TSMC Chairman Mark Liu was asked to comment on all things artificial intelligence-related at the SEMICON Taiwan 2023 industry event. According to a Nikkei Asia report, he foresees supply constraints lasting until the tail end of 2024: "It's not the shortage of AI chips. It's the shortage of our chip-on-wafer-on-substrate (COWOS) capacity...Currently, we can't fulfill 100% of our customers' needs, but we try to support about 80%. We think this is a temporary phenomenon. After our expansion of advanced chip packaging capacity, it should be alleviated in one and a half years." He cites a recent and very "sudden" spike in demand for COWOS, with numbers tripling within the span of a year. Market leader NVIDIA relies on TSMC's advanced packaging system—most notably with the production of highly-prized A100 and H100 series Tensor Core compute GPUs.

These issues are deemed a "temporary" problem—it could take around 18 months to eliminate production output "bottlenecks." TSMC is racing to bolster its native activities with new facilities—plans for a new $2.9 billion advanced chip packaging plant (in Miaoli County) were disclosed during summer time. Liu reckons that industry-wide innovation is necessary to meet growing demand through new methods to "connect, package and stack chips." Liu elaborated: "We are now putting together many chips into a tightly integrated massive interconnect system. This is a paradigm shift in semiconductor technology integration." The TSMC boss reckons that processing units fielding over one trillion transistors are viable within the next decade: "it's through packaging with multiple chips that this could be possible.".

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3 nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

"We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek. "TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market."

MIPS, a leading developer of high- performance RISC-V compute IP, has announced embedded systems industry veteran Sameer Wasson as the company's new CEO. Before joining MIPS, Wasson spent 18 years at Texas Instruments (TI), most recently as Vice President, Business Unit (BU) Manager, Processors, where he was responsible for the company's Processor businesses. In that role, Wasson re-established TI as a mainstream microprocessor (MPU) and microcontroller (MCU) supplier for high growth automotive and industrial markets, and established the company's footprint in embedded AI, software defined vehicles, and electrification.

As the new CEO of MIPS, Wasson will further accelerate the company's leadership in the High-Performance RISC-V market as it continues to expand its footprint in Automotive and Enterprise markets.

collaboration with diverse industries and support various applications
Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry's first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12 nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung's leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory.

"With our 12 nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data," said SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology."

Recently, the spot market for NAND Flash chips has seen a rise in active price inquiries for certain products, a movement driven by successful increases in wafer contract prices. TrendForce reports this uptick primarily stems from negotiations in late August between NAND Flash suppliers and key Chinese module makers. These discussions led to a new wafer contract that successfully boosted the price of 512 Gb wafers by approximately 10%.

Other suppliers have also raised prices for their comparable products, signaling a shift in supplier sentiment: they are now less inclined to finalize deals at lower prices. This change has contributed to a short-term surge in the wafer spot market. Nevertheless, whether this surge in procurement is supported by actual end-user demand remains uncertain, as these orders have arisen in reaction to adjustments in supply-side pricing.

Intel recently updated its website to highlight interposers used for testing upcoming chips before their actual product integration. A specific webpage now showcases components used by various tools, notably the "Gen5 VR," which stands for CPU Voltage Regulator in this context. The highlight of the update reveals at least four yet-to-be-announced products: Battlemage (BMG), Arrow Lake (ARL), and Lunar Lake (LNL), slated for launch in 2024. Particularly interesting are the two Battlemage interposers: BGA2362-BMG-X2 and BGA2727-BMG-X3. This hints that a Battlemage GPU could have more pins than Intel's current top-tier GPU from the Alchemist series, known as DG2, which features 2660 pins (BGA2660-DG2-512EU).

This unveiling could indicate Intel's plans to introduce two GPUs in its new series or potentially two different package sizes. Manufacturers often use consistent package sizes for multiple GPUs, granting flexibility to interchange processors with similar specifications and presenting a feasible production strategy. Another notable mention is the Arrow Lake-HX, intended for premium desktop/laptop hybrids.. While there was some buzz about the ARL-HX series before, this update provides clear confirmation from Intel. Lastly, the reveal includes an interposer for the Lunar Lake-M series (LNL-M), which is expected to be Intel's most energy-efficient line. Drawing parallels from the Alder Lake series, such chips were designed for tablets with power consumption between 5 to 7 watts.

During the Aspen Security Forums 2023, Intel CEO Pat Gelsinger spoke on the topic of semiconductors and national security. During his speech, Gelsinger mentioned that Intel should get the lion's share of the US$52 billion US CHIPS Act money, simply because Intel is a US company. In Gelsinger's opinion, it appears that TSMC and Samsung don't deserve as much, despite both companies manufacturing semiconductors for US companies, with Samsung already having a foundry in Texas, while TSMC is still struggling with the construction of its Arizona foundry.

Admittedly, Intel has far more foundries in the US, but it also seems like Gelsinger forgot about other foundries, such as GlobalFoundries, but also companies such as Micron, Texas Instruments, Qorvo, NXP, On Semi, Analog Devices and so forth that all own foundries that produce their own chips on US soil. We'd expect all these companies to be eyeing the CHIPS Act cash and without many of those companies, Intel wouldn't be able to sell any of its chips, as many of them produce much needed components that are used to build motherboards, laptops and what not. Gelsinger was obviously pointing fingers at the current US China trade war and how the export controls are causing concerns with regards to the global semiconductor business. As such, Gelsinger wants Intel to have fewer restrictions from the currently imposed trade regulations, largely due to China being some 25 to 30 percent of Intel's market, with Intel being busy expanding in the country. Make what you want of this, but it's clear that Gelsinger is expecting to eat the cake and have it at the same time. Video after the break.

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300 mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.

The planned fab is expected to have a monthly production capacity of 40,000 300 mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe's semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10. CEO, Andy Hsu, will deliver a keynote address titled "New Architectures which will Drive Future 3D NAND and 3D DRAM Solutions" on August 9th at 11:40 a.m. Pacific Time.

Earlier this year, Neo Semiconductor announced the launch of its ground-breaking technology, 3D X-DRAM. This development is the world's first 3D NAND-like DRAM cell array that is targeted to solve DRAM's capacity bottleneck and replace the entire 2D DRAM market. 3D X-DRAM can be manufactured using the existing 3D NAND flash memory process with minor changes, significantly reducing the time and cost spent developing a new 3D process. During the keynote, Mr. Hsu will reveal the 3D X-DRAM process flow and technical details.

The Council has today approved the regulation to strengthen Europe's semiconductor ecosystem, better known as the 'Chips Act'. This is the last step in the decision-making procedure. The Chips Act aims to create the conditions for the development of a European industrial base in the field of semiconductors, attract investment, promote research and innovation and prepare Europe for any future chip supply crisis. The programme should mobilise €43 billion in public and private investment (€3.3 billion from the EU budget), with the objective of doubling the EU's global market share in semiconductors, from 10% now to at least 20% by 2030.

With the Chips Act, Europe will be a frontrunner in the world semiconductors race. We can already see it in action: new production plants, new investments, new research projects. And in the long run, this will also contribute to the renaissance of our industry and the reduction of our foreign dependencies. - Héctor Gómez Hernández, Spanish Minister for Industry, Trade and Tourism

According to news out of Korea, NVIDIA is considering Samsung as a partner not only for HBM3 memory, but also as a potential partner when it comes to 2.5D chip packaging. The latter is due to TSMC having limited capacity when it comes to handling all of its customers advanced chip packaging needs, although Samsung is apparently not the only potential partner NVIDIA is looking at. Taiwan based SPIL and US based Amkor Technology are two alternative candidates for the 2.5D chip packaging according to the Elec.

As far as HBM3 memory goes, NVIDIA doesn't have as many potential options, with SK Hynix being its current partner, who NVIDIA will continue to work with when it comes to HBM memory for its high-end AI accelerators and GPUs. It's likely that Samsung is trying to win NVIDIA back as a foundry customer, by proving that it's capable of handling the chip packaging for NVIDIA. Samsung will likely use its I-Cube 2.5D packaging technology and the Elec suggests that Samsung would still be using TSMC made GPU wafers which will be mated with Samsung HMB3 memory. Samsung has as yet not started its mass production of HMB3 memory, but have sampled customers with evaluation samples that are said to have received very positive feedback. For now, nothing has been agreed and TSMC is, as we know, looking to expand its 2.5D packaging business by over 40 percent, but the question is how quickly TSMC can move before its customers consider other competitors.

DEEPX, a leading AI semiconductor technology company, aims to drive innovation in the rapidly evolving edge AI landscape with its state-of-the-art, low-power, high-performance AI chip product lineup. With a focus on revolutionizing application areas such as smart cities, surveillance, smart factories, and other industries, DEEPX unveiled its latest AI semiconductor solutions at the 2023 Samsung Foundry Forum (SFF), under the theme of "For AI Everywhere."

Recognizing the importance of collaboration and technological partnerships, DEEPX leveraged Samsung Electronics' foundry processes, harnessing the power of 5 nm, 14 nm, and 28 nm technologies for its semiconductor chip designs. As a result, the company has developed a suite of four high-performance, energy-efficient AI semiconductor products: DX-L1, DX-L2, DX-M1, and DX-H1. Each product has been specifically engineered to cater to the unique demands of various market segments, from ultra-compact sensors with minimal data processing requirements to AI-intensive applications such as robotics, computer vision, autonomous vehicles, and many others.

Today the Dutch government has published the new regulations regarding export controls of semiconductor equipment. As announced earlier in March, the new export controls focus on advanced chip manufacturing technology, including the most advanced deposition and immersion lithography systems.

Due to these export control regulations, ASML will need to apply for export licenses with the Dutch government for all shipments of its most advanced immersion DUV lithography systems (TWINSCAN NXT:2000i and subsequent immersion systems). The Dutch government will determine whether to grant or deny the required export licenses and provide further details to the company on any conditions that apply.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

Today, the U.S. Department of Commerce shared the Biden-Harris Administration's strategic vision to strengthen the semiconductor supply chain through CHIPS for America investments. To advance this vision, the Department announced a funding opportunity and application process for large semiconductor supply chain projects and will release later in the fall a separate process for smaller projects. Large semiconductor supply chain projects include materials and manufacturing equipment facility projects with capital investments equal to or exceeding $300 million, and smaller projects are below that threshold.

The announcement leads into the Biden-Harris Administration's Investing in America tour, where Secretary Raimondo and leaders in the Administration will fan across more than 20 states to highlight investments, jobs, and economic opportunity driven by President Biden's Investing in America agenda and the historic legislation he's passed in his first two years in office, including the bipartisan CHIPS and Science Act.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications. As semiconductors continue to scale, manufacturing becomes increasingly complex with hundreds of process steps needed to build nanometer-sized devices on a silicon wafer. In a single step, Coronus DX deposits a proprietary layer of protective film on both sides of the wafer edge that helps prevent defects and damage that can often occur during advanced semiconductor manufacturing. This powerful protection increases yield and enables chipmakers to implement new leading-edge processes for the production of next-generation chips. Coronus DX is the newest addition to the Coronus product family and extends Lam's leadership in bevel technology.

"In the era of 3D chipmaking, production is complex and costly," said Sesha Varadarajan, senior vice present of the Global Products Group at Lam Research. "Building on Lam's expertise in bevel innovation, Coronus DX helps drive more predictable manufacturing and significantly higher yield, paving the way for adoption of advanced logic, packaging and 3D NAND production processes that weren't previously feasible."

Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt state in Germany. The agreement encompasses Intel's expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities (also known as "fabs") in Europe, along with increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced.

Intel acquired the land for the project in November 2022, and the first facility is expected to enter production in four to five years following the European Commission's approval of the incentive package. Given the current timeline and scale of the investment, Intel plans to deploy more advanced Angstrom-era technology in the facilities than originally envisioned. The Magdeburg site will serve Intel products and Intel Foundry Services customers.

The U.S. Patent Office tribunal has ruled in favor of Intel Corp in a significant $2.2 billion case against VLSI Technology LLC. Intel's bid to nullify a patent that constituted $1.5 billion of a $2.18 billion verdict it previously lost to VLSI in 2021 was accepted. The Patent Trial and Appeal Board invalidated the computer chip-related patent and another VLSI patent, accounting for the rest of the Texas federal court verdict. An Intel spokesperson expressed their satisfaction with the decision, criticizing the invalidated VLSI patents as "low-quality."

VLSI, the company holding the patent that has filed several infringement lawsuits against Intel, retains the option to appeal both decisions to the U.S. Court of Appeals for the Federal Circuit. In a separate case last year, VLSI secured a verdict worth $949 million against Intel in Texas. VLSI is a subsidiary of Fortress Investment Group, which is managed by investment funds from SoftBank Group. The patent board proceeding was initiated by South Dakota-based Patent Quality Assurance LLC, while another patent from the $2.18 billion verdict was contested by OpenSky Industries LLC. Despite initial sanctions for attempting to extort both Intel and VLSI, OpenSky was permitted to continue the proceeding with Intel at the helm.

According to the latest report from Reuters, a former Samsung executive was arrested by the South Korean authorities yesterday, being accused of stealing company secrets to build a similar chip production facility in China. The former executive had worked for SK Hynix before joining Samsung, where he was involved in the Samsung Electronics division responsible for semiconductor factories. According to the report, the person planned to build a competing factory 1.5 km from a Samsung chip manufacturing facility in Xian, China. The suspect, who was not identified publically, has a collective of 28 years of experience with the South Korean chip makers.

Interestingly, the suspect also caused financial harm to the company, which the Suwon District Prosecutors' Office estimates to be around 300 billion won ($233 million). Prosecutors have announced the indictment of six additional individuals suspected of involvement in the case, including an employee of an inspection company who is charged with allegedly disclosing the architectural blueprint of Samsung's semiconductor plant. A police official commented, "We will sternly deal with any leakage of our technology abroad and strongly respond to illegal leak of domestic companies' core technologies in semiconductor, automobile and shipbuilding sectors among other."

A legal dispute between Realtek and MediaTek has kicked off over Realtek claiming that MediaTek has gotten a third party company to sue Realtek over some unspecified patents involving technology used in smart TVs and set-top boxes. The third party involved goes under the name of IPValue Management Inc and appears to be what is generally known as a patent troll, i.e. a company that buys up patents and uses them to take legal actions against other companies, without actually producing anything related to the patents in question. Realtek claims that MediaTek is conspiring with IPValue to drive Realtek out of the market, leaving Mediatek in a close to monopoly situation in the market.

According to Reuters, Realtek told the publication that it filed the lawsuit against MediaTek to "protect free and fair competition in the industry" and "prevent further harm to the public." Neither MediaTek or IPValue have commented on the lawsuit to the publication. What makes this entire mess even more peculiar, is that MediaTek is said to have a licensing agreement in place with a subsidiary of IPValue called Future Link System LLC, which was signed in 2019. This agreement was brought up by the U.S. International Trade Commission (ITC) in a separate lawsuit last year, with the ITC calling it alarming and the court calling it improper. After the ITC criticism last year, Future Link apparently settled with several other companies such as Amlogic, but not with Realtek, which is why the company is now taking things to court. Realtek claims that MediaTek is trying to force any allegedly infringing chips out of the market and trying to make Realtek look like an unreliable partner and supplier to its customers. As such, Realtek wants the court to end the alleged conspiracy and is also asking for damages. Time will tell if Realtek is successful or not, but it seems strange that a patent troll would agree to licence its patents to some parties, but not all, since the only reason for a patent troll to exist is to make money from its patents.

Applied Materials, Inc. today announced a landmark investment to build the world's largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D). The new Equipment and Process Innovation and Commercialization (EPIC) Center is planned as the heart of a high-velocity innovation platform designed to accelerate development and commercialization of the foundational technologies needed by the global semiconductor and computing industries.

To be located at an Applied campus in Silicon Valley, the multibillion-dollar facility is designed to provide a breadth and scale of capabilities that is unique in the industry, including more than 180,000 square feet - more than three American football fields - of state-of-the-art cleanroom for collaborative innovation with chipmakers, universities and ecosystem partners. Designed from the ground up to accelerate the pace of introducing new manufacturing innovations, the new EPIC Center is expected to reduce the time it takes the industry to bring a technology from concept to commercialization by several years, while simultaneously increasing the commercial success rate of new innovations and the return on R&D investments for the entire semiconductor ecosystem.

NVIDIA today announced a supercomputer built on the NVIDIA Grace CPU Superchip, adding to a wave of new energy-efficient supercomputers based on the Arm Neoverse platform. The Isambard 3 supercomputer to be based at the Bristol & Bath Science Park, in the U.K., will feature 384 Arm-based NVIDIA Grace CPU Superchips to power medical and scientific research, and is expected to deliver 6x the performance and energy efficiency of Isambard 2, placing it among Europe's most energy-efficient systems.

It will achieve about 2.7 petaflops of FP64 peak performance and consume less than 270 kilowatts of power, ranking it among the world's three greenest non-accelerated supercomputers. The project is being led by the University of Bristol, as part of the research consortium the GW4 Alliance, together with the universities of Bath, Cardiff and Exeter.

Thanks to the latest release of the Power On newsletter from Mark Gurman, we have additional information about Apple's upcoming M3 Pro chip. Currently in testing and reported on by an App Store developer, Apple is looking to upgrade the microarchitecture of the forthcoming chip and add additional cores to the system for more performance. As the report notes, the entry-level M3 Pro chip currently in testing will have 12 CPU cores, six for efficiency and six for performance tasks, with 18 graphics cores, all manufactured on TSMC's 3 nm node. The current baseline for M2 Pro is 10 CPU cores, where four are dedicated to efficiency, and six are dedicated to performance. The current generation entry-level M2 Pro also features a 16-core GPU, which is two cores fewer than the upcoming model.

Generally, the M3 Pro chip will boost integrated memory across the board, as the sample spotted in testing shows 36 GB of memory. The M2 Pro offered 32 GB in that memory tier, so a four GB increase is inbound there. Presumably, the 16 GB version (if it exists) and 64 GB version will also get memory bumps by going the M3 Pro route. Of course, we have to wait for more information as these chips become more widely available to developers.

In a rather unexpected move, Samsung will reportedly open a chip development facility in Yokohama, Japan. According to the Nikkei, Samsung is readying a 30 billion yen or US$222 million investment near its current R&D institute in Japan. Samsung is hoping to be able to leverage a combination of Japanese and Korean expertise at the site, although exactly what kind of chip development that will take place at the site is currently unknown, beyond it being focused on the back-end processor of chip manufacturing. This generally involves the wafer packaging process or chip stacking, processes that have evolved a lot of the past few years.

The facility is said to be employing hundreds of people once it starts operating sometime in 2025. The Nikkei is also reporting that Samsung is hoping to take advantage of subsidies offered by the Japanese government, which might also be one of the reasons for opening the development unit in Japan. The subsidies are said to be in excess of 10 billion yen. Considering that Japan and Korea aren't on the best terms at the moment, for many reasons and most of them irrelevant to this news post, it's surprising to see Samsung making this move, as although it might be a fairly minor investment for the company, it's doing so on what could only be referred to as hostile soil.