Hyper Light Breaker received some significant criticism immediately after launch, largely for clunky combat, insubstantial progression, and a lack of world-building. Some community feedback is to be expected, since Hyper Light Breaker is still in Steam Early Access, but the community backlash was unexpected, given the success that the game's predecessor, Hyper Light Drifter, garnered. The first major content update aimed at addressing much of the criticism has just dropped on Steam, and many of the changes seem to be welcome by the community.

Some of the biggest changes to Hyper Light Breaker introduced in the Buried Below update include changes to character progression, weapon synergies, and the overall gameplay loop itself. Heart Machine also introduced a new playable character, Rondo, two new melee weapons, a new mini boss—a Crown called Maw—with its own player perks, and new areas for players to explore. Heart Machine also says it has streamlined the game's onboarding process, and that the changes to the game should make the game easier to get into for new players but more difficult to master. In terms of the gameplay loop, the new update reduces player lives from four per run to one per run, making things much less forgiving, however, players will also now always spawn in one of two locations, making the start of a new run more predictable. There are also a number of improvements to the enemy AI that should make encounters and battles somewhat more challenging and interesting. Players are also locked to a single character and companion for the duration of each run, which is a substantial change from the previous system which allowed players to switch characters and Sycoms mid-run. There are a number of other balance patches and new additions, which you can read about in the full patch notes below. Overall, judging from the comments in the Steam Community discussion under the update patch notes, players seem to be tentatively excited about the majority of the changes to the gameplay loop, although some concerns remain.

AI-powered image generation has progressed at a remarkable pace—from early examples of models creating images of humans with too many fingers to now producing strikingly photorealistic visuals. Even with such leaps, one challenge remains: achieving creative control. Creating scenes using text has gotten easier, no longer requiring complex descriptions—and models have improved alignment to prompts. But describing finer details like composition, camera angles and object placement with text alone is hard, and making adjustments is even more complex.

Advanced workflows using ControlNets—tools that enhance image generation by providing greater control over the output—offer solutions, but their setup complexity limits broader accessibility. To help overcome these challenges and fast-track access to advanced AI capabilities, NVIDIA at the CES trade show earlier this year announced the NVIDIA AI Blueprint for 3D-guided generative AI for RTX PCs. This sample workflow includes everything needed to start generating images with full composition control. Users can download the new Blueprint today.

Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry's leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging. Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance - enabling a new and compelling solution for 3D IC and chiplet offerings to a breadth of semiconductor market verticals.

Intel 18A Certification Achievements
Siemens' industry-leading Calibre nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit (PDK). Intel 18A represents a significant technological leap forward, featuring innovative RibbonFET Gate-all-around transistors and the industry's first PowerVia backside power delivery. This Calibre certification allows mutual customers to continue leveraging the Calibre nmPlatform tool as their industry-standard sign-off solution with Intel Foundry's most advanced manufacturing process, accelerating time-to-market for next-generation chip designs.

In the latest blow to the gaming industry, Respawn Entertainment, a subsidiary of EA, has officially announced the cancellation of two new games it had in the early stages of development. The official announcement does not specify what the cancelled games were, but previous reports from early this month indicated that Respawn had quietly canned a game in the Titanfall IP. It seems somewhat like this announcement from Respawn is simply confirmation of the cancellation that was previously already leaked. Along with the cancellation of the game, and likely more importantly, Bloomberg claims that the "targeted team adjustments" Respawn mentioned in the release would mean that as many as 100 employees on the Respawn team will be laid off.

As for the rest of the restructuring, Respawn says that it will be focusing its efforts on Apex Legends and Star Wars Jedi. Previous rumors claimed that Respawn was developing a mainline Titanfall 3 game, which will supposedly launch at the 2025 The Game Awards show, which is scheduled for December 11, 2025. It seems as though the Titanfall IP game that was cancelled as of this announcement was something of a spin-off extraction shooter set in the Titanfall universe. This news comes at a time when gaming industry lay-offs seem to be at a peek and shortly after the creation of the United Videogame Workers Union—a union aimed at protecting North American video game workers from exactly these sorts of unexpected layoffs that are seemingly aimed at reducing the workforce in the name of short-term profits.

Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications—including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products. Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems.

Recognized as industry-leading solutions, RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family. HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, Wi-Fi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.

Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers.

Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain.

At today's Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery. To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems.

In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and Intel Foundry is advancing the semiconductor industry with silicon to system design solutions to meet the evolving needs for AI and high-performance computing applications. Our production-ready EDA flows, IP, and multi-die solution, provides our mutual customers with comprehensive technologies to accelerate the development of chip designs that meet or exceed their requirements."

MiTAC Computing Technology, a global leader in high-performance and energy-efficient server solutions, is proud to announce its participation at the OCP EMEA Summit 2025, taking place April 29-30 at the Convention Centre Dublin. At Booth No. B13, MiTAC will showcase its latest innovations in server design, sustainable cooling, and open-source firmware development - empowering the future of data center infrastructure.

C2810Z5 & C2820Z5: Advancing Sustainable Thermal Design
MiTAC will debut two new OCP server platforms - C2810Z5 (air-cooled) and C2820Z5 (liquid-cooled), built to meet the demands of high-performance computing (HPC) and AI workloads. Designed around the latest AMD EPYC 9005 series processors, these multi-node servers support the latest EPYC 9005 processors and are engineered to deliver optimal compute density and power efficiency.

OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass production technology by October 2025 at its Joetsu Plant in Joetsu City, Niigata Prefecture, which has a proven track record and advanced development and production capabilities in the field of high multilayer, high-precision, large-format PCBs for semiconductor inspection equipment.

AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection equipment meet even higher levels of performance and quality.

M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC's 3 nm process and has successfully completed tape-out on TSMC's 2 nm process. As a member of TSMC Open Innovation Platform (OIP) IP Alliance since 2012, M31 has been honored with TSMC OIP Partner of the Year Award for seven consecutive years. In 2020, M31 pioneered its eUSB2 IP solution on the TSMC 7 nm process node, further solidifying its leadership in advanced interface IP development. Since then, M31 has steadily expanded its eUSB2 IP portfolio across TSMC's 5 nm, 3 nm, and most recently, 2 nm process technologies—closely aligning with TSMC's cutting-edge roadmap to accelerate the adoption of AI-enabled smart devices. Looking ahead, M31 is actively developing the next-generation eUSB2 Version 2.0 (eUSB2V2) PHY IP, with ongoing efforts focused on both TSMC's 3 nm and 2 nm process nodes.

Reinforcing its robustness and reliability on advanced nodes, M31's eUSB2 IP solutions have been widely adopted by leading global companies in high-end smartphone chipsets and AI-driven image processing applications. Building on this success, M31 is currently advancing the development of eUSB2V2 IP on TSMC's N3 and N2 process technologies - expanding its comprehensive eUSB2 portfolio to include eUSB2 V1, V2 PHY, and eUSB2 Repeater solutions. Leveraging the eUSB2 standard, eUSB2V2 enhances data transfer rates while maintaining a low-voltage interface and leveraging asymmetric bandwidth technology—allowing TX and RX to operate at different data rates. This significantly improves transmission efficiency, making it ideal for embedded applications such as AI edge computing, smart surveillance, and image processing chips. To accommodate diverse design needs, eUSB2V2 leverages and enhances the I/O architecture based on the eUSB2 standard, supporting data transfer speeds from 480 Mbps up to 4.8 Gbps. The solution delivers a comprehensive eUSB2 platform for high-end SoCs—optimizing power efficiency, performance and design flexibility, while maintaining full compatibility with legacy USB 2.0 devices.

TSMC today unveiled its next cutting-edge logic process technology, A14, at the Company's North America Technology Symposium. Representing a significant advancement from TSMC's industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company's experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.

PlayStation 5 Pro console—the most innovative PlayStation console to date—elevates gaming experiences to the next level with features like upgraded GPU, advanced ray tracing, and PlayStation Spectral Super Resolution (PSSR) - an AI-driven upscaling that delivers super sharp image clarity with high framerate gameplay. Today we're providing a closer look at the console's internal architecture, as Sony Interactive Entertainment engineers Shinya Tsuchida, PS5 Pro Mechanical Design Lead and Shinya Hiromitsu, PS5 Pro Electrical Design Lead, provide a deep-dive into the console's innovative technology and design philosophy.

Note: in this article, we refer to the PlayStation 5 model released in 2020 as the "original PS5," the PS5 released in 2023 as the "current PS5," and the PS5 Pro released in 2024 as the "PS5 Pro." Do not try this at home. Risk of fires, and exposure to electric shock or other injuries. Disassembling your console will invalidate your manufacturer's guarantee.

At the tail end of March, an interaction between Tomasz Gawroński (aka GawroskiT) and Jaykihn (jaykihn0) indicated that Intel had abandoned the development of higher-end Arc Xe2 "Battlemage" graphics cards—possibly back in late 2024. Months of silence—since the launch of pleasingly wallet-friendly B580 and B570 models—instilled a sense of unease within segments of the PC gaming hardware community. Many watchdogs assumed that company engineers had simply moved onto devising futuristic Arc Xe3 "Celestial" equivalents. As discovered last week, hopes have been elevated for a potential expansion of Team Blue's "Battlemage" dGPU lineup. Haze2K1 highlighted an intriguing entry within an NBD shipping manifest; a "BMG-G31"-type GPU was transferred "for R&D purposes." Currently, the lower end of Intel's B-card series is populated by discrete solutions based on their smaller "BMG-G21" GPU design.

Tomasz Gawroński spent part of his Easter weekend poring over shipping documents; soon stumbling on an entry that mentioned a mysterious "IBC C32 SKT"—again, listed under "research and development" purposes. In a reply to Gawroński's social media bulletin, miktdt weighed in with a logical theory: "because of the BMG in the text the best I could believe is a reworked/restarted BMG G31. C32 could simply mean cores 32 which is a fully-enabled G31. This makes more sense to me." VideoCardz posits that these leaks do not necessarily signal the revival of fortunes for more potent Arc Xe2 "Battlemage" SKUs; Intel could be shipping "canceled project" prototypes to different locations. Going back to late summer 2023, a "BMG G10" GPU die was spotted by members of the press during a tour of Team Blue's Malaysian test lab. Back then, certain industry insiders believed that the whole "Battlemage" endeavor was going through "development hell." Fast-forward to the present day; OneRaichu reckons that there is still a likelihood of Team Blue's "B770" model turning up at some point in the future.

TSMC is pushing forward its plans to make 2 nm process chips in large quantities in the second half of the year, with major customer developments coming to light. After AMD placed its order, reports suggest Intel has also become one of TSMC's first 2 nm customers aiming to use this cutting-edge technology for its next-gen desktop processors. Intel, already a big TSMC customer for advanced processes sent out key compute tiles for its Core Ultra processors to TSMC using different processes like N3B, N5P, and N6. To be exact, these were Intel Core Ultra 200V "Lunar Lake" series laptop processors and Core Ultra 200S "Arrow Lake" series. While both companies didn't comment on the latest news, industry talk hints that they're cooperating on Intel's upcoming Nova Lake desktop processor set to launch next year (rumors suggest that it could be the Compute Tile). With the codename "NVL-S" Nova Lake combines two groups of eight high-performance "Coyote Cove" P-cores with 16 "Arctic Wolf" E-cores. It also includes four ultra-low-power LPE cores in a separate SoC tile. It is expected that Nova Lake-S will use LGA 1954, which has 1,954 active lands and might have more than 2,000 total pads when you count debug pins.

TSMC's work on 2 nm technology is moving forward as expected. The company uses first-generation nanochip transistor technology to boost performance and reduce power consumption across process nodes with big clients finishing designing silicon IPs and starting validation steps. AMD shared that its next EPYC "Venice" chip will be the first high-performance computing processor to use TSMC's 2 nm process. AMD validated it at TSMC's Arizona plant and is on track to launch it in 2026. Also, word has it that Apple's future iPhone 18 lineup will have its A20 chip made with the same TSMC 2 nm process.

Micron Technology, Inc. (Nasdaq: MU), a leader in innovative memory and storage solutions, today announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

Micron has maintained multiple generations of industry leadership in DRAM and NAND technology and has the strongest competitive positioning in its history. Micron's industry-leading product portfolio, combined with world-class manufacturing execution enables the development of differentiated solutions for its customers across end markets. As high-performance memory and storage become increasingly vital to drive the growth of AI, this Business Unit reorganization will allow Micron to stay at the forefront of innovation in each market segment through deeper customer engagement to address the dynamic needs of the industry.

It's the end of a long road, I'm exhausted. It's intimidating to finally put Lushfoil out there, but I'm also overwhelmingly excited to see what people can create with it. I hope the game falls into the right hands, and that those people with a sense of experimentation and creativity can surprise us all with what they've taken. I've put a lot of love and intention into the environments created in this game, and now it feels like time to pass it on. I can't wait to see the photos you take!

I'm thrilled to introduce Lushfoil Photography Sim, a tranquil, open-ended photography exploration experience available today on Xbox Series X|S. While real-life photography can be accessible, it can be harder to commit the time and money to travel. Inspired by some real-world locations that had a huge impact on me, I wanted to virtually recreate some of the highlights of my travels so others can experience them too. I committed to learning Unreal Engine over the last few years in order to do each location justice, and make the game I've always wanted to make.

Last year, leakers posited that Xiaomi engineers were working on proprietary new-generation mobile chipset. The giant Chinese technology company has produced proprietary SoC designs in the past—most notably 2017's Pengpai/Surge S1 (blink, and you missed it)—but has largely relied on a wide swatch of Qualcomm solutions for deployment in smartphones. According to a fairly fresh ITHome news report (via a source at Sina Technology), Xiaomi has established a "chip platform department" under the umbrella of its mobile phone product development division. The exact nature of this newly-formed team remains semi-mysterious, and how it intermeshes with current (rumored) proprietary chip design efforts. The megacorporation's speculated "dedicated chip platform department" is said to be working on a "Xuanjie" SoC series.

Qin Muyun—a former senior director of product marketing at Qualcomm—is purported to be the new department's leader. Insiders believe that Muyun will answer directly to Xiaomi's CEO: Lei Jun. Over the past half decade, company engineers have accumulated chip designing experience in multiple lesser technology fields—ITHome lists: "imaging, fast charging, power management, communication, and display" aspects. Xiaomi leadership could be "shaking up" its first-party SoC development projects. Two weeks ago, rumors turned up online regarding a node process downgrade—from 3 nm to 4 nm. Smartphone industry watchdogs reckon that Xiaomi's forthcoming flagship chipset design will perform on the level of Qualcomm's first generation Snapdragon 8 mobile processor (from 2021).

Chroma, Ubisoft's colorblind simulation tool, is now available for public use after several years of internal use and development. With an estimated 300 million people around the world affected by colorblindness, Chroma allows developers to accurately replicate their experience and create accessible content to meet their needs. The open-source tool works by applying a filter over the game screen without hindering performance."Over the past few years, Chroma has proven to be a highly efficient tool for us at Ubisoft," says David Tisserand, Director of Accessibility. "It has allowed us to assess the accessibility of our games for colorblind players much faster and more comprehensively than ever before. Because we believe accessibility is a journey, not a race, we're thrilled to share Chroma with the entire industry. We invite everyone to benefit from it, provide feedback, and contribute to its future development."

Development on Chroma started in 2021 as Ubisoft's Quality Control team based in India worked to create a tool that would provide feedback in real time and allow developers to control the game while simulating color blindness. Today, Chroma uses the Color Oracle algorithm and can be used on dual or single screens; furthermore, it works with hotkeys and has a customizable overlay.

Raiders! On Wednesday, April 30th, we're kicking off the ARC Raiders Tech Test 2, where invited playtesters on Steam, Epic Games Store, and consoles will be able to experience the deadly exploits of the Rust Belt, for five full days. This will be our largest test of ARC Raiders to date, for the first time also including players on PlayStation 5, Xbox Series X|S, and the Epic Games Store. The purpose of the test is to see how the game performs in a live environment across all launch platforms and gather key insights and feedback from players like you. This time around, you're free to share or stream gameplay capture and tell the world of your experience in ARC Raiders—in other words, the playtest is not confidential.

So, what can I expect?
For those who may need a refresher: ARC Raiders is a multiplayer extraction adventure, set in a lethal future earth, where little remains of the world we know today. On the surface, threats are everywhere: ARC machines loom high in the skies and lurk in the shadowy corners of abandoned spaceports and run-down warehouses. You'll encounter everything from roaming rollbots to multi-legged behemoths, and the choice will be yours—team up to defeat them, or risk combat with your fellow Raiders if you'd rather keep the spoils for yourself. While the line between friend and foe is razor thin on the surface, in Speranza, you'll find refuge. The Traders there are ready to supply you with quests and gear. You can also craft equipment in your Raider Den, such as advanced weapon mods or unique gadgets. With every level gained on the surface, you can invest your experience into a branching skill tree.

Cadence today announced that it has entered into a definitive agreement with Arm to acquire Arm's Artisan foundation IP business, consisting of standard cell libraries, memory compilers, and general-purpose I/Os (GPIOs) optimized for advanced process nodes at the leading foundries. The transaction will augment Cadence's expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface IP, SerDes IP at the most advanced nodes, and embedded security IP from the pending Secure-IC acquisition.

By increasing its footprint in SoC designs, Cadence is reinforcing its commitment to continuously accelerate customers' time to market and to optimize their cost, power and performance on the world's leading foundry processes. Cadence will acquire the Arm Artisan foundation IP business through an asset purchase agreement with a concurrent technology license agreement, to be signed at closing and subject to any existing rights. As part of the transaction, Cadence will acquire a highly talented and experienced engineering team that is well respected in the industry and can help accelerate development of both related and new IP products.

Recruit an unconventional team of operatives and deploy them on missions unlike any other in the galaxy far, far away in Star Wars Zero Company! The newly announced single-player turn-based tactics game, developed by Bit Reactor in collaboration with Respawn Entertainment and Lucasfilm Games, will share the first details about the game currently in development with attendees at Star Wars Celebration Japan. Here's your exclusive first look at Star Wars Zero Company and just a few members of the elite squad under your command. The upcoming turn-based tactics game puts you in command during the Clone Wars.

Bit Reactor Developer Panel featuring Respawn Entertainment and Lucasfilm Games
Join Bit Reactor, along with Respawn Entertainment and Lucasfilm Games, for a first look at a new Star Wars turn-based tactics game. Tune into the Star Wars Celebration on April 19, Live on the Galaxy Stage—4:30PM - 5:30PM—for a first look at STAR WARS Zero Company, a single-player turn-based tactics game coming to PC, PlayStation 5, and Xbox Series X|S.

Intel's "Bartlett Lake-S" architecture, previously only offered for edge and networking deployment, may spawn a 12 P-core variant for gamers that eliminates efficiency cores entirely. This hopeful configuration would specifically target applications that benefit from consistent single-threaded performance and deterministic core behavior, addressing a market segment underserved since Intel's transition to hybrid architectures. Recent software support developments strengthen this speculation, with diagnostic utility AIDA64 explicitly adding "improved support for Intel Bartlett Lake-S CPU" in its 7.65.7404 beta release notes from April 13, 2025. This update precedes any consumer launch announcement, suggesting possible platform expansion. MSI-affiliated overclocker Toppc amplified these rumors by highlighting the AIDA64 changelog while referencing undisclosed developments under NDA, a pattern historically preceding consumer product launches.

The rumored gaming-oriented CPU would leverage the LGA 1700 platform compatibility, enabling drop-in upgrades for existing 600-series and 700-series motherboard owners. Unlike the current flagship Core 7 251E with its 8P+16E configuration, a pure performance-core implementation would eliminate the Windows scheduler complications that sometimes impact frame timing in latency-sensitive games. Current hybrid designs force game engines to navigate complex thread scheduling across heterogeneous cores, with performance-critical threads occasionally migrating to efficiency cores during intensive scenes. A homogeneous 12 P-core architecture would eliminate this behavior, providing stable thread assignment and potentially reducing the 99th percentile frame time variances that affect perceived smoothness in CPU-bound titles.

As a pioneer in self-developed software for Windows handhelds, AYANEO has always adhered to integrated hardware and software development, continuously delivering exceptional user experiences that exceed gamers' expectations. Today, the highly acclaimed handheld management software AYASpace 3.0 has launched a newly upgraded beta version. Not only does it offer deep optimization and exclusive features for the modular flagship device AYANEO 3, but it also provides comprehensive support for all released AYANEO Windows handhelds and Mini PCs, including the FLIP, SLIDE, KUN, 2S, 2, GEEK, and AIR series. Gamers are welcome to upgrade and experience these enhancements while supporting AYANEO's software optimization with their valuable feedback!

AYASpace 3.0: The Era of All-in-One Intelligent Control Begins
AYASpace 3.0 has been completely upgraded in terms of interface design and functional logic, achieving dual improvements in "modern aesthetics" and "high-performance efficiency"：The UI interaction has been fully optimized, with a new "Device" section added. Quick-access features have made a complete return, and the keyboard/mouse mode has been reconstructed.

CD Projekt acquired The Molasses Flood—a Boston, Massachusetts-based video game developer—back in 2021. The New England studio was best known for making two indie titles: Drake Hollow (2020) and Flame in the Flood (2016). Under Polish ownership, the team embarked on a new "Project Sirius" adventure—several veteran members had spent time pumping out Bioshock, Halo, Guitar Hero and Rock Band franchise entries at previous workplaces. Earlier in the week, an official statement popped up on the company's official site: "dear all, we want to let you know that on April 1, 2025, The Molasses Flood LLC ("TMF") merged with CD PROJEKT RED Inc. ("CDPR Inc."), a company being a part of the CD PROJEKT Group. As a result of the merger TMF, in its former legal state (of a separate legal entity) ceased its operations, while CDPR Inc. assumed the rights and obligations of TMF. The merger will not affect the availability or distribution of 'The Flame in The Flood' and 'Drake Hollow' video games, which will continue to be published by CD PROJEKT Group."

In a LinkedIn post, Damian Isla provided an extra couple of tidbits and confirmed his exit from operations. The Molasses Flood (TMF) co-founder commented on recent reshuffles: "the studio I co-founded with some of my ex-Irrational friends, was to be absorbed into CDPR proper. To be ultra clear: this is a GOOD AND HEALTHY thing for the studio, and it was long-expected. It breaks down some organizational barriers, and better integrates the TMF team with the rest of the amazing CDPR org. Overall, it shows a very bright future for Project Sirius (aka "the multiplayer Witcher game," of which I was the Design Director for three years). It's going to be an amazing game, one for the books, and I cannot wait until the rest of the world learns about what we've been working on...On the sadder side—not to bury the lede—I've decided not to follow TMF on this transition. So last Monday—the last day of TMF's legal existence!—was also my last day at the studio."

Introducing My Team 2.0: as mentioned as part of our Reveal, My Team is having its biggest overhaul since it was introduced in F1 2020. If you've played My Team in one of our previous F1 games, you'll be familiar with taking on the role of driver/owner, a single character that not only runs the day-to-day activities behind the scenes, but also jumps into the cockpit for the on-track action. For F1 25 however, we're shaking things up, as My Team 2.0 sees you take on a more authentic, management-focused role in that of a team owner.

In addition to handling day-to-day running of the critical facilities that make an F1 team tick such as Engineering, Personnel and Corporate, you'll be responsible for recruiting and managing a pair of drivers to represent your team. Then, during race weekends, you'll be given the choice as to which driver you'd like to take to the track. By managing the competing concerns of two drivers instead of just a single teammate, you'll discover what kind of owner you'd like to be. We believe this refreshed approach allows you to craft a My Team story that's unique to you, unlocking new avenues of decision-making for you to explore.