Nikon Corporation (Nikon) is developing a digital lithography system with resolution of one micron (L/S) and high productivity for advanced semiconductor packaging applications. This product is scheduled to be released in Nikon's fiscal year 2026.

The rapid adoption of artificial intelligence (AI) technology is driving demand for integrated circuits (ICs) for data centers. In the field of advanced packaging, including chiplets, the size of packages is increasing with the miniaturization of wiring patterns. This will lead to heightened demand for panel level packages that use glass and other materials suitable for larger packages, requiring exposure equipment that combines high resolution with a large exposure area. To meet these demands, Nikon is developing digital exposure equipment that combines the high-resolution technology of its semiconductor lithography systems, which has been cultivated over many decades, along with the excellent productivity made possible with the multi-lens technology of its FPD lithography systems.

Last time we reported on Samsung Foundry, the company publicly apologized for its setbacks in the memory and foundry divisions, especially as its 3 nm GAA FET node has failed to attract new customers. On the other hand, Intel has also been struggling with its Foundry unit bleeding billions of Dollars in a bid to secure its spot as one of the best foundries for companies to manufacture their chips. There is no better pair than two struggling foundries looking for customers and new ways to conduct research than Intel and Samsung. According to an exclusive by South Korean media outlet "MK," it has reportedly been confirmed that Intel approached Samsung to form a "Foundry Alliance" to boost their foundry business units.

According to the source, Intel CEO Pat Gelsinger is reportedly eager to meet with Samsung Electronics Chairman Lee Jae-yong face-to-face to discuss "comprehensive collaboration in the foundry sector." What exactly will happen between the two is still unclear. Back in 2014, GlobalFoundries and Samsung formed a partnership for 14 nm FinFET offerings, and that was a wide success. Jointly developing a node and offering it in their foundry units could be the target goal for Intel and Samsung. At some level, research and development, as well as sharing valuable manufacturing information on yield improvements, should be beneficial for both to put together the final pieces of the semiconductor puzzle.

At Snapdragon Summit, Qualcomm Technologies, Inc. unveiled the Snapdragon 8 Elite Mobile Platform, the most powerful and world's fastest mobile system-on-a-chip ever. Our flagship mobile platforms are now taking on the Elite name, showcasing the remarkable progress it represents for the industry. This platform debuts industry leading technologies such as the second generation custom-built Qualcomm Oryon CPU, Qualcomm Adreno GPU and enhanced Qualcomm Hexagon NPU, all of which deliver game changing performance improvements.

These innovations empower the Snapdragon 8 Elite to transform user experiences with their devices - making on-device multi-modal generative AI applications a reality on smartphones powered by Snapdragon. These technologies also fuel many other experiences across camera capabilities, with our most powerful AI-ISP, as well as next level gaming, super-fast web browsing and more.

Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today in its annual silicon shipment forecast.

Strong silicon wafer shipment growth is expected to continue through 2027 to meet increasing demand related to AI and advanced processing, driving improved fab utilization rate for global semiconductor production capacity. Moreover, new applications in advanced packaging and high-bandwidth memory (HBM) production, which require additional wafers, are contributing to the rising need for silicon wafers. Such applications include temporary or permanent carrier wafers, interposers, device separation into chiplets, and memory/logic array separation.

Synaptics Incorporated today launched the Veros Seamless Intelligent Connectivity brand with high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. Signifying leadership and innovation, Veros encapsulates decades of field-hardened technology and IoT connectivity expertise. It encompasses Synaptics' entire wireless portfolio of proven solutions characterized by superior performance, interoperability, coexistence, power efficiency, and bill of materials integration.

The new high-performance SoCs, the SYN4383 and SYN43756E, add to Veros by explicitly targeting devices that demand the highest Wi-Fi throughput and range with seamless network interoperability. The SYN4383 extends Synaptics' award-winning "Triple Combo" Wi-Fi/Bluetooth/802.15.4 series with real simultaneous dual-band (RSDB) operation and greater system integration. The SYN43756E fortifies Synaptics' widely adopted 2x2 Wi-Fi and Bluetooth combo SoCs with a 6E Wi-Fi band and LE Audio.

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

Samsung Electronics is speeding up its work on 2 nm production facilities, industry sources say. The company has started to install advanced equipment at its "S3" foundry line in Hwaseong to set up a 2 nm production line. This line aims to produce 7,000 wafers each month by the first quarter of next year. Also, Samsung plans to create a 1.4 nm production line at its "S5" foundry in Pyeongtaek Plant 2 by the second quarter of next year. This line has a goal to make 2,000 to 3,000 wafers each month. By the end of next year, Samsung will change all the remaining 3 nm production lines at "S3" to 2 nm.

As we reported earlier, Samsung has pushed back the start date for its Tyler, Texas foundry. The plant set to open by late 2024, won't install equipment until after 2026. Also, Samsung has changed its plans for the Pyeongtaek Fab 4 foundry line. Because of lower demand, it will now make DRAM instead, moreover, at Pyeongtaek Fab 3, which has a 4 nm line, Samsung has cut back production. These changes are part of Samsung's plan to make 2 nm chips next year and 1.4 nm chips by 2027. The company wants to catch up with its rival TSMC, right now, Samsung has 11.5% of the global foundry market in Q2, while TSMC leads with 62.3%. An industry expert stressed how crucial this is saying, "With the delay in 3 nm Exynos production and other issues, getting the 2 nm process right could make or break Samsung Foundry". The struggle for Samsung is real, with the company's top management, led by DS Division Vice Chairman Jeon Young-hyun, having recently issued a public apology for the division's underwhelming performance.

Even though the global economy shows signs of recovery, worldwide shipments of traditional PCs dipped 2.4% year-over-year (YoY) to 68.8 million units, during the third quarter of 2024 (3Q24), according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Factors including rising costs and inventory replenishment led to a surge in shipments in the previous quarter, resulting in a slightly slower sales cycle.

"Demand, without a doubt, has returned for PCs amongst consumers and commercial buyers," said Jitesh Ubrani, research manager with IDC's Worldwide Mobile Device Trackers. "However, much of the demand was still concentrated at the entry-level thanks to a recovering economy and the back-to-school season in North America. That said, newer AI PCs such as Copilot+ PCs from Qualcomm along with Intel and AMD's equivalent chips as well as Apple's expected M4-based Macs are expected to drive the premium segment in coming months."

Corning Incorporated, one of the world's leading innovators in glass, ceramic, and materials science, today unveiled Corning EXTREME ULE Glass, a next-generation material that will support chip manufacturers in meeting the rapidly growing demand for advanced and intelligent technologies. The new material will help chipmakers improve photomasks - the stencils for chip design - which are critical for the mass production of today's most advanced and cost-efficient microchips.

Corning designed EXTREME ULE Glass to withstand the highest intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.

A new forecast from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker shows shipments of personal computing devices are expected to grow 2.6% year over year in 2024 to 398.9 million units. The traditional PC market will remain flat in 2024 with 261 million units shipped while the tablet market is forecast to grow 7.2% year over year as a refresh cycle and project investments are expected to drive the market.

For traditional PCs, the global market excluding China is expected to grow 2.8% in 2024 as China continues to suffer through a confluence of macroeconomic challenges, including high youth employment, deflation, and a tumultuous real estate market. However, China's economic concerns have largely impacted just the PC market as tablet demand has proven to be more resilient thanks to Huawei's efforts.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies' longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.

As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company's most advanced process node. Intel will also produce a custom Xeon 6 chip on Intel 3, building on the existing partnership under which Intel produces Xeon Scalable processors for AWS.

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD) such as Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP). As the only American company that both designs and manufactures leading-edge logic chips, Intel will help secure the domestic chip supply chain and collaborate with the DoD to help enhance the resilience of U.S. technological systems by advancing secure, cutting-edge solutions.

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Synopsys, Inc. today announced the industry's first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world's fastest AI data centers. The UCIe interconnect, the de facto standard for die-to-die connectivity, is critical for high-bandwidth, low-latency die-to-die connectivity in multi-die packages, enabling more data to travel efficiently across heterogeneous and homogeneous dies, or chiplets, in today's AI data center systems.

Synopsys' 40G UCIe IP supports both organic substrate and high-density, advanced packaging technologies to give designers the flexibility to explore the packaging options that best fit their needs. The complete Synopsys 40G UCIe IP solution, including PHY, controller, and verification IP, is a key component of Synopsys' comprehensive and scalable multi-die solution for fast heterogeneous integration from early architecture exploration to manufacturing.

Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.

The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.

E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers.

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, HYAWEI OPTRONICS for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and other key component suppliers such as HIWIN, HIWIN MIKROSYSTEM, Keyence Taiwan, Mirle Group, ACE PILLAR CHYI DING), and Coherent.

Xiangdixian Computing Technology (XCT), once hailed as China's answer to NVIDIA at its peak, is now grappling with severe financial difficulties and legal challenges. The company, which has developed its own line of GPUs based on the Tianjun chips, recently admitted that its progress in "development of national GPU has not yet fully met the company's expectations and is facing certain market adjustment pressures." Despite producing two desktop and one workstation GPU model, XCT has been forced to address rumors of its closure. The company has undergone significant layoffs, but it claims to have retained key research and development staff essential for GPU advancement. Adding to XCT's woes, investors have initiated legal proceedings against the company's founder, Tang Zhimin, claiming he failed to deliver on his commitment to raising 500 million Yuan in Series B funding.

Among the complainants is the state-owned Jiangsu Zhongde Services Trade Industry Investment Fund, which has filed a lawsuit against three companies under Zhimin's control. Further complicating matters, Capitalonline Data Service is reportedly suing XCT for unpaid debts totaling 18.8 million Yuan. There are also claims that the company's bank accounts have been frozen, potentially impeding its ability to continue operations. The situation is further complicated by allegations of corruption within China's semiconductor sector, with reports of executives misappropriating investment funds. With XCT fighting for survival through restructuring efforts, its fate hangs in the balance. Without securing additional funding soon, the company may be forced to close its doors, which will blow China's GPU aspirations.

Microsoft provided a detailed view of Maia 100 at Hot Chips 2024, their initial specialized AI chip. This new system is designed to work seamlessly from start to finish, with the goal of improving performance and reducing expenses. It includes specially made server boards, unique racks, and a software system focused on increasing the effectiveness and strength of sophisticated AI services, such as Azure OpenAI. Microsoft introduced Maia at Ignite 2023, sharing that they had created their own AI accelerator chip. More information was provided earlier this year at the Build developer event. The Maia 100 is one of the biggest processors made using TSMC's 5 nm technology, designed for handling extensive AI tasks on Azure platform.

Maia 100 SoC architecture features:

• A high-speed tensor unit (16xRx16) offers rapid processing for training and inferencing while supporting a wide range of data types, including low precision data types such as the MX data format, first introduced by Microsoft through the MX Consortium in 2023.
• The vector processor is a loosely coupled superscalar engine built with custom instruction set architecture (ISA) to support a wide range of data types, including FP32 and BF16.
• A Direct Memory Access (DMA) engine supports different tensor sharding schemes.
• Hardware semaphores enable asynchronous programming on the Maia system.

Today at Hot Chips 2024, FuriosaAI is pulling back the curtain on RNGD (pronounced "Renegade"), our new AI accelerator designed for high-performance, highly efficient large language model (LLM) and multimodal model inference in data centers. As part of his Hot Chips presentation, Furiosa co-founder and CEO June Paik is sharing technical details and providing the first hands-on look at the fully functioning RNGD card.

With a TDP of 150 watts, a novel chip architecture, and advanced memory technology like HBM3, RNGD is optimized for inference with demanding LLMs and multimodal models. It's built to deliver high performance, power efficiency, and programmability all in a single product - a trifecta that the industry has struggled to achieve in GPUs and other AI chips.

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world's leading all-silicon micro speakers, today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.

For the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, and other advanced mobile devices with the silent, vibration-free, solid-state xMEMS XMC-2400 µCooling chip, which measures just 1-millimeter thin.

Ola, an Indian automotive company, is venturing into AI chip development with its artificial intelligence branch, Krutrim, planning to launch India's first domestically designed AI chip by 2026. The company is leveraging ARM architecture for this initiative. CEO Bhavish Aggarwal emphasizes the importance of India developing its own AI technology rather than relying on external sources.

While detailed specifications are limited, Ola claims these chips will offer competitive performance and efficiency. For manufacturing, the company plans to partner with a global tier I or II foundry, possibly TSMC or Samsung. "We are still exploring foundries, we will go with a global tier I or II foundry. Taiwan is a global leader, and so is Korea. I visited Taiwan a couple of months back and the ecosystem is keen on partnering with India," Aggarwal said.

Samsung Electronics is set to make a significant leap in semiconductor manufacturing technology with the introduction of its first High-NA 0.55 EUV lithography tool. The company plans to install the ASML Twinscan EXE:5000 system at its Hwaseong campus between Q4 2024 and Q1 2025, marking a crucial step in developing next-generation process technologies for logic and DRAM production. This move positions Samsung about a year behind Intel but ahead of rivals TSMC and SK Hynix in adopting High-NA EUV technology. The system is expected to be operational by mid-2025, primarily for research and development purposes. Samsung is not just focusing on the lithography equipment itself but is building a comprehensive ecosystem around High-NA EUV technology.

The company is collaborating with several key partners like Lasertec (developing inspection equipment for High-NA photomasks), JSR (working on advanced photoresists), Tokyo Electron (enhancing etching machines), and Synopsys (shifting to curvilinear patterns on photomasks for improved circuit precision). The High-NA EUV technology promises significant advancements in chip manufacturing. With an 8 nm resolution capability, it could make transistors about 1.7 times smaller and increase transistor density by nearly three times compared to current Low-NA EUV systems. However, the transition to High-NA EUV comes with challenges. The tools are more expensive, costing up to $380 million each, and have a smaller imaging field. Their larger size also requires chipmakers to reconsider fab layouts. Despite these hurdles, Samsung aims for commercial implementation of High-NA EUV by 2027.

Primate Labs, the developer behind the popular Geekbench benchmarking suite, has launched Geekbench AI—a comprehensive benchmark tool designed to measure the artificial intelligence capabilities of various devices. Geekbench AI, previously known as Geekbench ML during its preview phase, has now reached version 1.0. The benchmark is available on multiple operating systems, including Windows, Linux, macOS, Android, and iOS, making it accessible to many users and developers. One of Geekbench AI's key features is its multifaceted approach to scoring. The benchmark utilizes three distinct precision levels: single-precision, half-precision, and quantized data. This evaluation aims to provide a more accurate representation of AI performance across different hardware designs.

In addition to speed, Geekbench AI places a strong emphasis on accuracy. The benchmark assesses how closely each test's output matches the expected results, offering insights into the trade-offs between performance and precision. The release of Geekbench AI 1.0 brings support for new frameworks, including OpenVINO, ONNX, and Qualcomm QNN, expanding its compatibility across various platforms. Primate Labs has also implemented measures to ensure fair comparisons, such as enforcing minimum runtime durations for each workload. The company noted that Samsung and NVIDIA are already utilizing the software to measure their chip performance in-house, showing that adoption is already strong. While the benchmark provides valuable insights, real-world AI applications are still limited, and reliance on a few benchmarks may paint a partial picture. Nevertheless, Geekbench AI represents a significant step forward in standardizing AI performance measurement, potentially influencing future consumer choices in the AI-driven tech market. Results from the benchmark runs can be seen here.