a slight QoQ drop of 0.1% in foundry revenue even though it had also benefited from the component demand related to the new iPhone series. Partially impacted by the weakening of the Korean won, Samsung's market share fell to 15.5%.

Although Morris Chang is no longer in charge of the day to day business at TSMC, the founder of the company is still getting his hands dirty. Chang attended the APEC Economic Leaders Meeting last week, as part of Taiwan's delegation and was questioned by the media about TSMC's future plans. The specific question was about TSMC's Arizona fab, which will initially produce chips using a 5 nm node. The US$12 billion plant is scheduled to kick off production at some point in 2024, by which time the 5 nm node should be a commonly used node rather than close to cutting edge.

When questioned about the future of the Arizona fab, Morris Chang answered that it will be moving to a 3 nm node, which is currently TSMC's most cutting edge node, that has gone into volume production earlier this year with th N3 node, which is set to be followed by the N3E node. According to Chang, there's interest by several countries to have TSMC set up fabs there, but apparently this is not something TSMC is considering at the moment. One potential reason for this would be a suitable labour force, something that has already proven to be tough for the Arizona fab.

During Snapdragon Summit 2022, Qualcomm Technologies, Inc. revealed the Snapdragon AR2 Gen 1 Platform, which delivers groundbreaking AR technology that will unlock a new generation of sleek, highly capable glasses. The Company built Snapdragon AR2 from the ground up to revolutionize the headworn glass form factor and usher in a new era of spatial computing experiences for the real-world/metaverse mix.

Purpose-built for AR: To help create the thinnest possible, high-performance AR glass, we have built a multi-chip distributed processing architecture combined with customized IP blocks. The main processor occupies a 40% smaller PCB area on glass and the overall platform delivers 2.5x better AI performance while consuming 50% less power to help achieve AR glasses that consume <1 W power. This enables rich AR experiences on glasses that can be comfortably worn for extended periods of time and meet the demands of both consumers and enterprise use cases.

MediaTek today announced its new Kompanio chipsets for Chromebooks: the Kompanio 520 and Kompanio 528. With upgraded computing performance and battery life for entry level Chromebooks, the newest Kompanio chipsets provide a seamless experience so consumers can browse, cloud game, stream and use Google Play apps while enjoying all-day battery life.

"Enhanced power efficiency, speedy performance and reliable connectivity are at the core of a great user experience, and that's exactly what MediaTek's new Kompanio chipsets deliver," said Adam King, Vice President and General Manager, Client Computing Business Unit at MediaTek. "As the No. 1 provider of Arm-based Chromebooks, MediaTek makes the latest AI, connectivity, display and imaging features accessible at every price point."